Particular Adhesive Patents (Class 156/325)
  • Patent number: 8366865
    Abstract: The invention relates to an adhesive system which is based on a non-reactive thermoplastic adhesive melt. The adhesive melt (A) contains a mixture of at least two metallocene-catalytically produced copolymers which are different from each other, and which are based on at least two a-olefins, whereby the copolymers of the mixture, which are different from each other, have different melt indices (MFIs); (B) optionally, at least one additional polymer; and (C) optionally, at least one resin and/or at least one wax. The inventive adhesive system is particularly suitable for use in the wood and furniture industry, e.g. for covering profiles or for gluing edges, in particular, by comparing copolymer adhesives to EVA melt adhesives which are used in a traditional manner, and the system enables considerably lower application temperatures to be used, and at the same time exhibiting improved adhesion capacity.
    Type: Grant
    Filed: March 10, 2006
    Date of Patent: February 5, 2013
    Assignee: Jowat AG
    Inventors: Christian Terfloth, Felix Starck, Peter Brückner
  • Patent number: 8366866
    Abstract: Compositions for binding organic or inorganic fibers are described. The compositions may include an aqueous solution having a pH of about 4.5 or more. The aqueous solution may include a polycarboxy polymer that is about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; and a polyol. The compositions can maintain a pH of about 5 or more after being cured into a thermoset plastic with the fibers. Processes for preparing a binder composition for organic or inorganic fibers are also described. The processes may include providing an aqueous solution of polycarboxylic acid polymers, where the polymers comprise about 10%, by wt., to 100%, by wt., of a butenedioic acid or butenedioic anhydride; adding a polyol to the aqueous solution; and maintaining the pH of the aqueous solution at about 5 or more.
    Type: Grant
    Filed: July 28, 2008
    Date of Patent: February 5, 2013
    Assignee: Johns Manville
    Inventors: Kiarash Alavi Shooshtari, Jawed Asrar
  • Patent number: 8357260
    Abstract: A partially crosslinked adhesive-supported porous film for battery separator, which in producing a battery, can effectively produce a battery as an electrode/separator laminate in which an electrode and a separator are temporarily bonded to each other without causing mutual slip movement between the electrode and the separator and which after producing a battery, functions itself as a separator having a small heat shrinkage factor even at high temperatures, and a process of producing a battery using such a partially crosslinked adhesive-supported porous film.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: January 22, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Keisuke Kii, Michio Satsuma, Yoshihiro Uetani, Mutsuko Yamaguchi, Yutaka Kishii, Shuuhei Murata, Tomoaki Ichikawa
  • Patent number: 8349123
    Abstract: The invention provides adhesive and sealant compositions prepared from urethane prepolymers. The urethane prepolymers are obtained by reacting the novel urethane diols, polyester polyols and polyether polyols with an excess of diisocyanate. The urethane diols are prepared by reacting excess low molecular weight diols and diisocyanates. The invention is particularly useful in end use applications such as panel lamination.
    Type: Grant
    Filed: April 1, 2008
    Date of Patent: January 8, 2013
    Assignee: Henkel Corporation
    Inventors: Yue S. Zhang, Louis A. Moore
  • Patent number: 8349111
    Abstract: A method for joining multiple ceramic components together is disclosed in one embodiment of the invention as including providing multiple ceramic components, each having a mating surface. A slip containing a mixture of alumina powder and a phosphate-containing reagent is applied to one or more of the mating surfaces. The mean particle size of the alumina powder is tailored to provide improved strength to the bond. Once the slip is applied, the ceramic components may be joined together at their mating surfaces. The joint may then be sintered to react the constituents in the mixture and thereby generate a bond between the ceramic components.
    Type: Grant
    Filed: July 20, 2007
    Date of Patent: January 8, 2013
    Assignee: Ceramatec, Inc.
    Inventors: Akash Akash, Balakrishnan G. Nair
  • Patent number: 8349124
    Abstract: A sealing material for a honeycomb structure includes inorganic fibers, oxide sol, and inorganic particles. The inorganic fibers include at least one of an alkali metal compound, an alkaline earth metal compound and a boron compound. The sealing material has a pH of at least about 4 and at most about 6.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: January 8, 2013
    Assignee: Ibiden Co., Ltd.
