Abstract: An optical fiber coating forming device forms a coating of an ultraviolet light hardening type in an optical fiber by precisely controlling an ultraviolet light output of a light source. The optical fiber coating forming device has a light source (2) for irradiating ultraviolet light to resin for coating formation molded to a coating removing portion (4) of an optical fiber core wire (3), a light receiver (5) for detecting intensity of the ultraviolet light by receiving the ultraviolet light irradiated to the resin for coating formation from the light source (2), and an environmental sensor (20) for detecting environmental information. The environmental sensor (20) includes at least a temperature sensor (6) and selectively includes a humidity sensor (7) and an atmospheric pressure sensor (8).

Abstract: On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

Abstract: The method for electroless deposition of a coating material, which may be a metal, semiconductor, or dielectric, that is carried out at a relatively low temperature of the working solution compensated by an increased temperature on the substrate which is controlled by a heater built into the substrate chuck. A decrease in the temperature of the working solution prevents thermal decomposition of the solution and reduces formation of gas bubbles, normally generated at increased temperatures. Accumulation of bubbles on the surface of the substrate is further prevented due to upwardly-facing orientation of the treated surface of the substrate. The substrate holder is equipped with a substrate heater and a substrate cooler, that can be used alternatingly for quick heating or cooling of the substrate surface.

Abstract: An exhaust monitoring cup which measures exhaust gas flowing through a top opening in a coater cup of a spin coating apparatus used in the deposition of photoresist coatings on semiconductor wafers. The exhaust monitoring cup includes a gas flow cup which is positioned in fluid communication with the top opening of the coater cup. The exhaust gas flows through a gas flow opening in the gas flow cup, and a flow rate measuring apparatus at the gas flow opening receives the exhaust gas and measures the flow rate thereof. The flow rate of the gas leaving the gas flow cup can be compared to the flow rate of the gas flowing from an exhaust conduit leading from the bottom of the coater cup, to facilitate detection of abnormal conditions in the coater cup or exhaust conduit.

Abstract: The present invention disclosed the deposition source installed in a chamber, heated by applied electric power to transfer heat to a vapor deposition material received therein and applying a vaporized deposition material generated therein to a substrate to form deposition organic electroluminescent layers onto the substrate, and comprising a vessel consisted of a top plate on which a vapor efflux aperture is formed, a side wall, and a bottom wall; a heating means for supplying heat to the deposition material received in the vessel, the heating means being capable of moving vertically; and a means for moving the heating means (or the bottom wall), the moving means (or the bottom wall) being operated in response to the signal of a sensing means on varied distances between the heating means and the surface of said deposition material.

Abstract: With a device for applying a coating agent onto a cyclically moved substrate, a uniform coating thickness may be achieved, although the rate of advance is not constant. At least one spray valve is provided which is permanently supplied with coating agent and the nozzle opening of which being adjustable with regard to the size of its effective discharge area in case of change of the rate of advance of the substrate according to the dependency, for a constant layer thickness of the coating agent, on the discharge rate of the coating agent out of the spray valve on the rate of advance of the substrate.

Abstract: A liquid output portion is arranged above and moves relative to a semiconductor substrate with determined film formation and non-film-formation regions. The liquid output portion continuously outputs a liquid in a constant amount to the substrate. Below the liquid output portion is a liquid shut-out-portion. A liquid controlled to spread in a constant amount is continuously output from the liquid output nozzle to the substrate. While the nozzle and the substrate relatively move, the liquid is supplied to a first region, and the liquid is supplied to a second region in such a way that the liquid supplied and spread in the second region is in contact with the liquid supplied and spread in the first region. Where projections and depressions are formed on the surface of the substrate, an amount of the liquid supplied varies depending upon the ratio between the projections and depressions.

Abstract: In the invention, the atmosphere in a vacuum chamber (1) is conditioned using a primary pump (3), a secondary pump (2), speed control means (6, 7) for controlling the speed of the primary pump, and at least first gas treatment means (5) adapted for treating the extracted gases downstream from the primary pump (3). The vacuum chamber (1) is contained in a room (130) having a false floor (36) covering a space (37). The primary pump (3) and the gas treatment means (5) are housed in the available space (37) under the false floor (36), so that the secondary pump (2) can be placed in the immediate vicinity of the vacuum chamber (1), and the primary pump (3) is in the proximity of the vacuum chamber (1).

