Abstract: A system for processing a workpiece includes a dry process chamber, such as a plasma etching chamber, and a wet process chamber, such as a spin/spray chamber. Gas supply lines supply gases to the dry process chamber, and to a chemical solution generator. A liquid supply line supplies a liquid, such as de-ionized water, to the chemical solution generator. The chemical solution generator manufactures liquid chemical solutions in situ, for point of use in the wet process chamber. The system allows for both wet and dry processing with few or no separate liquid chemical supply lines.

Abstract: A device is provided to clean an object by positioning the surface of the object to be cleaned in contact with a cleaning medium comprising one or more liquids having a dielectric constant of from 1 to 200 and placed in an electric field in the range of from 103 V/m to 107 V/m wherein said device is capable of generating said electric field using an alternating voltage/current source, said device comprising at least two electrodes where one of the electrodes is at a higher potential than the other and said electrodes are spatially separated by a distance of 1 micron to 2 cm by an insulating material having a dielectric breakdown strength greater than the applied electric field.

Abstract: The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chemical liquid, is accommodated in a housing. The processing fluid supply unit accommodated in the housing is advanced into the processing space through the opening of the enclosure structure to feed the processing fluid onto the substrate supported by the substrate support member.

Abstract: A non-intrusive device for automatically dosing at least one liquid laundry care composition to an automatic laundry washing machine. The device employs a Venturi tube mechanism or a pump to dose the laundry detergent care composition. The dosing is controlled by a machine-generic algorithm capable of determining the actual cycle at any duration of wash for various cycle designs from various washing machines, without the input of precise cycle design; and dose the correct products correctly and is capable of distinguishing between major water addition and a water pulse.

Abstract: In a machine for washing and/or sterilizing supplying-batching devices, an enclosing structure has supporting means for a supplying-batching device to be washed and/or sterilized. Feeding ducts are to be connected to a hopper of the supplying-batching device for feeding washing fluids. Working devices are to be connected to batching means and to supplying means of the supplying-batching device, and are to be operated to reproduce working operation of the batching means and supplying means, so as to perform working cycles with said washing fluids fed to the hopper.

Abstract: A simple and cost-effective method is provided, according to which a positive temperature component (PTC) element directly controls the element made of a shape memory alloy. A simple and cost effective device for performing the method has a PTC element series-connected upstream from the element made of a shape memory alloy, in the electric circuit for the element made of a shape memory alloy.

Abstract: An apparatus for processing a substrate is disclosed. The apparatus includes a proximity head having a surface that can be interfaced in proximity to a surface of a substrate. The proximity head has a plurality of dispensing ports capable of dispensing a first process mixture and a second process mixture to the surface of the substrate. The proximity head also has a plurality of removal ports capable of removing the first and second process mixtures from the surface of the substrate. The apparatus also has a distribution manifold connected to the plurality of dispensing ports for dispensing the first process mixture and second process mixture. The distribution manifold is connected to the plurality of removal ports, and is structured to define selected regions of the proximity head for delivery and removal of the first process mixture and the second process mixture.

Abstract: A moving light washer places moving light parts into a crate that has holes and drain parts therein, and uses the crate in a dishwasher to wash the the moving light parts. The crate can also be used for storing the lights, such that the same structure that is used for washing the lights is also used at a different time for storing the lights.

Abstract: An emission control device, such as a filter, is regenerated by exposure to plasma. Plasma breaks down carbon-based residues, such as soot, to enable the filter to be easily cleaned and regenerated without subjecting the filter to heat-related stress associated with thermal regeneration methods. Secondary plasma generation is used to overcome impediments caused by the presence of a metallic housing and/or metal-containing materials such as a washcoat or mesh in the filter.

Abstract: A mobile or stationary waste container cleaning system used for residential, commercial and industrial waste, garbage, trash, storage or operations containers or receptacles. Other applications include, but are not limited to cleaning of chemical drums, grease dumpsters (e.g. behind restaurants), rain barrels and non-uniform residential, commercial or industrial dumpsters or waste containers. The container cleaning system can alternatively be used for rural areas, farms or ranches. The system uses multiple spray nozzles.

Abstract: A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

Abstract: A process of washing plastics contaminated with polychlorinated biphenyls (PCBs) is provided to reduce the concentration of the PCBs. A two-step process includes a first washing step using a selected washing solution or solvent, such as, a non-flammable solvent, and followed by a second step using thermal desorption. The two-step process enables reducing the concentration of PCBs in polymers, such as recovered from shredder residue, for example, to as low as 0.253 PPM. One of the preferred solvents is Perchloroethylene.