    Inventors: Hideaki Mizuno, Akikazu Miyata, Yosuke Fuchi
  • Patent number: 8343304
    Abstract: A single-component, moisture-curing composition, including at least one polyisocyanate, a polyaldimine, an ?-functional organoalkoxysilane, and an acid in special proportions that can be matched to one another. An exemplary composition cures by moisture as much as possible without forming bubbles. In the curing of the composition by atmospheric humidity, an anisotropic material is produced with a predominantly elastic sheath that is virtually tack-free on the surface and a predominantly plastic core. An exemplary composition can be especially well suited as a flexible sealant.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: January 1, 2013
    Assignee: Sika Technology AG
    Inventor: Urs Burckhardt
  • Patent number: 8343303
    Abstract: In one embodiment, the invention is an composition comprising: a) one or more isocyanate functional polyether polyurethane prepolymers; and b) one or more prepolymers of one or more polyisocyanates and one or more polyesters wherein the terminal groups on the polyester polyol polyurethane prepolymer are the residue of a monofunctional polyalkylene glycol (hereinafter capped polyester polyurethane prepolymer) or one or more polyester polyols which are capped with the residue of one or more monofunctional isocyanates (hereinafter isocyanate capped polyesters); wherein the composition is a low viscous paste at temperature of from about 40 to about 80° C. and is high viscous paste at a temperature of from about 40° C. or less. In a preferred embodiment the composition further comprises c) one or more catalysts for the reaction of isocyanate moieties with hydroxyl groups.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: January 1, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Ulrich Tribelhorn, Josef S. Bühler, Renate Herger Hassan
  • Patent number: 8333867
    Abstract: The invention relates to a process for the adhesive bonding of fibrous supports using a silicone elastomer which is thermosetted by radical crosslinking using at least one peroxide. The silicone elastomer is inserted between the supports over at least a portion of the region of overlap of the supports, where the supports are held in contact in the region of overlap in an manner that prevents trapping of air at the interface between the supports. The supports containing the silicone elastomer are heated while in intimate contact to allow the adhesive bonding of the supports by crosslinking of the adhesive.
    Type: Grant
    Filed: May 5, 2004
    Date of Patent: December 18, 2012
    Assignee: Bluestar Silicones France SAS
    Inventors: Alain Pouchelon, Maryline Quemin, Laurent Dumont, Francis Lafaysse
  • Publication number: 20120313508
    Abstract: Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate.
    Type: Application
    Filed: December 21, 2011
    Publication date: December 13, 2012
    Applicant: Samsung Mobile Display Co., Ltd.
    Inventors: Jung-Hyun SON, Hoon Kim
  • Publication number: 20120305167
    Abstract: First and second aircraft structures are bonded together with an adhesive including strain-sensitive magnetostrictive material.
    Type: Application
    Filed: December 13, 2007
    Publication date: December 6, 2012
    Applicant: THE BOEING COMPANY
    Inventors: Diane C. Rawlings, Robert J. Miller, Kenneth A. Krienke, James H. Mabe, Robert T. Ruggeri, Dan J. Clingman
  • Patent number: 8323448
    Abstract: A two-part type adhesive composition which comprises a first composition comprising (A) a nitrile butadiene rubber having an acrylonitrile content of from 10 to 30%, (B) a polymerizable (meth)acrylic liquid composition, (C) an organic peroxide and (D) a basic compound having an amine structure, and a second composition comprising (E) a reaction condensate of an amine and an aldehyde and (F) a reducing agent containing copper, is provided. In a preferred embodiment, the first composition also contains a photopolymerization initiator. A bonding method using the adhesive composition provides high adhesion and quick curing properties on the second time scale, and a high retention in durability on a high temperature and high humidity test.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: December 4, 2012
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yuki Hisha, Kimihiko Yoda
  • Patent number: 8323800
    Abstract: The present invention relates to a method of bonding a gold surface to a second surface which comprises heating a hybrid organic-inorganic melting gel >50° C., applying the melting gel to either the gold surface or the second surface. The melting gel is heated to above 130° C. until the melting gel has cured sufficiently to bond the surfaces together. The invention also relates to a combination of a gold surface and a second surface that is bonded together with a hybrid organic-inorganic melting gel. In another aspect of the invention the hybrid organic-inorganic melting gel is heated to a workable viscosity and cast into a film, sheet, block or lens. The cast gel is cured or partially cured and then applied between the gold surface and the second surface. Additional uncured melting gel may be applied. The construct is heated to above 130° C. until the melting gel has cured sufficient to bond the surfaces together.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: December 4, 2012
    Assignee: Schott Corporation
    Inventors: Daniel Haines, David Yuhas, Eric Urruti
  • Publication number: 20120292009
    Abstract: A method of attaching members is provided. In one aspect, the method includes placing a bonding material comprising at least one of silver micro particles)and silver nano particles on a surface of a first member; placing the first member with the surface of the first member having the bonding material thereon on a surface of a second member; heating the bonding material to a selected temperature while applying a selected pressure on at least one of the first member and second member for a selected time period to sinter the bonding material to attach the first member to the second member.
