Abstract: An adhesion method capable of strongly adhering two members without using an adhesive and without impairing a fine structure or optical properties of a joining surface, and a biochemical chip and optical component made by the same are provided. The adhesion method includes step A of forming a coating film 13 of a first film compound having a first functional group on a first joining surface 11 of a first member 21, step B of forming a coating film 14 of a second film compound having a second functional group on a second joining surface 12 of a second member 22, and step C of bringing the first joining surface 11 into contact by pressure with the second joining surface 12 while bringing a coupling agent having at least one coupling reactive group that forms a bond by a coupling reaction with the first functional group and the second functional group into contact with the first and second functional groups to form bonds by the coupling reaction.

Abstract: The present invention provides a method for manufacturing a laminate, comprising the steps of laminating two or more layers of polycarbonate resin film and/or sheet using a (meth)acrylate-based adhesive composition containing a (A) (meth)acrylate monomer, a (B) meth(acrylate) olygomer, an (C) acrylamide derivative, and a (D) silane compound and/or an (E) organophosphorus compound to form a laminate having a thickness of 0.1 mm to 30 mm; heating the laminate at 130° C. to 185° C. so that a temperature difference between a top surface and a bottom surface of the laminate is within 20° C.; and bending the post-heating laminate into a curved shape having a radius of curvature of 10 mm or greater.

Abstract: Epoxy adhesive compositions containing a rubber-modified epoxy resin contain a bisphenol. The bisphenol can be pre-reacted with the rubber-modified epoxy resin to advance the resin. The adhesives are resistant to thermal degradation as can occur in so-called “overbake” conditions, in which the adhesive is heated to high temperatures for prolonged periods of time. In addition, expanded microballoons are included in epoxy structural adhesives to promote a desired fracture mode.

Abstract: A hot melt adhesive composition can be used to laminate substrates together in construction industry and industrial maintenance and assembly applications. The hot melt adhesive composition is sprayable to form a thin layer (1 to 200 microns in thickness) on a substrate. The hot melt adhesive can cure by exposure to moisture or harden by cooling, or a combination thereof.

Abstract: The glass-ceramic joining material, which is suitable for bonding or joining at low processing temperatures, especially less than 800° C., is composed of a BaO—SiO2—CaO—B2O3—Al2O3 system and has a coefficient of thermal expansion ?(20-300)?9.5·10?6 K?1.

Abstract: Moisture curable reactive hot melt adhesive compositions are prepared using a novel two-step polymerization process. Resulting adhesives have improved green strength.

Abstract: The invention relates to a method for connecting substrates including depositing a plasma polymer layer on each of a first and a second substrate by means of atmospheric pressure plasma and bringing the plasma polymer layers in contact with each other. In a variant of the method, only the first substrate is provided with a plasma polymer layer and connected to a second substrate, the surface of which can react with the plasma polymer layer. The invention further relates to composite structures which can be obtained with such methods.

Abstract: A method of making a multilayer protective film. The method comprises: (a) forming a PU layer comprising an at least partially crosslinked polyurethane, the at least partially crosslinked polyurethane comprising at least one of a polyester-based polyurethane or a polycarbonate-based polyurethane; (b) forming a TPU layer comprising a polycaprolactone-based thermoplastic polyurethane; (c) forming a PSA layer comprising a pressure sensitive adhesive; (d) bonding one major surface of the PU layer to one major surface of the TPU layer; and (e) bonding the PSA layer to an opposite major surface of the TPU layer; wherein the TPU layer is sandwiched between the PU layer and the PSA layer. The multilayer film may be used to protect painted surfaces of vehicle body parts.

Abstract: Adhesive tape having a carrier and a layer of adhesive applied on at least one side to the carrier, the carrier having at least one foam layer composed at least in part of a polyolefin-based polymer, wherein the polyolefin-based polymer contains an ethylene multi-block copolymer in a fraction of at least 40% (w/w), the ethylene multi-block copolymer being composed of hard segment blocks, containing at least 95% (w/w) of ethylene and a comonomer, and of soft segment blocks, containing ethylene and a comonomer, the fraction of comonomer in the soft segment blocks being between 10 and 20 mol %.