Abstract: Cleaning a liquid sample probe with a cleansing station having sources of air, cleansing solution, bath and shower water in a two-well cleansing body.

Abstract: A method of cleaning papermaking felt by applying a low concentration of a cleaning solution through the oscillating needle nozzles. The detergent is applied intermittently while paper is being manufactured. Each cleaning period lasts for at least the length of time required for the nozzles to cover the entire surface of the felt, and preferably twice that period of time. The application of cleaning solution is then discontinued for a period of time, generally equal to the time the cleaning detergent is applied to the felt. This cycle is repeated continuously as the paper is being manufactured. The chemistry of the cleaning solution can be changed, for example, from acidic to basic, alternately, to enhance cleaning performance.

Abstract: A proximity head for generating and maintaining a meniscus for processing a substrate is described. The proximity head includes a plurality of meniscus nozzles formed on a face of the proximity head, the nozzles being configured to supply liquid to the meniscus, a plurality of vacuum ports formed on the face of the proximity head, the vacuum ports being arranged to completely surround the plurality of meniscus nozzles, and a plurality of gas nozzles formed on the face of the proximity head, the gas nozzles at least partially surrounding the vacuum ports. The proximity head further includes means for reducing a size and frequency of entrance and/or exit marks at a leading edge and a trailing edge on the substrate by aiding and encouraging liquid from the meniscus to evacuate a gap between the substrate and the carrier.

Abstract: Holes having a variety of shapes exist on a surface of a substrate. When pure water is supplied on the substrate in a rinsing process, part of the pure water enters the holes. The pure water which have entered the holes can be hardly shaken off even though the substrate is rotated at a high speed. Therefore, HFE is held on the substrate so as to form an HFE layer after the rinsing process. In this case, the HFE enters the holes while the pure water emerges from the holes to the upper surface of the HFE due to a difference in specific gravity between the pure water and the HFE. Thus, the pure water is reliably prevented from remaining in the holes.

Abstract: Apparatus removes contaminants from edge areas of a wafer by spinning the wafer. Nozzles spray or jet fluid onto both the first and second sides of the wafer, near the edge of the wafer. Typically the spray or jet is at an acute angle to the wafer surface. Contaminants are removed and re-deposition of removed contaminants is reduced or avoided. The nozzle locations and angles may be varied to change the areas on the wafer cleaned by the sprays or jets.

Abstract: A substrate treating apparatus for stripping photoresist on a substrate includes a support part for supporting the substrate, a dry-type treating part for stripping the photoresist on the substrate, and a wet-type treating part for stripping the photoresist on the substrate. While the substrate is supported by the support part, the photoresist on the substrate is primarily stripped by means of the dry-type treating part and secondarily stripped by means of the wet-type treating part. The dry-type treating part includes a plasma supply unit configured to supply plasma onto the substrate and a moving unit configured to vary a relative position of the plasma supply unit and the substrate.

Abstract: An apparatus for wafer cleaning includes an enclosure. A stage is within the enclosure. At least one first wall is within the enclosure, around the stage. A plate is within the enclosure and above the stage, operable to enclose a first region between the stage and the first wall. The apparatus further includes an exhauster fluidly coupled to the first region between the stage and the first wall.

Abstract: An apparatus for simultaneously rinsing and drying front and back surfaces of a workpiece comprises a chuck adapted to spin the workpiece, a plurality of posts coupled to the chuck and adapted to support the workpiece, and first and second mechanical arms. The first mechanical arm is adapted to be positioned between the chuck and the workpiece, and to sweep along at least part of the workpiece back surface. The first mechanical arm comprises at least a first rinsing liquid nozzle, and a first tensioactive vapor nozzle. The second mechanical arm is adapted to be positioned adjacent to the workpiece front surface, and to sweep along at least part of the workpiece front surface. The second mechanical arm comprises at least a second rinsing liquid nozzle, and a second tensioactive vapor nozzle.

Abstract: Apparatus for cleaning an atomizer includes a cleaning device including an opening sized to receive at least a portion of the atomizer. The cleaning device includes a solvent coupling for supplying solvent to wash an exterior surface of the atomizer and an opening through which waste solvent is discharged. A first conduit is formed in a first closed curve around the opening. The first conduit includes a first sidewall. A supply of drying gas or mixture of gases is coupled to the first conduit. At least a first passageway is provided through the first sidewall. An outer end of the or each first passageway directs a first flow of drying gas or mixture of gases onto the exterior surface of the atomizer to dry the exterior surface of the atomizer as the atomizer is withdrawn from the opening.

