Abstract: A process for efficiently preparing fine zeolite particles comprising synthesizing zeolite in the presence of an alkaline earth metal-containing compound and/or with controlling the preparation process of zeolite, thereby giving fine zeolite particles being composed of crystalline aluminosilicate, the fine zeolite particles having a fine average primary particle size, being excellent in the cationic exchange properties and the oil-absorbing ability, having a fine average aggregate particle size, and being excellent in the dispersibility; fine zeolite particles obtainable by the above process; and a detergent composition comprising the fine zeolite particles, the detergent composition being excellent in the detergency.

Abstract: A dishwasher includes a cabinet having arranged therein a central cavity. Slidably supported within the second cavity are first and second dish support rack systems. The first dish support rack system is defined by first and second upper dish support racks with the first upper dish support rack having a first width and the second dish support rack having a second width, substantially smaller than the first width. The second dish support rack system includes first and second lower dish support racks, each being substantially similar in construction to the first and second upper dish support racks. The dishwasher includes a first wash zone defined by the first upper and lower racks and a second wash zone defined by the second upper and lower racks. A control can selectively direct pressurized wash water through an associated spray arm member to the first and second wash zones either singly or collectively.

Abstract: A high pressure water stream (14) is discharged onto a surface to be cleaned. An ozone/water stream (16) is discharged on the same surface for sanitizing the surface. The high pressure water and ozone/water streams (14, 16) are discharged simultaneously along closely adjacent paths that are either parallel (FIG. 3) or concentric (FIG. 2). The water pressure is at least about 100 p.s.i. and is preferably between 100 p.s.i. and 1000 p.s.i. The nozzles that discharge the streams (14, 16) may be movable relative to the object(s) that receives the high pressure water and ozone/water (FIG. 1) Or, they may be fixed and the object may be movable relative to them (FIG. 4).

Abstract: A dishwasher includes a pump assembly which functions to chop all fluid entrained soil prior to directing fluid to upper and lower wash anms. A flow conduit leading to the upper wash arm is provided with a sampling port which directs a percentage of the fluid flow into a filter chamber having one or more fine mesh filter screens that open into the dishwasher tub basin. The filter chamber is exposed to a collection chamber that leads to a flapper valve and then to a drain port. An overflow tube, which is in fluid communication with the filter chamber, extends upwardly within the dishwasher. When the fine mesh filter becomes clogged, fluid will be forced to flow up the overflow tube and be exposed to another filter. A filter guard is secured to a housing of the recirculation pump over portions of the fine mesh filter.

Abstract: Disclosed is a method and device for collecting particulate contaminants removed using a CO2 decontamination medium from an early step of a decontamination process. The device removes particulate contaminants from a contaminated subject by a decontamination stream, and simultaneously forms another stream for collecting such contaminants into a collecting filter, thus preventing such contaminants from diffusing into the atmosphere. The device forms streams between the nozzles and the surface of the contaminated subject to readily move the nozzles along the surface of the subject without frictional resistance, to reduce the sense of fatigue of the operator.

Abstract: A high pressure water stream(14) is discharged onto a surface to be cleaned. An ozone/water stream(16) is discharged on the same surface for sanitizing the surface. The high pressure water and ozone/water streams(14,16) are discharged simultaneously along closely adjacent paths that are either parallel (FIG. 3) or concentric (FIG. 2). The water pressure is at least about 100 p.s.i. and is preferably between 100 p.s.i. and 2000 p.s.i. The nozzles that discharge the streams (14,16) maybe movable relative to the object(s) that receives the high pressure water and ozone/water (FIG. 1). Or, they may be fixed and the object may be movable relative to them (FIG. 4).

Abstract: Described are methods, systems, and chemistries for cleaning various components of semiconductor process equipment. A method in accordance with one embodiment cleans articles with differently contaminated interior and exterior surfaces by using those articles to separate a cleaning vessel into separate chambers, one chamber for the interior surface and one for the exterior surface. Different chemistries are then applied to the differently contaminated surfaces. This embodiment reduces the required volume of etchant, and consequently saves the cost, treatment, and disposal of toxic chemicals. One embodiment further reduces the requisite etchant volume using one or more volume-displacement elements that displace some of the etchant volume.

