Abstract: An endoscope reprocessor having a water supply disinfection filter and a method for self-disinfection of the filter employ a pair of connectors to switch from a normal operating mode into a self-disinfection mode in which circulating germicidal fluid within the reprocessor flows through the filter, while the water supply remains connected to the system and isolated from the circulating fluid.

Abstract: A system for cleaning a dairy animal milker unit and applying dip to a dairy animal, the system includes a main control, an air supply, a water supply, a backflush fluid supply, a dip supply, a stall control for receiving the air, water, backflush fluid and dip supplies, and a safety valve that is adjacent to a downstream portion of the milker unit to control backflush and dip fluids being fed to the milker unit.

Abstract: A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.

Abstract: On the top surface of a substrate, an atmosphere blocker plate, of which plan size is equal or larger than the substrate size, is disposed opposing to the top surface of the substrate. In the rim portion of the atmosphere blocker plate, a vertical through hole is formed so that a nozzle can be inserted into the hole. Nozzle move mechanism moves the nozzle to insert the nozzle to the through hole and position it to the opposing position that is opposed to the top rim portion of the substrate and to the retract position that is away from the atmosphere blocker plate. Processing liquid is supplied from the nozzle, which is positioned to the opposing position, to the top rim portion of the substrate.

Abstract: A wafer W is held in a horizontal attitude within an airtight container 41 by a vacuum chuck 42 such that small gaps are formed between the wafer W and the inner surfaces of the airtight container 41. A cleaning liquid is supplied toward the center portion of a front surface of the wafer W through a fluid supply port 40 which is an end of a fluid supply path 5, and is discharged through a fluid discharge portion 44 arranged in the bottom portion of the airtight container 41 in a form of a groove running along a circle having its center located on the center axis of the wafer W. The cleaning liquid flows and spreads from the center portion of the wafer W toward the peripheral portion while removing particles adhered to the wafer W, and is discharged through the fluid discharge portion 44. This arrangement allows the particles to be uniformly and reliably removed without rotating the wafer W. The entire cleaning apparatus 4 has a small size.

Abstract: Disclosed are a cleaning apparatus and a cleaning method, which can collect a chemical liquid without reducing the throughput after a substrate is subjected to a cleaning treatment and dried by using a drying solvent, such as IPA. The disclosed cleaning apparatus carries out a chemical liquid cleaning treatment, a rinsing treatment, and a drying treatment with IPA, in order, on a wafer W while rotating wafer W, and includes a cleaning liquid supply device for supplying a cleaning liquid for cleaning the drain cup and the drain tube to the drain cup in a state where the cleaning liquid is not supplied to the wafer. Also, the apparatus further includes a control unit for controlling respective components of the cleaning apparatus. The control unit, after the cleaning treatment and then the rinsing treatment of wafer W, at the time when the drying treatment is performed by IPA, controls the cleaning liquid to be supplied to the drain cup.

Abstract: Apparatuses and processes for treating dielectric materials such as low k dielectric materials, premetal dielectric materials, barrier layers, and the like, generally comprise a radiation source module, a process chamber module coupled to the radiation source module; and a loadlock chamber module in operative communication with the process chamber and a wafer handler. The atmosphere of each one of the modules can be controlled as may be desired for different types of dielectric materials. The radiation source module includes a reflector, an ultraviolet radiation source, and a plate transmissive to the wavelengths of about 150 nm to about 300 nm, to define a sealed interior region, wherein the sealed interior region is in fluid communication with a fluid source.

Abstract: A water-conducting domestic appliance including a line system, a detergent feed facility that supplies at least one detergent into the line system, wherein the detergent feed facility includes at least one reservoir configured to be filled with detergent, and a refill fitting having a connection to the at least one reservoir, the refill fitting being arranged on a door of the water-conducting domestic appliance.

Abstract: A method and apparatus for cleaning washware, in particular dishes, is provided. In the process, the washware is subjected to at least one wash process in which adhering dirt is at least largely removed. The washware is then subjected to a final-washing process which has at least two substeps. The washware is acted on by a first rinse liquid in a first substep, with the first rinse liquid containing a disinfectant. The washware is acted on by a second rinse liquid in a subsequent second substep, with the second rinse liquid comprising at least one permeate which is produced by reverse osmosis.

