Abstract: Adhesives and sealants comprising submicron particles and nanomaterials, methods of making such adhesives and sealants, and methods of using such adhesives and sealants are provided.

Abstract: A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.

Abstract: Embodiments of the present invention generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present invention provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

Abstract: The present disclosure provides articles having an absorbent core. The absorbent core has a plurality of segmented volumes possessing an absorbent material therein. Suitable articles which may be formed with this absorbent core include, for example, diapers such as infant diapers, juvenile diapers and training pants, feminine hygiene products such as menstrual pads, adult incontinence products such as adult briefs, protective underwear, pads and bladder control pads, pet training pads, and other disposable products utilized to absorb fluids.

Abstract: The present invention relates to a conductive particle, a conductive adhesive with the conductive particles, a LCD panel with the conductive adhesive, a method of manufacturing of the conductive particle and a method of manufacturing of the conductive adhesive. The conductive particle comprising an outer coating layer of graphite and an inner core of an organic resin enclosed by the outer coating layer, and therefore the conductive particles can have good conductivity as well as good strength and elasticity.

Abstract: A method for covering an inanimate object with a botanical article includes the following steps: taking a dried botanical article having at least one surface, applying an adhesive to the surface of the botanical article, affixing the botanical item to the inanimate object by applying the surface covered with the adhesive to the inanimate object, whereby a natural veining and coloring of the botanical article are preserved, and optionally, applying a sealant over the botanical articles covering the inanimate object. The inanimate object may include sculptures, vessels, carvings, and frames. The botanical article may include flower petals, leaves, skeleton leaves, plant skins, and combinations thereof.

Abstract: The invention includes a method of bonding a perfluoroelastomer material to first surface that includes: (a) contacting a first surface with a bonding agent comprising a curable perfluoropolymer and a curing agent; (b) curing the bonding agent to form a perfluoroelastomer material that is bonded to the first surface. In the practice of such method, the bonding agent may be a solution prepared by dissolving the curable perfluoroelastomer and the curing agent in a solvent. In an embodiment of the invention, the perfluoroelastomer material formed in step (b) is a coating layer or, alternatively, the first surface is a surface of a perfluoroelastomer member and the perfluoroelastomer material formed is a perfluoroelastomer weld.

Abstract: Disposable absorbent articles assembled from a collection of components using an adhesive comprising an amorphous polyolefin composition and a heterophase polyolefin composition comprising amorphous character and crystalline blocks.

Abstract: Reinforced door skins, a door including one or more of the reinforced door skins, and methods of making the reinforced door skins and door are provided. The reinforced door skin as made by providing a reinforcement backing having a fibrous substrate layered with a solid-state thermoplastic hot melt adhesive, pressing the reinforcement backing and a preformed board having a door skin shape against one another at a temperature above a melt temperature of the thermoplastic hot melt adhesive and at sufficiently high pressure to conform the reinforcement backing to the door skin shape of the preformed board, and cooling the thermoplastic hot melt adhesive to form a reinforced door skin, the thermoplastic hot melt adhesive fusing the fibrous substrate to the preformed board of the reinforced door skin.

Abstract: Provided is a polarizing plate having improved single plate transmittance under high-temperature and high-humidity conditions, and a liquid crystal display device using the same. A laminate comprising a polarizer, and an adhesive layer adjoining to at least one surface of the polarizer, the adhesive layer containing a resin and a compound, etc. represented by the formula (1) below. In the formula (1), each of R1 and R3 independently represents a hydrogen atom, C1-20 straight-chain alkyl group, C3-20 branched alkyl group, C3-20 cycloalkyl group, C2-20 alkenyl group or C6-20 aromatic group, and R5 represents a substituent.

Abstract: The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120° C., and the electronic assembly made therewith.

Abstract: The invention relates to moisture-curing compositions which comprise at least one aromatic isocyanate group-bearing polyisocyanate and at least one dialdimine of formula (I). The compositions according to the invention have a longer open time and at the same time a shorter curing time, they are storage-stable and cure without forming bubbles. They are especially suitable as adhesives, sealing agents, potting compounds or coating materials, the use as sealing agents being especially advantageous.

Abstract: Disclosed is a bonding structure, including a heat dissipation substrate, a eutectic layer on the heat dissipation substrate, and a copper layer on the eutectic layer. The thermal dissipation substrate includes aluminum oxide, aluminum nitride, or zirconium oxide. The eutectic layer includes aluminum oxide, aluminum nitride, or zirconium oxide doped with zinc, tin, indium, or combinations thereof.

Abstract: An adhesive resin composition for a secondary battery for bonding a separator for a secondary battery and an electrode for a secondary battery, wherein the composition comprises an adhesive resin, the adhesive resin contains the following (A) and (B), and the phase composed of (A) and (B) has a core shell heterophase structure and/or a sea-island heterophase structure: (A) a resin having a glass transition temperature of ?30° C. to +20° C., (B) a resin having a glass transition temperature 20° C. to 200° C. higher than the glass transition temperature of (A).