Abstract: Cleaning systems and methods are provided. A preferred embodiment comprises a method of cleaning that includes providing a device and disposing a cleaning fluid on the device. The cleaning fluid includes a first component saturated with a second component. The first component comprises a liquid, and the second component comprises a material that is releasable from the cleaning fluid as a gas. The second component is caused to be released from the cleaning fluid while the cleaning fluid is disposed on the device.

Abstract: A processing tank stores heated sulfuric acid, and a semiconductor substrate having resist formed thereon and to be processed is immersed in the heated sulfuric acid. A first introduction unit introduces ozone gas into the sulfuric acid stored in the processing tank. A second introduction unit introduces hydrogen peroxide into the solution containing sulfuric acid and ozone at least before the processing of the semiconductor substrate is completed.

Abstract: The present invention relates to an apparatus for washing wheels and a lower part of a vehicle, wherein the body of the vehicle is washed while the vehicle passes through the apparatus at a low speed without stopping in the apparatus.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: After rinsing, while rotating a substrate, a front layer part of a rinsing liquid (DIW) adhering to a substrate surface is drained and removed from the substrate surface. This is followed by supply to the substrate surface of a liquid mixture which is obtained by mixing IPA and DIW together. Since a majority of the rinsing liquid on the substrate surface is removed off from the substrate surface, even when micro patterns are formed on the substrate surface, the liquid mixture replaces the liquid component adhering to the gaps between the patterns. Further, the IPA concentration in the liquid mixture supplied to the substrate surface is set to 50% or below.

Abstract: The substrate treatment method includes: a cleaning step of supplying deionized water to a major surface of a substrate to clean the substrate; a pre-drying treatment step of supplying a pre-drying treatment liquid containing an organic solvent more volatile than the deionized water to the major surface of the substrate after the cleaning step to replace deionized water remaining on the major surface with the pre-drying treatment liquid; and a drying step of removing the pre-drying treatment liquid supplied to the major surface of the substrate after the pre-drying treatment step to dry the substrate.

Abstract: Provided is an apparatus for cleaning and drying a substrate by applying a plurality of chemicals and gases to the substrate. The apparatus may include: a substrate support member including a chuck receiving a substrate; a first nozzle member injecting a drying fluid onto a top surface of the substrate for drying the substrate; a low cover including an opened top and enclosing the chuck; and an upper cover selectively closing the opened top of the low cover so as to dry the substrate in a closed space. Therefore, the apparatus dries a substrate more efficiently and protects the substrate from being contaminated by foreign pollutants. Furthermore, generation of an undesired oxidation layer on the substrate can be prevented.

Abstract: A substrate processing method according to the present invention is to be applied for stripping and removing, from the surface of a substrate, a resist no longer required. According to the substrate processing method, a resist stripping liquid is supplied to the center portion of the surface of a substrate held by a substrate holding unit. An organic solvent liquid is supplied to the peripheral edge portion of the surface of the substrate held by the substrate holding unit.

Abstract: A carbon dioxide snow apparatus of the present invention includes a carbon dioxide snow generation system and a propellant generation system connected to a common carbon dioxide gas source. The carbon dioxide snow generation system includes a condenser having a at least two connected segments, wherein a first segment has a lesser diameter than the a second segment to provide a stepped expansion cavity for cooling and condensing liquid carbon dioxide into solid carbon dioxide snow. Several snow generation systems, each separately controllable with separate condensers, may be integrated with the propellant generation system and common carbon dioxide source to provide for a multiplicity of carbon dioxide snow applicators for integration into both manual and automated machining processes.

Abstract: A work washing apparatus including a transfer unit for controlling forward and rearward movements of a work, a table moved by the transfer unit, carrying out the washing of the work from upper and lower surfaces thereof and provided with water/air pipes, an upper surface washing unit provided on an upper surface of the transfer unit and having upper surface washing nozzles which make planetary movements by utilizing rational movements of the nozzles on their own axes and an orbital movement of the washing unit, side surface washing units provided on both side surfaces of the transfer unit and having side surface nozzles which make planetary movements by utilizing rotational movements of the nozzles on their own axes and an orbital movement of the upper surface washing unit, a lower washing unit provided on a lower surface of the transfer unit and having lower surface washing nozzles which make planetary movements by utilizing rotational movements of the nozzles on their own axes and an orbital movement of the

Abstract: A detergent dispenser system is disclosed in which a dispensing valve is provided for fluidly connecting to a detergent supply container. A receptacle is connected to the dispensing valve for receiving a predetermined quantity of detergent from the detergent supply container. A motor is provided for displacing the receptacle between a fill position, connected to the dispensing valve, and a dispensing position, where the detergent is dispensed from the receptacle.

