Abstract: Purge bars for blowing excess residual cleaning fluid from an object, particularly a semiconductor wafer, before or as the wafer is removed from a cleaning chamber of a CMP cleaner, for example. Typically, a purge bar is mounted on each side of the cleaning chamber for blowing nitrogen or clean, dry air (CDA) against a corresponding surface of the wafer to remove the excess cleaning fluid from the wafer. The purge bars may be connected to a controller for a wafer transfer device which removes the wafer from the cleaning chamber, such that the purge bars are actuated as the wafer transfer device begins to remove the wafer from the chamber.

Abstract: An electrostatic charge-free solvent-type dryer for drying semiconductor wafers after a wet bench process is disclosed in a preferred embodiment and in an alternate embodiment. In the preferred embodiment, the electrostatic charge-free solvent-type dryer is constructed by a tank body, a wafer carrier, an elevator means, a tank cover and a conduit for feeding the flow of solvent vapor. At least one of the tank cover, the conduit for feeding the flow of solvent vapor and the plurality of partition plates is fabricated of a non-electrostatic material such that electrostatic charge is not generated in the flow of solvent vapor. In the alternate embodiment, a deionizer is further provided in the tank cavity for producing a flux of positive ions to neutralize any negative ions that are possibly produced in the flow of solvent vapor.

Abstract: A cleaning processing apparatus and method of wafers W held by a rotor capable of holding a plurality of wafers W, which is one embodiment of the liquid processing apparatus of the present invention, comprises an outside chamber, an inside chamber arranged slidable between a process position and a retreat position, and a cleaning mechanism for cleaning the inside chamber in the retreat position. The cleaning mechanism includes a cylindrical body arranged in the inside chamber so as to form a substantially cylindrical cleaning processing space between the inside chamber and the cylindrical body, a cleaning liquid spurting nozzle for spurting a cleaning liquid into the cleaning processing space, and a gas supply nozzle for supplying a predetermined drying gas into the cleaning processing space so as to make it possible to clean and dry the inside chamber.

Abstract: During the treatment, in particular cleaning, disinfecting and drying, of used, dirty endoscopes, in order to render them suitable once again for subsequent use, the following steps take place: placing a used, dirty endoscope in a rack, connecting the passages of the endoscope to a connection block which is arranged in a fixed position in the rack, placing the rack, with the endoscope therein, in at least one device for treating the endoscope, the connection block being connected to a counter-connection block which is present in the treatment device, in order to bring about a connection between the endoscopes and the treatment device, subjecting the endoscope which is accommodated in the rack to a specific treatment in the treatment device, taking the rack with the endoscope therein out of the treatment device, and uncoupling the endoscope from the connection block after it has been taken out of the final treatment device.

Abstract: A wet cleaning device for chemically cleaning a plurality of wafers. The wet cleaning device includes a plurality of first chemical cleaning tanks for conducting a first cleaning procedure, a plurality of second chemical cleaning tanks for conducting a second cleaning procedure, a transferring tank including a first measuring device for measuring the wafers after the first cleaning procedure, a measuring tank including a second measuring device for measuring the wafers after the second cleaning procedure, a first transporting device, and a second transporting device.

Abstract: Methods and apparatus for cleaning hearing aid devices are disclosed. Drying is facilitated in hearing instruments through a novel combination of heater and desiccant in an essentially closed system. Greater efficiency is obtained by minimizing the volume of gas, e.g., air, requiring moisture extraction.

Abstract: This apparatus for the preparation and/or regeneration of detergent reels of fabric for cleaning printing cylinders or cylinders of similar precision has the characteristic of impregnating the fabric (4) by its immersed transit through a suitable container (10), and by a subsequent sinuous passage involving its pressing and folding in alternate directions by a plurality of rollers implementing uniform distribution of the detergent, said passage terminating with winding the fabric into a new reel (8) of collected fabric which, thus treated, has acquired and/or conserved properties suitable for its use.