Abstract: The present inventions are directed to novel medical adhesives and their use, for example, in biomedical applications. These compositions and applications allow for improved adhesion with and between mammalian tissues.

Abstract: A method for bonding a polymeric medical device to tissue is provided which includes providing a polymeric medical device having a plurality of reactive members of a specific binding pair attached on a surface of the medical device, and providing tissue with a plurality of complementary reactive members of the specific binding pair, wherein upon contact of the reactive members on the surface of the medical device with the complimentary reactive members on the tissue, covalent bonds are formed between the reactive members and the complementary reactive members, thus adhering the device to the tissue.

Abstract: An inkjet head and a production method wherein the inkjet head is produced by forming a film on a head chip having a channel member with an ink channel formed thereon and joining an end surface of the head chip coated with the film to a nozzle plate. The method includes a step of applying an adhesive containing spherical particles, whose volume average particle diameter is in the range of 0.95*Rz (MV) to 2.0*Rz (MV), in the range of 0.1 volume % to 10.0 volume % to at least one of the end surface of the head chip and a joint surface of the nozzle plate and then joining the nozzle plate.

Abstract: Compositions having a compound comprising at least one alkoxy silane moiety, and at least one moiety selected from a nitrosoaromatic or a nitrosoaromatic precursor and combinations thereof; and an aqueous or water containing carrier medium are provided for use in polymer bonding. The water may allow for substantial hydrolysis of the compound. Suitable polymers may have diene or allylic functionality within the polymer chain, for example an elastomer such as a natural or synthetic rubber. The polymers may be bonded to metals or substrates with hydroxylated surfaces such as glass. The nitrosobenzene precursor may be at least one of a quinone dioxime or a quinone oxime.

Abstract: An automotive windshield replacement method which includes: a) applying an adhesive to an automotive windshield and/or an automobile body substrate, said adhesive including at least one urethane prepolymer formed from reaction materials including: i) isophorone diisocyanate and/or 4,4?-diphenylmethanediisocyanate; ii) an ethylene oxide-end-capped triol having a weight average molecular weight of about 4500 to about 5000; and iii) hexanediol adipate; b) contacting the substrates together, within the working time of the adhesive, along at least a portion of the substrate(s) to which the adhesive has been applied; and c) allowing the adhesive to bond the substrates together.

Abstract: An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.

Abstract: The removable tattoo is constructed to cover unsightly scars existing as a result of surgeries, such as tummy tucks, C-sections and the like. The removable tattoo is preferably fabricated from silicon or other durable, flexible material, and is provided with an adhesive on its rear face that permits multiple uses. The front face of the tattoo is designed to simulate a decorative, aesthetically pleasing piece of apparel, such as a stylish belt. The removable tattoo may be furnished as a kit that includes a case and a plastic tray that serves as backing for the tattoo in order to provide for storage of the tattoo when not in use.

Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

Abstract: Embodiments of the present invention provide improved systems and methods for external frit mounted components on a sensor device. In one embodiment, a method for fabricating a sensor device comprises securing at least one component stack on a sensor body over at least one opening in the sensor body, wherein the at least one component stack comprises a plurality of components and applying a frit to the plurality of components in the at least one component stack and the sensor body. The method further comprises heating the frit, the at least one component stack, and the sensor body such that the frit melts and cooling the frit, the at least one component stack, and the sensor body such that the at least one component stack is secured to the sensor body.

