Abstract: The invention has the objective of achieving high degree of hydraulic efficiency of the flow system—consisting of a circulation pump (1) and a water diverter (15)—in a dishwasher (2) with spray arms and with a circulation pump (1), having an impeller, a suction port (3) and at least one discharge port on the pump housing, with a water diverter (15) provided on the delivery side of the pump in order to generate a flow leading from an inlet to one of several selectable outlets associated with the spray arms, whereby the water diverter (15) has a blocking element (19) with at least one diaphragm opening (21) that can be positioned by a drive (20) in at least one outlet position.

Abstract: A substrate processing apparatus includes a container in which a heating plate, a discharge nozzle for discharging a vapor of organic solvent, and a discharge nozzle for supplying a process gas and a cooling gas are provided. A pump in communication with an exhaust outlet of the container exhausts an atmosphere from the container to reduce pressure in the container. Therefore, the substrate processing apparatus is capable of performing (1) the process of drying a substrate in a reduced-pressure atmosphere by the use of the vapor of organic solvent, and (2) the process of drying the substrate in the reduced-pressure atmosphere by heating, to thereby efficiently dry the substrate.

Abstract: A dishwasher minimizes the backflow of water to a sump and the gathering of water in a drain passage, by constructing the drain passage using a valve installed at the vertical peak of a passage for preventing the backflow of water.

Abstract: The present invention provides a processing liquid tank and a processing system which take smaller spaces for the tank and the heat exchanger and can be realized at low costs. The processing liquid tank 100 for storing a prescribed processing liquid comprises an inner cylinder 130 in the processing liquid tank 100. The processing liquid is stored outer of the inner cylinder 130. The pipes 160a, 160b, 160c for passing a heat medium are disposed in the processing liquid. The flow of the heat medium passing through the pipes 160a, 160b, 160c is opposite to the flow of the heat medium. The processing device comprises a processing liquid tank 100, a processing unit for processing objects-to-be-processed and a processing liquid supply line for supplying a processing liquid from the process liquid tank to the processing unit.

Abstract: A predicted value of acid consumption during pickling with a pickling solution in each of a third tank 11c and a final tank 11d of a continuous pickling apparatus 10 is calculated by a pickling line control unit 24, and based on the calculated predicted value, the amount of acid solution to be supplied to each of the third tank 11c and the final tank 11d is determined, and acid solution is supplied from an acid solution supply system 12. The acid concentration of the pickling solution in each of the third tank 11c and the final tank 11d to which acid solution is supplied is continuously measured by continuous acid concentration measuring devices 13c and 13d, and based on the continuously measured value of the measured acid concentration, acid solution is supplied from the pickling solution supply system 12 to the third tank 11c and the final tank 11d so that the concentration of the pickling solution in each of the third tank 11c and the final tank 11d matches a target value.

Abstract: A rate monitor connected to a single-wafer cleaning device to measure and control a wet cleaning process. During the wafer cleaning process the rate monitor can monitor a rate at which changes are being made to a portion of the wafer, as the wafer is covered with a liquid, and predict an endpoint in time to the wet cleaning process.

Abstract: An apparatus for the treatment of semi-conductor wafers is provided. The apparatus has a first valve mechanism for introducing different treatment fluids into a treatment tank from different reservoirs. At least one collection device is provided for collecting a treatment fluid after treatment of wafers therewith in the treatment tank. A second valve mechanism is provided for conveying at least a portion of the treatment fluid out of the collection device and to a respective reservoir. A rinsing mechanism is provided for rinsing the collection device.

Abstract: A method of cleaning a fouled RO membrane in a module for RO separation, the membrane having feed side and permeate side, the foulant accumulating at the feed side.

Abstract: An actuator mechanism is provided for a dishwasher dispensing assembly including a detergent dispenser actuator and a rinse agent dispenser actuator. Shape memory wire is connected to each actuator and is used to open a detergent reservoir and a rinse aid reservoir by operating the actuator through contraction of the shape memory wire.

Abstract: A vehicle mounted low amount of solution textile cleaning system. Uniquely, the present invention provides for a truck mountable textile cleaning system that: 1) uses less water than the typical existing truck mounted cleaning systems to clean the same amount of area; 2) requires a smaller amount of environmentally damaging water-based cleaning solutions so that fewer trips to dump sites are needed for the same amount of cleaning; and 3) has a self contained water-based cleaning solution that does not have to be connected to a customers expensive water supply during operation. The invention may provide a vehicle that is adapted to implement application of a cleaning solution to a remote textile area to be cleaned. Specifically, the vehicle may comprise a storage system, positioned in the vehicle, and designed to hold the cleaning solution. Additionally, there may be a delivery system fluidly coupled to the storage system to enable delivery of the cleaning solution to the textile area to be cleaned.