Abstract: A method for processing a substrate is provided which includes generating a fluid meniscus on the surface of the vertically oriented substrate, and moving the fluid meniscus over the surface of the vertically oriented substrate to process the surface of the substrate.

Abstract: In this disclosure, air flow is formed above chemical liquid film and a move of the chemical liquid is generated by making the air flow into a contact with the surface of chemical liquid. Further, a negative pressure is generated in a space between a processing object substrate and a plate by rotating the plate. Consequently, uniformity of processing of chemical liquid is improved, so that liquid removing step can be carried out effectively. As a result, yield rate of chemical liquid treatment can be improved.

Abstract: An apparatus and method for cleaning surfaces of semiconductor wafers utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of cleaning fluid formed on a semiconductor wafer surface to increase the amount of gaseous material that reaches the wafer surface through the boundary layer.

Abstract: A cleaning device for use in the production of semiconductor components comprises two feed devices with which a fluid medium is guided across a respective surface of an object to be cleaned so that different faces of the object are simultaneously cleaned. At least two gas feeding devices, having one means each for directing a gas flow onto the surface of the object to be cleaned, open into a cleaning chamber supplying a pressurized cleaning gas. At least two extraction means are connected to the outside of the cleaning chamber for discharging the gas fed to the cleaning chamber. The object can be introduced into the cleaning chamber through at least one gap. At least two ionization means are used to ionize the gas and the particles that are present in the cleaning chamber. One ionization means each is mounted between a direction means and an extraction means.

Abstract: Microelectronic substrate processing systems include a microelectronic substrate processing chamber that is configured to contain therein at least one microelectronic substrate. A carbon dioxide supply system is configured to supply densified carbon dioxide to the microelectronic substrate processing chamber. A detergent supply system is configured to supply detergent to the microelectronic substrate processing chamber.

Abstract: Apparatus for pressure processing components is disclosed which includes an improved closure system that minimizes dust-generating parts and allows easy access to the chamber. Ports are provided for introducing and releasing pressurized gases and fluids to and from the processing space. The heating system of the apparatus heats both the cover and the stage inside the pressurized chamber such that cycle time to equilibrate heated, pressurized fluids such as supercritical carbon dioxide inside the chamber are decreased. The apparatus includes a mechanism that raises the stage inside the chamber, pressing it against the fixed cover and sealing the inside of the pressure vessel. In one embodiment a screw-type jack is used to move the component-loaded stage fitted with a deformable o-ring seal a short travel distance to seat against the lid and seal the pressure chamber. In a related embodiment a computer and an electronic stepper motor are used to drive the pressing means in an automated fashion.

Abstract: The present invention relates a cooling device of the reverse Carnot cycle-type using a refrigerant, and an aerosol generation system including it. The cooling device includes a refrigerator of the reverse Carnot cycle-type, a cleaning medium conduit, a temperature sensor, and a heater. The intermediate portion of the cleaning medium conduit and the evaporator are wound like a coil in the same configuration so as to maximize the contacting area therebetween. The temperature sensor measures the temperature of the carbon dioxide discharged from the cooling device, and the heater is arranged to contact the evaporator of the refrigerator and the intermediate portion of the cleaning medium conduit so as to precisely adjust the liquefying rate of the carbon dioxide according to the temperature measured by the temperature sensor. The carbon dioxide is refrigerated at a temperature in the range of ?80° C. to ?100° C. through the cooling device, transformed into liquid phase.

Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.

