Abstract: Disclosed is a supercritical processing apparatus which can suppress the occurrence of pattern collapse, improve the throughput, and prolong a maintenance interval. In the disclosed supercritical processing apparatus to remove a liquid remained on a substrate by a super-critical state processing fluid, a heating unit heats the processing fluid to place the processing fluid into a processing receptacle in a supercritical state, and a cooling mechanism forcibly cools an area capable of transferring the heat to the substrate from the heating unit in order to suppress the liquid from being evaporated from the substrate until the substrate is disposed on a seating unit.

Abstract: A liquid processing system includes a liquid processing section including liquid processing units horizontally disposed therein and each configured to perform a liquid process while supplying a process liquid onto a substrate; a process liquid storing section that stores the process liquid to be supplied to the liquid processing units of the liquid processing section; and a piping unit including a supply pipe configured to guide the process liquid from the process liquid storing section to the liquid processing units. The process liquid storing section, the piping unit, and the liquid processing section are disposed inside a common casing in this order from below. The supply pipe of the piping unit has a horizontal pipe portion horizontally extending along an array direction of the liquid processing units, such that the process liquid is supplied from the horizontal pipe portion to the liquid processing units individually.

Abstract: A vehicle mountable system for cleaning trash receptacles with wash-water. The system includes an enclosure with an access opening, supported on the vehicle, and a carriage disposed within the enclosure. A spray head is aligned to impinge wash-water against the trash receptacle while it is engaged with the carriage. A basin is aligned to accumulate wash-water drainage from the spraying operation. A spray shield is operated to a closed position that reduces wash-water effluence from the enclosure. The system may include a filter and means for sanitizing wash-water that is accumulated by the basin and recirculated through a holding tank. An automated arm engages a trash receptacle to engage and disengage the trash receptacle with the carriage through the access opening in the enclosure. Plural trash receptacles can be engaged with the carriage and advanced through plural positions within the enclosure.

Abstract: The invention relates to a method for the pretreatment of polymer surfaces of components (20), which are to be painted, where at least one polymer surface of at least one component (20) is cleaned inside a pretreatment cell (12) and is subsequently reacted with an oxidizing flame, the cleaning of the polymer surface and the treatment of the polymer surface with an oxidizing flame being carried out in the same pretreatment cell (12).

Abstract: An imprint lithography apparatus including a service station.

Abstract: The present invention provides an apparatus for recycling noble metals, which comprises one or more conveyers, one or more carriers, an immersion device, one or more dissolution devices, and one or more rinse devices. The carriers, the immersion device, the dissolution devices, and the rinse devices are arranged in U-shape. Thereby, adding an object containing noble metals or pouring the object containing noble metals can be performed on the same side of the apparatus for recycling noble metals. Hence, a user needs not to operate on both sides of the apparatus for recycling noble metals, enhancing ease of operation. The carriers carry objects containing noble metals. The conveyer is used for conveying the carriers to the immersion device, the dissolution devices, and the rinse devices sequentially for recycling noble metals from the objects containing noble metals. The apparatus according to the present invention can recycle noble metals continuously.

Abstract: Apparatus to clean silicon electrode assembly surfaces which controls or eliminates possible chemical attack of electrode assembly bonding materials, and eliminates direct handling contact with the parts to be cleaned during acid treatment, spray rinse, blow dry, bake and bagging. Aspects of the apparatus include a kit including an electrode carrier to hold an electrode assembly, a treatment stand to allow access to the electrode assembly, a spider plate to clamp the electrode assembly in the electrode carrier, a nitrogen purge plate to supply nitrogen gas to the backside of the electrode assembly during acid cleaning of the electrode, a water rinse plate to supply water to the electrode face, a blow dry plate to supply nitrogen to dry the electrode assembly and a bake stand to support the electrode assembly during a bake before placing the clean electrode assembly in a bag.

Abstract: A method and system for positioning a wafer on a bake plate in a processing module that includes lowering a bake plate cover assembly over the wafer during a baking process, raising the bake plate cover assembly after the baking process, removing the wafer, determining whether the bake plate cover assembly requires cleaning, then either processing another wafer if the cover assembly does not need cleaning or establishing a cleaning process for the bake plate cover assembly if the cover does need cleaning. Automated sensing of the state of the cover assembly may be employed, and cleaning process may be automatically performed in response to the cleaning need determination.

