Abstract: The present invention relates to an inexpensive adhesive resin composition which is applicable even to a base material having a poor bonding property. The adhesive resin composition comprises (A) a polymer having no radical-polymerizable double bond and (B) a radical generating agent in which the radical generating agent (B) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). In the preferred embodiment of the present invention, the adhesive resin composition further comprises (C) a radical-polymerizable monomer wherein the monomer (C) is present in an amount of 0.1 to 10 parts by weight on the basis of 100 parts by weight of the polymer (A). The radical-polymerizable monomer (C) is a glycidyl group-containing monomer, and the glycidyl group-containing monomer is 4-hydroxybutyl acrylate glycidyl ether.

Abstract: Curable wood particle composites curable by the Michael addition reaction in the presence of strong base catalyst are disclosed, along with a method for making those curable wood particle composites. Cured wood particle composites are also disclosed, along with a method of making those cured wood particle composites.

Abstract: A method for connecting an electronic part, which contains: mixing a dispersing solvent, an adhesive resin which is dissolved in the dispersing solvent, conductive particles, and insulating particles which have smaller particle diameters than those of the conductive particles so as to prepare an anisotropic conductive adhesive; placing a terminal of a substrate and a terminal of an electronic part so as to face each other via the anisotropic conductive adhesive, and applying heat and pressure to the substrate and the electronic part so as to sandwich the conductive particles between the terminal of the substrate and the terminal of the electronic part to thereby deform the conductive particles, in which the pressure is smaller than pressure at which the conductive particles are destroyed, and smaller than pressure at which the particle diameters of the conductive particles become equal to the particle diameters of the insulating particles.

Abstract: Adhesive compositions useful for laminating cellulosic substrates are formulated using an aqueous emulsion of a vinyl ester polymer such as polyvinyl acetate, one or more monomers or oligomers functionalized with (meth)acrylate groups, and a photoinitiator. The adhesive is cured by drying and exposing the adhesive to UV or visible light and is particularly useful for attaching clear films to cellulosic substrates such as paper and boxboard (e.g., in the manufacture of envelopes or folding cartons having windows).

Abstract: Curable wood particle composites curable by the Michael addition reaction in the presence of weak base catalyst are disclosed, along with a method for making those curable wood particle composites. Cured wood particle composites are also disclosed, along with a method of making those cured wood particle composites.

Abstract: A filter assembly includes a filter pad comprising flame resistant viscose. The filter assembly also includes a bonding emulsion. The bonding emulsion may comprise casein resin. The bonding emulsion may additionally comprise acrylic resin. The filter assembly also includes a structural support. In particular embodiments, at least a portion of the fibers are treated with a solution that is fire resistant or fire retardant.

Abstract: Provided is a single layer adhesive that provides the appropriate balance of adhesion and clean release required for a wafer dicing function and also provides the necessary bond required in a subsequent die attach step. The adhesive composition comprises an acrylate ester polymer having a functional group, a multi-functional thermosetting resin, wherein the acrylate ester polymer and the thermosetting resin are capable of reacting with each other, a multi-functional acrylate ester, an acrylate ester polymerization catalyst or curing agent, a thermally-latent catalyst suitable for curing the multi-functional thermosetting resin, and an acrylic acid salt.

Abstract: Acrylic-based pressure sensitive adhesives are modified with a telechelic hydrocarbon oligomer. The oligomer comprises a hydrocarbon polymer chain or backbone and a functional end group, e.g., an oligomer prepared from a mono hydroxyl polybutadiene polymer and toluene diisocyanate. The oligomer attaches to the acrylic backbone of the polymer as a pendant group and in a preferred embodiment, the oligomer is mixed with the PSA shortly before the PSA is coated.

Abstract: The present disclosure is generally directed to electrically conductive adhesives. More particularly, the disclosure is directed to electrically conductive adhesives comprising an organic polymer resin and an electrically conductive polymer. Advantageously, the electrically conductive adhesives have low RF loss, and are thus suitable for use in a space radar antenna and in other antenna applications where antenna components are in the RF field of view.

Abstract: An article comprising an adhesive having an acid number of less than about 5 is provided. The adhesive is selected from the group consisting of polyurea, polyamide, polyurethane, polyester, addition cure silicone and combinations thereof. The adhesive is in contact with a corrosion sensitive layer selected from the group of metal and metal alloys. When the article is conditioned for about 21 days at about 60° C and 90% relative humidity, the corrosion sensitive layer exhibits a change from its initial electrical resistance value of 20% or less.

