Abstract: A wafer thinning apparatus for treating wafers each having at least a circuit-forming surface thereof protected, by immersing the wafers in a treating solution. The apparatus includes a support table for receiving, as placed thereon, containers each containing a plurality of wafers in one of groups into which the wafers are sorted according to predetermined ranges of thickness, a treating tank for storing the treating solution and receiving the containers, a transport mechanism for transporting the containers between the support table and the treating tank, and a control unit for controlling the transport mechanism to transport the containers successively to the treating tank, and for changing an immersion time of the containers in the treating tank for each group.

Abstract: A liquid processing apparatus has a substrate rotating device including a holder for holding a substrate and a motor, a chamber for applying the liquid processing to the substrate, a posture changing mechanism for changing the posture of the substrate rotating device at outside of the chamber such that a state of the substrate held by the holder changes between vertical and horizontal, and a position adjusting mechanism for relatively adjusting the positions of the chamber and the substrate rotating device together with the posture changing mechanism such that the holder is housed in the chamber. The substrate is taken out from the container and held by the holder in a horizontal state. After the posture of the holder was changed to vertical, a process liquid is supplied to the substrate of vertical state.

Abstract: This invention is related to an apparatus for treating substrates. According to the present invention, the substrate is cleaned by injecting high temperature and high pressure steam on substrate. A steam generator is configured to continually provide steam on substrate. After cleaning by steam, cleaning by brush may be followed.

Abstract: Disclosed herein is a device for cleaning a photomask, which prevents haze from being generated on a surface of the photomask during a photolithography process. The photomask is heat treated to remove residual ions on a surface thereof and to induce curing and oxidation of Cr and MoSiON layers, thereby preventing diffusion of the ions. Etching of Cr and MoSiON layers due to a cleaning process is suppressed in order to significantly reduce a change in phase and transmissivity of optical properties of Cr and MoSiON.

Abstract: A substrate treating apparatus for treating substrates includes a treating tank for receiving and treating the substrates, a holding device movable, while holding the substrates in a cantilever mode, between a treating position in the treating tank and a transfer position above the treating tank, a transport device for supporting the substrates and transferring the substrates to and from the holding device in the transfer position, a detecting device for detecting a posture variation of the holding device, and a correcting device for correcting a position of the holding device or the transport device. The correcting device performs a correction according to the posture variation of the holding device detected by the detecting device in time of transfer of the substrates between the holding device and the transport device.

Abstract: A disk immersing and extracting mechanism is provided, which utilizes a floating-control means to control a disk, so as to prevent the disk from floating up or falling over in the rinse tank and to prevent liquid droplets from dripping from the floating-control means onto the disk to cause an undesired cleaning. In the present invention, a disk is immersed into a rinse tank by a disk holder, and then, the cleaned disk is extracted out of the rinse tank. The disk holder comprises a control bar on the upper side, and a disk support frame on the lower side that has a pair of tooth plates parallel to the control bar.

Abstract: Provided are a supporter and a substrate cleaning apparatus including the supporter, and a method for cleaning substrates. In the apparatus, a guide plate is provided close to an outer surface of an outermost substrate among substrates arranged in a cleaning process. The guide plate is shaped such that cleaning liquid injected toward a lower edge of the outermost substrate flows to an upper edge of the outermost substrate in a substantially vertical direction.

Abstract: A parts immersion system and method includes a trough through which a conveyor belt carries the parts. A chemical solution is introduced into the trough through an opening in the bottom of the trough, from above the trough, and/or from the sides of the trough. The parts on the conveyor belt in the trough have a tendency to retard liquid movement out of the open ends of the trough thereby allowing the chemical solution to accumulate in the trough resulting in a greater immersion of the parts in the chemical solution. A gate may be provided near one or both ends of the trough to further enhance the accumulation of the chemical solution in the trough. Flights may extend upwardly from the conveyor belt to further enhance liquid retention in the trough between the flights. Flexible seals at the ends of the flights may contact sidewalls of the trough. One or more vibrators may be provided to enhance drainage of the chemical solution from the parts as the parts exit the trough.

Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion.

Abstract: A unit for preventing a substrate from drying includes a transfer arm for transferring a substrate from a first bath containing a first cleaning solution to a second bath containing a second cleaning solution, a spraying part connected to the transfer arm, wherein the spraying part sprays a drying prevention solution from an upper portion of the substrate to a lower portion of the substrate, and a drainage container connected to the transfer arm, wherein the drainage container receives the drying prevention solution.