Abstract: The present invention relates to a cooling device (30) of the reverse Carnot cycle-type using a refrigerant, and an areosol generation system including it. The cooling device (30) includes a refrigerator (310, 320) of the reverse Carnot cycle-type, a cleaning medium conduit (120), a temperature sensor (130), and a heater (140). The intermediate portion of the cleaning medium conduit and the evaporator are wound like a coil in the same configuration so as to maximize the contacting area therebetween. The temperature sensor (130) measures the temperature of the carbon dioxide discharged from the cooling device (30), and the heater (140) is arranged to contact the evaporator of the refrigerator and the intermediate portion of the cleaning medium conduit so as to precisely adjust the liquefying rate of the carbon dioxide according to the temperature measured by the temperature sensor. The carbon dioxide is refrigerated at a temperature in the range of ?80° C. to ?100° C.

Abstract: An etching/cleaning apparatus is provided, which makes it possible to effectively remove an unnecessary material or materials existing on a semiconductor wafer without damaging the device area with good controllability. The apparatus comprises (a) a rotating means for holding a semiconductor wafer and for rotating the wafer in a horizontal plane; the wafer having a device area and a surface peripheral area on its surface; the surface peripheral area being located outside the device area; and (b) an edge nozzle for emitting an etching/cleaning liquid toward a surface peripheral area of the wafer. The etching/cleaning liquid emitted from the edge nozzle selectively removes an unnecessary material existing in the surface peripheral area.

Abstract: A substrate cleaning apparatus is provided that includes a cleaning cup for receiving a to-be-cleaned substrate, a table in the cleaning cup, a first, second, and third nozzles, a pure water heating mechanism configured to supply hot pure water, a branch line, a control mechanism, and an open/close valve, provided between the branch line and the pipe, wherein the open/close valve is configured to interrupt emission of hot water from the third nozzle by opening the open/close valve to lower the pressure in the pipe.

Abstract: The invention relates to a device for keeping optical elements clean in motor vehicles, especially sensor or camera covers. This is done according to the present invention by applying a directed stream of gas, for example a stream of air, to the transparent cover in such a way that when the cover moves relative to the surroundings no ambient atmosphere, e.g., no ambient air, reaches the surface of the cover. According to one embodiment, by using a nozzle pressurized air is blown in, producing a transverse air stream. It is also possible, using a cover, to form a buffer space in front of the cover in addition to the transverse air stream. In a further refinement, a cleaning nozzle and a heater for the cover can be provided, in order to also be able to perform cleaning when soiling has occurred during stationary operation and to remove icing at low temperatures. To this end the cleaning fluid and/or the supplied air may also be pre-heated.

Abstract: Dispensing device of washing agents for a household washing machine, in particular a dishwasher, said dispenser having at least a tank for a liquid washing agent and an arrangement for dispensing a dose of said liquid washing agent, wherein this arrangement comprises: a passage, being adapted to put the inside of the tank in hydraulic communication with a discharge outlet for said liquid washing agent; first plugging means, act on said passage and capable of taking a first position due to which the washing agent cannot reach said discharge outlet, and a second position due to which the washing agent is able to reach said discharge outlet; actuating means producing actuation of said first plugging means. According to the invention, controllable safety means act along said passage are provided, which normally operate for preventing washing agent downflow from said tank to said passage, independently from the position or state of the first plugging means.

Abstract: In an exhaust pipe, a rotating shaft takeoff connection is provided so as to support a rotating shaft for rotating a switching valve fixed thereon. The rotating shaft extends to the outside of the exhaust pipe and is provided with an introduction hole and branch holes in such a manner that the introduction hole and the branch holes are communicated with each other to form through holes extending from the outside to the inside of the exhaust pipe. Into a gap between the rotating shaft takeoff connection and the rotating shaft, purge gas is introduced via the introduction hole and the branch holes. Furthermore, pure water is introduced into the gap via the introduction hole and the branch holes. By utilizing the purge gas, exhaust gas within the exhaust pipe is prevented from leaking outside the pipe and by utilizing the pure water, accumulated solid substance are prevented from adhering to the related parts of the pipe.