Abstract: A semiconductor processing apparatus capable of diagnosing re-assembly fault of a process chamber after wet cleaning or a condition of the process chamber such as deposition of reaction products and cutoff of components, and a diagnosis method of the semiconductor processing apparatus. A semiconductor processing apparatus for imparting plasma treatment to a sample arranged in a vacuum process chamber includes a plasma generation apparatus for generating plasma inside a vacuum process chamber and a process gas introduction device for introducing a process gas into the vacuum process chamber. The semiconductor processing apparatus includes an oscillator for imparting mechanical oscillation to the semiconductor processing apparatus and a receiver for detecting mechanical oscillation generated by the oscillator in the semiconductor processing apparatus.

Abstract: A system and method for real time deposition process control based on resulting product detection, where the system and method detect an amount of at least one reaction product in real time, while the deposition process is being performed, the detected amount of reaction product is compared with a reference amount, and a comparison result is fed back in real time to adjust a supply of one or more reactants. The system and method provide real time control over the deposition process and/or reduce the number of wafers produced that do not meet processing target values.

Abstract: An apparatus for use with a deposition chamber includes a temperature control system that communicates with a heating element of the deposition chamber so as to not cause the formation of a thin layer exhibiting a substantially uniform property on an active surface of a semiconductor substrate. The apparatus causes uneven heat distribution across the surface of the substrate. The apparatus may also include a feedback control system that communicates with the temperature control system so as to cause the temperature control system to alter the heat output by the heating element and, thereby, to enhance the uniformity of at least one property of the material layer being deposited.

Abstract: A method and apparatus for operating a matching network within a plasma enhanced semiconductor wafer processing system that uses pulsed power to facilitate plasma processing.

Abstract: A method and system are provided for controlling and/or monitoring a semiconductor processing apparatus while predicting its processing results.

Abstract: A device for applying fluids to a moving substrate has at least one nozzle system provided with fluid from a supply channel that is coupled to a fluid source. A valve system cooperating with the nozzle has a valve element that is movable between open and closed positions, relative to an associated valve seat, to selectively dispense fluid from the nozzle. The device further includes at least one sensor configured to sense a position of the valve element relative to the valve seat. Signals from the sensor are utilized by a controller to generate control signals that regulate operation of the valve element.

Abstract: A substrate-processing apparatus comprising at least a substrate delivery chamber, a substrate-processing chamber and a substrate takeup chamber, wherein in said substrate delivery chamber, a web substrate and an interleaf are delivered from a delivery bobbin comprising said web substrate and said interleaf alternately wound while said web substrate delivered is transported into said substrate-processing chamber to process said web substrate therein and said interleaf delivered is wound on an interleaf takeup bobbin; in said substrate takeup chamber, said web substrate transported from said substrate-processing chamber and an interleaf delivered from an interleaf delivery bobbin are alternately wound in a roll form on a substrate takeup bobbin, characterized in that said substrate-processing apparatus is provided with a mechanism for detecting transport abnormality of the interleaf at least either in the substrate delivery chamber or in the substrate takeup chamber in order to previously prevent occurrence of

Abstract: A process for manipulating particles distributed substantially non-uniformly in a plasma of a carrier or reaction gas, wherein Coulomb interaction between the particles is so low that the particles substantially do not form a plasmacrystalline state, and the particles are exposed in a location-selective manner to external adjustment forces and/or the plasma conditions are subjected to a location-selective change to apply at least a portion of the particles onto a substrate surface mask-free and/or subject it to a location-selective plasma treatment in the carrier or reaction gas.

Abstract: A plasma processing system and method for operating a windowless optical diagnostic system in conjunction with a plasma processing system. The plasma processing system comprises a windowless optical diagnostic system that is constructed and arranged to detect a plasma process condition. The method includes providing a first pressure within a chamber of the plasma processing system and providing a second pressure within a windowless optical diagnostic chamber in which the windowless optical diagnostic system is positioned. The method further includes controlling the second pressure within the windowless optical diagnostic chamber relative to the first pressure within the chamber and optically detecting a plasma process condition.