Abstract: Frameless window which comprises a transparent pane, the lower edge of which is fixed in the slot of one or more holders by at least one layer of adhesive and is joined to the walls of the slot of the holders by one or more layers of a first adhesive applied close to the lateral ends of the slot, wherein at least one layer of a second adhesive is applied in the slot between the layers of the first adhesive. A process for manufacturing the window is also disclosed.

Abstract: The present invention provides an improved bonding system including an adhesion promoter that may be used to help adhesively bond two or more components together. The preferred use of the present adhesion promoter is in a transportation vehicle (e.g., automobile), and more particularly in an engine assembly for use in such vehicles. The present invention includes a bonded automobile engine assembly including at least one plastic component, an adhesive that bonds the plastic component to at least one separate component, and an adhesion promoter between the adhesive and the plastic component. Fasteners for attaching components are optionally employed. In one specific example, an intake manifold including a plastic component is bonded to an engine assembly.

Abstract: A fastening element for the fixed attachment of an object to a surface. The element comprises a base body which is capable of accommodating an element for holding the object and can be attached to the surface with the aid of a moisture-curable bonding and fixing agent. The base body is capable of acting at least in part as a water reservoir and/or of accommodating a water reservoir therein such that the agent can receive moisture for curing from the water reservoir. An installation system comprising the fastening element and a moisture-curable agent and a method of curing the agent are also disclosed. This Abstract is not intended to define the invention disclosed in the specification, nor intended to limit the scope of the invention in any way.

Abstract: A PNA zip-code chip in which PNA zip-code probes are immobilized on a substrate at high density using an epoxy compound as a linker, and method for fabricating such PNA chip. The use of PNA provides the chip with superior properties to DNA chips, allowing precise diagnosis of congenital diseases or base mutations with much higher sensitivity than is achievable with a DNA chip. The use of the PNA zip-code chip enables diagnosis of gene mutations in a simple manner, using only hybridization reaction, without the difficulties associated with processes in which probes must be immobilized directly on a substrate every time the target gene changes.

Abstract: A single- or multiple-component, free-radically curable composition having at least one free-radically polymerizable monomer of the formula (I) and at least one free-radical initiator. These compositions are suitable as adhesives or sealants and also as coverings. Both before and after curing they have a very low odour, and after curing they possess excellent mechanical qualities in tandem with effective adhesion, to various materials such as plastics, and are therefore suitable for use in areas that are closed or difficult to aerate.

Abstract: The present invention provides a method for producing a laminated product, the method comprising the steps of: applying a solution containing a liquid-crystalline polymer and a solvent to a first metal layer, removing the solvent from the solution to form a liquid- crystalline polymer layer on the first metal layer, placing a second metal layer such that the liquid-crystalline polymer layer is placed between the first and second metal layers, and subjecting the liquid-crystalline polymer layer to compression from the direction of the first and second metal layers, wherein the thickness of the second metal layer is larger than that of the first metal layer. In the production method, the first metal layer preferably comprises a different metal from the second metal layer.

Abstract: A pre-adhesive composition is described comprising an acid-functional (meth)acrylate copolymer and an aziridine crosslinking agent, which when crosslinked provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.

Abstract: Provided is an oxymethylene copolymer composition for a stretched material having a high strength and a high elastic modulus, the composition including: an oxymethylene copolymer; and a crosslinkable compound to be blended with the oxymethylene copolymer in an amount of 0.001 to 0.05 part by mass with respect to 100 parts by mass of the oxymethylene copolymer. The present invention also relates to a stretched material obtained by using the oxymethylene copolymer composition. Further, the present invention relates to a structure obtained by the secondary processing of the above stretched material, and a structure obtained by using the above oxymethylene copolymer composition in a bonding layer of the structure. The present invention also relates to a method of producing a structure, the method including: using the oxymethylene copolymer composition in a bonding layer of the structure; and removing a polyalkylene glycol component with water or a solvent.