Abstract: Disclosed is a system and method to monitor and count particles removed from a component. The particle monitoring system includes a jet spray device, a snow generator, a particle collection device, and a particle counter. The jet spray device includes an outlet that is disposed locally relative to the component. The snow generator is operable to generate cleaning snow comprising a stream of ice particles, wherein the cleaning snow is emitted from the outlet of the jet spray device onto the component to cause the ejection of particles from the component. The particle collection device includes a collector that is disposed locally around the component to collect particles ejected from the component. The particle counter is coupled to, and in fluid communication with, the particle collection device. The particle counter is operable to detect and count particles ejected from the component.

Abstract: A cleaning and drying-preventing method including: positioning a nozzle in a container such that a funnel-like inner circumferential surface of the container is located around a periphery of a distal end of the nozzle; sucking a liquid in the nozzle to retract a level of the liquid to a side of a supply passage; supplying a solvent into the container to form a swirl flow of the solvent turning around the distal end of the nozzle, and cleaning the nozzle by the swirl flow; supplying a solvent into the container to form a liquid pool of the solvent; and further retracting the level of the liquid in the nozzle to the side of the supply passage. A liquid layer, an air layer, and a solvent layer are formed in the nozzle in this order from the side of the supply passage, to prevent drying of the liquid in the nozzle.

Abstract: There is disclosed a substrate treating method comprising supplying a treating solution onto a substrate, and continuously discharging a first cleaning solution to the substrate from a first discharge region disposed in a nozzle, while moving the nozzle and substrate with respect to each other in one direction, wherein a length of a direction crossing at right angles to the direction of the first discharge region is equal to or more than a maximum diameter or longest side of the substrate, the nozzle continuously spouts a first gas to the substrate from a first jet region, and the length of a direction crossing at right angles to the direction of the first jet region is equal to or more than the maximum diameter or longest side of the substrate.

Abstract: A water-conducting domestic appliance, in particular a domestic dishwasher, the water-conducting domestic appliance including a washing compartment for receiving items therein that are to be subjected to a handling process by the water-conducting domestic appliance; and a detergent dosing system, the detergent dosing system having a detergent dispenser, the detergent dispenser being configured to receive at least one cartridge that is configured to hold a dosing agent, the detergent dosing system being configured to communicate the washing compartment and an area surrounding the water-conducting domestic appliance with one another in the manner of an expansion opening via which a fluid under pressure in the washing compartment can be released to the area surrounding the water-conducting domestic appliance.

Abstract: The present invention relates to n apparatus of supplying and discharging a fluid, comprising: an inner tub; a fluid inflow passage connected to the inner tub; and a fluid outflow passage connected to the inner tub, wherein at least one of the inner tub, the inflow passage and the outflow passage has undergone at least one of the Kimchi lactic acid bacteria culture treatment and the Kimchi lactic acid bacteria culture exposure treatment.

Abstract: Inside a single apparatus main body (100), a surface treatment apparatus includes: a treatment cell (11); a vertical rotation shaft (12); an attachment/detachment means; a receiving tank (15); a cover body (16); a plurality of tanks (21) and the like; a plurality of surface treatment liquid supply means (22) and the like; a cleaning water supply means; a drain means (3); and a first cleaning means, wherein upon operation of the surface treatment liquid supply means while the treatment cell (11) containing small objects is rotated by the vertical rotation shaft (12), a surface treatment is carried out on the small objects, upon operation of the cleaning water supply means, the small objects inside the treatment cell (11) are cleaned, and upon operation of the first cleaning means, the inner face of the cover body and/or the outer face of the treatment cell are/is cleaned, thus providing circulation use of surface treatment liquids in the tanks.

Abstract: A chemical concentration controller and recorder is disclosed for controlling and recording chemical concentrations in a cleaning system. The invention allows a user to control the concentration of two or more chemicals in the cleaning system simultaneously using either concentration-based feed or timed feed. The invention records and archives chemical concentration data from sensors in the cleaning system tanks or the cleaning system fluid conduits during operation of the cleaning system. The data may then be downloaded by a user and analyzed for efficiency and cost control purposes. For example, the data may indicate the overfeeding of chemicals to the cleaning system or leaking valves in the cleaning system.

Abstract: A device for the metered delivery of a liquid washing or ringing agent for a washing machine and the like. The device includes a casing which is to be secured to the machine and which is provided with a refillable reservoir for the liquid agent in which is defined a delivery receptacle capable of holding an amount of liquid agent corresponding to a plurality of metered amounts, and an electrically controlled delivery valve device associated with the receptacle and capable of permitting a flow of liquid agent from the delivery receptacle towards the washing chamber of the machine, a level-indicator device associated with the delivery receptacle and capable of signalling the instantaneous level reached by the rinsing agent in the receptacle, and a control unit connected to the indicator and arranged to control the delivery valve device in accordance with predetermined modalities as a function of the signal provided by the level-indicator device.