Abstract: Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

Abstract: A dryer for drying a substrate includes: a bath containing a fluid; a chamber; and an isopropyl alcohol delivery system supplying isopropyl alcohol vapor to the interface between the substrate and the fluid when the substrate is removed from the fluid of the bath into the chamber. The isopropyl alcohol vapor is supplied perpendicularly to a vertical axis of the substrate. The dryer further includes a chamber environment control system that supplies a gas into the chamber to dry the substrate and controls temperature and humidity in the chamber and a chamber heater attached to the chamber to transfer thermal energy into the chamber. A drying method includes: immersing a substrate into a fluid contained in a bath; removing the substrate from the fluid into a chamber; and supplying isopropyl alcohol vapor into an interface between the substrate and the fluid perpendicularly to a vertical axis of the substrate.

Abstract: An apparatus and system for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The apparatus and system includes a chamber for partially immersing the substrate in a solvent (e.g., deionized water), a chamber for receiving an oxidizing gas (e.g., ozone), and a mechanism for rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas.

Abstract: Apparatuses and methods of processing a substrate. The apparatus includes a wet-cleaning chamber, a drying chamber, and a substrate transferring chamber which transfers a substrate to and from the wet-cleaning chamber and the drying chamber. The drying chamber is one of a supercritical drying chamber or a low pressure drying chamber. The wet-cleaning chamber is one of a single-wafer cleaning chamber, a horizontal spinning chamber, a megasonic wet-cleaning chamber, or a horizontal spinning chamber having acoustic waves transmitted to the substrate.

Abstract: There is disclosed a scrub cleaning device which can reduce cleaning time and which requires no large-scaled device for transferring a substrate to the next cleaning process.

Abstract: A computer-implemented method and system for cleaning a contaminated cannula so that it may be reused includes moving the contaminated cannula from a drug reconstitution station where the cannula is used to prepare a drug solution into a first rinsing station where the cannula is cleaned. A database is referred to to determine what drug solution the cannula has been contaminated with, and to determine a first amount of cleaning fluid that needs to be passed internally through the cannula, and a second amount of cleaning fluid that needs to be passed externally about the cannula so that there is effectively no contaminant remaining inside and outside of the cannula. The first amount of cleaning fluid is passed internally through the cannula. The second amount of cleaning fluid is passed externally about the cannula. After the cannula is cleaned, the cannula is moved to the drug reconstitution station to prepare another drug solution.

Abstract: A machine for cleaning a die by using electrolysis and ultrasonic vibration which has in combination a degreasing processing system, an electrolytic-cleaning system with an electrolyte circulator system, and a rinse system. The die, in a container, is dipped into an electrolytic liquid tank with an ultrasonic vibrator, and it is electrolyzed in a cleaning medium for large sized dies and die components.

Abstract: A photoresist stripping apparatus and a corresponding method for removing photoresist layers after a patterned polyimide layer is developed. The photoresist-stripping apparatus includes a transporting unit, a stripping unit, a washing unit, a drying unit and a control unit. The transporting unit connects the stripping unit, the washing unit and the drying unit. The control unit is responsible for controlling the transport sequence and timing of the transporting unit. The method of stripping the photoresist layer off the OLED panel includes providing a stripping solution to the stripping unit to remove photoresist layers. The OLED panel is jet-cleaned with a washing solution in the washing unit so that any residual stripping agent is removed. Finally, the surface of the OLED panel is blown dry.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: An apparatus for wet cleaning or etching of flat substrates comprising a tank with an inlet opening and outlet opening for said substrates. Said tank contains a cleaning liquid and is installed in a gaseous environment. At least one of the openings is a slice in a sidewall of the tank and is present below the liquid-surface. In the tank there may be a portion above the liquid filled with a gas with a pressure being lower than the pressure within said environment. The method comprises the step of transferring a substrate through the cleaning or etching liquid at a level underneath the surface of said liquid making use of said apparatus.