Abstract: A washing unit for vegetables, comprising at least one upper and one lower stacked tanks, which are suitable to contain washing water and vegetables to be washed, and wherein a connection is provided between an upper and a lower tank of said tanks, said connection being suitable to allow for the vegetables to be washed to be transferred among said at least two tanks.

Abstract: Methods and apparatus for cleaning hearing aid devices are disclosed. Drying is facilitated in hearing instruments through a novel combination of heater and desiccant in an essentially closed system. Greater efficiency is obtained by minimizing the volume of gas, e.g., air, requiring moisture extraction.

Abstract: Cleaning apparatus having multiple wash tanks for washing articles in a carbon dioxide dry cleaning system employing a liquid carbon dioxide cleaning solution are provided. Cleaning apparatus having multiple wash tanks of the present invention may provide improved thermodynamic efficiency by allowing carbon dioxide vapor to be transferred between wash tanks rather than condensed. Cleaning apparatus having multiple wash tanks of the present invention may have a lower capital cost than multiple cleaning systems having single wash tanks. Cleaning apparatus having multiple wash tanks of the present invention include a first wash tank for contacting a first article with liquid carbon dioxide cleaning solution, and a second wash tank for contacting a second article with liquid carbon dioxide cleaning solution. The second wash tank is in fluid communication with the first wash tank. Methods of utilizing such cleaning apparatus are also provided.

Abstract: A screenings washer having a hopper, a grinder downstream of the hopper, and a washer downstream of the grinder. The washer includes an auger rotor that receives the screenings ground by the grinder, a spray wash system that sprays a wash fluid directly onto a portion of said auger rotor and the ground screenings, a perforated trough, and tubular casing directly coupled to the discharge end of said auger rotor and having a severe bend proximate to the discharge end of said auger rotor. The severe bend partially obstructing transportation of the ground screenings transported by said auger rotor so as form a compaction zone that compacts and de-waters the ground screenings.

Abstract: A screenings washer having a hopper, a grinder downstream of the hopper, and a washer downstream of the grinder. The washer includes an auger rotor that receives the screenings ground by the grinder, a spray wash system that sprays a wash fluid directly onto a portion of said auger rotor and the ground screenings, a perforated trough, and tubular casing directly coupled to the discharge end of said auger rotor and having a severe bend proximate to the discharge end of said auger rotor. The severe bend partially obstructing transportation of the ground screenings transported by said auger rotor so as form a compaction zone that compacts and de-waters the ground screenings.

Abstract: An apparatus for supercritical processing and non-supercritical processing of a workpiece comprises a transfer module, a supercritical processing module, a non-supercritical processing module, and a robot. The transfer module includes an entrance. The supercritical processing module and the non-supercritical processing module are coupled to the transfer module. The robot is preferably located within the transfer module. In operation, the robot transfers a workpiece from the entrance of the transfer module to the supercritical processing module. After supercritical processing, the robot then transfers workpiece from the supercritical processing module to the non-supercritical processing module. After the non-supercritical processing, the robot returns the workpiece to the entrance of the transfer module. Alternatively, the non-supercritical processing is performed before the supercritical processing.

Abstract: The invention relates to a method and a device for treating surfaces of metallic strip material (1), especially for pickling rolled material, in a treatment channel (2), with a pickling medium (3) containing acid. Jets (4) are set in the direction in which the strip is transported (5) at the entrance to the channel (2a) and in the opposite direction that in which the strip is transported at the exit of the channel (2b). The aim of the invention is to produce a closed liquid film with some turbulence on the surface of the strip. Said film should be maintained as far as the exit (2b) of the channel. To this end, additional jets (4) between the channel entrance (2a) and the channel exit (2b) are oriented in the opposite direction to the direction in which the strip is transported (5) and the pickling medium (3) is further delayed in flowing out at the channel exit (2b) by mechanical resistance devices (7) situated in the path of the transport channel (6).

Abstract: A cleaning processing system including a wafer transfer device, a wafer detecting sensor for detecting a wafer, a memory for storing the position and direction of an extra wafer present inside the cleaning processing system when the power supply is cut off, an alarm device for generating an alarm in the case where the information detected by the wafer detecting sensor when the power supply to the cleaning processing system is turned on differs from the wafer information taken out of the memory, an alarm canceling section for canceling the alarm, an apparatus control section for controlling the wafer transfer device to recover the extra wafer, and a recovery start-up section for emitting an instruction to start the wafer recovery to the apparatus control section.