Abstract: A system and method for extracting active elemental iodine from the contact of water with stored crystal iodine and for introducing the extracted elemental iodine into a water supply line and/or otherwise making the extracted elemental iodine available for an intended use. The system operates by allowing a portion of the water entering from a water supply line to be redirected to a first housing where it makes contact with stored crystal iodine causing to extract active elemental iodine. The iodinized water leaves the first housing and enters a second housing where it makes contact additional stored crystal iodine to help stabilize the elemental iodine concentration. The system can be designed to provide the elemental iodine in more than one potency concentration through the use of a metering valve and different travel routes for the elemental iodine out of the second housing.

Abstract: A substrate processing apparatus comprises an interface block. An exposure device is arranged adjacent to the interface block. The interface block comprises first and second cleaning/drying processing units. A substrate W is subjected to cleaning and drying processing before exposure processing in the first cleaning/drying processing unit, while being subjected to cleaning and drying processing after the exposure processing in the second cleaning/drying processing unit.

Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. The invention includes spraying a line of fluid to a substrate, thereby creating an air/fluid interface line on the substrate; supplying a line of drying vapors to the air/fluid interface line, thereby creating a Marangoni drying effect along the air/fluid interface line; and moving the substrate relative to the air/fluid line. Numerous other aspects are provided.

Abstract: A plasma cleaning method particularly useful for removing photoresist and oxide residue from a porous low-k dielectric with a high carbon content prior to sputter deposition. A remote plasma source produces a plasma primarily of hydrogen radicals. The hydrogen pressure may be kept relatively low, for example, at 30 milliTorr. Optionally, helium may be added to the processing gas with the hydrogen partial pressure held below 150 milliTorr. Superior results are obtained with 70% helium in 400 milliTorr of hydrogen and helium. Preferably, an ion filter, such as a magnetic filter, removes hydrogen and other ions from the output of the remote plasma source and a supply tube from the remote plasma source includes a removable dielectric liner in combination with dielectric showerhead and manifold liner.

Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes a substrate replacement group. The substrate replacement group has a stack of three cleaning/drying processing units. The cleaning/drying processing unit subjects the substrate after exposure processing to cleaning and drying processing.

Abstract: The invention provides probe washing cups and methods. A probe washing cup has a washing well and a waste cup. A drying section is disposed between an open end of the probe washing cup and an inlet plane of the washing well. The drying section has a channel that is aligned with the washing well. The channel has an opening for receiving the probe therethrough.

Abstract: A tunnel washer that includes fluid exhaust paths that are optimized to minimize fluid transfer between chambers of the washer and minimize heat loss from each chamber of the washer. The fluid exhaust paths also facilitate uniform vapor evacuation from each chamber of the washer. The tunnel washer also includes spaced-apart double wall curtains for isolating chambers of the tunnel washer to prevent fluid and heat transfer therebetween, and to the exterior of the tunnel washer. The double wall curtains include surfaces that inhibit the curtains from sticking together during operation of the tunnel washer. The tunnel washer also includes an air manifold that provides uniform drying efficiency for articles of varying dimensions.

Abstract: An apparatus for rinsing an article includes a tank having an upper portion, the upper portion including a rim; a discharge pipe connected to the tank; a generally cylindrical spray assembly disposed in a middle portion of the tank; a second tank; a source of rinse fluid connected to the second tank and to the spray assembly through a valve, the valve being operable to open to both the second tank and the spray assembly when a level of rinse fluid in the second tank is decreasing and operable to close to both the second tank and the spray assembly when the level in the second tank is at a full level; a fluid connection between the second tank and the rim of the tank; and a second valve disposed in the fluid connection and operable to open to allow rinse fluid to flow from the second tank to the rim of the tank and operable to close to allow refilling of the second tank.