Abstract: To provide an electrically conductive adhesive, which contains: a curable resin; electrically conductive particles: a curing agent; and a black colorant consisting of titanium black, wherein the electrically conductive particles are silver-coated copper powder, and wherein the electrically conductive adhesive is configured to connect an electrode of a solar battery cell with tab wire.

Abstract: The invention provides an adhesive or sealant comprising (A) at least one compound selected from the group consisting of polyurethanes, polyureas, polyacrylates, polysulphides, silylated polyurethanes, silylated polyureas, silylated polyethers, silylated polysulphides and silyl-terminated acrylates, and (B) at least 0.32% by weight of 2-ethylhexyl methyl terephthalate, based on the overall adhesive or sealant. A process is disclosed for preparing the adhesive or sealant, and also disclosed is the use thereof for producing material bonds between parts to be joined.

Abstract: A deposition mask for forming a thin film pattern having a predetermined shape on a substrate by deposition, includes a resin film that transmits visible light and has an opening pattern penetrating through the resin film and having the same shape and dimension as those of the thin film pattern so as to correspond to a preliminarily determined forming region of the thin film pattern on the substrate.

Abstract: A carbon fibre reinforced composite material including at least two carbon fibre fabrics and a thermoplastic resin, wherein each of the at least two carbon fibre fabrics is formed of an opened yarn obtained by opening a carbon fibre bundle, and the thermoplastic resin is impregnated with the at least two carbon fibre fabrics in a solidified state such that the carbon fibre reinforced composite material is formed integrally as a whole. Also disclosed is a method for producing the carbon fibre reinforced composite material.

Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.

Abstract: A composition, an article and a method for the bonding of non-woven substrates is disclosed. The composition includes solid particles comprising one or more polymers which are emulsified, dispersed and or suspended in a fluid carrier. The composition forms a molten blend when energy activated at temperatures in excess of 60° C. (140° F.).

Abstract: The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 ?m and a flake-shaped silver powder having an average particle diameter of from 1 to 5 ?m which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability.

Abstract: The intense purple dye normally found in purple primers for use in the adhesive bonding of plastics is replaced with a leuco dye capable developing a visually intense color when activated through contact with the particular plastic being bonded or a complementary solvent cement.

Abstract: A hot melt assist waterborne adhesive having high amplitude bead profile and higher heat resistance is provided. The hot melt assist waterborne adhesive includes an emulsion polymer, a preservative, a plurality of pre-expanded hollow microspheres and water. The hot melt assist waterborne adhesive is suitable as a partial or complete replacement to hot melt adhesives for use in converting paper and packaging process.

Abstract: A method for solvent-less adhesive bonding is provided comprising depositing thin, functional, polymeric films on one or more substrates and bonding the substrates to each other or to other substrates. Depositing the polymeric films, including, for example, chemically reactive polymers and thermoplastics with adhesive qualities, may be accomplished using an initiated chemical vapor deposition technique compatible with a variety of monomers, including monomers with chemically functional moieties such as amine and epoxy groups. The technique allows for deposition of polymeric films on a wide variety of substrates/devices and provides an alternative for other coating/deposition methods that are incompatible with certain substrates/devices and/or do not provide adequate control over the resulting polymeric film. The provided method is advantageous in that it is applicable to fabrication of hybrid devices and is compatible with microfabrication technology, including that in clean-room settings.

Abstract: Disclosed is a pressure-sensitive adhesive for single- or double-sidedly tacky pressure-sensitive adhesive strips that are redetachable without residue or destruction both by extensive stretching substantially in the bond plane and by peeling. The pressure-sensitive adhesive is composed at least of (1) a vinylaromatic block copolymer, (2) a solid tackifying resin having a softening temperature by the ring-and-ball method of more than 30° C. and (3) a resin which is liquid at room temperature (23° C.), wherein the fraction of liquid resin accounts for at least 40% by weight, based on the total amount of resin. Also disclosed are strips formed from the adhesive and the use of the strips to form redetachable bonds.

Abstract: A powder primer composition particularly useful as a primer intended to be used in conjunction with an adhesive topcoat in rubber to metal bonding. And a method for bonding an elastomeric substrate to a metallic substrate comprising, applying a powder primer composition onto one of said substrates, wherein the powder primer composition comprises a rubbery polymer and at least one of a phenolic resin and a phenoxy resin, applying an adhesive covercoat to form a coated substrate, contacting the coated substrate with the other of said substrates, and heating the contacted substrates to effect bonding of the metallic substrate to the elastomer.