    Type: Application
    Filed: May 20, 2011
    Publication date: November 22, 2012
    Applicant: BAKER HUGHES INCORPORATED
    Inventors: Julian Kähler, Thomas Kruspe, Sebastian Jung, Gerhard Palm, Andrej Stranz, Andreas Waag, Erwin Peiner
  • Publication number: 20120295183
    Abstract: An electrochemical device includes a ceramic electrode, a metallic interconnect, and a ceramic bond material that bonds the ceramic electrode and the metallic interconnect together. The ceramic material includes manganese-cobalt-oxide that is electrically conductive such that electric current can flow between the ceramic electrode and the metallic interconnect.
    Type: Application
    Filed: February 8, 2010
    Publication date: November 22, 2012
    Inventors: Jean Yamanis, Dustin Frame, Lei Chen, Ellen Y. Sun
  • Publication number: 20120288702
    Abstract: One embodiment relates to an article and a method for producing an article including a plurality of substrates, and an adhesive bonded between at least two of the plurality of substrates. The adhesive can include a polycarbonate copolymer that includes reacted resorcinol, siloxane, and bisphenol-A. Another embodiment relates to an article having a first polyimide substrate, a second polyimide substrate, and an adhesive bonded between the first substrate and the second substrate. The article can have a 2 minute integrated heat release rate of less than or equal to 65 kilowatt-minutes per square meter (kW-min/m2) and a peak heat release rate of less than 65 kilowatts per square meter (kW/m2) as measured using the method of FAR F25.4, in accordance with Federal Aviation Regulation FAR 25.853(d).
    Type: Application
    Filed: May 10, 2011
    Publication date: November 15, 2012
    Inventors: Erich Otto TEUTSCH, Craig Milne
  • Patent number: 8308893
    Abstract: A method of increasing adhesion between a copper or copper alloy layer and a polymeric resin. The method includes the steps of a) applying a pre-dip composition to the copper layer; b) applying a nano-oxide composition to the treated copper layer, c) applying a post-dip composition to the nano-oxide treated surface, and d) bonding a resin to the treated copper surface. The nano-oxide composition comprises (i) a chlorite; (ii) a caustic; (iii) a phosphate salt; (iv) an organic nitro compound; and (v) a thio compound. The post-dip composition is an alkaline solution that comprises (i) a phosphate salt; (ii) a source of molybdenum ions; and (iii) a thiazole. The process of the invention is useful for improving the bond between copper and a resin, including high Tg resins, halogen-free resins, and high speed/lost resins.