Abstract: The invention provides probe washing cups and methods. A probe washing cup has a washing well and a waste cup. A drying section is disposed between an open end of the probe washing cup and an inlet plane of the washing well. The drying section has a channel that is aligned with the washing well. The channel has an opening for receiving the probe therethrough.

Abstract: A tunnel washer that includes fluid exhaust paths that are optimized to minimize fluid transfer between chambers of the washer and minimize heat loss from each chamber of the washer. The fluid exhaust paths also facilitate uniform vapor evacuation from each chamber of the washer. The tunnel washer also includes spaced-apart double wall curtains for isolating chambers of the tunnel washer to prevent fluid and heat transfer therebetween, and to the exterior of the tunnel washer. The double wall curtains include surfaces that inhibit the curtains from sticking together during operation of the tunnel washer. The tunnel washer also includes an air manifold that provides uniform drying efficiency for articles of varying dimensions.

Abstract: The present invention provides a drying apparatus capable of satisfactorily drying a workpiece by using a dry vapor The drying apparatus has a control device for controlling a supply of a carrier gas and a supply of a dry vapor into a processing tank holding workpieces. A drying process carries out a carrier gas supply step of supplying the carrier gas and a mixed fluid supply step of supplying a mixed fluid prepared by mixing the carrier gas and the dry vapor alternately. A total mixed fluid supply time for which the mixed fluid supply step is executed is not shorter than 57% of a total processing time for which the carrier gas supply step and the mixed fluid supply step are executed.

Abstract: [Object] To provide a surface treatment apparatus capable of carrying out a surface treatment, a water washing process, a drying process, etc. automatically in an assembly line manner and in a space-saving installation area.

Abstract: Embodiments of the present invention improve the efficiency of a cleaning process for cleaning a component part of a magnetic disk drive in a magnetic disk drive manufacturing line. According to one embodiment, a magnetic disk part cleaning apparatus is included in a head stack assembly (HSA) cleaning line for cleaning head stack assemblies of magnetic disk drives included in a magnetic disk drive manufacturing line. The magnetic disk part cleaning apparatus is disposed between a HSA assembly line for assembling a head stack assembly, and head disk assembly (HDA) assembly line for assembling a head disk assembly including the head stack assembly and is connected directly to at least either of the HSA assembly line and the HDA assembly line.

Abstract: An apparatus and method are provided to treat for example a semiconductor wafer substrate wherein a delivery means for heat, a cryogen, and a fluid chemical reactant, is disposed in a chamber in which the substrate is disposed for at least one surface of the substrate to be cleaned in the chamber. The chamber may also consist of a plurality of stations for chemically treating, providing cryogen to the substrate to effect such cleaning and heating. Air is provided in the chamber in a laminar flow substantially parallel to the surface being treated to remove displaced material from the surface and prevent redeposition of the material on the substrate surface.

Abstract: Provided are a substrate treating apparatus and a method of manufacturing the substrate treating apparatus. Processing units of a process equipment are modularized, and the modularized processing units are detachably disposed in a main frame. According to this characteristic, work time and work effort required for manufacturing the process equipment can be reduced. In addition, maintenance/repair of each of the processing units can be further easily performed.

Abstract: A container rinsing system (10) has an air nozzle adapted to be positioned proximate an opening of the container and adapted to direct a supply of compressed air to the container. A vacuum member is adapted to be in communication with a vacuum source. The vacuum member is positioned around the air nozzle and adapted to vacuum foreign particles away from the container.

Abstract: Provided are an apparatus for cleaning a substrate by dipping the substrate in a treating bath filled with a treating solution and a method for cleaning a substrate using the apparatus. A boat provided to each of the treating baths supports the substrate by being in contact with a different point of a substrate during a process. Contact points of the substrate which each of the boats supports are made different at every treating bath, so that contact points of a substrate which are not cleaned in any treating bath can be cleaned in different treating baths. Therefore, an efficiency of a cleaning process is improved.

