Abstract: A heat exchanger which including a metal exchange surface having a plurality of upward extending walls forming channels between the walls. The channels are between about 5 and about 500 um in width and the walls are between about 50 and about 1000 um in height. At least one reservoir communicates with the channels and a refrigerant is position in the reservoir, the refrigerant having a boiling point of at least about 50° C. A cover is positioned above the exchange surface such that refrigerant is returned to the exchange surface.

Abstract: A heat-exchange apparatus is provided, including a first heat exchanger, a second heat exchanger, a third heat exchanger and a fourth heat exchanger. The first heat exchanger is thermally separated from the second heat exchanger. The third heat exchanger is thermally connected to the first heat exchanger. The fourth heat exchanger is thermally connected to the second heat exchanger, wherein a first air flow passes through the first heat exchanger and the second heat exchanger to be divided into a first divergent flow and a second divergent flow, the first divergent flow flows on a surface of the first heat exchanger, the second divergent flow flows on a surface of the second heat exchanger, the first divergent flow does not flow on the surface of the second heat exchanger, and the second divergent flow does not flow on the surface of the first heat exchanger.

Abstract: Methods are provided for facilitating cooling of an electronic component. The methods include providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: A heat dissipation module includes a heat conducting plate having an upper surface, a stacked fins heat sink in thermal contact with and disposed on the upper surface of the heat conducting plate, at least one heat pipe and multiple fins. The evaporation end is in thermal contact with and disposed on the upper surface. The plurality of fins are located on the upper surface and positioned at intervals. Each of the fins has at least one through hole and the condensation end runs through the at least one through hole.

Abstract: A thin heat pipe structure includes a pipe body, a thin-sheet member, and a plurality of bosses. The pipe body internally defines a receiving space, in which a working fluid is provided. The thin-sheet member includes a plurality of open spaces, and the bosses are provided in the open spaces, so that the bosses and the thin-sheet member are disposed in the receiving space of the pipe body at the same time. A method of manufacturing thin pipe structure is also disclosed for manufacturing thin heat pipe structure with reduced time and labor, and protecting a wick structure formed in the thin heat pipe structure against damage. Therefore the thin heat pipe structure can be manufactured with increased good yield and at reduced manufacturing cost.

Abstract: A thermal management system includes a distributor plate secured to and parallel to a circuit board. The circuit board has a module secured thereto and the distributor plate defines an area on an inner surface thereof secured to or otherwise in thermal contact with the module. Heat pipes embedded in the distributor plate include a portion over the module and a portion over the circuit board outward from the module. A portion of the heat pipes outward from the module may be substantially perpendicular to a direction of airflow between the circuit board and distributor plate. The module may be located closer to one edge of the circuit board and the heat pipes may according extend from adjacent that edge to an opposite edge of the circuit board. An inward facing surface may include fins extending toward the circuit board and the fins may be contoured to the circuit board.

Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Abstract: A heat dissipation unit includes a housing and a heat pipe. The housing has a chamber in which a working fluid is contained. Multiple support posts and multiple fixing members are disposed in the chamber. The heat pipe has a heat absorption section positioned in the chamber of the housing and securely supported by the fixing members, and a heat dissipation section extending from the heat absorption section through the housing and positioned outside the chamber of the housing.

Abstract: A heat transfer system including a first heat exchange assembly, a second heat exchange assembly, and a heat transfer circuit interconnecting the first and second heat exchange assemblies, the circuit incorporating a working fluid to transfer heat between the first and second heat exchange assemblies. The heat transfer circuit preferably takes the form of a closed loop heat-pipe system. The heat transfer system is operative in a first mode where the working fluid is at or below a threshold pressure and in a second mode where the working fluid is at a higher pressure than the threshold pressure. A pressure regulating device is also provided to increase the pressure of the working fluid above the threshold pressure to effect change of operation of the heat transfer system from the first mode to the second mode. Optionally the pressure regulating device is a pressure vessel having at least one heat transfer surface.

Abstract: A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber. The mounting elements are externally connected to one side of the main body at positions corresponding to the supports in the chamber, and respectively define an internally threaded coupling bore therein. With these arrangements, it is able to ensure the air-tightness of the chamber of the heat dissipation unit having the mounting elements provided thereon. Further, the mounting elements with internally threaded coupling bore also provide good locking effect for the heat dissipation unit to securely connect with other elements via the mounting elements.