Abstract: The invention relates to the use of a two-phase polymer combination which is dissoluble in aqueous alkali and comprises a. an alkali-soluble copolymer or terpolymer of an ?,?-unsaturated monocarboxylic acid which possesses carboxyl groups distributed essentially uniformly over the chain of the molecule, as a continuous phase, and b. a copolymer or terpolymer which is insoluble in aqueous alkali and contains epoxy groups along its polymer chain, as a discontinuous finely disperse phase, c. free epoxy groups on the surface of the polymer particles of the discontinuous phase being linked to one another by esterification with some of the carboxyl groups of the polymer of the continuous phase, and the remaining carboxyl groups being present in unchanged form, as an adhesive. The polymer combination, which is not tacky in the dry state, can be made tacky by supplying aqueous moisture to it.

Abstract: A peelable adhesive sheet is provided. The peelable adhesive sheet includes a base material and an adhesive composition layer that is provided to at least one side of the base material and that contains an acrylic resin and hollow particles. The adhesive composition layer is configured to removably adhere to another adhesive layer when at least two adhesive composition layers at least contact each other and at least pressure is applied thereto.

Abstract: Use of an adhesive sheet having a carrier film provided with an adhesive on one side for covering microtitre plates, the adhesive being formed from at least one acid- or acid anhydride-modified vinylaromatic block copolymer, at least one tackifier resin and at least one metal chelate.

Abstract: The invention relates to a solvent-free, reactive composition comprising at least a photoinitiator and a polymer A, capable of reacting under UV-radiation using a photoinitiator and optionally further components, characterised in that the polymer A contains at least one in-chain olefinically unsaturated group and that the polymer A and/or a polymer B contains further a) at least two groups capable of reacting in the presence of moisture, and/or b) at least two olefinically unsaturated groups in terminal position, and/or c) at least one group capable of reacting in the presence of moisture and at least one olefinically unsaturated group in terminal position. The invention relates also to the process making the same, and its use as adhesive and/or as coating composition.

Abstract: The present invention is to significantly improve copper-foil adhesion strength (copper-foil peel strength) without roughening or blackening a copper-foil surface, and thereby to provide a copper-clad laminate used favorably in a high frequency range. The copper-clad laminate (101) for a single-sided printed-wiring board is formed by bonding a copper foil (4) onto a surface of an insulating substrate (2) with an LCP/PFA composite film (3) disposed in between. The insulating substrate (2) is made of a fluororesin prepreg 2A. The copper foil (4) is a rolled copper foil, the both surfaces of which are smooth and not roughened or blackened. The insulating substrate (2) and the copper foil (4) are bonded to each other with the composite film (3) disposed in between by firing and pressing them under temperature conditions which are 5° C. to 40° C. higher than the melting point of PFA and lower than the melting point of LCP.

Abstract: The disclosure is directed to a framed device. The framed device includes a substrate, a frame, and a seal. The substrate has a first length, a first width, and a peripheral edge. The frame has a second length, a second width, and a groove that runs along the second length and the second width of the frame. The groove is substantially engaged with the peripheral edge of the substrate. The seal is disposed within the groove of the frame, wherein the seal runs contiguously from the substrate to the frame and the seal includes a foamed polymer.

Abstract: The present invention provides a method for bonding a membrane electrode assembly (MEA) and a gas diffusion layer (GDL) of a fuel cell stack, which facilitates stacking of an electrode catalyst layer of the MEA and the GDL and, at the same time, facilitates the keeping of the stacked layers for mass production of the fuel cell stack. For this purpose, the present invention provides a method for bonding a membrane electrode assembly and a gas diffusion layer of a fuel cell stack, the method including: coating a catalyst layer on a surface of a polymer electrolyte membrane; attaching a sub-gasket on the circumference of the polymer electrolyte membrane; and stacking a gas diffusion layer onto an outer surface of the catalyst layer by bonding all or a portion of an outer surface of the sub-gasket and the circumference of the gas diffusion layer with a bonding means.

Abstract: To provide an adhesive composition which can exhibit high adhesion to a circuit board and also has ability capable of releasing the connection to the circuit board connected and reconnecting the circuit board (repairing properties). An adhesive composition comprising: (i) one or more aromatic-group-containing polyhydroxy ether resins, (ii) a compound having an alkoxysilyl group and an imidazole group in the molecule, and (iii) organic particles, wherein the content of the organic particles is 50% by weight or more based on the weight of the adhesive composition.

Abstract: Transdermal drug delivery patches and methods of their production are described. The patches can be made such that the accommodate highly plasticizing drugs such as selegiline and/or the use of protonated forms of various drugs.