    Type: Grant
    Filed: February 1, 2010
    Date of Patent: November 13, 2012
    Inventors: Ming De Wang, Steven A. Castaldi, Kesheng Feng
  • Publication number: 20120279655
    Abstract: Ceramic floors and methods of making thereof such that the ceramic tiles are quickly and easily removable from the floor substrate and replaceable at a future date. A ceramic tile floor is laid by releasably adhering a sheet to a floor substrate and bonding at least one ceramic tile to the sheet. A plurality of pre-fabricated articles each comprising a sheet and one or more ceramic tiles bonded to the sheet are laid onto the floor substrate with sheet edges abutting, and the sheets are releasably adhered to the floor substrate. The tile edges are set inwardly from the sheet edges so that a tile of one article is spaced from a tile of another article when the articles are laid. A non-Portland cement grout, preferably urethane grout, is provided between adjacent tiles.
    Type: Application
    Filed: May 8, 2012
    Publication date: November 8, 2012
    Inventor: Joseph D. D'Agostino
  • Publication number: 20120276387
    Abstract: It is provided a high-temperature assembly that is favorable for increasing the sealing property at the boundary area between a first member and a second member that are used in a high-temperature environment. Further it is provided a method for producing the high-temperature assembly, and a heat-resistant sealing material. The heat-resistant sealing material, which is disposed at the boundary area between a first member and a second member, comprises ceramic particles made of a plurality of materials which form a ceramics the volume of which increases when the ceramics is synthesized.
    Type: Application
    Filed: November 15, 2010
    Publication date: November 1, 2012
    Applicant: TYK CORPORATION
    Inventors: Hirokatsu Hattanda, Tomohiro Yotabun
  • Patent number: 8298367
    Abstract: A pressure sensitive adhesive composition includes (A) a bodied MQ resin containing (i) a resinous core and (ii) a nonresinous polyorganosiloxane group, where the nonresinous polyorganosiloxane group is terminated with a silicon-bonded hydroxyl group; (B) a treated MQ resin, where (B)/(A) ratio has a value of 0.3 to 5.0, and (C) a polydiorganosiloxane terminated with a condensation reactable group; where resin/polymer ratio has a value of 2.0 to 3.0; optionally (D) a crosslinker; optionally (E) a catalyst; and optionally (F) a solvent. A pressure sensitive adhesive product prepared by curing the pressure sensitive adhesive composition is useful in structural attachment applications such as structural glazing applications.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: October 30, 2012
    Assignee: Dow Corning Corporation
    Inventors: Andrew Beger, Loren Lower, Timothy Lueder, Rochelle Nesbitt, Randall Schmidt
  • Patent number: 8287686
    Abstract: The invention provides derivatives of poly(styrene-co-allylalcohol). These materials are useful as thermosetting monomers that can be incorporated into adhesive compositions. In some embodiments, the adhesive compositions are useful in the microelectronic packaging industry.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: October 16, 2012
    Assignee: Designer Molecules, Inc.
    Inventor: Stephen M. Dershem
  • Publication number: 20120247650
    Abstract: An imaging optic comprising a first combination element comprised of at least two individual lens elements, aligned with each other along an optical axis and adhered to each other, a second combination element comprised of at least one individual lens element and an aperture disposed between the first and second combination elements, the surfaces of the imaging optic having less than about 3 minutes tilt relative to the optical axis and less than about 0.005 mm de-center relative to the optical axis. A method of making the imaging optic and an endoscope comprising the imaging optic.
    Type: Application
    Filed: June 4, 2012
    Publication date: October 4, 2012
    Applicant: GYRUS ACMI, INC.
    Inventors: Jane L. Bareau, James D. Milks, Nidia A. Alvez, Teresa M. Lupien
  • Patent number: 8277599
    Abstract: The inventive method for placing and fixing (bonding) a first object, whose surface is functionalized by compounds of formula I Y (X), A? (I), on the surface of a second object whose surface is functionalized by compounds of formula II Y (X)n A (II), wherein A and A? are functional groups enabling to be bonded at least by a link in a covalent manner to an object surface X and X? are aliphatic, linear, branched or cyclic spacers which can comprise one or several hetero or aromatic, or heteroaromatic atoms or consist of several aromatic or heteroaromatic cycles and optionally of alternating aliphatic chains having aromatic or heteroaromatic groups, n and n?=0 or 1 and Y and Y are functions for generating one or several non-covalent bonds wherein said Y or Y? are selected such that they are complementary or can complex a metal atom or an identical metal compound.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: October 2, 2012
    Assignee: Commissariat a L'Energie Atomique
    Inventors: Renaud Demadrille, Stéphane Guillerez
  • Patent number: 8277870
    Abstract: A method of controlling corrosion at an interface formed between at least two metal components includes applying a blend of magnesium particles and one of an adhesive or a sealant to the interface. The magnesium particles have a diameter sufficient to span a distance between the metal components. The method further includes exposing the metal components to a substantially corrosive environment, where the corrosive environment at least partially dissolves the magnesium particles. At least partial dissolution of the magnesium particles i) cathodically protects the metal components at the interface, ii) alkalizes the corrosive environment, and iii) generates hydrogen bubbles that substantially block a crevice formed at the interface.