Abstract: A clean equipment for removing polymer residues on sidewalls of metal lines and method thereof are provided. The present clean equipment comprises a stripping solution bath, at least an organic solvent bath, an overflow bath and a dryer. A gas bubbler and a lattice-like cassette stage are positioned within the organic solvent bath. The gas bubbler provides gas flow in the organic solvent bath to increase the convection of the organic solvent. The lattice-like cassette stage is used for supporting cassettes for carrying wafers. By way of increasing the number of bubbling apertures of the gas bubbler and designing the gas bubbler structure in a way that preventing the bubbling apertures from being blocked by the lattice-like cassette stage, the convection effectiveness of the organic solvent is increased. Thereby, the stripping solution can be effectively removed with the organic solvent.

Abstract: An apparatus for conveying a workpiece as used to convey the workpiece such as a semiconductor wafer, a glass substrate or liquid crystal panel, between processing apparatuses when the workpiece is processed in the plurality of processing apparatuses. The amount of liquid on a surface of a workpiece is adjusted to a predetermined amount, and the workpiece, which retains the predetermined amount of liquid, is conveyed between processes. The adjusting includes both supplying a sufficient amount of liquid onto the surface of the workpiece, which is in a certain state, and removing a certain amount of liquid from the surface of the workpiece.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: A unified strip/cleaning apparatus wherein a strip device is integrated with a cleaning device. In the apparatus, a strip line removes resin on a substrate and a cleaning line is provided under the strip line to clean and dry the substrate. A loader supplies the substrate to the strip line, and an unloader receives the substrate from the cleaning line. Accordingly, the installation space can be minimized.

Abstract: Disclosed is a compact apparatus for manufacturing semiconductor wafers, which is aimed at complete removing of moisture from the wafers after final cleaning while reducing the manufacturing time. The apparatus includes a cleaning chamber (1) for final cleaning, a storage chamber (3) for storing wafers, a transfer chamber (2) communicating with the both cleaning and storage chambers (1, 3), and formed in its upper wall with a heat-conducting window (7), a robot hand (5) and a robot arm (4) for transporting the wafer (W) from the cleaning chamber (1) to the storage chamber (3) within the transfer chamber, infrared lamps (6) arranged to face the window (7) outside the transfer chamber (2) so as to heat the wafer (W) in the course of transportation within the transfer chamber, gas supply ports (8) for producing a laminar flow of inert gas from the storage chamber (3) to the cleaning chamber (1) to expose wafers (W) with the gas, and exhaust ports (9) for exhausting the moisture removed from wafers.

Abstract: A system and method have been provided for cleaning integrated circuit and liquid crystal display substrates of organic residue, such as photoresist, using a high concentrate ozonated water. Chilled water is used to increase the ozone concentration in the water to approximately 90 parts per million. The cleaning method is especially effective when used subsequent to an organic stripping process. The etching rates of the combined process are effective, and the use of the high concentrate ozonated water after the organic stripper also removes any contaminants on the substrate accumulated as a result of using the organic stripper.

Abstract: A method for drying a disk-shaped substrate. The substrate is typically a substrate used for the manufacture of magnetic disks, and has a centrally located opening. The substrate is lowered into a liquid bath by a first holder, which also becomes immersed in the bath. The first holder lifts the substrate until the substrate extends partially out of contact with the liquid. A second, dry holder grabs a dry portion of the substrate that extends out of the bath, and continues to lift the substrate out of contact with the liquid.

Abstract: The present invention relates generally to a new process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, this invention is concerned with removing a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. This invention is also concerned with cleaning of solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board.

Abstract: A buffer station for an article handling system, the handling system having a general path along which it moves when handling the article, the buffer station including at least two supporting assemblies including supporting elements forming a supporting plane each capable of supporting an article within the supporting plane and located so as to support the article within the general path, at least two receptacles for liquid in which the at least two supporting assemblies are disposed, and at least two drivers associated with the at least two supporting assemblies and the receptacles for shifting them in and out of the general path.