Abstract: A flux-cored wire for stainless steel arc welding including an outer sheath made of stainless steel and flux filled up in the outer sheath contains, as percentage to the total mass of the wire, Cr: 22.0-30.0 mass %, Ni: 6.0-12.0 mass %, Mo: 2.0-5.0 mass %, N: 0.20-0.35 mass %, TiO2: 4.0-9.0 mass %, SiO2: 0.1-2.0 mass %, ZrO2: 0.5-4.0 mass %, total of Li2O, Na2O and K2O: 0.50-1.50 mass %, metal fluoride in terms of fluorine amount: 0.10-0.90 mass %, and rare earth element component: 0.10-1.00 mass %, limits C to 0.04 mass % or below, W to 4.0 mass % or below, Cu to 2.0 mass % or below, Bi2O3 to 0.01 mass % or below, and limits oxides other than the above to 3.0 mass % or below. With such a composition, it is possible to obtain a weld bead which is excellent in the weldability in welding in all attitudes and is more excellent in the low temperature toughness while keeping excellent pitting corrosion resistance in arc welding of duplex stainless steel and the like.

Abstract: A method of manufacturing a bonded body of a semiconductor substrate and a semiconductor device to be mounted on the semiconductor substrate are provided. The method includes: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in a vicinity of a surface of the bonding film to thereby obtain the bonded body.

Abstract: A process for protecting a surface of a metal layer or a metal oxide layer including providing a protective film containing a base material and a pressure-sensitive adhesive layer formed thereon, wherein the surface of the pressure-sensitive adhesive layer has a contact angle with methylene iodide as measured just after contact, ?1, of 70° or smaller and a change in contact angle with methylene iodide through 30-second standing, ??, of 8% or less.

Abstract: Disclosed is an inertial sensor, including a membrane, a mass body provided underneath a central portion of the membrane, a post provided underneath a peripheral portion of the membrane, and a cap having a peripheral portion bonded to a lower surface of the post using low-temperature silicon direct bonding. A method of manufacturing the inertial sensor is also provided.

Abstract: A bonding agent is provided which includes a flux containing either calcium aluminate or calcium oxide and aluminum oxide and aluminum nitride powder.

Abstract: Hot melt adhesive compositions which have enhanced adhesion to difficult substrates, particularly at refrigerator/freezer temperatures or at elevated temperatures. The inventive compositions require a base polymer comprising at least one metallocene ethylene-containing polymer or at least one non-metallocene, amorphous, propylene containing polymer; a tackifier; an optional wax; and an adhesion promoting additive comprising at least one semi-crystalline polymer having a weight average molecular weight of about 30,000 daltons or less. It has been found that the adhesion promoting additive of this invention enhances the adhesion properties of a hot melt adhesive composition having a metallocene ethylene-containing base polymer or non-metallocene, amorphous, propylene containing base polymer, particularly at elevated temperatures or at low refrigerator and freezer temperatures where other conventional adhesives have been unsuccessful.

Abstract: A pressure sensitive adhesive for sticking together an electromagnetic wave-shielding film and optically functional film, wherein a storage elastic modulus at 70° C. is 7.00×104 Pa or more; and a display panel filter element comprising (1) an electromagnetic wave-shielding film, the film being a laminate of a transparent substrate film, an adhesive for a metal foil, which is applied on one surface of the transparent substrate film, and a metal foil mesh formed on the adhesive for a metal foil, (2) a layer of the pressure sensitive adhesive according to (1), which is applied so as to cover the metal foil mesh of the electromagnetic wave-shielding film, and (3) an optically functional film provided on the pressure sensitive adhesive, are provided. The pressure sensitive adhesive exhibits sufficient adhesive strength, can be filled into the inside of the pores of the metal foil mesh, and does not generate bubbles in a heating treatment.

Abstract: The invention relates to a method for mutually adhering a first moulded article of an at least partially vulcanized rubber polymer and a second moulded article of a polymer. The method comprises at least the steps of providing a first moulded article of a rubber polymer which comprises a compound containing carboxylic acid anhydride; providing a second moulded article of a polymer; providing an adhesive composition comprising at least a polyisocyanate, a polyol and a catalyst; arranging an adhesive layer of the adhesive composition on the surface for adhesion of at least one moulded article; bringing the surfaces for adhesion together under pressure; and polymerizing at least the adhesive layer at a suitable temperature.