Abstract: A condensing device and a thermal module using same are disclosed. The condensing device includes a hollow main body having a first inlet, a first outlet, and a flow-guiding zone. In the flow-guiding zone, there is provided a plurality of spaced flow-guiding members to define at least one flow passage therebetween. The at least one flow passage is communicable at two opposite ends with the first inlet and the first outlet. The thermal module is formed by connecting the first inlet and the first outlet of the condensing device to a second outlet and a second inlet of a heat-absorption unit, respectively, via two separate heat-transfer units. With the flow-guiding zone provided in the condensing device, it is able to accelerate the vapor-liquid circulation in the condensing device to thereby provide upgraded heat transfer efficiency.

Abstract: An apparatus for providing transfer of a heat load between a heat source and a heat receiver includes a female part configured to be fixed to the heat source or the heat receiver and a male part configured to be fixed to the other of the heat source or the heat receiver. The female part includes a female structure. The male part includes a male structure. The male part and the female part are configured to form a heat transfer surface for the heat load therebetween when the male part is placed in the female part. Structures are configured to provide a heat transfer surface that increases with the temperature, so as to increase the heat load transfer between the structures.

Abstract: The present invention relates cooling system comprising at least one Thermo syphon, which Thermo syphon comprises at least one indoor evaporator, which is by first tubing connected to at least one outdoor condenser. It is the object of the present application to achieve effective automatic cooling of electronic systems placed inside a housing. This can be achieved by a system as disclosed in that the second tubing comprises a valve, which valve comprises a valve seat and a moveable valve piston, which valve piston is by decreasing temperature by the actuator moving towards the valve seat for closing the valve. Hereby a highly efficient cooling system can be achieved which can operate automatically without any energy supply from the outside, due to the use of the Thermo syphon principle.

Abstract: A heat transfer device that can improve temperature uniformity along the entire length of a pipe line housed in the heat transfer device is provided. The heat transfer device transferring heat to the pipe line in which a fluid flows includes: a heat transfer block of high heat conductivity, surrounding the pipe line, a heat pipe formed in the heat transfer block, along an extending direction of the pipe line, and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extending direction of the pipe line. There is provided a proximity portion where the heat transfer block is in proximate to the pipe line at both ends of the heat transfer block in the extending direction of the pipe line.

Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112?) and an attaching plane (113?) perpendicular to each other, coating an adhesive (50) on the contact planes (112?), connecting the contact planes to make the attaching planes co-planar.

Abstract: The present invention relates to fluoroolefin compositions. The fluoroolefin compositions of the present invention are useful as refrigerants or heat transfer fluids and in processes for producing cooling or heat. Additionally, the fluoroolefin compositions of the present invention may be used to replace currently used refrigerant or heat transfer fluid compositions that have higher global warming potential.

Abstract: A slim type pressure-gradient-driven low-pressure thermosiphon plate includes a main body closed by a cover. The main body includes a central heat receiving zone, a pressure accumulating zone and a first flow passage unit separately located at two opposite sides of the heat receiving zone, a free zone communicating with the pressure accumulating zone, a first and a second condensing zone communicating with the free zone, a third and a fourth condensing zone communicating with the first flow passage unit, a second flow passage unit located between and communicating with the first and the third condensing zone, and a third flow passage unit located between and communicating with the second and the fourth condensing zone. In the thermosiphon plate, a low-pressure end is created through proper pressure-reduction design to form a pressure gradient for driving steam-water circulation, and the working fluid can transfer heat without any wick structure.

Abstract: A vapor chamber includes a first metal cover plate and a second metal cover plate. The first metal cover plate has a plurality of first support portions, each of the first support portions has a head portion and a neck portion, and the head portion is extended from the neck portion. The second metal cover plate has a plurality of second support portions, each of the second support portions has a through hole and an engaging recess, and the engaging recess is formed in the through hole. The head portion is disposed in the engaging recess and the neck portion is disposed in the through hole, such that the first support portion and the second support portion are engaged with each other.

Abstract: A heat pipe based passive residual heat removal system for a spent fuel pool has a plurality of partitions (6) arranged around the inside of a spent fuel pool (3), wherein the heights of the partitions (6) are all lower than the height of the spent fuel pool (3); a plurality of evaporation-end heat pipes (4) are arranged between the outside of the partitions (6) and an inner wall of the spent fuel pool (3), and these evaporation-end heat pipes (4) are divided into several groups. Top outlets of each group of evaporation-end heat pipes (4) are extended beyond the spent fuel pool (3) and are connected to an inlet of an ascending pipe (10). An outlet of the ascending pipe (10) is connected to top inlets of a group of condensation-end heat pipes (7) comprising a plurality of condensation-end heat pipes. Bottom outlets of the group of condensation-end heat pipes (7) are connected to an inlet of a descending pipe (5).