Abstract: The invention relates to a hot melt adhesive, when irradiated with microwave radiation, heats up and loses its adhesive properties. The invention further relates to a process for bonding and opening package with the hot melt adhesives. The hot melt adhesive is particularly well suited for food packages.

Abstract: The present invention relates to polycarbonate having repeat units derived from tert-butylhydroquinone (TBHQ). It has herein been found that polycarbonate having repeat units derived from TBHQ has superior properties as compared to polycarbonate having repeat units derived from other dihydroxy (hydroquinone-type) compounds. In one embodiment the present invention provides a polycarbonate having repeat units derived from tert-butylhydroquinone. The polycarbonate has a Mw (PC) of at least 9,000 g/mol.

Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.

Abstract: The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

Abstract: An electronic device of the present invention has a substrate; an electro-conductive pattern (electrodes) provided over the substrate; a semiconductor chip mounted over the substrate, and electrically connected with the electrodes; a resin cap provided over the substrate and composed of two or more resin layers to hollow-sealing the semiconductor chip; and an adhesive layer (metal-resin adhesion maintenance layer) bonding the resin cap with the electrode.

Abstract: A process for improving adhesion to a surface that is at least partially coated with a fluorocarbon-containing coating, as well as a method for bonding surfaces that are at least partially coated with a fluorocarbon-containing coating, are disclosed. Moreover, compositions that may be used in the aforementioned process and method are disclosed. Additionally, articles and assemblies that include surfaces that are coated with a fluorocarbon-containing coating are disclosed.

Abstract: The invention relates to a two-component bonding agent system, consisting of a component A and a component B, comprising A) at least one polymer that possesses at least one Michael acceptor group, and in addition at least one Michael donor group, B) a compound catalyzing the Michael reaction, as well as optional additional additives and/or auxiliaries, wherein the polymer of component A has a number average molecular weight (Mn) between 1000 g/mol and 1 000 000 g/mol. Furthermore, 2K-adhesives, casting compounds and coating agents made from such bonding agent systems are described.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: The present invention provides a double-sided adhesive tape for fixing a decorative sheet for speaker, which includes a nonwoven fabric substrate, an acrylic pressure-sensitive adhesive layer A disposed on one side of the nonwoven fabric substrate and an acrylic pressure-sensitive adhesive layer B disposed on the other side of the nonwoven fabric substrate, in which the adhesive tape has a tensile strength in the tape flow (MD) direction of 8 N/10 mm or more and a tensile length in the width (TD) direction of 8 N/10 mm or more. The double-sided adhesive tape is excellent in the adhesion performance to a housing and a decorative sheet for speaker and at the same time, has excellent releasability ensuring that when separating the decorative sheet portion, smooth separation can be attained without leaving a residue of tape or pressure-sensitive adhesive on the housing portion.

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract: An electrode comprising a conducting substrate for detecting species such as nitric oxide (NO), carbon monoxide (CO), oxygen (O2) and hydrogen (H2) and a polymer matrix formed from a first layer only or first and second layers with the second layer applied to the first. The matrix forms a permselective barrier. Each layer has a first pre-coat or first and second pre-coats. Each pre-coat may be formed by: depositing a liquid form of at least one halogenated polymer such as fluorinated or chlorinated polymers onto a substrate and allowing the material to dry. A liquid form of at least one halogenated polymer adheres the first and second layers to the substrate. The electrode allows for detection of the target species and allows real time in vivo measurements to be taken. Blood flow can also be monitored. An electrode bundle with electrodes for different target species is also provided.

Abstract: The invention relates to a method of producing a friction lining whereby a friction paper is displaced with a latex based on an elastomer and fibers of the friction paper are then bonded one another due to precipitation of the elastomer out of the latex. A non-surface active protective colloid is added to the latex as a suspension agent before applying it to the friction paper.

Abstract: The adhesive bonding of matted PMMA with customary polymerization adhesives leads to very shiny bond seams, since the cured polymerization adhesives have a shiny surface. This emphasizes the very joining zones which it is intended that the viewer of bonded products should not perceive. The adhesive should therefore be matted after curing. The adhesive has for its basis a polymerization adhesive, preferably a (meth)acrylate-based adhesive. Two different kinds of silica are added as disperse powder to the polymerization adhesive, namely a silica powder having an average particle size of from 1 ?m to 10 ?m (matting agent) and a silica powder having an average particle size of more than 10 ?m up to 200 ?m (texturing agent).