Abstract: A method for the production of an abrasion-resistant film (7, 9), in particular for the production of laminate floor materials or abrasion-resistant furniture surfaces, comprising the following method stages: a first application stage (AI) in which a decorative paper (1) is provided with an impregnation (2) containing a first synthetic resin, a second application stage (AII) in which a layer (4wet) which contains a second synthetic resin and particulate abrasion-reducing material is applied to the moist impregnate (3wet), a first treatment stage (BI) in which a heat treatment for partial curing of synthetic resins and for partial removal of the moisture from the moist coated impregnate (5wet) is effected, a third application stage (AIII) in which the application of a cover layer (6wet) containing a third synthetic resin is effected, and a final second treatment stage (BII) in which a heat treatment for removing the moisture is effected.

Abstract: Water-redispersible polymer powder compositions are obtained by means of free-radical-initiated polymerization in aqueous medium of one or more monomers of vinyl esters of unbranched or branched alkylcarboxylic acids having from 1 to 15 carbon atoms, methacrylic esters and acrylic esters of alcohols having from 1 to 15 carbon atoms, vinylaromatics, olefins, dienes and vinyl halides and subsequent drying of the polymer dispersion, wherein one or more silanes of the general formula (RO)3?nR1nSiR2X (1) where X is an amino- or epoxy-containing radical are added before drying of the polymer dispersion. The powders are especially useful in tile adhesives for tiles having low water absorbtion capacity.

Abstract: The invention relates to the use of a native or modified leguminous starch for producing an adhesive labeling composition. Said leguminous starch has an amylose content ranging between 25 and 60 percent by weight (dry/dry) and can be embodied as pea starch, especially pea starch having an amylose content of at least 30 percent but less than 50 percent by weight. The adhesive composition can advantageously be used for labeling glass or plastic bottles and can contain another natural polysaccharide polymer or protein polymer in addition to the leguminous starch, for example another native or modified leguminous or non-leguminous starch, particularly a starch having an amylopectin content of at least 80 percent by weight (dry/dry). The use of a leguminous starch makes it possible to obtain labeling adhesives, optionally highly dry (>40%) substances, which have excellent characteristics regarding stability during storage, rheology, and water resistance.

Abstract: The present invention relates to a composite core material for a vacuum insulation panel which exhibits excellent initial insulation and long-term durability, a method of manufacturing the same, and a vacuum insulation panel using the same. The vacuum insulation panel includes a composite core material formed of glass fiber wool and a glass fiber board, and an outer skin material having a layered structure comprising a surface protective layer, a metal barrier layer, and a bonding layer from the outside to vacuum-package the core material.

Abstract: A composition that includes aldimines of Formula (I). The composition can be a two-component polyurethane composition. The composition can have a long open time, but build up an early strength quickly, and in the cured state can have high tensile strength and a high modulus of elasticity. The composition can be odorless or at least low-odor before, during and after curing.

Abstract: An aqueous adhesive composition intended for assembly of corrugated cardboard, consisting of a primary part and a secondary part, wherein the secondary part is made from a mixture including at least one legume starch and at least one cereal and/or tuber starch. A process for preparing corrugated cardboard using such a composition, and the corrugated cardboard thus obtained are also disclosed.

Abstract: Inorganic-organic composite articles and methods for producing them using inorganic acidic/alkaline precursor components as inorganic adhesives is provided. Articles prepared therefrom provide improved flexibility, zero flame spread, no release of volatile organic compounds, and low carbon foot print.

Abstract: The invention relates to composition for an acrylic structural adhesive containing a mixture of block copolymers containing styrene and an elastomer.

Abstract: An apparatus and method of manufacturing a skeg protector to cover a motorboat skeg to prevent damage to the skeg and to the propellers. The SkegProtector™ apparatus is made of a composite of non-stainless steel woven material of high material strength and durability, such as carbon fiber, Kevlar®, fiberglass, titanium, and polyethylene fiber. It is affixed over the skeg using marine grade underwater adhesive, and without installing bolts or other mechanical means to secure it. Methods of manufacture comprise the use of curing using a heated platen press on aluminum molds encasing multiple layers (7) of woven material and a mandrel.