Abstract: A substrate treating method for treating substrates with a treating solution includes a step of heating a treating solution containing sulfuric acid, and treating, with the treating solution, the substrates coated with a film material including a high dielectric-constant material. The substrates with the high dielectric-constant material are treated appropriately by heating, before use, the treating solution containing sulfuric acid.

Abstract: An apparatus for supercritical processing and non-supercritical processing of a workpiece comprises a transfer module, a supercritical processing module, a non-supercritical processing module, and a robot. The transfer module includes an entrance. The supercritical processing module and the non-supercritical processing module are coupled to the transfer module. The robot is preferably located within the transfer module. In operation, the robot transfers a workpiece from the entrance of the transfer module to the supercritical processing module. After supercritical processing, the robot then transfers workpiece from the supercritical processing module to the non-supercritical processing module. After the non-supercritical processing, the robot returns the workpiece to the entrance of the transfer module. Alternatively, the non-supercritical processing is performed before the supercritical processing.

Abstract: The invention relates to an arrangement and a method for cleaning fine solid particles from a continuously flowing liquid suspension. According to the invention, alternate emptying of cleaned liquid in at least two decanting chambers (34, 36) of the cleaning arrangement (10) is brought about by alternately opening and closing valve units (48, 50) coordinated with outlets (44, 46) of the decanting chambers (34, 36). Alternatively, valves in feeds to at least two separate inlet tanks of the cleaning arrangement can be opened and closed alternately in order to bring about a continuous outflow of cleaned liquid.

Abstract: A flexible container for liquid transport made of a flexible material includes a top face portion, a bottom face portion, and a peripheral face portion connecting the top face portion and the bottom face portion. An air tight, water resistant slide fastener is openably/closably mounted to the peripheral face portion of the container. A liquid stirring port is provided at the top face portion, and a liquid injecting and ejecting port are provided at a lower end of a rear face portion of the peripheral face portion. Container suspending pieces and bottom face portion fixing pieces are mounted at the top face portion of the container and at four corners of the bottom face portion. During washing, the container can be washed reliably and efficiently while the inside of the spread out container can be visually checked by efficiently utilizing the air tight, water resistant slide fastener, liquid stirring port, liquid injecting and ejecting port, and container suspending pieces, and bottom face port fixing pieces.

Abstract: An apparatus containing a composition suitable for eliminating a thermosetting resin is disclosed. In the composition, tetra methyl ammonium hydroxide (TMAH) is included so as to eliminate the thermosetting resin. Accordingly, the composition is suitable for removing a dielectric layer, an organic protective layer, an insulating layer, an alignment layer, black matrices and color filters, etc. made form a thermosetting resin in an LCD or a semiconductor, and permits a reproduction or a rework of the thermosetting resin film.

Abstract: A system for processing a wafer includes a cleaning module configured to only clean the back side of the wafer so as to remove unwanted particles therefrom before performing subsequent processing tasks on the process side of the wafer. The system also includes a processing module configured to perform processing tasks on the process side of the wafer. The processing module includes a chuck for supporting the wafer during the processing task. The system further includes a transport module configured to remove the cleaned wafer from the cleaning module, move it to the processing module and place it on the chuck of the processing module without performing any intervening manipulations during the movement.

Abstract: An installation for processing wafers with a plurality of fabrication units and a plurality of measurement units as well as a transport system for transporting the wafers, is described. A transport control unit, which detects a capacity utilization of the installation and saves a processing sequence of the wafers, is allocated to the transport system. As a function of these parameters, control instructions are generated in the transport control unit, and can be output to the transport system for controlling the wafer transport procedure.

Abstract: A method for removal of post reactive ion etch sidewall polymer rails on a Al/Cu metal line of a semiconductor or microelectronic composite structure comprising: 1) supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber in which said composite structure is supported to form a water soluble material of sidewall polymer rails left behind on the Al/Cu metal line from the RIE process; removing the water soluble material with deionized water; and removing photo-resist from said composite structure by either a water-only plasma process or a chemical down stream etching method; or 2) forming a water-only plasma process to strip the photo-resist layer of a semiconductor or microelectronic composite structure previously subjected to a RIE process; supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber on which said structure is supported to form a water soluble material of saidwall polymer rails left behind on the Al/Cu metal line from the RIE proc

Abstract: In an apparatus, after completion of a CMP (i.e., chemical mechanical polishing) operation of a semiconductor wafer, the thus polished wafer is temporarily stored in a water tank before it is subjected to a post-CMP cleaning operation. During its storage period in the water tank, the wafer is prevented from being chemically attacked by an oxidizing agent contained in an abrasive used in the CMP operation. The apparatus includes: the water tank for storing the wafer therein; a pure water supply pipe for supplying pure water to the water tank; an anticorrosion agent supply pipe for supplying an anticorrosion agent to the pure water; a drain pipe connected with a lower portion of the water tank to discharge the water from the water tank; a return pipe for returning the discharged water to an upper portion of the water tank through a pump and a filter, the return pipe branching-off from the drain pipe; and, valves mounted on these pipes.