    Type: Grant
    Filed: November 25, 2008
    Date of Patent: October 2, 2012
    Assignee: GM Global Technology Operations LLC
    Inventor: Guangling Song
  • Patent number: 8268922
    Abstract: Pressure-sensitive adhesive based on a mixture of chemically crosslinked polyurethane and at least one hydrocarbon resin, the chemically crosslinked polyurethane being a reaction product of at least one aliphatic or alicyclic polyisocyanate and a combination of at least one polypropylene glycol diol and one polypropylene glycol triol, reacted with one another catalytically in the presence of the at least one hydrocarbon resin, the at least one hydrocarbon resin being a monomer resin of the styrene/?-methylstyrene type.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: September 18, 2012
    Assignee: tesa SE
    Inventors: Uwe Schümann, Kirstin Weiland, Bodo Zu Putlitz
  • Patent number: 8263711
    Abstract: Described is a pre-adhesive, curable composition comprising an acid-functional (meth)acrylate copolymer and a novel (meth)acryloyl-aziridine crosslinking agent, which when crosslinked provides a pressure-sensitive adhesive composition.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: September 11, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Larry R. Krepski, Peiwang Zhu, Belma Erdogan-Haug, Wen Jie Zhang, Dang Xie, Maureen A. Kavanagh, Marie Aloshyna ep Lesuffleur, Babu Gaddam, Qing Wu
  • Patent number: 8257528
    Abstract: A pair of substrates each having a bonding surface are joined together by interposing a bond layer precursor coating between the bonding surfaces of the substrates and heating the precursor coating to form a bond layer. Prior to the joining step, the substrate on the bonding surface is provided with a gas-permeable layer. Even when a material which will evolve a noticeable volume of gas upon heat curing is used as the precursor coating, substrates can be joined via a robust bond without the peeling problem by gas evolution.
    Type: Grant
    Filed: August 13, 2009
    Date of Patent: September 4, 2012
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Fujio Yagihashi, Yoshitaka Hamada, Takeshi Asano
  • Patent number: 8257543
    Abstract: The invention relates to a process for the production of a layered composite structure comprising (1) a semi-permeable membrane made of a polymer composition comprising a polyetherester elastomer and (2) at least one web layer bonded to the membrane, wherein the process comprises a step wherein a melt layer of the polymer composition is applied onto the at least one web layer, and wherein the polyetherester elastomer comprises polyether soft segments formed from poly(alkylene-ether)glycols comprising alkylene-ether segments formed from ethylene oxide and polyester hard segments consisting of ester units derivable from short chain diols and dicarboxylic acid consisting of 98-65 mole % terephthalic acid (TPA), 2-35 mole % isophthalic acid (IPA) and optionally 0-20 mole % other dicarboxylic acids, wherein the mole % is relative to the total molar amount of dicarboxylic acid.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: September 4, 2012
    Assignee: DSM IP Assets B.V.