Abstract: In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.

Abstract: Methods for cleaning a microelectronic substrate in a cluster tool are described that include placing the substrate in a pressure chamber of a module in a cluster tool; pressurizing the pressure chamber; introducing liquid CO2 into the pressure chamber; cleaning the substrate in the pressure chamber; removing the liquid CO2 from the pressure chamber, depressurizing the pressure chamber, and removing the substrate from the pressure chamber. Apparatus for processing a microelectronic substrate are also disclosed that that include a transfer module, a first processing module that employs liquid carbon dioxide as a cleaning fluid coupled to the transfer module, a second processing module coupled to the transfer module, and a transfer mechanism coupled to the transfer module. The transfer mechanism is configured to move the substrate between the first processing module and the second processing module.

Abstract: An outer covering wall (26) and an inner covering wall (27), which are capable of surrounding a rotor (24), can be horizontally moved. A wafer carrier waiting portion (30) is disposed right below the rotor (24). A wafer holding member (41) included in a water lifter (40) moves into a wafer carrier (C) containing wafers (W) and mounted on a stage (31) (sliding table 32) included in the wafer carrier waiting portion (30), lifts up the wafers (W) and transfers the wafers (W) to the rotor (24). The outer covering wall (26) or the inner covering wall (27) surrounds the rotor (24) to define a processing chamber. The wafers (W) held on the rotor (24) are subjected to a cleaning process in the processing chamber.

Abstract: A method of cleaning an article having oil adhered thereto, which enables the article to be cleaned easily in a short period of time and provides a high degree of cleanliness to the article.

Abstract: A method and apparatus is provided for removing material from the edge of a disk. In one embodiment, the edge of the disk is contacted with etchant via an etchant containing swab or trough (which may contain one or more transducers) and is rotated such that successive portions of the disk edge are scanned through the trough or past the swab. To prevent etchant from contacting the major surface of the substrate, and/or to prevent excessive etching, the edge of the disk is contacted with a rinsing fluid (e.g., a rinsing fluid nozzle or a trough filled with rinsing fluid). In a further embodiment material such as residue or particles may be removed via a trough containing sonically energized rinsing fluid.

Abstract: An instrument treatment station includes a station body having a first and second elongate and spaced channel walls. The channel walls define an elongate instrument channel therebetween. The station body defines an elongate drain channel in fluid communication with the instrument channel. The station body further defines a source port in fluid communication with the instrument channel for delivering a fluid flow into the instrument channel for treating an instrument therein. The instrument treatment station may accommodate arrays of aligned instruments.

Abstract: A small-sized cleaning and drying apparatus is provided. Without generating particles, hydrogen gas, etc., the apparatus easily generates an ozone water to form an oxidation film on an object to be processed. The apparatus includes a cleaning part 1 for washing semiconductor wafers W and a drying part 2 for drying the wafers W. The cleaning part 1 is formed by a processing bath 10 storing a chemical liquid or a rinsing liquid. The processing bath 10 is communicated with a chemical source 17 and a pure water source 15 through a rinsing liquid pipeline 14 interposing an ozone water generating unit 21. After completing both chemical treatment and rinsing, it is possible to form the oxidation Elms on respective surfaces of the wafers W and dry them.

Abstract: The method for removing particles that adhere to the surface of semiconductor wafers is constituted so as to sequentially carry out a first cleaning process in which semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 104 containing a first cleaning solution consisting of ozone water, and, after said first cleaning process, a second cleaning process in which said semiconductor wafers 100 are cleaned for a prescribed time in cleaning tank 106 containing a second cleaning solution consisting of hydrogen water.