Abstract: To shorten the time required to clean a printing mask used in printing solder paste pattern, an unused surface of a cotton cleaning sheet is brought into contact with a transfer surface of a printing mask while a feed roller, suction roller, take-up roller, solvent dispenser and air blower are moved horizontally in an integral fashion in a direction perpendicular to the direction in which a tape substrate is conveyed, thereby cleaning the printing mask along the shorter, widthwise direction of the tape substrate.

Abstract: A method of cleaning and maintenance used for a rotational etching tool, combining the physical characteristics of water (splashed off after striking the surface of a spinning wafer) and a PM (preventive maintenance) computer program, can automatically and quickly clean the interior of the etching tool. By setting the appropriate parameters of PM program, single or all of process chambers can be well cleaned. Also, the DI water dropping positions on the wafer can be altered to create more splashing angles. To clean the sidewalls of the etching chambers, the wafer supporting means is moved between the process chamber and the rotating speed thereof is preferably alter while it is moving. The PM program of the present invention can be executed whenever the cleaning job needs to be done. It not only is timesaving and easy to apply, but also keeps the wafer in a almost-no-particle environment while being etched.

Abstract: A heat sterilization process for small, washed, and bagged articles such as vial stoppers includes a conditioning or air removal phase prior to sterilization. During the air removal phase, a substantial majority of the liquid moisture is removed from the bagged articles by introducing brief periods of dry, warm air to the autoclave chamber. The air is introduced in short bursts at the point of greatest vacuum while pressure pulsing the chamber during the air removal phase. The air is heated and injected into the chamber through a supply valve which is rapidly opened and closed while the chamber is maintained within a preselected vacuum range between the pressure pulses. The result is a greatly reduced time for a complete sterilization and drying process.

Abstract: A cleaning apparatus cleaning a chuck is provided with a cleaning tank, an injection nozzle, a discharge nozzle, a liquid supply mechanism and a gas supply mechanism. The liquid supply mechanism has a supply tank, a heater and a liquid distribution mechanism so that the heater heats pure water supplied from the supply tank under the room temperature for forming warm water, reduced in electrical resistance, heated to a temperature higher than the room temperature. The liquid supply mechanism supplies the formed warm water to the cleaning tank through the liquid distribution mechanism. A vertical moving mechanism moves down a transport arm thereby dipping the chuck in the warm water and cleaning the chuck. Thus, the throughput of the cleaning apparatus cleaning the chuck is improved, the quantity of consumed gas is reduced and cleaning performance is improved.

Abstract: Methods of and apparatus for washing an array of sites in high-density microplates or similar assay plates wherein the microplates or assay plates are washed in an inverted or nearly inverted position, rather than in an upright position. Preferably, the wash liquid is dispensed upwardly in the form of a sheet from a nozzle mounted on a spray bar as the spray bar moves relative to the microplate or assay plate. After washing, the microplate or assay plate is dried with a stream of gas such as air, also preferably blown upwardly in the form of a sheet.

Abstract: In the art of wet-cleaning a substrate by etching with a cleaning solution prepared by dissolving hydrofluoric acid as an active component in water, using the process of measuring the concentration of a predetermined component regularly and then replenishing the cleaning solution with a component for correcting the concentration at need on the basis of the result of measurement on the concentration in case of cleaning the substrate with an aqueous solution of ammonium fluoride as the cleaning solution while controlling air in a cleaning draft at an exhaust rate within a predetermined range.

Abstract: An active rinse shield designed to protect electrofill chemical baths from excessive dilution during rinse sprays on the semiconductor wafer. The shield uses overlapping blades to cover the bath, making a physical barrier between the bath chemistry and the wafer rinse water. The blades are interconnecting ribs that actuate around a common pivot axis. A linear mechanical actuator controls the blade movement, moving the top-most blade, which in turn, moves an adjacent lower blade. Each upper blade is interconnected to an adjacent lower blade by upper and lower ledges, a pivot boss and interlocking cut, and a curved ledge on each blade's body surface. The interconnecting features allow the blades to move one another out for extension or in for retraction. The interlocking blades are inclined above one another, forming grooves to redirect the rinse water away from the chemical bath.