Abstract: In an anisotropic conductive adhesive including a magnetic powder such as nickel-coated resin particles used as conductive particles, the conductive particles are present in an insulating adhesive composition without being aggregated. The magnetic powder used as the conductive particles is at least partially composed of a magnetic material. In this case, demagnetization has been performed on the conductive particles in a powder form that have not been dispersed in the insulating adhesive composition, the conductive particles in a paste obtained by dispersing the conductive particles in the insulating adhesive composition, or the conductive particles in a film formed from the paste, before establishment of an anisotropic conductive connection using the anisotropic conductive adhesive.

Abstract: The present invention has an object to provide a photosensitive resin composition for optical waveguide formation, which has low transmission loss and can form a waveguide pattern with high shape accuracy at low cost; an optical waveguide; and a method for producing an optical waveguide. The present invention provides a photosensitive resin composition for optical waveguide formation comprising at least: a polymer containing at least a (meth)acrylate structure unit having an epoxy structure, and a (meth)acrylate structure unit having a lactone structure and/or a vinyl monomer structure unit having an aromatic structure; and a photoacid generator, of which one or both of a core layer and a cladding layer are formed of a cured product.

Abstract: A single-component, moisture-curing composition, including at least one polyisocyanate, a polyaldimine, an organomethoxysilane, an acid as well as a tin catalyst in special proportions that can be matched to one another. An exemplary composition cures by moisture as much as possible without forming bubbles. In the curing of the composition by atmospheric humidity, an anisotropic material is produced with a predominantly elastic sheath that is virtually tack-free on the surface and a predominantly plastic core. An exemplary composition can be especially well suited as a flexible sealant.

Abstract: The invention relates to the use of a one-component aqueous polyurethane dispersion composition (PD) as a primer for the adhesion of plastic films (KF) by means of an aqueous one-component polyurethane dispersion adhesive (DK). The aqueous polyurethane dispersion composition (PD) comprises a polyurethane (P1) and carbodiimide groups and/or carboxyl groups, and the polyurethane dispersion adhesive (DK) comprises a polyurethane (P2) and carbodiimide groups, and carboxyl groups such that the aqueous polyurethane dispersion composition (PD) and the aqueous polyurethane dispersion adhesive (DK) react with one another in a polyaddition reaction when heated to a temperature of 50° C. or more. The invention also relates to primer-coated plastic films, to composite bodies produced therefrom and to methods for the production thereof.

Abstract: The invention includes a hot melt adhesive composition that includes at least one of an isotactic copolymer of butene-1 and a metallocene catalyzed propylene homopolymer, a tackifying resin, and, optionally, a wax. The adhesive composition initially exhibits adhesion quality and subsequently non-adhesion quality. The invention also includes methods of using the adhesive composition for temporarily bonding substrates.

Abstract: The present invention relates to innovative amorphous polyurethane polymers of the formula (I) and also to hotmelt adhesive compositions based on them. The compositions are notable for greatly improved dimensional stability after application, and are ideally suited to the adhesive bonding of transparent substrates. The polymers are notable for rapid, bubble-free curing.

Abstract: A surface-coating material includes a double-bond-containing, OH-functional component A and a double-bond-containing, NCO-functional component B, having the following properties: Component A: solids fraction between 30% and 100% by weight, double-bond density between 2 eq/kg and 5 eq/kg (at a solids fraction of 100%), and OH content between 4% and 7% by weight, and Component B: solids fraction between 30% and 100% by weight, double-bond density between 1 eq/kg and 4 eq/kg (at a solids fraction of 100%), and NCO content of between 4% and 7% by weight.

Abstract: A pressure-sensitive adhesive containing a pressure-sensitive adhesive resin and fine particles having an average particle diameter of 0.1 to 20 ?m. The pressure-sensitive adhesive has a storage elastic modulus (G?) at 23° C. of 0.3 to 15 MPa, and a haze value that is 5% or more.