Abstract: To provide a cleaning processing method and a cleaning processing apparatus which can improve cleaning efficiency. The apparatus is structured to install processing units 11a-11d which provide more than one kind of chemical liquids out of a plurality of chemical liquids A-C for processing wafers W, and to enable the same kind of a processing liquid to be provided for at least two processing units, and, upon successively processing objects-to-be-processed which require their own processing sequences, to consecutively load each object-to-be-processed W to a processing unit which stores designated chemical liquid for a processing sequence of the object-to-be-processed.

Abstract: Provided is a wafer rotary holding apparatus by which a reduced pressure is created on an upper surface of a rotary disk by a simple and easy-to-make mechanism with no need of any of a vacuum source apparatus, a compressed air supply apparatus, a compressed gas supply apparatus and other apparatuses in use; a wafer can be held while rotating with no contact to a rear surface thereof; a degree of pressure reduction can be adjusted with ease and even a thin wafer (of 0.1 mm or less in thickness) can be held while rotating with no deformation; and the wafer with a bowing can be held while rotating with no correction of the bowing. A wafer rotary holding apparatus includes: a rotary disk on which a fluid flow path is formed; a through hole formed in a central section of the rotary disk; and a plurality of wafer rests provided on an upper surface of the rotary disk.

Abstract: A method for performing electrochemical processes using an array of dedicated cells is disclosed. Various construction details and steps of the method are developed which promote, in one embodiment, automating the method of performing the processes and cleaning the articles between electrochemical processes. In one embodiment, the array of dedicated cells includes rinsing cells which have a rinse chamber adapted to receive an article and flow rinse fluid such that the fluid impinges against the article at predetermined locations.

Abstract: Disclosed is a dishwasher having an improved inlet valve assembly. The present invention includes a housing, a tub in the housing to hold tableware, an injector assembly for injecting water on the tableware in the tub, and an inlet valve assembly. And, the inlet valve assembly includes a case installed at an inlet passage for supplying the water to the tub, the case having an inlet opening via which the water flows in and an outlet opening via which the water is discharged, a first valve provided to the case to selectively open/close a passage in the case, and a second valve closing the passage in the case in case that the water leaks.

Abstract: The present invention comprises methods, compositions and apparatus for cleaning the surfaces within vessels that have restricted points of entry, and in particular, the surfaces within oxygen converters and oxygen cylinders. These oxygen converters and oxygen cylinders are components of the onboard oxygen supply systems of aircraft. A surfactant and a solvent are mixed to form a cleaning composition that is boiled at reduced pressure and increased temperature within the oxygen converter or oxygen cylinder. The oxygen converter or oxygen cylinder is rinsed with pure solvent, and the rinse fluid is measured to determine the level of contaminants. Dry air is forced through the oxygen converter or oxygen cylinder to remove remaining solvent. The cleaning composition may comprise a fluorocarbon solvent and a fluorosurfactant.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a gas-liquid mixture by mixing a liquid and a pressurized gas, to discharge the gas-liquid mixture to a substrate at high speeds. The mixture process is conducted in an open space out of the nozzle, and change in the supply pressure of the gas does not affect the supply of the liquid. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the gas-liquid mixture, whereby the quality of the process is improved.

Abstract: A method of and system for cleaning semiconductor wafers minimizes the exposure of the wafers to the air by washing, rinsing and drying the wafers in one cleaning chamber. The system includes a wafer support by which a plurality of wafers can be supported in the cleaning chamber as oriented vertically and spaced from each other, and tubular de-ionized water supply nozzles extending longitudinally in the direction in which the wafers are spaced from each other as disposed to the sides of the wafers. Each de-ionized water supply nozzle has an inner nozzle passageway, and a plurality of sets of nozzle holes extending radially through the main body of the nozzle from the inner nozzle passageway. Each such set of nozzle holes subtends an angle of 80˜100° in a vertical plane and is directed towards a surface of a respective wafer W.