Abstract: A wet etching apparatus and method to shorten processing time and to eliminate formation of unintended mask pattern are described. In the conventional art, after a mask pattern is formed, alien substances such as water mist or stain are left on the substrate. The alien substances act as an etching block in the wet etching process. This generates an unintended mask pattern. The present invention uses ultraviolet light to remove the alien substances prior to the etching process. When the alien substances are removed, the intended mask pattern is generated after the etching process. The wet etching device according to the present invention includes an ultraviolet cleaner and a conveyor to convey substrates to and from the ultraviolet cleaner. Spaces for the ultraviolet cleaner and the conveyor are created in the wet etching apparatus by reducing space for cassettes and reducing space required by the loader.

Abstract: A cleaning system that utilizes an organic cleaning solvent and pressurized fluid solvent is disclosed. The system has no conventional evaporative hot air drying cycle. Instead, the system utilizes the solubility of the organic solvent in pressurized fluid solvent as well as the physical properties of pressurized fluid solvent. After an organic solvent cleaning cycle, the solvent is extracted from the textiles at high speed in a rotating drum in the same way conventional solvents are extracted from textiles in conventional evaporative hot air dry cleaning machines. Instead of proceeding to a conventional drying cycle, the extracted textiles are then immersed in pressurized fluid solvent to extract the residual organic solvent from the textiles. This is possible because the organic solvent is soluble in pressurized fluid solvent. After the textiles are immersed in pressurized fluid solvent, pressurized fluid solvent is pumped from the drum.

Abstract: A photoresist stripping apparatus and a corresponding method for removing photoresist layers after a patterned polyimide layer is developed. The photoresist-stripping apparatus includes a transporting unit, a stripping unit, a washing unit, a drying unit and a control unit. The transporting unit connects the stripping unit, the washing unit and the drying unit. The control unit is responsible for controlling the transport sequence and timing of the transporting unit. The method of stripping the photoresist layer off the OLED panel includes providing a stripping solution to the stripping unit to remove photoresist layers. The OLED panel is jet-cleaned with a washing solution in the washing unit so that any residual stripping agent is removed. Finally, the surface of the OLED panel is blown dry.

Abstract: A cleanling apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.

Abstract: A substrate cleaning system for cleaning wafers using a sheet-type wet cleaning treatment. The system has a sealable system body, a loading/unloading booth having a substrate carry-in section in which a plurality of substances are stocked to be carried in before a cleaning treatment is applied to them and a substrate carry-out section in which a plurality of substrates are stocked to be carried out after the cleaning treatment is applied, a processing booth provided with at least one sheet-type substrate cleaning chamber in which the cleaning treatment can be applied to a plurality of substrates by a plurality of cleaning solutions, and a robot booth provided with a transport robot for transporting the substrates one by one between the processing booth and the loading/unloading booth, the respective booths having partition walls.

Abstract: The invention provides a substrate processing apparatus including a processing tank for processing substrates, a transporting path provided along the processing tank, a substrate transporting device moving along the transporting path for transporting the substrates, wherein the substrate processing apparatus and the substrate transporting device mounted thereto may realize the improvement of the throughput of substrate processing without increasing the area for installing the substrate processing apparatus. There are provided at least two substrate transporting devices that are capable of moving on the identical transporting path. The movable ranges of the respective substrate transporting devices for transporting the substrates are overlapped with respect to each other. When transportation of the substrates is required simultaneously at a plurality of processing tanks in scheduling data prepared by a scheduler, the scheduling data is determined by referencing substrate transportation sharing conditions.

Abstract: An apparatus for supercritical processing of multiple workpieces comprises a transfer module, first and second supercritical processing modules, and a robot. The transfer module includes an entrance. The first and second supercritical processing modules are coupled to the transfer module. The robot is preferably located with the transfer module. In operation, the robot transfers a first workpiece from the entrance of the transfer module to the first supercritical processing module. The robot then transfers a second workpiece from the entrance to the second supercritical processing module. After the workpieces have been processed, the robot returns the first and second workpieces to the entrance of the transfer module. Alternatively, the apparatus includes additional supercritical processing modules coupled to the transfer module.