Abstract: A cleaning processing apparatus comprises a spin chuck for holding a wafer W, an under plate being positioned to face the back surface of the wafer W with a prescribed gap provided therebetween, a support member for supporting the under plate, and a nozzle hole formed to extended through the plate member and the support member. A chemical liquid, a pure water and a gas can be supplied into a nozzle hole through opening-closing valves, and the chemical liquid and the pure water remaining inside the nozzle hole can be sucked by a sucking device. A pure water remaining inside the nozzle hole is sucked and removed by using the sucking device after the processing of the wafer W with a pure water and, then, a gas is spurted onto the back surface of the wafer W.

Abstract: Substrates having liquid films with preprocessing liquid on surfaces thereof in a preprocessing unit are transported to a freezing unit arranged separately from the preprocessing unit by a substrate transporting robot. In the freezing unit, the substrates are accommodated in a processing space in a processing chamber and the liquid films are frozen by decreasing the temperature of the processing space to a temperature below the freezing point of the preprocessing unit. Subsequently, the substrates subjected to the freezing process are transported from the freezing unit to a post-processing unit arranged separately from the freezing unit. In the post-processing unit, cleaning liquid is supplied to frozen films, whereby contaminants having adhesive forces to the substrate reduced by the freezing process can be easily removed together with the frozen film.

Abstract: Systems and methods for cleaning asphalt contact surfaces are provided. One such system includes a means for determining a dilution ratio appropriate to a particular asphalt contact surface, a nozzle proximate to the asphalt contact surface, and a pump in fluid communication with the nozzle. The pump is configured to deliver to the nozzle a mixture of water and said cleaning compound with the appropriate dilution ratio. One such method includes the steps of: pumping a cleaning mixture with a dilution ratio appropriate to a particular asphalt contact surface; supplying said pumped cleaning mixture to at least one nozzle proximate to the asphalt contact surface; and spraying the asphalt contact surface through the nozzle with the pumped mixture.

Abstract: An apparatus for cleaning an inside of a chamber using a gas separation type showerhead is provided. The apparatus includes: a gas supply module through which first and second gases are separately supplied; a gas separation module through which the first and second gases are separately dispersed; and a gas injection module that includes a plurality of holes through which the separately dispersed first and second gases are commonly injected into the chamber, wherein at least one gas of the first and second gases includes an ionized first cleaning gas including a gas containing fluorine (F) ingredient, and wherein at least one gas of the first and second gases includes a non-ionized second cleaning gas including nitrogen oxide based gas (NxOy, x and y are integers equal to or more than 1).

Abstract: An apparatus for inspecting a semiconductor and a method for automatically cleaning the tip of a probe card may include an inspection chamber having a probe card for inspecting a wafer, and a chemical-wetting chamber for applying a chemical agent to a cleaning member. The inspection chamber and the chemical-wetting chamber may be integral parts of the apparatus.

Abstract: An apparatus and method for treating surfaces of semiconductor wafers with a reactive gas, such as ozone, utilizes streams of gaseous material ejected from a gas nozzle structure to create depressions on or holes through a boundary layer of processing fluid formed on a semiconductor wafer surface to increase the amount of reactive gas that reaches the wafer surface through the boundary layer. The apparatus and method may be used to clean a semiconductor wafer surface and/or grow an oxide layer on the wafer surface by oxidation.

Abstract: An ion sampling method for wafer provides a wafer in a sampling chamber, wherein the wafer surface that is going to be sampled faces upward; spraying an extraction liquid continuously on the wafer surface to form a liquid film thereon; keeping the thickness of the film constant for dissolving the ion contaminants in the extraction liquid; and collecting the extract solution at the bottom of the sampling chamber.

Abstract: Embodiments of the invention provide a semiconductor wafer cleaning apparatus and a related method. In one embodiment, the invention provides a semiconductor wafer cleaning apparatus comprising a wafer stage adapted to support a wafer; a first cleaning unit adapted to spray a first cleaning solution onto the wafer to remove particles from the wafer, wherein the first cleaning solution prevents static electricity from being generated on the surface of the wafer; and a second cleaning unit adapted to provide a second cleaning solution onto the wafer and oscillate a quartz rod to remove particles from the wafer, wherein the second cleaning solution makes a surface of the wafer hydrophilic.

Abstract: Electronic device cleaning equipment includes a cleaning stage having a processing face on which a substrate having an obverse face at which an electronic device is formed is to be placed, a vapor supply nozzle for supplying vapor to the obverse face of the substrate, and chemical solution supply means for supplying a chemical solution to the obverse face of the substrate. Accordingly, static electricity present on the obverse face of the substrate is diselectrified.