Abstract: A washed sand drying and handling plant (100) includes a belt feed hopper (1), a conveyor belt (2), a sand rinsing unit (3), a dewatering apparatus (4), a radial conveyor (5) and a sand drying and handling apparatus (6). The sand drying and handling apparatus (6) includes four vesssels or tanks (7). Each tank (7) is generally cylindrically shaped and has a cone-shaped base. Sand is held in the tanks (7) for a predetermined amount of time sufficient to allow the sand to dry to the desired level by gravity.

Abstract: A wafer drying method includes submerging a wafer in a cleaning solution in a dry chamber. An organic liquid vapor from an organic liquid is supplied into the dry chamber at a first volumetric supply rate to form an organic liquid layer on a surface of the cleaning solution, the organic liquid layer having at least a prescribed concentration of the organic liquid. The organic liquid vapor is supplied into the dry chamber at a second volumetric supply rate that is lower than the first volumetric supply rate. During and/or following the supplying of the organic liquid vapor into the dry chamber, at least a portion of the wafer is removed from the cleaning solution through the organic liquid layer.

Abstract: An electrostatic charge-free solvent-type dryer for drying semiconductor wafers after a wet bench process is disclosed in a preferred embodiment and in an alternate embodiment. In the preferred embodiment, the electrostatic charge-free solvent-type dryer is constructed by a tank body, a wafer carrier, an elevator means, a tank cover and a conduit for feeding the flow of solvent vapor. At least one of the tank cover, the conduit for feeding the flow of solvent vapor and the plurality of partition plates is fabricated of a non-electrostatic material such that electrostatic charge is not generated in the flow of solvent vapor. In the alternate embodiment, a deionizer is further provided in the tank cavity for producing a flux of positive ions to neutralize any negative ions that are possibly produced in the flow of solvent vapor.

Abstract: A substrate plating apparatus forms a plating layer on the surface of a substrate and stores the substrate until the next process in a way that the substrate is not exposed to the atmosphere. The substrate plating apparatus is not only capable of introducing semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, but is also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers, thus reducing the number of process and reducing the installation area required for the apparatus. The substrate plating apparatus includes a plating process section (20) for plating a substrate, a washing process section (10) for washing the substrate after the plating process, and a storage vessel (16) containing a storing solution in which the substrate is immersed after having been plated and washed.

Abstract: A system and methods for substrate preparation are provided. In one example, a wafer processing system includes a system enclosure that contains wafer processing apparatus within an isolated wafer processing environment. The wafer processing apparatus include a pair of immersion tanks in the lower front region of the system with a pair of wafer pickers behind the immersion tanks to extract wafers from the tanks. In the rear of the system, a pair of brush boxes are located in a lower region with a pair of dryer units positioned above the brush boxes. A robot arm is positioned between the pair of immersion tanks and the pair of brush boxes in a middle region of the system, and is configured to transition wafers between the processing apparatus. A pair of output shelves holding output cassettes is positioned over the immersion tanks. The output cassettes receive clean wafers after processing. In another example, a method for preparing a substrate is provided.

Abstract: There is provided a substrate cleaning system which is capable of cleaning wafers W in a high cleanliness atmosphere with high accuracy taking an advantage of a sheet-type wet cleaning treatment, and which is simple and compact in construction, and is excellent in cost performance.

Abstract: After a substrate is completely cleaned in a processing bath, de-ionized water is discharged from the processing bath while a supply nozzles supplies nitrogen gas. The supply nozzle discharges IPA vapor toward an opening of the processing bath while the substrate is held in the processing bath. Thus, the IPA vapor flows into the processing bath for drying the substrate held in the processing bath. Consequently, it follows that the IPA vapor may sufficiently be supplied to the processing bath having a smaller volume than a chamber, whereby consumption of vapor of an organic solvent can be reduced.

Abstract: The invention relates to an arrangement and a method for cleaning fine solid particles from a continuously flowing liquid suspension. According to the invention, alternate emptying of cleaned liquid in at least two decanting chambers (34, 36) of the cleaning arrangement (10) is brought about by alternately opening and closing valve units (48, 50) coordinated with outlets (44, 46) of the decanting chambers (34, 36). Alternatively, valves in feeds to at least two separate inlet tanks of the cleaning arrangement can be opened and closed alternately in order to bring about a continuous outflow of cleaned liquid.