Abstract: A cleaning/drying apparatus including a vapor area where vapor of an organic solvent inside the cleaning/drying apparatus is generated, an ejecting part configured to eject the organic solvent onto a cleaning/drying target, a first detecting part configured to determine whether the temperature of the cleaning/drying target is a first temperature equivalent to a temperature of the vapor in the vapor area, a second detecting part configured to determine whether the temperature of the cleaning/drying target is a second temperature enabling the organic solvent to condense on a surface of the cleaning/drying target, and a cleaning/drying control part configured to drive the ejecting part to eject the organic solvent when the first detecting part detects that the temperature of the cleaning/drying target is the first temperature and stop the ejection when the second detecting part detects that the temperature of the cleaning/drying target is the second temperature.

Abstract: [Object] It is an object of the invention to provide a cleaning apparatus for cleaning a precision substrate capable of preventing a contamination factor from adhering again, to prevent a natural oxide film from being formed, and to prevent a water mark.

Abstract: A cleaning processing part including an edge cleaning processing unit for cleaning an edge of a substrate is provided in an indexer block. An indexer robot provided in the indexer block transports an unprocessed substrate taken out of a cassette to the cleaning processing part before transporting the unprocessed substrate to an anti-reflection film processing block serving as a processor. The cleaning processing part cleans an edge and a back surface of a substrate.

Abstract: An apparatus and method for removing photoresist from a substrate, which includes treating the photoresist with a first reactant to cause swelling, cracking or delamination of the photoresist, treating the photoresist with a second reactant to chemically alter the photoresist, and subsequently removing the chemically altered photoresist with a third reactant. In one example, the first reactant is supercritical carbon dioxide (SCCO2), the second reactant is ozone vapor, and the third reactant is deionized water.

Abstract: An end effector for a transport robot arm for a wafer wet cleaning system has an arm with a chuck at an end of the arm to support a wafer. The chuck also includes a cavity to spray a bottom surface of the wafer with a cleaning fluid. At least two branches extend from the chuck away from the arm with a roller at the end of each branch to hold the wafer. A spray bar is coupled to the arm. The spray bar is configured to hold and spray a top surface of the wafer with the cleaning fluid.

Abstract: This invention relates to a mask cleaning apparatus 101 and a method of cleaning a mask substrate 110. An embodiment according to the invention is a mask cleaning apparatus 101 with a trap comprising a cold trap 120. An additional heater 130 performs the heating function. The mask cleaning apparatus 101 further comprises a support means 105, an aerosol nozzle 150 for blowing aerosol 155 towards the mask substrate 110. In a first stage of the cleaning process the mask substrate 110 is close to the heater 130, and the mask substrate 110 is heated. In a second stage of the cleaning process, the gas flow 170 is stopped, and the mask 110 is transported close to the cold trap 120. The cold trap 120 is cooled. In a third stage of the cleaning process, the aerosol nozzle 150 blows aerosol 155 towards the mask substrate 110, which detaches particles from the mask substrate 110. This embodiment uses thermophoretic forces for trapping detached particles.

Abstract: A commercial dishwasher comprising spray nozzles for spraying liquid into a treatment region in the form of a treatment chamber or a treatment zone for treating items to be washed; at least two centrifugal pumps, which are arranged in series hydraulically one behind the other, for conveying liquid from the wash tank to the spray nozzles; a control device for alternatively operating only one centrifugal pump or at least two of the centrifugal pumps which are connected hydraulically one behind the other in series, in order to thus generate different liquid pressures.

Abstract: An apparatus and method for treating subject materials with compositions includes a material treatment section for treating a subject material with a composition of a silane-containing material and a hydrocarbon solvent to form a treated material, and a neutralizing section for neutralizing the treated material such that the treated material has a pH in a range of approximately 7 to approximately 8.

Abstract: A conveyor-type dish washer and method of operating it, wherein items to be cleaned are conveyed through the dishwasher and are subjected to the action of steam prior to a final-rinse operation but after a wash operation.

Abstract: A substrate processing apparatus of a simplified structure, which is capable of decreasing an amount of a process liquid to be used, and of restraining change in temperature of the process liquid is provided. The substrate processing apparatus includes: a processing unit that holds one substrate and processes the substrate held by the processing unit; a processing bath capable of simultaneously accommodating a plurality of substrates, the processing bath storing a process liquid into which a substrate is immersed so as to be processed, the process liquid being circulatingly supplied to the processing bath; and a transfer unit that simultaneously transfers substrates whose number is less than the number of substrate that can be accommodated in the processing bath. The transfer unit transfers, at least, to the processing bath in which the process liquid is stored. A substrate is processed with the use of at least one of the processing unit and the processing bath.

