Grounded electrode for a plasma processing apparatus
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The broken lines show the boundary of enlarged portions and form no part of the claimed design.
Claims
The ornamental design for a grounded electrode for a plasma processing apparatus, as shown and described.
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Type: Grant
Filed: Sep 18, 2019
Date of Patent: Apr 13, 2021
Assignee: Hitachi High-Tech Corporation (Tokyo)
Inventor: Taku Watanabe (Tokyo)
Primary Examiner: Jennifer O King
Application Number: 29/706,143