Abstract: Liquid is removed from batches of substrates by apparatus and methods for drying substrates that have been wet in an elongated liquid bath. The substrates are moved relative to the bath and an elongated gas-filled volume at rates of movement selected according to the location of the batches of substrates in the bath or the volume. As an example, the substrates and the bath are separated at a controlled rate to form a thin layer of liquid on each substrate as each substrate enters the gas-filled volume. The gas-filled volume is defined by an elongated hot chamber and hot gas directed into the volume and across the substrates and out of the volume continuously transfers thermal energy to the substrates . The flow rate of the gas into the volume is related to introduction of the substrates into the bath to avoid disturbing the liquid in the bath.

Abstract: The present invention includes a method and system for cleaning, disinfecting, or sterilizing objects, such as medical or dental instruments or devices. The system of the invention includes an energy source, such as a sonicator, adapted and configured to impact the object with energy, such as ultrasonic energy; a liquid transporter adapted and configured to circulate around, through, and/or into the object a wash composition, an antimicrobial composition, a rinse composition, or a plurality of these compositions; and a dryer adapted and configured to dry the object, preferably, in the presence of a sterilant. The method of the invention includes contacting the object with a wash composition and energy, such as ultrasonic energy; treating the object with an antimicrobial composition; rinsing the object with a rinse composition; and drying the object, preferably in the presence of a sterilant.

Abstract: In this substrate transport apparatus, portions connecting a transport chamber (101) with a first load-lock chamber (109) and a second load-lock chamber (110) are provided to linearly align with each other. A processing station (120, 121) for processing a substrate (400) is provided on a position not interfering with rotational motion and telescopic motion of a robot arm (106). A substrate transport apparatus capable of improving the degree of integration of the apparatus while suppressing enlargement of a foot print and implementing common load-lock chambers can be provided by employing this structure.

Abstract: A transport enclosure arranged between a first apparatus and a second apparatus, all located in a clean room, is shielded from the clean room and maintained a degree of cleanliness which is cleaner than that of the clean room. Accordingly, the volume of space within the clean room requiring the highest degree of cleanliness is minimized, thereby reducing overall costs.

Abstract: A method for removing photoresist or other organic material from a substrate such as a semiconductor wafer is provided. The method includes partially immersing the substrate in a solvent (e.g., deionized water) in a reaction chamber, injecting an oxidizing gas (e.g., ozone) into the reaction chamber, and rotating or otherwise moving the substrate through the solvent to coat a thin film of solvent over the organic component on the substrate surface and expose the solvent-coated substrate to the ozone gas to remove the organic material from the surface.

Abstract: The invention concerns a method and a machine for cleaning objects in plate form such as screen printing stencils. The method consists in: immersing an object (2) to be cleaned in a cleansing composition bath consisting of an azeotropic liquid solution having a density not less than the density of residues of average density likely to soil the object (2), and adapted to loosen the residues from the object (2) without solubilising them. The object (2) is placed in a vessel with vertical walls at a distance less than 10 cm from the vertical faces of the object (2). The treating vessel (1) spills over into an overflow vessel (8). The cleansing composition is continuously removed from both vessels (1, 8), filtered and re-introduced in the treating vessel (1) top part.

Abstract: Process and apparatus for recovering clean fiberglass and urea formaldehyde from urea formaldehyde treated waste fiberglass, which involves the use of a continuous batch tunnel machine comprising end to end modules in each of which a perforated basket is rotatable and of such construction as to transfer goods within each basket to subsequent baskets and out the end of the basket at the exit of the machine. The waste fiberglass is introduced into the basket at the entrance to the machine to pass the fiberglass out the end of the machine, during which it passes through acid and wash loops in which the recovery takes place.