Abstract: A wafer cleaning apparatus with multiple wash-heads is applied in chemical and mechanical polishing process after wafer cleaning. The wafer cleaning apparatus device includes a supporting base, which supporting base comprises a driving device and at least one fluid pipe. A rotation module is also included in the wafer cleaning apparatus. The top side of the rotation module is connected with the driving device. Besides, the rotation module comprises multiple wash-heads and at least one nozzle. The bottom side of wash-head here is contacted with the surface of the wafer. By using driving device, the rotation module can be wholly driven. Also, multiple wash-heads can rotate individually along a cleaning path for cleaning wafer. The fluid was jetted from nozzle and assistant to clean wafer through fluid pipe. The prior art of single wafer wash-head is easily to reform a cleaning dead angle in wafer cleaning process.

Abstract: A circuit board processing system includes a wash tank configured to contain cleaning fluid, and a positioning subsystem configured to immerse a set of circuit boards into the wash tank. The system further includes a flow control subsystem having (i) a first set of nozzles disposed within the wash tank, (ii) a second set of nozzles disposed within the wash tank, and (iii) a controller. The controller is configured to direct the cleaning fluid through the first set of nozzles to provide a flow of the cleaning fluid in a first direction relative to the set of circuit boards. The controller is further configured to direct the cleaning fluid through a second set of nozzles to provide a flow of the cleaning fluid in a second direction relative to the set of circuit boards after providing the flow of the cleaning fluid in the first direction.

Abstract: A cleaning apparatus in which a cleaning process is simplified, a time required for the cleaning process is reduced and which has an excellent cleaning effect, and a high pressure cleaner for use therein are provided.

Abstract: An apparatus for cleaning substrates includes a supporting member supporting substrates in an upright position, and a liquid supplying member including a first nozzle disposed at one side of a vertical centerline of the substrates, and a second nozzle is disposed at another side of the vertical centerline of the substrates. Each of the first and second nozzles may include first injection holes to inject cleaning liquid toward lower ends of the substrates or regions adjacent to the lower ends of the substrates.

Abstract: There is provide an apparatus for washing and disinfecting an endoscope having a duct for detecting a water leakage, the duct having an opening to which a fitting is attached. The apparatus comprises a nozzle unit having a nozzle to supply a gas into the duct via the fitting in a case where the nozzle is inserted into the fitting and a base member holding the nozzle member. The apparatus further comprises a gas supplying unit capable of supplying the gas to the nozzle, a shifting unit capable of shifting the base member toward the fitting of the endoscope, and a controlling unit controlling drive of the shifting unit to shift the base toward the fitting and to drive of the gas supplying unit to allow the nozzle to blow the gas from before the nozzle reaches the fitting.

Abstract: Provided are a nozzle and a related substrate treatment apparatus. The substrate treatment apparatus includes a process chamber, a supporting member disposed in the process chamber to support substrates, and a nozzle disposed in the process chamber to supply treatment fluid. The nozzle includes an outer tube along which a plurality of spraying holes are formed and which has a first end that is closed and an inner tube inserted into the outer tube through a hole formed on a second end of the outer tube.

Abstract: A unit for preventing a substrate from drying includes a transfer arm for transferring a substrate from a first bath containing a first cleaning solution to a second bath containing a second cleaning solution, a spraying part connected to the transfer arm, wherein the spraying part sprays a drying prevention solution from an upper portion of the substrate to a lower portion of the substrate, and a drainage container connected to the transfer arm, wherein the drainage container receives the drying prevention solution.

Abstract: A substrate processing apparatus removes resist films formed on wafers by holding the wafers in a processing vessel and exposing the wafers to a mixed gaseous fluid of steam and an ozone-containing gas into the processing vessel. The inner surfaces, to be exposed to the mixed gaseous fluid, of the processing vessel and the surfaces, to be exposed to the mixed gaseous fluid, of component members placed in the processing vessel are coated with SiO2 film to protect the same from the corrosive action of the mixed gaseous fluid.

Abstract: Disclosed is a method and apparatus for treating a substrate with a reaction solvent formed of supercritical ozone in a feed phase. The feed phase can be aqueous, e.g., formed of heated, deionized water, nonaqueous, e.g., formed of a dense fluid, such as supercritical carbon dioxide, liquid carbon dioxide, supercritical nitrogen or combinations the dense fluids or the feed phase can be a mixture of aqueous and nonaqueous phases.