Abstract: A method and biological cleaning system are provided for cleaning substrate surfaces of oils and/or greases using a biological cleaning system which utilizes a pre-treatment bath and/or post-treatment bath as part of the cleaning system. The pre-treatment and/or post-treatment baths are compatible with the biological cleaning bath and during operation of the system, the used pre-treatment and/or post-treatment baths are recycled to the biological cleaning solution for biodegradation. A system is provided in which none of the pre-treatment, post-treatment or biological cleaning baths need expensive waste disposal. Replenishment pre-treatment and/or post-treatment baths as well as biological cleaning baths are added as needed to the biological cleaning system. Other treatment baths may be added directly to the biological cleaning bath with or without pre- or post-treatment for specific purposes such as a detergent phosphating bath used in the biological cleaning tank to provide a cleaned phosphated part.

Abstract: A chemical solution treatment apparatus for dissolving and removing ruthenium-based metal adhering to a substrate by a chemical solution, includes: a chemical solution treatment unit; a reservoir unit; and a chemical solution circulation system. The chemical solution inside treatment unit comprises a chemical solution supplying nozzle, and a recovering mechanism. The reservior unit has a structure having a clearence part to be in contact with the chemical solution so that gas components derived from the ruthenium-based metal dissolved and removed in said chemical solution treatment are volatilized outside the chemical solution during circulation of the chemical solution, and comprises an exhaust duct.

Abstract: Ozone gas having a high ozone concentration is generated by a solid electrolyte electrolytic process. An ozone solution is prepared by injecting the ozone gas into an acidic solution of pH 6 or below. The ozone solution heated at a temperature in the range of 50° to 90° C. is supplied to a contaminated object to oxidize and dissolve a chromium oxide film by an oxidizing dissolving process. The ozone solution used in the oxidizing dissolving process is irradiated with ultraviolet rays to decompose ozone contained in the ozone solution, the ozone solution is passed through an ion-exchange resin to remove ions contained in the ozone solution. An oxalic acid solution is supplied to the contaminated object to dissolve an iron oxide film by a reductive dissolving process.

Abstract: A semiconductor wafer washing system can execute a method in which the washing solution is quickly changed over and over again without the need to alter the structure of the system. The wafer washing system includes a washing solution supply section in which a plurality of chemicals are stored separately, and from which selected ones of the chemicals can be supplied in a predetermined ratio into a washing tank. A circulation section includes circulation piping connected to the washing tank for circulating the washing solution to and from the tank. A discharge section selectively discharges residual chemicals or washing solution from the washing solution supply section, the washing tank and the circulation section. A controller controls the flow of chemicals and washing solution in the washing solution supply section, the circulation section and the discharge section, respectively.

Abstract: An apparatus for processing a microelectronic workpiece is set forth. The apparatus comprises a workpiece support adapted to hold the microelectronic workpiece and a processing container adapted to receive the microelectronic workpiece held by the workpiece support. A drive mechanism is connected to drive the processing container and the workpiece support relative to one another so that the microelectronic workpiece may be moved to a plurality of workpiece processing positions for processing using processing fluid that is provided by first and second chemical delivery systems. The apparatus also includes first and second chemical collector systems that are used to assist in at least partially removing spent processing fluid. In accordance with one embodiment, the apparatus is particularly adapted to execute an immersion process, such as electroplating, and a spraying process, such as an in-situ rinse.

Abstract: A composition and apparatus and method for aqueous spray conditioning of scale on metal surfaces. An aqueous solution having a base composition of an alkali metal hydroxide is used. The aqueous solution may contain additives to improve the performance of the salt. In one embodiment, the solution is used to condition the scale on a strip of stainless steel. The strip of steel is at a temperature between the melting point of the alkali metal hydroxide in anhydrous form and a temperature at which the Leidenfrost effect appears. One or more nozzles is provided to spray the solution, and the heated strip is passed by the nozzle or nozzles where the solution is sprayed on the surface or surfaces of the strip that have the scale or oxide. The invention also includes the apparatus and control thereof for the spraying of the solution.