Abstract: A method of cleaning pipeline pigs of a material that is to be recycled includes providing a vessel having an interior. A manifold is placed within the vessel interior, the manifold having a plurality of openings. The vessel is filled with a solvent that is capable of dissolving the material to be recycled. The pipeline pig is placed in the vessel and above the manifold. A volume of gas is bubbled into the vessel via the manifold openings. These steps are repeated with multiple pigs in sequence so that the material to be recycled is concentrated over time within the vessel. Thereafter, the material that has accumulated within the vessel is recycled. The solvent is preferably a terpene blend with an ethoxylated alcohol. The material to be recycled is preferably paraffin and/or asphaltene.

Abstract: A method for cleaning an edge surface of a semiconductor substrate is disclosed. The proximity head unit is positioned so that the flow head portion and the collection head portion of the proximity head unit are proximate to the edge surface of the semiconductor substrate. The semiconductor substrate is then rotated using one or more powered rollers. During the rotation of the semiconductor substrate, the flow head portion applies a fluid to the edge surface while the collection head portion collects fluid from the edge surface. Additional methods, an apparatuses, and a system for cleaning an edge surface of a semiconductor substrate are also described.

Abstract: A substrate (W) is held and rotated in its horizontal position on a spin base (10). A processing liquid can be supplied from a processing liquid lower nozzle 15 to the lower surface of the substrate (W). The upper surface of the substrate (W) is covered with an atmosphere blocking plate (30). A splash guard (50) is disposed so as to circumscribe the substrate (W). A guard (52) is curved such that the vertical cross section of a recovery port (52f) of the splash guard (50) is of substantially U-shape opening to the center of the splash guard (50), so that the maximum internal diameter part of the recovery port (52f) is brought near a guard (53). The space between the internal wall surface of the recovery port (52f) and the substrate (W) is increased to thereby suppress the bounce of the processing liquid flying spattering from the substrate (W) in rotation.

Abstract: The invention concerns a device and a method of adding rinse aids to a home appliance containing liquid, especially a household dishwasher, with a main tub (1), which has a service opening (4) to put the things to be washed into the main tub (1), whereby the device includes at least one dispensing unit (6) to hold and dispense the rinse aid. The dispensing unit (6) is placed in the main tub (1), whereby at least part of the dispensing unit (6) is placed so it can move or is movable and can be pulled out of the main tub (1), at least partly, in the direction of the service opening (4).

Abstract: A fluid dispensing system for a dishwasher door assembly having an inner door panel and an outer door panel is provided. The fluid dispensing system includes a storage tank fixedly coupled within the door assembly between the inner door panel and the outer door panel. A pump is fixedly coupled within the door assembly. A dispenser extends at least partially through the door assembly. At least one conduit is in flow communication with the storage tank, the pump, and the dispenser. A control board is in electrical communication with the pump.

Abstract: A mixing valve assembly 42 is communicated with a dedicated tank 51D, storing therein a compatibilizer D, via an inlet valve 43 and is also communicated with dedicated tanks 51A-51C via three injection valves, the tanks storing therein auxiliaries A-C respectively. A chemical formulation is prepared by selectively injecting any one(s) of four chemical agents into the mixing valve assembly 42 by way of on-off control of the inlet valve 43 and the injection valves and blending together the injected chemical agents. Then, the chemical formulation is pumped into SCF by a high-pressure pump 45 such that the SCF and the chemical formulation are mixed together to form a process fluid. Thus, the number of components of a high-pressure portion can be reduced to achieve a cost reduction of an apparatus. Furthermore, a pipe line for pumping the chemical agents is simplified.

Abstract: A parts cleaner for use in a process whereby solvent is preferred to always be available and is preferred to be as clean or pure as possible for use, comprising two containers respectively for clean solvent and for capture of used solvent or a single container having separate zones for clean and used solvent, said clean container having an outlet for supplying clean solvent for cleaning. The clean container may have an outlet for supplying clean solvent for cleaning and an inlet for clean recycled solvent, the used solvent container having an inlet for used solvent, an outlet for supplying used solvent for cleaning and an outlet for supplying used solvent for recycling. The used solvent container may have an outlet for supplying used solvent for cleaning and means for automatically switching between the outlets supplying said clean solvent and said used solvent for cleaning.