Abstract: The invention concerns a sanitary device comprising:

Abstract: An apparatus and method are disclosed that can process a substrate such as a wafer while keeping high cleanliness. The apparatus comprises a center port 100, which is stationarily arranged in the center and on the surface of which at least one blow-off outlet is provided for blowing off fluid, and a rotating housing portion 200 which is capable of rotating about the center port 100. The rotating housing portion 200 comprises a top plate 210 comprising a main surface S2 that opposes a wafer W, and a lower housing being connected to the top plate 210 and rotatably driven by a rotation-driving member. When the surface S1 comprising blow-off outlets 151a and 153a of the center port 100 is offset from the main surface S2 of the top plate 210 and fluid is blown off from the blow-off outlet 151a, the substrate W is contactlessly held above the main surface S2 of the top plate 210 and the surface S1 of the center port 100.

Abstract: The present invention relates to heat curing impregnation sealant compositions, which are readily separable from water upon mixing.

Abstract: A hard floor surface cleaning apparatus includes an aerator, a rotating scrub medium engaging the hard floor surface, a fluid conveyor, and a fluid recovery device. The aerator is configured to produce a foam-like aerated cleaning liquid from a cleaning liquid. The fluid conveyor is coupled to the aerator and is configured to deliver the aerated cleaning liquid onto the scrub medium. The fluid recovery device is configured to remove soiled solution from the hard floor surface.

Abstract: A removable cartridge for a detergent dispensing system for a dishwasher comprising: a storage unit containing a plurality of cylindrical or spherical detergent tablets arranged in two or more rows with curved surfaces of adjacent tablets touching such that when the cartridge is upright the tablets will move under gravity towards a transfer station, a transfer station comprising ejection means to eject a tablet from the transfer station through a transfer port out of the cartridge, a transfer seal associated with the transfer port to prevent ingress of moisture into the cartridge.

Abstract: An apparatus and method for cleaning passageways and the like with a two-phase mixture of gas under pressure and an aqueous cleaning solution. The two-phase cleaning mixture is generated in a module and is passed out of the module at a predetermined rate that determines droplet size, velocity and droplet density at the pipeline surface to be cleaned. The droplets impact the walls of the passageway to be cleaned, thereby fragmenting, eroding and removing contaminants in said passageway. These are then flushed out of the passageway by the two-phase flow. The flow of cleaning solution can be steady or pulsed. The apparatus and process include a clean-in-place system that is useful in food, beverage, pharmaceutical and similar process industries.

Abstract: A method and system for cleaning collector optics in a light source chamber. In producing, for example, extreme ultraviolet light for lithography, debris such as tungsten can accumulate on optical components near a light source in the light source chamber.

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: By a simple apparatus construction and process, it is made possible to “clean precisely” a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 1012 molecules/cm2 or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 105 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Abstract: Method and system for purging a process line of a process gas used in a semiconductor wafer fabrication process. Inert gas (e.g., nitrogen gas) is repeatedly charged from an inert gas source into the process line and evacuated using a vacuum system. The vacuum system is preferably supplied with inert gas having a pressure in excess of 30 psig from the inert gas source. The inert gas is introduced into the process line from an inert gas conduit at a predetermined pressure to prevent process gas from liquefying in the process line. A set pressure regulator or an absolute pressure regulator may be used to reduce he pressure of the inert gas to below the vapor pressure of the process gas.

Abstract: A particle measurement configuration measures the particle concentration in a liquid or gaseous medium by way of a particle measuring instrument. In order to avoid erroneous measurements or damage to the particle measuring instrument, a measuring cell is provided which measures temperature or pressure or pH of the medium. A system controller shuts off a valve if threshold values are exceeded and it prevents the particle measuring instrument from being operated outside a predefined specification.

Abstract: An air conditioner cleaning device with which the use of detergent can be decreased to zero or minimized and washing time can be shortened. A feature is that the device comprises a watertight cover to receive washings for the air conditioner that is set in the ceiling, the nozzles—located above the watertight cover—for washing an air conditioner from which steam, warm water, and air for drying gush out, and a steam generator that connects to the steam supply line of the nozzles so that the steam generated with the steam generator and warm water shall be below the specified temperature and gush out from said nozzles.

Abstract: The subject of the present invention is a method and a device for filling a distribution line (20) with corrosive gas. The said method is a method for filling with gas, with passivation, a line (20) for distributing corrosive gas, which line is intended to distribute the said corrosive gas to a system (3) located immediately downstream of the said line (20); the said method comprising: prior conditioning of the said line (20); the actual filling of the said line (20) with the said corrosive gas known as an active gas. Characteristically, the said actual filling with gas comprises: at least one cycle of filling the said line (20) with active gas as far as immediately upstream of the system (3) and of removing the said active gas thus introduced into the said line (20); the said removal being performed without the said active gas passing through the said system (3); followed by the final filling of the said line (20) with gas so as to make the said gas available to the said system (3).