Abstract: Providing liquid treatment equipment capable of largely reducing a frequency of discarding a treatment solution as a whole and capable of implementing smooth and high quality liquid treatment with less manufacturing burden. Equipment comprises a treatment solution bath capable of accommodating a treatment solution for implementing liquid treatment to a substrate to treat, a treatment solution circulating system circulating the accommodated treatment solution between the outside of the treatment solution bath, and a product removal unit removing a reaction product due to the liquid treatment contained in the circulated treatment solution. By circulating the accommodated treatment solution between the outside of the treatment solution bath, reaction products contained in the circulated treatment solution are removed by means of the product removal unit.

Abstract: The present invention relates to a solution treatment unit for supplying a treatment solution to a substrate to treat the substrate within a treatment container, and an inner container surrounding an outer periphery of the horizontally held substrate with its upper and lower faces open is provided in the treatment container. An exhaust pipe for exhausting an atmosphere in the treatment container is provided in a bottom portion of the treatment container and inside the inner container. An exhaust port of the exhaust pipe is open at a position higher than the bottom portion. A drain port for draining the treatment solution in the treatment container is provided in the bottom portion. According to the present invention, the drain of a solution and the exhaust of an atmosphere can be performed separately without being mixed, and hence pressure loss of a fan on the factory side which performs an exhaust operation can be reduced, resulting in a reduction in excess power consumption.

Abstract: A system for equalizing pressure in a washing chamber in response to changes in pressure inside washing chamber. Gate elements are operable between open and closed positions to regulate pressure conditions inside the washing chamber.

Abstract: A system and method for removing a layer from a substrate surface is provided. The method includes providing at least one encapsulating transport, where the encapsulating transport contains at least some reactive gas. At least one encapsulating transport is applied to the layer, and the layer is a chemically reactive layer. The encapsulating transport ruptures on the chemically reactive layer and releases the reactive gas in combination with a reaction inducing agent onto the chemically reactive layer to facilitate removal of the layer from the substrate surface.

Abstract: A system for cleaning golf clubs having a detergent nozzle and rinse nozzle which move in a rectilinear fashion across the face of the golf club irons placed generally horizontally therein. The golf club irons may be placed generally horizontally in a right hand and left hand configuration such that the face of each golf club iron lies in grooves at an angle generally between 15 and 30 degrees relative to a detergent nozzle of a cleaning assembly. The generally trapezoidal lid is then closed around the golf club irons. As the lid is closed, complementary grooves form slots around the handle of the golf club irons. The golf club cleaning system may then be activated by inserting a coin into a control box . When activated, the cleaning system translates along a track assembly while the detergent nozzle imparts a stream of detergent from a detergent container to the faces of the golf club irons.

Abstract: The present invention provides a system (200, 300) for remediating aberrations along the perimeter of a semiconductor wafer (202). The system includes a cleaning apparatus (204) within which the wafer is spun within a confined area. A chuck (208) defines the confined area, having a sidewall that extends above the upper surface (214) of the wafer and surrounds the perimeter of the wafer. The chuck also has a bottom wall, with an aperture formed therein, beneath the wafer. The system includes an isolation barrier (220), disposed atop the bottom wall of the chuck and around the aperture, in proximity to the lower surface so of the wafer. This forms a narrow gap (226) between the barrier and the wafer. A pressurized source forcefully directs a gas (218) at and along the lower surface of the wafer. The system also includes a remediation solution (228) that is applied to the upper surface of the wafer.

Abstract: The invention relates to a cleaning apparatus with a filter device. The filter device contains a ceramic filter equipped with a heating device. The heating device serves for thermal sterilisation of the ceramic filter, by which allergenic substances are destroyed.

Abstract: A ware wash machine includes one or more fluidic oscillator nozzles (or other variable stream orientation nozzles) used in connection with the dispensing of wash liquid, rinse liquid, sanitizing liquid and/or gaseous fluids onto wares being cleaned and/or dried and/or heated within the machine.