Abstract: A method for manufacturing an image display device includes: providing an image display unit having an image display surface; providing a translucent protective material having a light-shielding portion; disposing a liquid optically clear adhesive (LOCA) between the image display surface of the image display unit and the translucent protective material; and curing the LOCA to adhere the image display unit with the translucent protective material. The LOCA is a two-part redox-type adhesive composed of a first composition including a first base agent containing a compound having at least one ethylenically unsaturated group and a polymerization initiator and a second composition including a second base agent containing a compound having at least one ethylenically unsaturated group and a reducing agent capable of decomposing the polymerization initiator.

Abstract: This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to lamination. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to lamination. The invention further provides devices containing electrical conductors made by these methods.

Abstract: Disclosed herein are novel stabilizers for thermoplastic oil-modified alkyd resins. It has now been found that such stabilizers can greatly increase the stability of alkyd resins against melt viscosity variations after thermal aging. The alkyd resins can be used as the predominant component of a hot melt adhesive which can be employed for instance as a construction adhesive in the manufacture of disposable absorbent articles.

Abstract: Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.

Abstract: A window covers a display panel including a display area for displaying an image and a non-display area neighboring the display area by a resin. The window includes a window main body including a transmitting area corresponding to the display area and a blocking area neighboring the transmitting area and corresponding to the non-display area; a light blocking layer provided on the window main body corresponding to the blocking area; and a contamination preventing layer provided on a region of the window main body located near or at a border line between the transmitting area and the blocking area. The contamination preventing layer contacts the resin.

Abstract: One embodiment of the invention includes a shape memory polymer which functions similar to a gecko footpad. A shape memory polymer may exhibit adhesive properties when heated above its glass transition temperature. A shape memory polymer may function as a reversible dry adhesive.

Abstract: A method for die bonding includes positioning a dispenser in a die bonding apparatus, wherein the dispenser includes a reservoir having bonding adhesive therein including particles and a liquid carrier. The dispenser is moved to provide mechanical agitation to the dispenser for mixing the bonding adhesive into a homogeneous mixture of particles and the liquid carrier, wherein the bonding adhesive is not dispensed during moving. After the moving, the bonding adhesive is dispensed onto a bonding location on the workpiece without removing the dispenser from the die attach apparatus. An integrated circuit (IC) die is attached onto the bonding adhesive over the bonding location. The method can also include determining an amount of time elapsed after the last mixing of the bonding adhesive or the positioning of the dispenser in the die bonding apparatus, and automatically initiating movement for mixing only if the elapsed time exceeds a predetermined time.

Abstract: An electromagnetic radiation shielding device includes a first ply having a No. 1 surface and a No. 2 surface and a second ply having a No. 3 surface and a No. 4 surface. The No. 2 surface of the first ply faces the No. 3 surface of the second ply. A first coating having three or more metallic layers is provided over at least a portion of one of the surfaces, such as over at least a portion of the No. 2 surface. A second coating having three or more metallic layers is provided over at least a portion of one or more of the other surfaces, such as over at least a portion of the No. 3 surface.

Abstract: An advertisement laminate meets the fire-resisting requirements needed for placement inside of an aircraft cabin. The laminate includes several specifically configured adhesively attached layers, including a fire protection barrier layer, a printed advertisement layer which is visible to passengers, and a transparent protective cover layer. The laminate is equipped for being adhesively adhered to an interior component of the aircraft cabin, such as an overhead storage bin, an overhead bin door, a sidewall panel, a bulkhead, window surround, or any other area inside the aircraft which must meet FAR 25.853 requirements.

Abstract: A method for coating substrates, containing a) applying a composition to a first side of a substrate, the composition containing an inorganic compound and the inorganic compound containing a metal such as Sc, Y, Ti, Zr, Nb, V, Cr, Mo, W, Mn, Fe, Co, B, Al, In, Tl, Si, Ge, Sn, Zn, Pb, Sb, or Bi, and an element such as Te, Se, S, O, Sb, As, P, N, C, or Ga, b) drying the composition, c) applying a coating to the first side of the substrate, the coating containing a silane, oxide particles of Ti, Si, Zr, Al, Y, Sn, Zn, Ce or mixtures thereof, a polymer and an initiator, d) drying the coating, e) applying a barrier layer to a second side of the substrate, and f) drying the barrier layer to form a dry barrier layer.

Abstract: Embodiments according to the present invention relate to sacrificial polymer compositions that include polycarbonate polymers having repeat units derived from stereospecific polycyclic 2,3-diol monomers. The sacrificial polymer compositions also include an acid generator that is selected from at least one photoacid generator and/or at least one thermal acid generator. In addition, embodiments according to the present invention relate to a method of forming a structure that includes a three-dimensional space interposed between a substrate and an overcoat layer, and a method of temporarily bonding first and second substrates together, which make use of the polycarbonate polymers.