Abstract: The embodiments of the present invention provide apparatus for cleaning patterned substrates with fine features with cleaning materials. The apparatus using the cleaning materials has advantages in cleaning patterned substrates with fine features without substantially damaging the features. The cleaning materials are fluid, either in liquid phase, or in liquid/gas phase, and deform around device features; therefore, the cleaning materials do not substantially damage the device features or reduce damage all together. The cleaning materials containing polymers of a polymeric compound with large molecular weight capture the contaminants on the substrate. In addition, the cleaning materials entrap the contaminants and do not return the contaminants to the substrate surface. The polymers of one or more polymeric compounds with large molecular weight form long polymer chains, which can also be cross-linked to form a network (or polymeric network).

Abstract: By exposing a wet chemical cleaning solution, such as hydrofluoric acid, to a pressurized inert gas ambient prior to applying the solution to patterned dielectric materials of semiconductor devices, the incorporation of oxygen into the liquid during storage and application may be significantly reduced. For instance, by generating a substantially saturated state in the pressurized inert gas ambient, a substantially oversaturated state may be achieved during the application of the liquid in ambient air, thereby enhancing efficiency of the treatment, for instance, by reducing the amount of material removal of exposed copper surfaces after trench patterning, without requiring sophisticated modifications of process chambers.

Abstract: A method and apparatus for removing a first liquid from a surface of a substrate is provided. A second liquid is supplied to at least part of a surface of a substrate having a rotary movement. The rotary movement has a center of rotation and an edge of rotation. The second liquid is directed from the center of rotation to the edge of rotation using a nozzle. A dry zone is created on the substrate as the position of the spray moves from the center of rotation to the edge of rotation. As a result, the first liquid and the second liquid are removed from the surface of the substrate.

Abstract: A container rinsing system (10) has an air nozzle adapted to be positioned proximate an opening of the container and adapted to direct a supply of compressed air to the container. A vacuum member is adapted to be in communication with a vacuum source. The vacuum member is positioned around the air nozzle and adapted to vacuum foreign particles away from the container.

Abstract: A substrate cleaning apparatus is used to clean a substrate with a cleaning liquid. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold a substrate horizontally, a rotating mechanism configured to rotate the substrate held by the substrate holding mechanism, a liquid supply nozzle for supplying a cleaning solution to the substrate, and a spin cover provided around the substrate and rotatable at substantially the same speed as the substrate. The spin cover has an inner circumferential surface shaped so as to surround the substrate. The inner circumferential surface is, from a lower end to an upper end thereof, inclined radially inwardly.

Abstract: A method for processing a substrate is provided which includes applying fluid onto a surface of the substrate from a portion of a plurality of inlets and removing at least the fluid from the surface of the substrate where the removing being processed as the fluid is applied to the surface. The applying the fluid and the removing the fluid forms a segment of a fluid meniscus on the surface of the substrate.

Abstract: A system is provided for cleaning wafers that includes specialized pressurization, process vessel, recirculation, chemical addition, depressurization, and recapture-recycle subsystems. A solvent delivery mechanism converts a liquid-state sub-critical solution to a supercritical cleaning solution and introduces it into a process vessel that contains a wafer or wafers. The supercritical cleaning solution is recirculated through the process vessel by a recirculation system. An additive delivery system introduces chemical additives to the supercritical cleaning solution via the solvent delivery mechanism, the process vessel, or the recirculation system. Addition of chemical additives to the sub-critical solution may also be performed. The recirculation system provides efficient mixing of chemical additives, efficient cleaning, and process uniformity. A depressurization system provides dilution and removal of cleaning solutions under supercritical conditions.

Abstract: A drip tray sanitizing system includes a pump connectable to a sanitizer solution container and a valve connectable to a diluent source. A spray manifold disposed in the drip tray receives a mixture of the two streams and sprays the mixture into the drip tray in a prescribed routine to produce a sanitizing or cleansing effect. Methods for using the drip tray sanitizing system include manual, semi-automatic, and automatic sanitizing, as well as manual and automatic rinsing. The semi-automatic and automatic sanitizing routines require the use of a controller. Use of this apparatus in a product dispenser may widen the range of products and product concentrates available for use with a product dispenser.