Abstract: A supercritical CO2 cleaning system according to the invention can include: a pressure chamber configured to clean a workpiece with supercritical CO2; an expansion chamber configured to receive an output of the pressure chamber; a CO2 recycle system configured to receive an expanded CO2 stream from the expansion chamber, and configured to output a recycled CO2 stream; a supply of fresh CO2 configured to output a fresh CO2 stream; a purification system configured to receive at least one of the fresh CO2 stream and the recycled CO2 stream, the purification system configured to output a purified CO2 stream; and a first co-solvent supply configured to output a first co-solvent stream, where the pressure chamber is configured to receive the purified CO2 stream and the first co-solvent stream.

Abstract: In a cleaning controller for a recording head of a recorder connected to an external device, a timer acquires a first time value indicating a current time from the external device, and performs cyclic clocking in which a first predetermined time period is repetitively clocked from a predetermined time point. A nonvolatile storage medium stores a second time value indicating a time at which a cleaning operation is lastly performed. A determinant compares the first and the second time values to obtain a third time value, and determines whether a cleaning operation is necessary to be performed based on the third time value. A cleaner performs a cleaning operation of the recording head based on the result determined by the determinant.

Abstract: The present invention is an apparatus that cleans contaminants from pipes. The apparatus comprises a high velocity pump, a cleaning solution tank, a first line that selectively connects said cleaning solution tank to said high velocity pump, a solvent tank, a second line that selectively connects said solvent tank to said high velocity pump, a manifold, and a third line that selectively connects said manifold to said high velocity pump.

Abstract: A method of cleaning and maintenance used for a rotational etching tool, combining the physical characteristics of water (splashed off after striking the surface of a spinning wafer) and a PM (preventive maintenance) computer program, can automatically and quickly clean the interior of the etching tool. By setting the appropriate parameters of PM program, single or all of process chambers can be well cleaned. Also, the DI water dropping positions on the wafer can be altered to create more splashing angles. To clean the sidewalls of the etching chambers, the wafer supporting means is moved between the process chamber and the rotating speed thereof is preferably alter while it is moving. The PM program of the present invention can be executed whenever the cleaning job needs to be done. It not only is timesaving and easy to apply, but also keeps the wafer in a almost-no-particle environment while being etched.

Abstract: The present invention relates to a multi-functional surface cleaning machine having a fluid tank, a primary fluid pump, a secondary priming pump, and at least one receptacle for holding concentrated cleaning chemicals. The receptacle(s) are in fluid communication with an operator controllable selector. The selector, either alone or in combination with a metering valve, may control which chemical(s) and the amount of such chemical(s) that will be allowed to flow to an inlet of a multi-inlet mixing member. A second input to the mixing member is a fluid to be stored within the fluid tank. The fluid and chemical which may be supplied to the mixing member may be mixed within the mixing member to create a cleaning solution, which may be supplied to any number of dispensing devices. One such device may be a spray gun for dispensing pressurized cleaning solutions onto a surface to be cleaned.

Abstract: The inventive device for cleaning substrates, especially semiconductor wafers, comprises a treatment basin for receiving at least one substrate, a cover for sealing said treatment basin, a first feeding device for controllably feeding in a reactive gas, a second feeding device for controllably feeding in at least one moist fluid for promoting a reaction between the reactive gas and a deposit to be removed from the substrate and a control device for controlling the concentration of moisture in the treatment basin.

Abstract: System and method for reducing damage to a semiconductor substrate when using cleaning fluids at elevated pressures to clean the semiconductor substrates. A preferred embodiment comprises applying the cleaning fluid at a first pressure for a first time period, wherein the first pressure is relatively low, and then increasing the pressure of the cleaning fluid to a pressure level that can effectively clean the semiconductor substrate and maintaining the pressure level for a second time period. The application of the cleaning fluid at the relatively low initial pressure acts as a temporary filler and creates a buffer of the cleaning fluid on the semiconductor substrate and helps to dampen the impact of the subsequent high pressure application of the cleaning fluid on the semiconductor substrate.