Abstract: The present invention relates to compositions based on silane-functional polymers that are suitable for the adhesive bonding, sealing and coating of porous substrates, more particularly of porous mineral substrates, and that even after water storage ensure effective adhesion of the composition to the substrate.

Abstract: Electrodes are constructed with pressure-bonding techniques that simplify alignment of various electrode components during lamination. In an exemplary embodiment, a current collector is made from aluminum foil that has been roughed or pitted on both surfaces. The surfaces of the current collector can be further treated to enhance adhesion properties of these surfaces. Layers of film that include active electrode material, such as activated carbon particles, are fabricated using non-lubricated techniques. Each film is coated on one side with an adhesive binder solution, such as a thermoplastic solution. The adhesive binder is dried, and the films are laminated to the current collector using a calender with heated rollers. The resulting electrode product is processed to shape electrodes, which can then be used in electrical energy storage devices, including double layer capacitors.

Abstract: Method of bonding labels to hydrophobic substrates, a pressure-sensitive hotmelt adhesive being applied wholly or partly to the label or to the substrate at an area opposite the label, then bringing label and substrate together and bonding them, characterized in that the pressure-sensitive hotmelt adhesive is water-soluble in alkaline solution and the label is selected from i) water-permeable labels having a water absorbency (Cobb value) of greater than 0.3 g/m2 per 20 sec, ii) perforated labels which on the bonded surfaces have a perforation or cutouts of below 10%. Further described is a label which is coated with a water-soluble pressure-sensitive hotmelt adhesive and which exhibits a high water absorbency and/or, where appropriate, contains perforations or cutouts on the bonded surface.

Abstract: An aqueous composition comprising a) a polymer obtainable by free-radical polymerization b) a tricyclic diterpene derivative or a mixture of tricyclic diterpene derivatives (referred to collectively as tricyclic diterpene for short) c) a metal salt of an organic acid d) if appropriate filler.

Abstract: Surface protection films are disclosed that comprise an outer surface contact layer, an outer stiffening layer, and optionally a core layer, wherein the surface contact layer consists essentially of (A) a mixture of a tackified quadblock styrene block copolymer elastomer and a triblock styrene block copolymer containing up to 30 wt % of a diblock styrene copolymer; (B) a mixture of a tackified quadblock styrene block copolymer elastomer, a tackified triblock styrene block copolymer and a triblock styrene block copolymer containing up to 30 wt % of a diblock styrene copolymer; (C) a mixture of a tackified triblock styrene block copolymer and a triblock styrene block copolymer containing up to 30 wt % of a diblock styrene copolymer; or (D) a triblock styrene block copolymer containing up to 30 wt % of a styrene diblock copolymer and a low density polyethylene polymer.

Abstract: A belt for a machine for the production of web material, especially paper or cardboard, including a carrying structure and, on one web material contact side of the carrying structure, a fibrous material with polymeric material contained therein. A bulk of the polymeric material is provided in a volumetric area of the fibrous material which is close to a web material contact surface.

Abstract: A method is for making a non-planar three-dimensional (3D) multilayered circuit board. The method may include forming a stacked arrangement including at least one pair of liquid crystal polymer (LCP) layers with a bonding layer therebetween. The stacked arrangement may further include at least one electrically conductive pattern layer on at least one of the LCP layers. The method may further include heating and applying pressure to the stacked arrangement to shape the stacked arrangement into a non-planar 3D shape and concurrently causing the bonding layer to bond together the adjacent LCP layers of the stacked arrangement to thereby form the non-planar 3D multi-layered circuit board.

Abstract: A curable composition is provided which is excellent in adhesion to a substrate and mechanical strength and which has a low viscosity and thus is excellent in workability even without incorporating a solvent or a plasticizer.

Abstract: A press fabric for a machine for the production of web material, especially paper or cardboard, including a carrying structure and at least one layer of fibrous material, which is firmly bonded with the carrying structure, at least one layer of fibrous material containing polymeric material at least partially coating fibers of this layer with a polymeric film.

Abstract: A method of manufacturing a mount includes dispensing a predetermined amount of molten thermoplastic adhesive on a release liner, attaching a tab to the adhesive while the adhesive is at a temperature above its softening point, and cooling the adhesive to a temperature below its softening point.