Abstract: A method and apparatus for cooling a heat source is disclosed. The apparatus includes a fin-diffuser including a blower integrated with fins of a diffuser. A heat spreader is coupled to the fin-diffuser. The heat spreader is configured to spread heat from a location proximate the blower to location of the fins. The apparatus spreads heat from a heat source proximate a blower of the fin-diffuser to a location away from the blower to cool the heat source.

Abstract: A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first surface being coupled to a substrate; a thermal interface material disposed in thermal conductive contact with the second surface of the die; and a heat spreader adapted for dissipating heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material. The heat spreader includes a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the chamber, the lid being mounted to the substrate and a wick layer positioned in the chamber.

Abstract: An inorganic aqueous solution for use in a phase-change heat transfer device comprises an aqueous solution of potassium permanganate (KMnO4), potassium dichromate (K2Cr2O7), chromium trioxide (CrO3), silver chromate (Ag2CrO4), strontium hydroxide (Sr(OH)2), calcium hydroxide (Ca(OH)2), magnesium hydroxide (Mg(OH)2) and sodium hydroxide (NaOH).

Abstract: A heat sink module includes a base block having opposing top wall and bottom wall, insertion grooves located at the top wall, heat pipe grooves located at the bottom wall and rows of equally spaced holes cut through the top and bottom walls in communication between the insertion grooves and the heat pipe grooves and matching the insertion grooves, heat pipes mounted in the heat pipe grooves of the base block, and radiation fins respectively mounted in the insertion grooves of the base block, each radiation fin having heat pipe mating edges respectively inserted into the holes and stopped against the heat pipes for dissipating heat from the heat pipes.

Abstract: The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises E-1,2-difluoroethylene. The compositions of the present invention are useful in processes for producing cooling or heat, as heat transfer fluids, foam blowing agents, aerosol propellants, and power cycle working fluids.

Abstract: An oven configured for drying a container. The oven includes a housing defining an interior space including a supply chamber and a return chamber. A conveyor is configured for movement within a portion of the interior space of the housing defined by a plurality of semi-circular shaped duct sections connected at each end of the semi-circular shaped duct sections to a straight duct section. Each duct section includes two side walls coupled to a back wall defining a continuous U-shaped duct path through which the conveyor moves. The oven is further configured to provide a temperature difference between any two points within the interior space of the oven housing controlled to plus or minus two degrees Fahrenheit, by a uniform air flow throughout the oven. The uniform air flow is facilitated by the sizing and spacing of various circular orifices and slotted orifices in the continuous duct path.

Abstract: The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises Z-1,2-difluoroethylene (Z-HFO-1132a). The compositions of the present invention are useful in processes for producing cooling or heat, as heat transfer fluids, foam blowing agents, aerosol propellants, and power cycle working fluids.

Abstract: A heat exchanger with recuperating and condensing functions is provided. The heat exchanger includes a pressure vessel, a recuperating pipe and a cooling stream pipe. The pressure vessel has an inlet, an outlet and a baffle. The baffle, located between the inlet and the outlet, divides the interior of the pressure vessel into a working fluid recuperating region and a working fluid condensing region. The recuperating pipe is disposed in the pressure vessel, and passes through the working fluid recuperating region to heat a liquid working fluid flowing through the recuperating pipe. The cooling stream pipe is disposed in the pressure vessel, and passes through the working fluid condensing region to cool a vapor working fluid flowing into the pressure vessel. The vapor working fluid passes through the working fluid recuperating region and then flows into the working fluid condensing region.

Abstract: A heating device includes a heating device chamber, a heating element for heating air in the heating device chamber, and a condensing counter-flow heat exchanger including a first flow path that receives outgoing air from the heating device chamber and a second flow path for providing incoming air to the heating device chamber. The first flow path and the second flow path are configured in a counter-flow heat exchange relationship such that the outgoing air flows in a direction opposite the incoming air and the latent heat of evaporated water in the outgoing air is transferred to the incoming air thereby condensing liquid water from the outgoing air.