Abstract: The present invention provides a substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, which is to be stuck to a front surface of a semiconductor wafer in grinding a back surface of the semiconductor wafer, the pressure-sensitive adhesive sheet consisting of a pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is formed of a UV-curable pressure-sensitive adhesive containing a polymer composed mainly of an acrylic monomer polymerizable compound, the pressure-sensitive adhesive force of a surface of the pressure-sensitive adhesive layer to be stuck to the front surface of the semiconductor wafer is larger than the pressure-sensitive adhesive force of the opposite surface thereof, and the pressure-sensitive adhesive layer has an initial elastic modulus of from 0.01 MPa to 500 MPa.

Abstract: The present invention pertains to a process for the silicate bonding of joined surfaces, facing one another, of two components by means of an aqueous, alkaline, silicon-cation-containing joining solution for the purpose of producing an optical element, characterized in that one or both of said joined surfaces (1; 2b; 10) are covered with a layer of an oxide (3), which has a higher refractive index than SiO2 and is selected from among oxides of the third and fourth main group elements, of the second and third group of the transition elements as well as zirconium and from among mixed oxides of the said elements, whereupon the joining solution is applied to at least one of the surfaces to be joined and the surfaces are bonded to one another.

Abstract: The invention relates to bonding agent composition containing at least one bonding agent and at least one carrier medium which is liquid at room temperature and has a boiling point higher than 250° C. The carrier medium part represents between 40 and 99 wt. % of the total weight of the composition.

Abstract: Adhesives particularly useful for industrial bottle labeling are provided. The adhesives comprise at least one starch component and at least one protein component (which is not gelatin or casein). The adhesive is also free of synthetic polymer. The label, along with the adhesive, can be easily removed from the bottle during the recycling process. In one embodiment, the starch component does not contain leguminous starch having an amylose content of 25% or more. In another embodiment, the adhesive comprises a crosslinking agent.

Abstract: A pivot assembly bearing having a bearing inner ring, a shaft, a bearing outer ring, a housing, and an UV curable anaerobic adhesive fixing the bearing inner ring to the shaft, and the bearing outer ring to the housing, wherein the adhesive includes 15 to 25% of urethane acrylate, 45 to 55% of acrylic acid diester, less than 3% of acrylic acid monomer, 15 to 30% of hydroxyalkylmethacrylate, less than 3% of anaerobic catalyst, and less than 3% of photopolymerization initiating agent, and in addition, a coloring agent, if necessary. The pivot assembly bearing reduces outgas, shortens adhesive curing time, and no tack at the adhesive surface is obtained.

Abstract: Provided are a method of bonding a resin material (X) containing an oxymethylene-based polymer (A) and a resin material (Y), including: preparing an oxymethylene-based polymer composition (B) as resin material (Y), and resin material (X); or preparing resin material (X) and a resin material identical to resin material (X) or another resin material as resin material (Y), and providing polymer composition (B) between resin material (Y) and resin material (X); and heating: wherein polymer composition (B) has a melting point lower than that of polymer (A), and a difference in melting point between the composition and the polymer is smaller than 5° C.; and 50% or more of a peak area determined from a peak showing the molten state of polymer composition (B) measured by DSC is present in a temperature region lower than the peak temperature of polymer (A) by 5° C. or more; and a structure obtained thereby.

Abstract: Provided are a bonded structure, a sealed structure, an electronic component including the same, a bonding method, and a sealing method, the bonded structure and sealed structure allow hermetic adhesion using an adhesive even when the materials of the bonding surfaces are different, or the bonding surfaces have low wettability for the adhesive. A sealed structure 21 used for an electronic component or the like includes a first bonding surface 17 on a first adherent 11 bonded to a second bonding surface 18 on a second adherent 16 via an adhesive layer 24, the first and/or second bonding surfaces 17 and 18 having films 22 and 23 of film-forming compounds, the film-forming compounds being bound to the surfaces 17 and 18 at one end of the molecule thereof, and bound to a molecule of the adhesive at the functional group at the other end of the molecule.