    Inventors: Hermanus P. Snuverink Ook Lansink, Hendricus F. Aussems, Paul W. J. Heuvel Van Den, Angelika Schmidt
  • Publication number: 20120205145
    Abstract: A multilayer substrate includes a plurality of stacked thermoplastic resin layers each including an in-plane conductive pattern provided on one principal surface thereof and an interlayer conductive portion arranged to penetrate through the thermoplastic resin layer in a thickness direction. The plurality of thermoplastic resin layers include a first thermoplastic resin layer and a second thermoplastic resin layer, a stacking direction of which is inverted with respect to a stacking direction of the first thermoplastic resin layer. The second thermoplastic resin layer is thicker than the first thermoplastic resin layer. One end in the thickness direction of the interlayer conductive portion provided in the second thermoplastic resin layer is connected with the interlayer conductive portion of the thermoplastic resin layer adjacent to the second thermoplastic resin layer in the thickness direction such that the in-plane conductive pattern is not interposed therebetween.
    Type: Application
    Filed: April 23, 2012
    Publication date: August 16, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventor: Norio SAKAI
  • Patent number: 8236130
    Abstract: The invention concerns a sealing liquid comprising water and a penetration agent for sealing of mail pieces, the use of said sealing liquid as well as sealing devices and franking machines containing such a sealing liquid.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: August 7, 2012
    Assignee: Francotyp-Postalia GmbH
    Inventors: Thomas Gerhardt, Wolfgang Muhl
  • Patent number: 8236128
    Abstract: Adhesive material and adhesive parts are formed according to the present invention along with used therefore. The adhesive parts typically include a handling layer.
    Type: Grant
    Filed: October 12, 2007
    Date of Patent: August 7, 2012
    Assignee: Zephyros, Inc.
    Inventors: Abraham Kassa, Christopher Hable, Terry Finerman
  • Patent number: 8236129
    Abstract: One embodiment provides an attachment pad including a multilayer thermo-reversible adhesive including a shape memory polymer layer and a dry adhesive layer underlying the shape memory polymer layer, the multilayer thermo-reversible adhesive having a curved surface when the shape memory polymer layer is below its glass transition temperature and unaffected by a load; and a means for evenly applying a load and/or detaching force on the perimeter of the multilayer thermo-reversible adhesive including a spring.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: August 7, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: Tao Xie, Xingcheng Xiao, Ruomiao Wang
  • Patent number: 8231758
    Abstract: The present invention relates to two-part, curable, (meth)acrylic adhesives containing naturally occurring fillers which inhibit free radical cure, such as wood flour, and oxygen scavenging components. Also provided are methods of preparing such adhesive compositions and methods of bonding substrates together with such adhesive compositions.
    Type: Grant
    Filed: January 5, 2010
    Date of Patent: July 31, 2012
    Assignee: Henkel Corporation
    Inventors: Charles F. Schuft, Douglas E. Frost, David N. Mason
  • Patent number: 8221571
    Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: July 17, 2012
    Assignee: Brewer Science Inc.
    Inventors: Wenbin Hong, Dongshun Bai, Tony D. Flaim, Rama Puligadda
  • Patent number: 8221880
    Abstract: An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: July 17, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yasushi Akutsu, Yasunobu Yamada, Kouichi Miyauchi
  • Patent number: 8202622
    Abstract: The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 ?m or greater but less than 10 ?m and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.
    Type: Grant
    Filed: September 10, 2009
    Date of Patent: June 19, 2012
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Motohiro Arifuku, Itsuo Watanabe, Yasushi Gotou, Kouji Kobayashi, Kazuyoshi Kojima
  • Publication number: 20120135179
    Abstract: The invention provides a set gypsum-containing product having increased resistance to permanent deformation and a method for preparing it comprising forming a mixture of a calcium sulfate material, water, and an appropriate amount of one or more enhancing materials chosen from condensed phosphoric acids, each of which comprises 2 or more phosphoric acid units; and salts or ions of condensed phosphates, each of which comprises 2 or more phosphate units. The mixture is then maintained under conditions sufficient for the calcium sulfate material to form a set gypsum material.