Abstract: A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired body of a first shell and a desired body of a second shell; separating the binder from the body of the first shell and the body of the second; sintering the body of the first shell and the body of the second shell, thereby forming the first shell and the second shell; and mounting the second shell on the first shell and sintering the first shell and the second shell together, thereby forming the casing of the heat pipe.

Abstract: A server and a heat dissipating assembly thereof includes an airflow generating device, a central processing unit, several memory slots, a first cooling fin set, a second cooling fin set and a heat conductive member. The airflow generating device generates an airflow flowing along an airflow direction and is located at a front side of the central processing unit. The several memory slots are used to plug of memories, and they are located at a lateral side of a central processing unit. The first cooling fin set is correspondingly located over the central processing unit and at a lateral side of the memory slots. The second cooling fin set is located at a front side of the memory slots and between the airflow generating device and the memory slots. The first cooling fin set is thermally connected with the second cooling fin set via the heat conductive member.

Abstract: A heat dissipation device for electronic controllers, is provided and includes a housing that has a hollow portion into which a working fluid for heat transfer and dissipation is filled. The housing of the electronic controller is formed to have the hollow portion using the material containing the heat-conductive filler and the heat transfer working fluid is filled in the hollow portion, to improve the cooling efficiency and achieving the weight reduction. By forming the condensation unit that condenses the vaporized working fluid in the upper end portion relative to the working fluid filled in the hollow portion of the housing, the heat exchange effect of the working fluid may be maximized.

Abstract: Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

Abstract: A heat pipe system and methods of arranging a heat pipe system are provided. The heat pipe system includes a plurality of heat pipes, with each of the plurality of heat pipes including a hot end thermally coupled to a heat source and a cold end thermally coupled to a heat sink The plurality of heat pipes include a first pair of heat pipes. When the plurality of heat pipes are secured to a rotatable body, the first pair of heat pipes are aligned with and oriented in opposing directions along a first axis of rotation of the rotatable body.

Abstract: In one embodiment, the invention is a method and apparatus for chip cooling. One embodiment of an apparatus for cooling a heat-generating device includes an inlet for receiving a fluid, a manifold comprising a plurality of apertures formed therein for decreasing the pressure of the fluid from a first pressure by adiabatic expansion for impinging the fluid on the heat-generating device once the pressure of the fluid is decreased from the first pressure.

Abstract: A vapor chamber structure is disclosed and includes a main body and a working fluid. The main body has a condensation section and an evaporation section and a chamber. The condensation section and the evaporation section are respectively disposed on two sides of the chamber. The evaporation section has a first face and a second face. A raised section is formed on the first face. The working fluid is filled in the chamber. The raised section is formed by means of mechanical processing as a support structure for enhancing the structural strength of the vapor chamber structure. The vapor chamber structure is manufactured at a much lower cost.

Abstract: A cycling heat dissipation module is used for removing the heat generated by a heat generating element and includes at least one main body and at least one conducting pipe. The main body has a chamber and a heat guiding part. The chamber is filled with fluid and has a wall to divide the chamber into a first compartment and a second compartment connected to each other. The first compartment has a first outlet, and the second compartment has a first inlet. The heat guiding part is used for conducting the heat generated from the heat generating element. The conducting pipe has a first end, a second end and a heat exchanging section. The fluid is pushed into the heat exchanging section by a pressure difference after absorbing the heat of the heat guiding part. After it is cooled, the fluid is flowed back to the chamber.

Abstract: A heat exchanger (100) is disclosed for exchanging heat with a medium across a substantially planar surface. The exchanger (100) comprises: a heat exchanging panel (101); a fluid circuit comprising a first chamber (104) disposed at a first end of the panel (101), a second chamber (105) disposed at a second end of the panel (101), a plurality of passages (103) which extend along the panel between the first and second chambers (104,105), and a duct (107) which extends between the first and second chamber (104,105); a fluid disposed within the circuit; wherein, the plurality of passages (103) are arranged in thermal communication with the panel (101) and are arranged to communicate the fluid from the first chamber (104) to the second chamber (15), and the duct (107) is arranged to communicate fluid from the second chamber (105) to the first chamber (104).

Abstract: The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises a tetrafluoropropene and at least one other component. The compositions of the present invention are useful in processes for producing cooling or heat, as heat transfer fluids, foam blowing agents, aerosol propellants, and fire suppression and fire extinguishing agents.