Abstract: A coating equipment managing system for controlling and monitoring a coating equipment of an automobile manufacturing line, comprising local installations which are provided in the manufacturing lines at a plurality of localities, and a central installation for receiving data from the plurality of local installations, wherein the local installation comprises a sensor installed in the coating equipment, a data acquisition unit for receiving signals from the sensor, a control unit for controlling the coating equipment, and a local communication unit; the central installation comprises a server unit and a central analysis unit; the local communication unit transmits the data from the data acquisition unit to the server unit by E-mail; the server unit transmits correction data for the coating equipment obtained from the analysis of the measured data by the central analysis unit to the local communication unit by E-mail; and the local communication unit converts the correction data into a control code and transmit

Abstract: A plasma processing apparatus for processing an object arranged within a chamber by utilizing the plasma caused within the chamber, the apparatus including: a sensor having plural lines of a plurality of elements for detecting a plurality of strip-like beams; an application unit for applying the plurality of strip-like beams generated from the light within the chamber in such a way that each of the illumination faces of the strip-like beams makes an angle with respect to each of the lines of the elements; and a control unit for adjusting the operation of the apparatus using outputs from the sensor.

Abstract: A liquid crystal dispensing apparatus and a method of controlling a liquid crystal dropping amount are provided to drop liquid crystal onto a substrate corresponding to at least one unit panel area. In one aspect, the apparatus uses a liquid crystal dispensing unit to dispense liquid crystal. The liquid crystal dispensing unit includes a nozzle having a discharging hole through which the liquid crystal is dropped onto the substrate, a needle moveable between a down position in which the needle blocks the discharging hole and an up position in which the needle is separated from the discharging hole, a spring member to bias the needle toward the down position, and a solenoid coil to provide a magnetic force to move the needle to the up position. The dropping amount liquid crystal dispensing unit may be electrically controlled by controlling the solenoid coil or by controlling a gas pressure used to drive the liquid crystal through the discharging hole.

Abstract: An apparatus including: a movement device that moves an object to be coated; a slot die coater equipped with a position sensor mounted on at least one end of the slot die coater and which slot die coater controllably dispenses coating material onto the moving object; and at least one servor motor-controller system in electrical contact with the position sensor, wherein the position sensor senses the position of the slot die coater relative to the object and wherein the at least one servor motor-controller system adjusts the position of the slot die coater relative to the object if the position of the slot die coater relative to the moving substrate deviates from a set of predetermined coordinates.

Abstract: The present invention pertains to an arrangement for the controlled application of adhesive to substrate. In at least one embodiment, the arrangement comprises a) an adhesive reservoir, b) a pump, c) an applicator head having at least one applicator nozzle, d) a volume throughput sensor, and e) a monitoring unit. The reservoir, the pump, and the applicator head are connected together by a conduit system carrying the adhesive. The volume throughput sensor and the monitoring unit are connected together by a pulse transmission line. The monitoring unit, the feed pump, and the applicator head are connected together by control lines. In at least one embodiment, the application of adhesive to substrates is controlled by measuring the volume throughput of the adhesive, transmitting signals indicative of volume throughout to the monitoring unit, and controlling the amount of adhesive applied to the substrate material in-line in response to the signals.

Abstract: A liquid coating device and method for coating a coatable composition on a workpiece to form a coating, wherein a parameter indicative of barometric pressure is measured and at least one thickness-affecting process parameter is adjusted in order to compensate for the effects of variations in barometric pressure on coating thickness uniformity.

Abstract: The present invention is a substrate treatment method in which a treatment by supplying a treatment solution from a nozzle to a substrate is successively performed for a plurality of substrates, which comprises the step of, during the performance of the successive treatments, performing between the treatments a plurality of pre-dispenses for different purposes of the treatment solution, wherein at least a recipe of the treatment solution to be pre-dispensed or a start condition of the pre-dispense is determined for each of the pre-dispenses. According to the present invention, the pre-dispense can be performed at a necessary and sufficient frequency to shorten the suspension time due to the pre-dispenses in the substrate treatment. This improves the throughput and reduces the number of pre-dispenses, resulting in reduced consumption of the treatment solution.