Abstract: To provide a cleaning processing method and a cleaning processing apparatus which can improve cleaning efficiency. The apparatus is structured to install processing units 11a-11d which provide more than one kind of chemical liquids out of a plurality of chemical liquids A-C for processing wafers W, and to enable the same kind of a processing liquid to be provided for at least two processing units, and, upon successively processing objects-to-be-processed which require their own processing sequences, to consecutively load each object-to-be-processed W to a processing unit which stores designated chemical liquid for a processing sequence of the object-to-be-processed.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A treatment system for use with conveyor apparatus that allows for the uninterrupted use of the conveyor apparatus system while simultaneously treating the conveyor belt. The system employs of a sump basin and various spray bars that can sanitize, clean or lubricate a conveyor belt in conjunction with the processing of various products. The treatment system allows for the effective reduction of the down time in the manufacturing possess using conveyor apparatus.

Abstract: A system for recycling reusable resin mold products recovered from discarded apparatuses is disclosed. This recycling system includes a crushing system for crushing resin mold products one kind by one kind into crushed resinous pieces and packing the same in a bag, a classification system for irradiating a light beam to the resin in the bag and classifying the bags into respective kinds of resins based on a reflected beam therefrom, a cleaning system for separately cleaning the respective kind of crushed resinous pieces taken out of the bag to remove foreign matters adhered onto the surfaces of the crushed resinous pieces therefrom, and a recovery system for recovering the cleaned crushed resinous pieces.

Abstract: During the treatment, in particular cleaning, disinfecting and drying, of used, dirty endoscopes, in order to render them suitable once again for subsequent use, the following steps take place: placing a used, dirty endoscope in a rack, connecting the passages of the endoscope to a connection block which is arranged in a fixed position in the rack, placing the rack, with the endoscope therein, in at least one device for treating the endoscope, the connection block being connected to a counter-connection block which is present in the treatment device, in order to bring about a connection between the endoscopes and the treatment device, subjecting the endoscope which is accommodated in the rack to a specific treatment in the treatment device, taking the rack with the endoscope therein out of the treatment device, and uncoupling the endoscope from the connection block after it has been taken out of the final treatment device.

Abstract: A semiconductor wafer cleaning apparatus and method uses only one inner bath for chemical solution and de-ionized water cleaning, and includes a marangoni dryer for cleaning and drying semiconductor wafers. The apparatus includes a loading unit loaded with a cassette holding wafers; a moving mechanism for extracting the wafers from the cassette and moving the wafers into a loader; an inner bath for cleaning the wafers with a chemical solution or de-ionized water; a marangoni dryer including a hood, for moving the wafers from the loader into the bath, to be sealed to the bath; and a knife for supporting the wafers loaded into the bath at a lower portion thereof and moving the wafers up and down. Since the marangoni dryer is adhered to the bath during drying, the wafers are not affected by laminar flow or exhaustion and water marks do not occur thereon.

Abstract: A substrate processing apparatus is used to remove an organic matter attached to a substrate with use of a removal liquid. This apparatus includes a process chamber directed to an organic matter removal process, a holding element to hold the substrate in the process chamber, a removal liquid supply element to supply the removal liquid to the substrate held by the holding element, and a light-blocking element disposed in a transport path for the substrate that extends from a cassette housing the substrate and having high transparency, to the process chamber, thereby blocking light passing through the transport path into the process chamber.

Abstract: A composition suitable for eliminating a thermosetting resin (and a method of so using the composition) is disclosed. In the composition, tetra methyl ammonium hydroxide (TMAH) is included so as to eliminate the thermosetting resin. Accordingly, the composition is suitable for removing a dielectric layer, an organic protective layer, an insulating layer, an alignment layer, black matrices and color filters, etc. made form a thermosetting resin in an LCD or a semiconductor, and permits a reproduction or a rework of the thermosetting resin film.

Abstract: A cleaning apparatus for removing contaminants from the surface of a substrate includes two parts: one which produces an aerosol including frozen particles and directs the aerosol onto the surface of the substrate to remove contaminants from the surface by physical force, and another part in which a fluid including a gaseous reactant is directed onto the surface of the substrate while the surface is irradiated to cause a chemical reaction between the reactant and organic contaminants on the surface, to chemically removing the organic contaminants. In the method of cleaning the substrate, the physical and chemical cleaning processes are carried out in a separate manner from one another so that the frozen particles of the aerosol are not exposed to the effects of the light used in irradiating the surface of the substrate. Therefore, the effectiveness of the aerosol in cleaning the substrate is maximized.