Abstract: The invention relates to a method of a cleaning a metal strip (1). In order to improve the cleaning of the strip, according to the invention, it is provided that the metal strip (1) is first subjected to a first high-pressure cleaning (4) with at least one liquid jet in a first region (2) of a cleaning device (3), and in that the metal strip (1) thereafter is subjected to an ultrasonic cleaning (6) in a second region off the cleaning device (3), at which the metal strip (1) is displaced through a container filled with liquid. The invention further relates to a device for cleaning a metal strip.

Abstract: A continuous-flow dishwashing machine and a method for operating the dishwasher is provided. The continuous-flow dishwashing machine is used for cleaning items to be cleaned and has a feed device for transportation of the items to be cleaned in the feed direction through successive treatment zones in the continuous-flow dishwashing machine. This optionally contains an initial cleaning zone, at least one cleaning zone, at least one rinsing zone and, optionally, a drying zone. Means are provided in the at least one rinsing zone in order to supply dishwashing liquid for the at least one rinsing zone to at least one cleaning zone and/or to the initial cleaning zone, as required by a machine controller and governed by a controller, with the decision on the zone to which the dishwashing liquid for the at least one rinsing zone is passed depending inter alia on level states in the at least one cleaning zone and the at least one rinsing zone.

Abstract: In an apparatus and method for removing a photoresist structure from a substrate, a chamber for receiving the substrate includes a showerhead for uniformly distributing a mixture of water vapor and ozone gas onto the substrate. The showerhead includes a first space having walls and configured to receive the water vapor, and a second space connected to the first space so that the water vapor is supplied to and partially condensed into liquid water on one or more walls of the first space. Ozone gas and water vapor without liquid water may be supplied to the second space to form the mixture therein. The showerhead may be heated to vaporize the liquid water on a given surface of the first space.

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back

Abstract: The invention provides a substrate processing apparatus including a processing tank for processing substrates, a transporting path provided along the processing tank, a substrate transporting device moving along the transporting path for transporting the substrates, wherein the substrate processing apparatus and the substrate transporting device mounted thereto may realize the improvement of the throughput of substrate processing without increasing the area for installing the substrate processing apparatus. There are provided at least two substrate transporting devices that are capable of moving on the identical transporting path. The movable ranges of the respective substrate transporting devices for transporting the substrates are overlapped with respect to each other. When transportation of the substrates is required simultaneously at a plurality of processing tanks in scheduling data prepared by a scheduler, the scheduling data is determined by referencing substrate transportation sharing conditions.

Abstract: A method of cleaning a semiconductor device. The method includes: A chemical cleaning using an organic solvent without using deionized water. An iso propyl alcohol cleaning using the iso propyl alcohol. Drying by inserting the semiconductor device into a dryer and then ejecting an inert gas thereto to dry and clean simultaneously. A method may clean a semiconductor device without using deionized water, so that corrosion of the semiconductor device can be substantially prevented by avoiding the use of deionized water, while substantially removing containments from the semiconductor device.

Abstract: Methods, apparatus, and systems are provided for efficiently reclaiming solvents used to clean surfaces of semiconductor wafers, etc. More particularly, embodiments of the present invention provide an in-situ reclaim approach that utilizes condensing mechanisms to reclaim evaporated solvent components. In these embodiments, the condensing can occur within a proximity head itself and/or along a vacuum line running from the proximity head to a vacuum tank. Other embodiments of the present invention provide an in-situ reclaim approach that prevents the evaporation of solvents at the onset by maintaining appropriate equilibrium gas phase concentrations between the liquid chemistries and gases used to process wafer surfaces.