Abstract: A substrate treatment apparatus for removing an unnecessary substance from a surface of a substrate. The apparatus is provided with: an oxidation liquid supply mechanism for supplying an oxidation liquid having an oxidative effect to the substrate surface; a physical cleaning mechanism for physically cleaning the substrate surface; and an etching liquid supply mechanism for supplying an etching liquid having an etching effect to the substrate surface. It is preferred to physically clean the substrate surface while supplying the oxidation liquid to the substrate surface.

Abstract: Disclosed are a method and apparatus for etching disk-shaped members, especially a method and apparatus for etching semiconductor wafers. In a method wherein wafers (30) are rotated and etched in an etching chamber (12) which is filled with an etching solution, a non-rotating cell plate (26) is disposed between two rotating wafers (30). In an etching apparatus wherein multiple wafers (30) are supported and rotated by a rod (16), the cell plate (26) is disposed between each two wafers (30). The cell plate (26) has a surface area roughly equivalent to that of the wafer (30).

Abstract: In a first aspect, an apparatus adapted to clean a semiconductor device manufacturing component is provided. The apparatus includes an ozone module adapted to (1) obtain Ozone; (2) combine the Ozone with a fluid to generate ozonated fluid; and (3) deliver the ozonated fluid to the semiconductor device manufacturing component so as to clean the semiconductor device manufacturing component. Numerous other aspects are provided.

Abstract: A dishwasher has multiple wash zones which are each supplied by a wash liquid supply. An interior tub configured to provide an interior wash chamber for washing dishes is divisible into three wash zones supplied by first, second, and third wash liquid supplies. The third wash zone is supplied by a wash liquid supply that is controllable independently of the other two wash liquid supplies. The third wash liquid supply can be controlled to supply wash liquid to a detergent dispenser or a wall-mounted spray manifold, or shut off separately from the first and second wash liquid supplies.

Abstract: A dishwasher includes a pump assembly which functions to chop all fluid entrained soil prior to directing fluid to upper and lower wash arms. A flow conduit leading to the upper wash arm is provided with a sampling port which directs a percentage of the fluid flow into a filter chamber having one or more fine mesh filter screens that open into the dishwasher tub basin. The filter chamber is exposed to a collection chamber that leads to a drain. In the event the filter chamber becomes clogged, a pressure relief valve opens a pressure regulation port to permit washing fluid in the filter chamber to enter the tub basin. In one embodiment, the pressure relief valve is constituted by a check ball which is displaced by a pressure build up in the filter chamber. In another embodiment, the pressure relief valve is constituted by a flapper valve.

Abstract: A system and method of forming and using a proximity head. The proximity head includes a head surface, the head surface including a first zone, a second zone and an inner return zone. The first zone including a first flat surface region and a plurality of first discrete holes. Each one of the plurality of first discrete holes being connected to a corresponding one of a plurality of first conduits. The plurality of first discrete holes residing in the head surface and extending through the first flat surface region. At least a portion of the plurality of first discrete holes are arranged in a first row. The second zone including a second flat region and a plurality of second discrete holes. Each one of the plurality of second discrete holes being connected to a corresponding one of a plurality of second conduits. The plurality of second discrete holes residing in the head surface and extending through the second flat surface region. The inner return zone including a plurality of inner return discrete holes.

Abstract: A system for dispensing a liquid, wherein the system includes a reservoir comprising a plurality of apertures disposed therein, and at least one dispenser in flow communication with the reservoir, the dispenser comprising a first and a second tube operatively coupled to the reservoir.

Abstract: A chemical supply system comprises, as principal elements, a chemical storage tank in which a liquid chemical for cleaning is stored in the state of its formulated concentrate, a chemical supply apparatus connected to the chemical storage tank for positively performing chemical supply, a piping system connected to the chemical supply apparatus to form a supply flow passage that is a passage for ultrapure water which the liquid chemical is to be mixed with, a pair of discharge nozzles disposed at end portions of the piping system so as to oppose surfaces of a wafer set in a cleaning chamber to supply a cleaning liquid onto the surfaces. Thereby, remarkable miniaturization/simplification of a cleaning liquid supply system including chemical tanks is intended, it is made possible easily and rapidly to compound and supply a cleaning liquid at an accurate chemical concentration, and particles or the like being generated and mixing in a cleaning liquid, are suppressed to the extremity.

Abstract: Described are methods, systems, and chemistries for cleaning various components of semiconductor process equipment. A method in accordance with one embodiment cleans articles with differently contaminated interior and exterior surfaces by using those articles to separate a cleaning vessel into separate chambers, one chamber for the interior surface and one for the exterior surface. Different chemistries are then applied to the differently contaminated surfaces. This embodiment reduces the required volume of etchant, and consequently saves the cost, treatment, and disposal of toxic chemicals. One embodiment further reduces the requisite etchant volume using one or more volume-displacement elements that displace some of the etchant volume.