Abstract: A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.

Abstract: A laminating device for laminating a window on a display panel for displaying an image includes: a first plate on which the display panel is provided; a second plate on which the window is provided and which is adjacent to the first plate; an applier provided on the second plate and applying a resin on the window; a folder for connecting the first plate and the second plate, for folding to allow the second plate to face the first plate, and for disposing the window on the display panel with the resin therebetween; and a pressurizer for pressurizing the second plate in a direction of the first plate.

Abstract: Adhesive composition usable in particular as an adhesion primer, based on a polyisocyanate compound and a polyester or vinyl ester resin comprising (in particular hydroxyl) functional groups which are reactive towards isocyanate groups of said polyisocyanate, the total number of said isocyanate groups being in excess relative to the total number of said functional groups of the polyester or vinyl ester resin. The polyisocyanate compound is preferably a diisocyanate, the resin is preferably an epoxy vinyl ester resin, in particular novolac- and/or bisphenol-based. Said composition is usable, as an adhesion primer, in combination with a secondary adhesion layer preferably based on a polyvinylpyridine/stirene/butadiene elastomer and a polyester or vinyl ester resin.

Abstract: The invention relates to a method of producing a friction lining whereby a friction paper is displaced with a latex based on an elastomer and fibers of the friction paper are then bonded one another due to precipitation of the elastomer out of the latex. A non-surface active protective colloid is added to the latex as a suspension agent before applying it to the friction paper.

Abstract: A composition for the protection of sheer hosiery comprising: a styrene polymer; an octylacrylamide/acrylates/butylaminoethyl methacrylate copolymer; a polyurethane-14 AMP-acrylates copolymer; and an AMP-100™ (amino methyl propanol) or triethanolamine emulsifier and surfactant; dissolved in a denatured alcohol/ethanol solvent and contained in a pump spray bottle. The composition to be sprayed on a detected imperfection and the surrounding area, and being allowed to dry, binding in a flexible, natural manner the elongated and broken fibers of the material to the surrounding weave thus preventing further damage to the hosiery.

Abstract: The present invention relates to novel polymer-bound adducts useful as cure components for anaerobic curable compositions. The compositions are particularly useful as adhesives and sealants.

Abstract: Certain example embodiments relate to techniques for bonding automotive brackets for sensors, rear view mirrors, and/or other components to an interior surface of the glass. The adhesive films of certain example embodiments may be film-based adhesives that may be die-cut and pre-applied to the brackets or components. They may have a good initial adhesion or green strength immediately upon contact with the glass. In certain example instances, the films may be applied and successfully bond to the glass at near ambient temperature conditions to a strength level adequate to meet operational specifications for the component in under 72 hours.

Abstract: An adhesive composition comprising a solids component, said solids component including a rubber component that includes polychloroprene; and a solvent component, said solvent component including t-butyl acetate.

Abstract: The present invention relates to two-component polyurethane compositions which on the one hand have a long open time and, even after extended exposure to a climate with high atmospheric humidity (e.g., 70% relative humidity), even after 40 minutes and in particular even after 60 minutes, can still be glued and cured to form polymers having high mechanical strength. The composition comprises castor oil, at least one polyol having 5-8 hydroxyl groups, a mixture of two different polyether alcohols and/or polyester polyols on the basis of castor oil or soybean oil and at least one polyisocyanate. The two-component polyurethane compositions are suitable in particular for non-positive filling joints or gaps that are joined by large-surface area structural gluing, in particular of vane half shells of rotor blades for wind power plants.

Abstract: The invention relates to a composition for a structural acrylic adhesive that comprises an adhesion promoter including a phosphate ester and a high molecular-weight polyamine as a polymerisation accelerator.

Abstract: The present invention describes a decorative surface covering comprising a plurality of component layers, structural and/or chemical, chemically bonded to the surface, together forming a unique single unit, monolithic decorative surface overlay, referred to generally herein as a functionally bonded system. The functionally bonded system is designed to be flexible, expandable, and functional, providing the same durability as pre-existing flooring or horizontal surfaces. While the individual components have various properties, the chemical bonding of one layer to an adjacent layer above and/or below provides for a unique surface covering that is decorative and functional.

Abstract: Curable sealant compositions having low temperature sealing ability improved over convention curable sealing compositions. The composition is flowable and can be cured to a cross linked form to provide cured reaction products that exhibit elastomeric properties. The curable elastomeric sealant composition can include a cross linkable elastomeric oligomer; an initiator or cross-linking agent; a glassy monomer and/or a rubbery monomer; and optionally one or more additives. Cured reaction products of the composition have a single Tg and retain a higher sealing force at low temperatures (but above the cured product Tg) as compared to a curable composition made from the same cross linkable elastomeric oligomer but without the glassy and/or rubbery monomer.

Abstract: New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.