    Type: Application
    Filed: February 1, 2012
    Publication date: May 31, 2012
    Applicant: UNITED STATES GYPSUM COMPANY
    Inventors: Qiang YU, Steven W. SUCECH, Brent E. GROZA, Raymond J. MLINAC, Frederick T. JONES, Paul J. HENKELS
  • Patent number: 8187411
    Abstract: Provided are a temporal fixation method in processing of optical members and a resin composition suitable therefor. The present invention provides a composition which is characterized by comprising (A1): a (meth)acrylate with a molecular weight of at least 500 having at least one (meth)acryloyl group at a terminal or in a side chain of a molecule, (B1): a polyfunctional (meth)acrylate, (C1): a (meth)acrylate other than (A1) and (B1), and (D1): a photopolymerization initiator. The invention also provides a method for temporarily fixing a member, characterized by comprising bonding a member to temporarily fix it with use of the composition, processing the temporarily fixed member, and immersing the processed member in warm water of at most 90° C., thereby removing a cured resin of the composition.
    Type: Grant
    Filed: June 9, 2005
    Date of Patent: May 29, 2012
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Kazuhiro Oshima, Tomoyuki Kanai, Kunio Iriuchijima
  • Patent number: 8187706
    Abstract: An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2?CR0—COO—R1—NHCOO—R2??(1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
    Type: Grant
    Filed: June 9, 2008
    Date of Patent: May 29, 2012
    Assignee: Sony Chemical & Information Device Corporation
    Inventors: Yasushi Akutsu, Yasunobu Yamada, Kouichi Miyauchi
  • Publication number: 20120103515
    Abstract: In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.
    Type: Application
    Filed: October 23, 2009
    Publication date: May 3, 2012
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Aiko Nagahara, Yutaka Hisaeda, Toshihiko Ueyama
  • Patent number: 8162870
    Abstract: A blood filter device has a housing that includes: a head portion (2) provided with a blood inlet (5) and forming an upper structure of the housing, a filtration portion (3) positioned below the head portion and forming a middle structure of the housing, and a bottom portion (4) disposed below the filtration portion and provided with a blood outlet (7); and a filter (8) mounted in a cavity of the filtration portion and partitioning a cavity of the housing into a head portion side and a bottom portion side. The filter is formed of a filter sheet folded to have a plurality of pleats, and disposed so that ridgelines of the plurality of pleats traverse respectively the cavity of the filtration portion in parallel. The bottom portion has a conical portion (4a) on the inner bottom face protruding downward to form a conical face.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: April 24, 2012
    Assignee: JMS Co., Ltd.
    Inventors: Shota Nakao, Yutaka Katsuno, Masayoshi Omori
  • Publication number: 20120094137
    Abstract: The present invention relates to one-part cationically curable compositions with storage stability, wherein cure is independent of external stimuli such as heat and UV irradiation. In particular, the present invention provides for compositions with a long shelf life that will cure only upon application of the composition to the target surface, i.e. the surface is involved in initiating cure of the cationically curable component. Suitable compositions comprise those for curing on a surface comprising carbon-halogen covalent bonds comprising a cationically curable component and a non-halide silver salt. The present invention also relates to a primer capable of promoting cure of cationically curable non-halide silver salt compositions.
    Type: Application
    Filed: August 17, 2011
    Publication date: April 19, 2012
    Applicants: LOCTITE (R&D), HENKEL IRELAND LIMITED
    Inventors: David Farrell, Ciaran McArdle
  • Publication number: 20120091863
    Abstract: A bonding structure that provides excellent conductivity and bonding between a piezoelectric body and a metal plate includes a metal plate and an electrode of a piezoelectric body bonded to one another with an electrically conductive adhesive so as to provide electrical conductivity, the electrically conductive adhesive includes carbon black with a nano-level average particle size, and has a paste form included in a solventless or solvent-based resin so that the carbon black forms an aggregate with an average particle size of about 1 ?m to about 50 ?m. The electrically conductive adhesive is applied between the metal plate and the electrode of the piezoelectric body, and the metal plate and the piezoelectric body are subjected to heating and pressurization so that the carbon black aggregate is deformed, thereby hardening the electrically conductive adhesive.
    Type: Application
    Filed: December 27, 2011
    Publication date: April 19, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiroki Kitayama, Hideo Nakagoshi, Kiyoshi Kurihara
  • Patent number: 8153268
    Abstract: A compound comprising at least one alkoxy silane moiety; and at least one moiety selected from a nitrosobenzene or a nitrosobenzene precursor and combinations thereof are provided and used in polymer to metal in particular rubber to metal bonding. The nitrosobenzene precursor may be at least one of a quinone dioxime or a quinone oxime.