Abstract: After subjected to a developing process, a rinsing process and a replacing process in this order in a developing unit 10A, 10B, a substrate W wet with an anti-drying solution is wet-transported to a supercritical drying unit 20 by a primary transport robot 30. The supercritical drying unit 20 performs a high-pressure drying process (supercritical drying process) in a dedicated manner. Accordingly, by virtue of the presence of the anti-drying solution, the substrate W is effectively prevented from becoming air-dry during the transportation of the substrate W.

Abstract: A design process for a conveyor-type warewash machine involves consideration of Weber number for flow from nozzles within at least one zone of the machine. Warewash machines having one or more zones with flows within certain Weber number limits or ranges are also described.

Abstract: A method for evaluating and guaranteeing a thermal hygienic effect in a conveying dishwashing machine preferably a multi-chamber dishwasher, is provided. The inventive dishwasher is provided with one or several sensors which are fixed therein and transmit a temperature inside each treatment areas to a machine controller, preferably a controller for the conveying dishwashing machine. The machine controller determines the thermal hygienic effect by means of heat equivalent-based temperature and time acting on a cleanable object. A washing process is controlled in such a way that predetermined quantity of heat equivalents is transmitted to the cleanable object.

Abstract: After the completion of a cleaning process by deionized water on substrates in a first processing bath, alcohol is supplied to the first processing bath by an alcohol supply part, to replace a processing liquid in the first processing bath by alcohol. Then, a cleaning process by a liquid of fluorinated solvent is executed on the substrates in a second processing bath in a chamber. After that, the substrates are lifted out of the second processing bath, to be subjected to a drying process by gas of fluorinated solvent in the chamber. This prevents poor drying caused by complicated structures (trenches and holes) formed on the surfaces of the substrates.

Abstract: An automatic cart wash apparatus. The automatic cart wash apparatus provides improved cleaning of stock carts on a regular basis over manual cleaning by store employees. The automatic cart wash apparatus includes three main stages: a debris removal (vacuum) stage, a cleaning (wash, sanitize, rinse) stage, and a drying stage. The debris removal stage uses forced air and/or suction to remove solid and generally non-soluble waste, such as a paper or other trash and debris, from a stock cart. The cleaning stage uses a selection of detergents, sanitizing agents, and rinse agents to remove soluble or sticky waste, such as food and liquids, and to kill germs, viruses, and bacteria present on the cart. The drying stage removes excess liquids from the cart making it ready for use by the next customer.

Abstract: A wet etching apparatus and method to shorten processing time and to eliminate formation of unintended mask pattern are described. In the conventional art, after a mask pattern is formed, alien substances such as water mist or stain are left on the substrate. The alien substances act as an etching block in the wet etching process. This generates an unintended mask pattern. The present invention uses ultraviolet light to remove the alien substances prior to the etching process. When the alien substances are removed, the intended mask pattern is generated after the etching process. The wet etching device according to the present invention includes an ultraviolet cleaner and a conveyor to convey substrates to and from the ultraviolet cleaner. Spaces for the ultraviolet cleaner and the conveyor are created in the wet etching apparatus by reducing space for cassettes and reducing space required by the loader.

Abstract: It is an object of the invention to provide a cleaning apparatus which can subject wafers that have undergone polishing to various cleaning processes while reducing the usage amount of pure water, increase the processing speed of wafers per unit floor area and significantly improve the operating rate, enable change or rearrangement of a plurality of cleaning processing chambers to more optimum arrangement in accordance with the cleaning treatment processes and the like, prevent generation of defects in wafers that are in process of, for example, pre-treatment, and simplify the configuration of the apparatus.

Abstract: A liquid processing system includes a liquid processing section including liquid processing units horizontally disposed therein and each configured to perform a liquid process while supplying a process liquid onto a substrate; a process liquid storing section that stores the process liquid to be supplied to the liquid processing units of the liquid processing section; and a piping unit including a supply pipe configured to guide the process liquid from the process liquid storing section to the liquid processing units. The process liquid storing section, the piping unit, and the liquid processing section are disposed inside a common casing in this order from below. The supply pipe of the piping unit has a horizontal pipe portion horizontally extending along an array direction of the liquid processing units, such that the process liquid is supplied from the horizontal pipe portion to the liquid processing units individually.