Grounded electrode for a plasma processing apparatus

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Description

FIG. 1 is a front, top and right side perspective view of a grounded electrode for a plasma processing apparatus according to the design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 7; and,

FIG. 10 is an enlarged view of the portion shown in BOX 10 in FIG. 9.

The broken lines show the boundary of enlarged portions and form no part of the claimed design.

Claims

The ornamental design for a grounded electrode for a plasma processing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
6265094 July 24, 2001 Pedicini
D494551 August 17, 2004 Doba
D556704 December 4, 2007 Nakamura
D699200 February 11, 2014 Nagakubo
D703160 April 22, 2014 Tanimura
D770992 November 8, 2016 Tauchi
D812578 March 13, 2018 Uemura
D830435 October 9, 2018 Wakisaka
D870314 December 17, 2019 Isozaki
D871609 December 31, 2019 Isozaki
D891382 July 28, 2020 Koppa
Patent History
Patent number: D916038
Type: Grant
Filed: Sep 18, 2019
Date of Patent: Apr 13, 2021
Assignee: Hitachi High-Tech Corporation (Tokyo)
Inventor: Taku Watanabe (Tokyo)
Primary Examiner: Jennifer O King
Application Number: 29/706,143