Abstract: A critical point drying apparatus for sample preparation in electron microscopy and semiconductor wafer production includes a computer system to automate the operational modes in drying the specimen. These operational modes controlled by the computer system are: cooling, in which a drying chamber is cooled; starting, in which the specimen chamber is filled with a transitional fluid; purging, in which the transitional fluid purges an intermediary fluid from the drying chamber and the purged intermediary fluid is collected by a collector condenser; heating, in which the drying chamber is heated to elevate the transitional fluid to its critical point temperature and pressure; and bleeding, in which the drying chamber is depressurized to atmospheric pressure at a very slow rate until the drying chamber is completely vented, which signals the end of the drying operation. The drying chamber incorporates concave surfaces for pressure dispersal and to facilitate purging the intermediary fluid completely.

Abstract: Pyro sulfuric acid is employed to decontaminate air. Contaminated air is contacted with pyro sulfuric acid in a pyro sulfuric acid system, and released as decontaminated air. The system can be especially useful in a chemical/biological/nuclear defense module.

Abstract: A pump is supported on a housing and has an inlet port coupled to a lubricant supply and an outlet port coupled to a tube outlet opening for delivering a predetermined amount of the lubricant during an activated cycle of the pump. An actuator, when triggered, operates in an actuated state for a predetermined duration during which time the pump is activated for one cycle and delivers a predetermined amount of the lubricant to the tube outlet opening. A switch is independently selectable for triggering the actuator to activate only the active cycle of the pump. The actuator may be a spring-biased solenoid or a timer circuit with a relay. The pump may be a piston-diaphragm type or any one of various motor driven types. The pump is activated for about 1 second, without also activating a cleaning cycle or a purging cycle and delivers ⅛ to ½ cc of a lubricant comprising about 90% by volume of a pharmaceutical grade mineral oil and about 10% by volume of NNL-690.

Abstract: There are provided an system for evaluating the amount of particles, a dip cleaning system, and a method of evaluating the amount of particles adhering to a substrate, which enable high-precision quantitative evaluation of the amount of particles suspended in a liquid without use of a monitor substrate, which enable easy determination of the correlation between the amount of particles suspended in the liquid and the amount of particles adhering to the substrate which is an object of cleaning, and which enable low-cost and highly-reliable cleaning evaluation. A residual liquid recovery pan for recovering a residual liquid interposed and a residual liquid quantitative measurement bath for measuring the amount of submerged particles is interposed, between the first substrate treatment bath and the second substrate treatment bath.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into contact with the liquid. Sonic energy is introduced into the liquid and acts on the workpiece to improve processing. The head spins the workpiece during or after contact with the liquid. The upper and lower rotors have side openings for loading and unloading a workpiece into the head. The rotors are axially moveable to align the side openings.

Abstract: A method and biological cleaning system are provided for cleaning substrate surfaces of oils and/or greases using a biological cleaning system which utilizes a pre-treatment bath and/or post-treatment bath as part of the cleaning system. The pre-treatment and/or post-treatment baths are compatible with the biological cleaning bath and during operation of the system, the used pre-treatment and/or post-treatment baths are recycled to the biological cleaning solution for biodegradation. A system is provided in which none of the pre-treatment, post-treatment or biological cleaning baths need expensive waste disposal. Replenishment pre-treatment and/or post-treatment baths as well as biological cleaning baths are added as needed to the biological cleaning system. Other treatment baths may be added directly to the biological cleaning bath with or without pre- or post-treatment for specific purposes such as a detergent phosphating bath used in the biological cleaning tank to provide a cleaned phosphated part.

Abstract: The invention relates to a device (1) for discharging two or more media with media nozzles (15, 25, 35) in which each media nozzle is located on a media arm (10, 20, 30), with a suspension device for each media arm, so that the media arms can perform pivoting movements separately from one another around same axis (Z). Further, the invention relates to a unit for treating in each case a disk-shaped object (2) with at least two media, with a carrier for holding the disk-shaped object.

Abstract: An apparatus for manufacturing a semiconductor device by forming a thin film on a substrate, comprises a cleaning process section for cleaning the substrate using a cleaning solution and a drying process section for jetting compressed gas onto the cleaned substrate, thereby removing the cleaning solution on the substrate, wherein the cleaning process section includes a nozzle body for jetting the cleaning solution onto the substrate under high pressure.