Abstract: This invention relates to azeotrope-like compositions, methods and systems having utility in numerous applications, and in particular, uses for azeotrope-like compositions comprising effective amounts of the compound cis-1,1,1,4,4,4-hexafluoro-2-butene (Z-HFO-1336mzzm), which has the following structure: and another material selected from the group consisting of water, fluoroketones, alcohols, hydrochlorofluoroolefins, and combinations of two or more thereof. These compositions may be used in a wide variety of applications such as, blowing agents, refrigerants, heating agents, power cycle agents, cleaning agents, aerosol propellants, sterilization agents, lubricants, flavor and fragrance extractants, flammability reducing agents, and flame suppression agents.

Abstract: A process analytic device includes an input to receive a sample of interest and an analytic detector operably coupled to receive the sample of interest. An analytic output is provided relative to the sample of interest. A plurality of heat pipes is thermally coupled to the analytic detector.

Abstract: An electronics chassis heat-pipe conduction cooling system includes a first chassis wall having multiple heat transfer sleeves defining multiple first chassis slots. A cabinet bottom chassis wall has multiple second chassis slots. A cabinet second chassis wall has multiple heat transfer sleeves defining multiple third chassis slots. Multiple first heat-pipes each have a vertical leg received in one of the first chassis slots and a horizontal leg received in one of the second chassis slots. Multiple second heat-pipes each have a vertical leg received in one of the third chassis slots and a horizontal leg received in one of the second chassis slots. A cold plate in direct contact with the cabinet bottom chassis wall completes a conduction cooling path including the vertical leg of the first and second heat-pipes through the horizontal leg of the first and second heat-pipes and the bottom chassis wall.

Abstract: The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises 2,3,3,3-tetrafluoropropene (HFC-1234yf) and at least one hydrocarbon. The compositions of the present invention are useful in processes for producing cooling or heat, as heat transfer fluids, foam blowing agents, and aerosol propellants.

Abstract: Vapor flow-diverting devices that re-direct upwardly flowing vapor, for example, in a downward direction across condenser tubes disposed in the upper or top section of a vapor-liquid contacting apparatus, are described. These devices are particularly beneficial in tubular condensers within distillation columns and may be used in combination with other associated equipment (e.g., a deflector plate and divider plate) as well as in combination with the tube surface enhancements to improve the heat transfer coefficient.

Abstract: A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.

Abstract: A heat exchanger includes a heat exchanger housing having a first flow path with a first inlet and a first outlet, and having a second flow path with a second inlet and a second outlet. A first fluid flows from the first inlet to the first outlet in the first flow path, and a second fluid flows from the second inlet to the second outlet in the second flow path. A heat pipe array within the housing extends between the first flow path and the second flow path for transferring heat from the first fluid to the second fluid.

Abstract: A heat dissipating device includes a heat dissipating module, a heat pipe, and an injection molded member formed by molding and solidifying. The heat pipe has a transfer segment, a heat input segment, and a heat output segment. The heat input segment and the heat output segment are respectively integrally extended from two opposite ends of the transfer segment. The heat input segment and the heat output segment each has a contact surface, and at least one of the contact surfaces contacts the heat dissipating module. The injection molded member connects to the heat dissipating module and a portion of the heat pipe, which contacts the heat dissipating module, for keeping the connection of the heat dissipating module and the contact surface of the heat pipe. The instant disclosure also provides a manufacturing method of the heat dissipating device by using connection of the injection molded member.

Abstract: The invention relates to a heat exchanger system comprising a jacket extending along a longitudinal axis and surrounding a jacket space. A pipe bundle is arranged in the jacket space wherein pipes are wound helically around a central pipe. At least one pre-distributor container is arranged in the jacket space for accommodating and degassing a liquid-gas mixture and designed to coat a distributing means with liquid degassed in the at least one pre-distributor container. The distributing means is designed to deliver the liquid to the pipe bundle. At the top the jacket has an inlet which is aligned with the longitudinal axis and in fluid connection with the central pipe. The central pipe has at least one lateral opening so that the liquid-gas mixture can be fed via the inlet, the central pipe, and the at least one lateral opening into the at least one pre-distributor container.

Abstract: A device with increased heat dissipation abilities for supporting printed wiring boards includes a chassis for holding printed wiring boards, a plurality of fins attached to the chassis, and a heat pipe in each of the plurality of fins that is capable of transferring heat from the chassis to the surrounding ambient by absorbing heat from the chassis at a first end of the heat pipe and releasing the heat into the ambient at a second end of the heat pipe.