Abstract: A heat pipe includes a metal tube, a heat-absorption part, a capillary and working fluid. The metal tube has a chamber formed therein. A vapor channel and a liquid channel communicating with the vapor channel are formed in the chamber. The heat-absorption part corresponds to a portion of the vapor channel and the liquid channel. The capillary is arranged in the vapor channel and in the liquid channel of the heat-absorption part. The working fluid fills the chamber.

Abstract: In one possible implementation, a thermal plane structure includes a non-wicking structural microtruss between opposing surfaces of a multilayer structure and a thermal transport medium within the thermal plane structure for fluid and vapor transport between a thermal source and a thermal sink. A microtruss wick is located between the opposing surfaces and extends between the thermal source and the thermal sink.

Abstract: A heat pipe device and a corresponding method in which micro-channel embedded pulsating heat pipes are incorporated into a substrate. A volume of fluid in a vacuum is introduced into a micro-channel which will become slugs of liquid. Heating of the contents of the micro-channel at an evaporator region (heat source) will cause vaporization within the micro-channel and cooling at a heat sink will cause condensation within the micro-channel, acting to both drive fluid flow within the micro-channel and efficiently transfer heat. Such devices could be used in a number of different configurations, including one as a stacked set of micro-channel embedded substrates.

Abstract: An exemplary heat exchanger includes evaporator channels and condenser channels, connecting parts for providing fluid paths between evaporator channels and the condenser channels, a first heat transfer element for transferring a heat load to a fluid in said evaporator channels, and a second heat transfer element for transferring a heat load from a fluid in the condenser channels. In order to achieve a heat exchanger that can be used in any position, the evaporator channels and said condenser channels can have capillary dimensions. The connecting part arranged at a first end of heat exchanger can include a first fluid distribution element for conducting fluid from a predetermined condenser channel into a corresponding predetermined evaporator channel, and the connecting part arranged at a second end of the heat exchanger can include a second fluid distribution element for conducting fluid from a predetermined evaporator channel into a corresponding predetermined condenser channel.

Abstract: A thermal management device including a first face configured to be in contact with a hot source and a second face opposite the first face configured to be in contact with a cold source, and at least one network of cells filled with a solid/liquid phase-change material located in a cavity between the first and second faces, wherein the cells include walls formed of carbon nanotubes, wherein the nanotubes extend roughly from the first to the second face, thermally connecting the first face to the second face.

Abstract: The invention relates to a method for executing an alternating evaporation and condensation process of a working medium on a heat transfer surface provided simultaneously as an evaporation and condensation surface. The method is characterized in that, during a respective operating cycle from in each case an condensation process and in each case an evaporation process, a condensate film of the working medium which forms during the condensation process is stored permanently in situ on the heat transfer surface and is then evaporated from the heat transfer surface during the evaporation process. In terms of the apparatus, the heat transfer surface (2) is in the form of an in-situ store for a condensate film (6) of the working medium which covers the heat transfer surface and does not drip off and remains on the heat transfer surface during the condensation process and evaporates during the evaporation process.

Abstract: Method for manufacturing a heat pipe is disclosed. A tube and a vessel mesh are provided. Solder paste in a pattern is coated on the vessel mesh. The vessel mesh is rolled into a vessel and the vessel is placed in the tube. The tube is heat to weld to the vessel to the tube. The present disclosure also provides an exemplary heat pipe having a vessel welded therein.

Abstract: The invention relates to a heating device for heating a liquid flow (I) in a water-bearing domestic appliance. According to the invention, the heating device has a heat pipe having a heat-absorbing evaporator section and a heat-outputting condenser section that is in thermal connection with the liquid flow (I).

Abstract: A sheet-like heat pipe for a heat-generating element, which is intended to make an electronic device more compact, more lightweight, and thinner, while also reducing costs, is provided. A sheet-like heat pipe (10) of the present invention includes a container (17) in which the peripheries of the sheet-like members (11, 12) disposed facing each other are bonded to form a cavity inside, and a working liquid which is enclosed in a cavity (15) of the container (17). At least one of the sheet-like members (11, 12) disposed facing each other is formed with protruding pieces (12A, 12B) which project outwards from the bonded part with the other sheet-like member and have a spring structure which causes the container (17) to elastically abut a heat-generating element (5) of an electronic device.