Abstract: A single wafer cleaning chamber that includes a rotatable bracket that can place a wafer beneath an upper end of a catch cup during a wafer cleaning process, a gutter positioned above a wafer transfer slit; where the catch cup can mate with the gutter to create a gap, and with the upper end of the catch cup positioned at a height equal to or higher than the gutter.

Abstract: A method and apparatus for cleaning the bevel of a semiconductor substrate. The apparatus generally includes a cell body having upstanding walls and a fluid drain basin, a rotatable vacuum chuck positioned centrally positioned in the fluid drain basin, and at least 3 substrate centering members positioned at equal radial increments around the rotatable vacuum chuck. The substrate centering members include a vertically oriented shaft having a longitudinal axis extending therethrough, a cap member positioned over an upper terminating end of the shaft, a raised central portion formed onto the cap member, the raised central portion having a maximum thickness at a location the coincides with the longitudinal axis, and a substrate centering post positioned on the cap member radially outward of the raised central portion, an upper terminating end of the substrate centering post extending from the cap member to a distance that exceeds the maximum thickness.

Abstract: A device and method for processing substrates, whereby medium consumption and processing time are reduced. According to the inventive method, liquid is conducted to a surface of the substrate that is to be treated via at least one nozzle that is arranged in a substantially centric position with respect to said substrate and via a plurality of second nozzles that are controlled separately from the first nozzle.

Abstract: Methods of and apparatus for washing an array of sites in high-density microplates or similar assay plates wherein the microplates or assay plates are washed in an inverted or nearly inverted position, rather than in an upright position. Preferably, the wash liquid is dispensed upwardly in the form of a sheet from a nozzle mounted on a spray bar as the spray bar moves relative to the microplate or assay plate. After washing, the microplate or assay plate is dried with a stream of gas such as air, also preferably blown upwardly in the form of a sheet.

Abstract: A substrate treatment process is disclosed to remove organic matter existing on a substrate such as a wafer, glass substrate or ceramic. The process comprises treating the substrate with ozone water and then with hydrogen water, or treating the substrate with ozone-hydrogen water or treating the substrate with ozone water and hydrogen water at the same time. A substrate treatment apparatus is also disclosed for a substrate. The apparatus comprises a treatment vessel, a substrate holder for rotating the substrate in a horizontal plane in the treatment vessel, a nozzle unit arranged in an upper part of the treatment vessel such that a liquid is downwardly fed, a feed line for feeding the liquid to the nozzle unit, and a chamber enclosing therein the apparatus in its entirety.

Abstract: In the art of wet-cleaning a substrate by etching with a cleaning solution prepared by dissolving hydrofluoric acid as an active component in water, using the process of measuring the concentration of a predetermined component regularly and then replenishing the cleaning solution with a component for correcting the concentration at need on the basis of the result of measurement on the concentration in case of cleaning the substrate with an aqueous solution of ammonium fluoride as the cleaning solution while controlling air in a cleaning draft at an exhaust rate within a predetermined range.

Abstract: A plurality of incrementally rotating nozzles are mounted in the bottom and side walls of a swimming pool provide bursts of water to channel in a cascade manner debris toward outlets disposed in the bottom of the pool.

Abstract: A dishwasher includes a door, a washing tub closable by the door, and a water softener including an ion exchanger and a salt container. The salt container is disposed in an area of the door and includes a first and a second side wall, a bottom, narrow connecting walls, a water inlet and a brine outlet. Two side walls are disposed in the salt container, the dividing walls extending from the side walls to the bottom, dividing the salt container into a water distribution duct including the water inlet, a salt chamber, and a brine collecting duct including the brine outlet. The dividing walls, each including a respective screen surface in a region adjacent to the bottom, separate the water inlet and a brine outlet from each other. The screen surfaces are arranged in a v-shape relative to each other.