Abstract: An apparatus for controlling a speed of a motor of a metering pump providing pressurized fluid at a dispensing gun. The dispensing gun is opened and closed to dispense fluid onto a substrate being carried by a conveyor past the dispensing gun. The apparatus has a pressure control producing first motor speed signals as a function of changing speeds of the conveyor and changing fluid pressures in the dispensing gun when the dispensing gun is open. A flow control produces second motor speed signals as a function of the changing speeds of the conveyor. During changes in conveyor velocity, a motor speed control provides the first motor speed signal to the pump motor which operates the motor at speeds causing the pump to provide fluid to the dispensing gun at pressures changing at a rate tracking a rate of change of the speed of the conveyor.

Abstract: A substrate coated with a coating solution is placed on a heating plate in a processing chamber in which an inert gas is circulating. The substrate is heated on the heating plate while the inert gas is circulating at an extremely small first circulating amount. The substrate is heated further on the heating plate while the inert gas is circulating at a second circulating amount larger than the first circulating amount. Detected is the density of the solvent in the processing chamber. The supply and exhaust amounts of the inert gas are controlled based on the density detected after the start of heating, so that an exhaust amount of the inert gas becomes a predetermined amount for a predetermined period until the solvent density reaches a predetermined density. A necessary control process is performed so that the solvent density reaches the predetermined density when the solvent density has not reached or exceeded the predetermined density after the predetermined period has elapsed.

Abstract: The present invention relates to methods and/or systems for applying treatment fluid to a plurality of fabric articles in a fabric treatment apparatus. The present invention is also directed to an apparatus capable of carrying out such methods and/or systems.

Abstract: The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member (2111) having a screw portion (2122) inserted therein is rotated by a rotating device (230), so that a nozzle stopper (2114) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed.

Abstract: An apparatus and a method for applying a fluid are provided which enable an application amount of the fluid to be stabilized even at a fluid discharge start part and a fluid discharge end part. There are provided an application head and a control unit, whereby an operational control is carried out so that a discharge member is rotated and moved in a discharge direction along an axial direction of the discharge member when the fluid is to be discharged, while the rotation of the discharge member is stopped and the discharge member is moved in a direction opposite to the discharge direction when the discharge is to be stopped. The application amount of the fluid to be applied can be stabilized even at the fluid discharge start part and the fluid discharge end part.

Abstract: The invention relates to a device for the regulation of a plasma impedance in a vacuum chamber, wherein at least one electrode is connected to an AC generator. This AC generator is a free-running [oscillator], whose frequency adjusts to the resonance frequency of the load upon which it acts. This load comprises fixed circuit elements and a variable plasma impedance. If the plasma impedance is changed, with it the resonance frequency is also changed. The plasma impedance can thus be varied by acquisition of the resonance frequency and by presetting of a reference frequency value, for example thereby that the voltage, the current, the power or the gas inflow is varied as a function of the difference between resonance frequency and reference frequency value.

Abstract: A fluid ejection cartridge for dispensing a bioactive fluid including a first reservoir containing the bioactive fluid and a first fluid ejector fluidically coupled to the first reservoir. The first fluid ejector ejects at least a drop of the bioactive fluid onto the ingestible sheet.

Abstract: Described are dispensing apparatuses and methods of their use, the dispensing apparatuses having one or more process chamber inside of a control chamber, and the volume of the process chamber increases or decreases by adding or removing control fluid from the control chamber, with proper valving, to cause fluid to flow into and out of the process chamber, for use in dispensing fluid, especially in precise amounts.

Abstract: Spray coating apparatus comprising a spray nozzle (2) and a regulation system (16) to limit the high voltage and to limit the current, further to measure the electric spray current of the high-voltage electrode (10).

Abstract: A system and method is provided that facilitates the application of a uniform layer of developer material on a photoresist material layer. The system includes a multiple tip nozzle and a movement system that moves the nozzle to an operating position above a central region of a photoresist material layer located on a substrate, and applies a volume of developer as the nozzle scan moves across a predetermined path. The movement system moves the nozzle in two dimensions by providing an arm that has a first arm member that is pivotable about a first rotational axis and a second arm member that is pivotable about a second rotational axis or is movable along a translational axis. The system also provides a measurement system that measures the thickness uniformity of the developed photoresist material layer disposed on a test wafer. The thickness uniformity data is used to reconfigure the predetermined path of the nozzle as the developer is applied.