Abstract: The present invention relates to vacuum processing systems in which process gases are introduced in a process chamber and are exhausted through a vacuum processing system exhaust path. Deposits made by the exhausted gases in one or more dry vacuum pumps are removed by introducing hydrofluoric acid upstream of the dry pump while the processing chamber is idle. The hydrofluoric acid is introduced upstream of the dry pump through a nozzle in the foreline or at the inlet to the dry pump.

Abstract: A method of cleaning a surface, comprising applying de-gassed water (containing no more than 1 ppm gas) to the surface to disperse or dissolve dirt on the surface in the water. The method may also comprise dissolving hydrophobic dirt on the surface using a non-aqueous solvent, and dispersing the non-aqueous solvent and dissolved hydrophobic dirt in the de-gassed water. The non-aqueous solvent may itself contain low levels of dissolved gas, for example no more than 10 ppm. Apparatus for cleaning a surface is also disclosed.

Abstract: A substrate processing system that enables foreign matter adhered to a rear surface or a periphery of a substrate to be completely removed. A substrate processing apparatus performs predetermined processing on the substrate. A substrate cleaning apparatus cleans the substrate at least one of before and after the predetermined processing. A jetting apparatus jets a cleaning substance in two phases of a gas phase and a liquid phase and a high-temperature gas towards the rear surface or the periphery of the substrate.

Abstract: Aluminum-plated components of semiconductor material processing apparatuses are disclosed. The components include a substrate and an optional intermediate layer formed on at least one surface of the substrate. The intermediate layer includes at least one surface. An aluminum plating is formed on the substrate, or on the optional intermediate layer. The surface on which the aluminum plating is formed is electrically-conductive. An anodized layer can optionally be formed on the aluminum plating. The aluminum plating or optional the anodized layer comprises a process-exposed surface of the component. Semiconductor material processing apparatuses including one or more aluminum-plated components, methods of processing substrates, and methods of making the aluminum-plated components are also disclosed.

Abstract: A spray fill device for delivering water to a washing machine is provided. The spray fill device includes a body defining an inlet, an outlet port, a mounting port, and a plurality of outlet apertures in flow communication with the inlet. The spray fill device also includes a first valve coupled to the inlet, the valve configured to control a flow rate of water into the inlet. The spray fill device also includes a pressure relief mechanism coupled to the mounting port, the pressure relief mechanism inhibiting flow through the outlet port when a pressure within the body is less than a predetermined pressure.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: A device for cleaning a selective catalyst reduction unit by directing air or a cleansing solution directly into or out of honeycomb cells of the selective catalyst reduction unit. The device utilizes a plurality of orifices which are sufficient in diameter and number to cleanse honeycomb cells thereby directing air or cleansing solution into or out of each individual honeycomb cell. The device also utilizes a plurality of probes which are sufficient in number and diameter to cleanse the honeycomb cells. The invention also involves a method for cleaning the honeycomb cells and a method for producing the catalyst cleaning tool.

Abstract: A vending machine and a hose controller system for vending machines wherein the dispenser hose is axially and torsionally controlled to facilitate slight twisting, thereby minimizing applicator tool resistance, and making it easier for users to operate the remote vending tool on the hose distal end. The elongated reinforced applicator hose terminates at the controller, which bridges the hose between the outdoors and the cabinet interior. The controller has an angulated bracket mounted within the vending machine cabinet. A collar assembly secured on the bracket top above a hose feed-through orifice has a terminator, a bushing, and a cooperating yoke that are coaxially secured. The terminator anchors the hose end and is seated within the yoke. A rigid lug projects radially from the yoke. A rigid restrictor surmounts the collar assembly and limits rotation by contact with the lug.

Abstract: A dishwasher having at least one actuator, at least one input device, at least one processor and at least one door defining at least part of a washing area when the door is closed. The dishwasher has at least one supply housing supported by the door, and the supply housing is sized to hold an amount of liquid dish washing supply which is sufficient for a plurality of wash cycles. The actuator is operable to cause movement of the liquid dish washing supply from the supply housing toward the washing area. The input device is operable to receive different inputs associated with different portions of the liquid dish washing supply. The processor is programmed to cause the actuator to cause movement of the different portions toward the washing area for different wash cycles.