Abstract: A control unit controls a lifter to raise at least part of each of a group of substrates above the liquid level of a treating liquid in a treating bath. Thereafter, a valve is opened to drain the treating liquid from the treating bath at a high speed. As a result, a physical force to tilt and adhere an upper portion of the adjacent substrates accompanied by lowering of the liquid level of the treating liquid due to the high speed drainage acts upon a lower portion of the substrates near the lowered liquid level of the treating liquid, thereby reducing the physical force exerted on the substrates. This arrangement, even if a holding interval between the substrates is narrowed at a half of a normal pitch, eliminates a contact of the adjacent substrates and prevents damage of the substrates due to the contact without providing an additional member such as a substrate support guide in the treating bath.

Abstract: A system for processing a workpiece includes a base having a bowl or recess for holding a liquid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a liquid in the bowl. A process reactor or head holds a workpiece between an upper rotor and a lower rotor. A head lifter lowers the head holding the workpiece into the liquid. Sonic energy is provided to the workpiece through the liquid, optionally while the head spins the workpiece. The liquid may include de-ionized water and an etchant.

Abstract: A cleaning unit (A) includes a movable cart (20) which carries a cleaning system for cleaning baked-on residues from walls (10) of a sterilizer chamber (12). Alkaline and acid cleaning solutions (180, 182), for removing organic and inorganic residues, respectively, from the chamber, are stored in a multi-compartment container carried by the cart and having two storage compartments (52, 54). The alkaline and acid solutions are sequentially sprayed over the chamber walls and returned to their respective compartments. After cleaning is complete, a wall (200) which separates the two compartments is punctured. The two cleaning fluids are thereby mixed together to form a neutral or near neutral solution which is disposable in a sanitary sewer system without further treatment.

Abstract: A solution delivery system for use with a wafer preparation system is provided. The solution deliver system includes a de-ionized water (DIW) dispense drawer having an input for receiving an initial flow of DIW from a facility water supply. The DIW dispense drawer further includes a first pressure regulator for stabilizing the initial flow of DIW and producing a substantially steady flow of DIW as a DIW output of the DIW dispense drawer. A chemical drawer is also provided as part of the solution delivery system. The chemical drawer is configured to receive the substantially steady flow of DIW from the DIW dispense drawer. The chemical drawer is further configured to receive an initial flow of chemicals from a chemical source. The chemical drawer also includes a second pressure regulator for stabilizing the initial flow of chemicals from the chemical source and thus producing a substantially steady flow of chemicals.

Abstract: A method, apparatus and system for fabricating a stencil mask for ion beam and electron beam lithography are provided. The stencil mask includes a silicon substrate, a membrane formed from the substrate, and a mask pattern formed by through openings in the membrane. The method includes defining the mask pattern and membrane area using semiconductor fabrication processes, and then forming the membrane by back side etching the substrate. The apparatus is configured to electrochemically wet etch the substrate, and to equalize pressure on either side of the substrate during the etch process. The system includes an ion implanter for defining a membrane area on the substrate, optical or e-beam pattern generators for patterning various masks on the substrate, a reactive ion etcher for etching the mask pattern in the substrate, and the apparatus for etching the back side of the substrate.

Abstract: An industrial sponge device and a method of manufacturing the same. The sponge is made from a polyvinyl acetal material with a process in which the pores are formed by gas to provide an open pore structure having no fibrils. Additionally, the sponge is purified by an extracting process which includes alternating exposure of the partially cross-linked sponge to solutions of high pH and low pH. The sponge is sterilized by electron beam radiation to destroy micro organisms that can cause contamination of the final product. The resulting sponge material is formed into an industrial sponge having a cylindrical body and a plurality of projections extending from the body. The projections are tapered truncated cones having a cross-sectional radius that decreases with distance from the body. The extracting process permits residual amounts of calcium, zinc, and other elements to be 2 ppm or less preferably 1 ppm or less.

Abstract: An apparatus for servicing a wafer chuck such as an electrostatic chuck that is equipped with vent holes for cooling the backside of a wafer positioned on the chuck and for clearing the vent holes is provided. The novel apparatus can be used either in replacing a gas supply conduit to the electrostatic chuck without having to break vacuum in the process chamber, or can be used in clearing the vent holes when servicing an electrostatic chuck. The apparatus consists of a three-way control valve and a high pressure gas supply line of a suitable inert gas.