Abstract: A liquid dispensing system has a number of cartridges, preferably two or four, selectively coupled to a single motor with a respective clutch for dispensing dots of liquid at high speed. The motor drives a spur gear that meshes with individual spur gears associated with each of the clutches. Multiple cartridges are thus activated with a single motor and are housed together in one housing. Each cartridge is movable relative to the housing and is biased downward to a dispensing position with a spring. Air is selectively provided between the dispensers and the housing to drive the cartridges upward to a non-dispensing position. When the air is not provided, the spring returns the cartridge to its downward position. By moving the cartridge relative to the housing, the assembly can dispense at different locations without it being necessary to move the entire pump assembly every time a dot is dispensed.

Abstract: A vacuum treatment system in which a part (9) is provided inside a vacuum treatment chamber (1). A potential (&phgr;9) which deviates from the system reference potential (&phgr;0) by approximately at least ±12 V is applied to said part. A sensor and/or an actuator (11) is/are arranged on said part. In addition, the invention comprises an electronic unit (13) which is connected to the sensor and/or actuator. Processing signals on the unit (13) is considerably simplified in that the electronic unit (13) is operated as a reference potential on the potential (&phgr;9) of said part (9).

Abstract: A coating apparatus and a coating method are provided capable of adjusting the coating conditions into optimum and producing stabilized coating film continuously. The coating apparatus comprises a backing roll 2; a coating color delivery slit 4; a gas chamber 10, disposed upstream to the coating color delivery slit 4, containing therein a gas injection nozzle 9 and a pressure sensor 7; a gas recovery chamber 14 disposed upstream to the gas chamber; a nozzle group 20 disposed upstream to the gas recovery chamber 14; and a pressure control device for controlling the pressure inside of the gas chamber within a predetermined pressure range based on the detection results of the pressure sensor.

Abstract: A method and system for producing a thin film with highly uniform (or highly accurate custom graded) thickness on a flat or graded substrate (such as concave or convex optics), by sweeping the substrate across a vapor deposition source with controlled (and generally, time-varying) velocity. In preferred embodiments, the method includes the steps of measuring the source flux distribution (using a test piece that is held stationary while exposed to the source), calculating a set of predicted film thickness profiles, each film thickness profile assuming the measured flux distribution and a different one of a set of sweep velocity modulation recipes, and determining from the predicted film thickness profiles a sweep velocity modulation recipe which is adequate to achieve a predetermined thickness profile.

Abstract: A substrate processing chamber has a substrate support to support a substrate, and an exhaust conduit about the substrate support. A first process gas distributor directs a first process gas, such as a non-reactive gas, about the substrate perimeter and toward the exhaust conduit at a first flow rate to form a curtain of non-reactive gas about the substrate. A second process gas distributor directs a second process gas, such as reactive CVD or etchant gas, toward a central portion of the substrate at a second flow rate which is lower than the first flow rate. A gas energizer energizes the first and second process gases in the chamber. A controller operates the substrate support, gas flow meters, gas energizer, and throttle valve, to process the substrate in the energized gas.

Abstract: An optical fiber resin coating apparatus having an ultraviolet flash lamp used for coating an optical fiber by an ultraviolet curing resin, a lamp lighting circuit for making the ultraviolet flash lamp emit light, and a control circuit for controlling this lamp lighting circuit. The control circuit detects the intensity and emission time of ultraviolet light emitted from the ultraviolet flash lamp by an ultraviolet sensor and supplies a voltage and excitation time to the power source for exciting the ultraviolet flash lamp based on this. As the ultraviolet light source, at least one ultraviolet laser diode or ultraviolet light emitting diode may be used instead of an ultraviolet flash lamp. The ultraviolet light source may be arranged to emit ultraviolet light so that the coating portion of the ultraviolet curing resin exhibits an inclined profile where the intensity of the ultraviolet light gradually changes according to the position.

Abstract: A device for maintaining constant a certain viscosity of an adhesive, that is used for pasting a spine of an inner book or a book cover, by adding a diluent has an adhesive container filled with an adhesive. A rotating conveyor roll is immersed in the adhesive. An applicator roll is positioned downstream of the conveyor roll. It receives the adhesive from the conveyor roll and applies the adhesive onto a spine of an inner book or a book cover passing by the applicator roll. A stirring apparatus is arranged on the container and has a stirrer immersed in the adhesive. The stirring apparatus stirs the adhesive received in the container and also measures the viscosity of the adhesive received in the container. A control unit with a computer is connected to the stirring apparatus. The control unit compares a measured value of the viscosity with a set-point value of the viscosity and meters the diluent to the adhesive in order to regulate the viscosity.