    Type: Grant
    Filed: March 26, 2008
    Date of Patent: April 10, 2012
    Assignee: Loctite (R&D) Limited
    Inventors: Nigel Fay, Brendan J. Kneafsey, Darren Nolan, Susan Warren
  • Patent number: 8153245
    Abstract: An exemplary composite product and method of manufacturing is provided. In one embodiment, the method includes dewatering a first slurry through a dewatering belt to form a first substrate layer, applying a first functional layer onto at least a portion of the first substrate layer, and dewatering a second slurry through the dewatering belt to form a second substrate layer. A first side of the second substrate layer may be overlayed onto the first functional layer, and the layers may be cured, and the layers bonded.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: April 10, 2012
    Assignee: James Hardie Technology Limited
    Inventors: Basil Naji, John Sydney Cottier, Robert Lyons
  • Patent number: 8141324
    Abstract: A structural adhesive tape includes a closed cell silicone foam support and a structural adhesive composition on opposing sides of the closed cell silicone foam support. The structural adhesive composition may be a condensation reaction curable pressure sensitive adhesive composition. The structural adhesive tape is useful in structural glazing applications, such as curtain wall applications.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: March 27, 2012
    Assignee: Dow Corning Corporation
    Inventors: Lawrence Carbary, Timothy Lueder, Rochelle Nesbitt, Andrew Beger, Loren Lower, Randall Schmidt
  • Patent number: 8137500
    Abstract: Sprayable low-viscosity rubber damping compounds based on liquid rubbers or elastomers and vulcanization agents, which contain small quantities of structure-reinforcing fiber fillers, are notable for the absence of previously usual solid rubbers and have a very low viscosity in the application state. Acoustic compounds of this kind are sprayable with the aid of fully automatic application systems, and are preferably processed at the basic body stage in vehicle construction.
    Type: Grant
    Filed: July 31, 2007
    Date of Patent: March 20, 2012
    Assignee: Henkel KGaA
    Inventors: Ralf Sauer, Peter Born
  • Patent number: 8133336
    Abstract: A multi-lamellar tissue-adhesive sheet comprises a structural layer or laminate conjoined to a tissue-contacting layer. The structural layer or laminate comprises one or more synthetic polymers having film-forming properties, and the tissue-contacting layer of material contains tissue-reactive groups. The synthetic polymers having film-forming properties are preferably biodegradable polyesters, and the tissue-reactive groups are most preferably NHS-ester groups.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: March 13, 2012
    Assignee: Tissuemed Limited
    Inventors: Graeme Kettlewell, David Mandley, David Fortune, Ian Thompson, Diane Morris
  • Patent number: 8133346
    Abstract: Medical devices comprised of bonded joints are disclosed. The bonded joints comprise two surfaces bonded by a layer of phenoxy resin therebetween. In the preferred embodiments, bonded surfaces are comprised of materials that are suitable for medical devices. Most preferably, Nitinol comprises at least one bonded surface, however, other preferred materials may include, but are not limited to cobalt chromium, stainless steel, titanium, tantalum, and plastic. An intraluminal device comprised of a plurality of locations with a phenoxy resin layer is also disclosed wherein the phenoxy resin is further comprised of a radiopaque additive, a lubricious additive, or both radiopaque and lubricious additives. Also disclosed is an intraluminal device comprised of contiguous heterogeneous structural elements comprised of metallic members and non-metallic sections that are bonded together by a layer of phenoxy resin therebetween.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: March 13, 2012
    Assignee: Cordis Corporation
    Inventors: I Mark Huang, Michael V. Williamson
  • Patent number: 8128781
    Abstract: Pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling, the pressure-sensitive adhesive being composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), the fraction of liquid resin accounting for at least 40% by weight, based on the total amount of resin. Strips formed from the adhesive and the use of the strips to form redetachable bonds are also disclosed.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: March 6, 2012
    Assignee: tesa SE
    Inventors: Thorsten Krawinkel, Bodo Zu Putlitz