Abstract: A method of forming a high dielectric oxide film conventionally formed using a post formation oxygen anneal to reduce the leakage current of such film includes forming a high dielectric oxide film on a surface. The high dielectric oxide film has a dielectric constant greater than about 4 and includes a plurality of oxygen vacancies present during the formation of the film. The high dielectric oxide film is exposed during the formation thereof to an amount of atomic oxygen sufficient for reducing the number of oxygen vacancies and eliminating the post formation oxygen anneal of the high dielectric oxide film. Further, the amount of atomic oxygen used in the formation method may be controlled as a function of the amount of oxygen incorporated into the high dielectric oxide film during the formation thereof or be controlled as a function of the concentration of atomic oxygen in a process chamber in which the high dielectric oxide film is being formed.

Abstract: A method and apparatus for depositing a boron insitu doped amorphous or polycrystalline silicon film on a substrate. According to the present invention, a substrate is placed into deposition chamber. A reactant gas mix comprising a silicon source gas, boron source gas, and a carrier gas is fed into the deposition chamber. The carrier gas is fed into the deposition chamber at a rate so that the residence of the carrier gas in the deposition chamber is less then or equal to 3 seconds or alternatively has a velocity of at least 4 inches/sec. In another embodiment of forming a boron doped amorphous for polycrystalline silicon film a substrate is placed into a deposition chamber. The substrate is heated to a deposition temperature between 580-750° C. and the chamber pressure reduced to a deposition pressure of less than or equal to 50 torr. A silicon source gas is fed into the deposition at a rate to provide a silicon source gas partial pressure of between 1-5 torr.

Abstract: A machine for one of manufacturing and processing a fiber web includes an input end which receives a fiber suspension or a fiber web. The input end includes a plurality of control modules, with each control module controlling at least one of a plurality of adjustable input parameters. A plurality of sensors are provided, with each sensor being configured to sense a physical characteristic of one of the fiber suspension and the fiber web and provide an output signal indicative thereof. A chemistry process controller is coupled with each sensor and each control module to define a closed loop control system. The chemistry process controller controls operation of each control module.

Abstract: An apparatus for performing in-situ curvature measurement of a substrate during a deposition process is provided which includes a clamp for retaining the substrate near one end while leaving the opposite end free. A plurality of displacement sensors are arranged in a spaced apart fashion along the length of the substrate and are directed to a surface of the substrate opposite a surface to be coated. Each sensor provides a signal to a computer corresponding to a position of the substrate relative to the sensor. The computer receives and stores data from the displacement sensors to determine a stress evolution during a deposition process and to determine a coating modulus based upon a resultant curvature of the substrate.

Abstract: A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.

Abstract: A control system for assisting in applying a uniform layer of liquid to a substrate. The control system monitors a fluid pump advantageously integrated directly with an extrusion head. The pump receives the material to be deposited from a remote reservoir and controls dispersion of fluid to the extrusion head. The pump dispense rate is controlled by hydraulic pressure selectively applied by a flow control motor. The control system ensures that a steady-state flow of the liquid is maintained while preventing transient perturbations during initial extrusion startup.

Abstract: There is provided a method for feeding a corrosion inhibitor, that is capable of feeding a corrosion inhibitor necessary for preventing corrosion on steam lines and/or condensate lines without wasting any part thereof and is free from causing trouble of water level control. The method consists of the step of feeding a corrosion inhibitor to a steam line 3 or a condensate line 5 in a boiler system having the condensate line 5.

Abstract: The automated system includes a fluid dispenser having an applicator tip which is used to apply a fluid to an object. A compliance mechanism is utilized to assist in maintaining the applicator tip of the fluid dispenser in contact with the object during the coating operation. A robot can be utilized to advance the object past the applicator tip during the coating operation. The fluid dispenser is mounted on a movable arm to allow the fluid dispenser to be moved or rotated into and away from the position where fluid is applied to the object. The automated system provides a fluid application system that can apply a precise and repeatable layer of fluid to an object. The use of the robot allows larger objects to be easily handled and for the coating process to be done in a rapid fashion. The automated system is flexible and can readily accommodate changes in the object that is to be coated or the configuration of the coating that is to be applied to the object.

Abstract: A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.