Abstract: An apparatus for cooling objects such as food items, beverages or vaccines comprises at least two reservoirs, a cooling device for cooling fluid contained in one of the reservoirs and a thermal transfer region between respective upper regions of the reservoirs. The thermal transfer region permits thermal transfer between the fluid contained in the reservoirs such that cooling of the fluid in one reservoir causes cooling of the fluid in the other reservoir.

Abstract: The present disclosure relates to an apparatus having an evaporator with a base plate having a first surface for receiving a heat load from one or more electric components, tubes that partly penetrate into the base plate via a second surface of the base plate for providing evaporator channels which are embedded into the base plate and condenser channels which are located outside of the base plate. In order to obtain a compact and efficient apparatus, the connecting parts can include hollow sections located within the tubes, each hollow section connecting the channels of a tube to each other in a vicinity of an end of the tube in order to allow fluid to flow between the channels of the tube via the hollow section.

Abstract: A system (1) and a method for cooling freshly baked bread under sub-pressure, which system includes: a sub-pressure chamber (2) which is adapted for receiving freshly baked bread for the cooling thereof; a sub-pressure source (3), such as a vacuum pump, which is connected to the sub-pressure chamber (2) for exhausting fluid from the sub-pressure chamber (2) and creating a sub-pressure inside it; a condenser (4) for cooling steam exhausted from the sub-pressure chamber and separate condensed water (19) from it. The system also includes a heating tank (5) with a first heat exchanger (6) in which the heat generated by the condenser (4) is used for heating water.

Abstract: The present invention provides a cooling apparatus and a method for an apparatus room, which is related to a cooling apparatus capable of transferring the heat generated by the heat source in the apparatus room out of the apparatus room and comprises a heat pipe having a heat transfer fluid flowing therein and attached to at least one heat transfer unit, characterized in that: one end portion of the heat transfer unit conducts a heat exchange with the heat source and the heat is transferred to another end portion thereof such that the heat is removed for cooling. The heat generated by the heat source is removed and carried away via the effective heat transfer to a remote end such that the temperature surrounding the heat source can be kept at low temperature and the effect of improved cooling can be advantageously achieved.

Abstract: A thermal transfer device having a reduced vertical profile. The device includes a condenser with substantially vertical internal cooling fins. An inlet conducts a thermal transfer fluid in a vapor state to the tops of the cooling fins where the vapor condenses and flows down the fins to the bottom of the condenser. The bottom of the condenser is angled towards an outlet for conducting the liquid thermal transfer fluid to a reservoir for holding the fluid. The inlet and the outlet are both positioned at a height above the level of the thermal transfer fluid in liquid state in the reservoir. The device may also include fins on the exterior of the condenser for providing cooling surfaces which do not contact the thermal transfer fluid in either the liquid or vapor states.

Abstract: A flat heat pipe radiator and a new kind of portable computer are provided. The air convective extended heat exchange surface of the radiator surrounds the fan impeller and is facing the air outlet of the impeller, the heat transport distance in heat pipe is shortened, the fan shell and the diffusion channel in the shell can be left out, so the size, weight and cost of the radiator are decreased effectively. The restrictions to a radiator when installing are reduced, which helps to implement the standardization of the radiator series. The new kind of portable computer helps to decrease weight and thickness and improve the heat dissipation further.

Abstract: A heat dissipating device includes a substrate, a plurality of fins, and a heat pipe. The substrate has a plurality of retaining holes. Each of the fins includes a heat dissipating sheet and a retaining sheet extended from the heat dissipating sheet and passing through one of the retaining holes. The heat pipe is disposed on the fins.

Abstract: The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.

Abstract: The present invention relates to a multi-cooling module for a vehicle, and more particularly to a multi-cooling module adapted to simultaneously cool an engine, electric parts, and a condenser through one or more heat pipes. In the multi-cooling module for a vehicle, one or more heat pipes are mounted to pass through two or more refrigerant passage pipes which go through with the same cooling system core unit.

Abstract: A supply module for supplying a weapon system includes an electric storage device and a thermal storage device that stores coolant. The supply module also includes at least one electrical connection via which power can be transferred from the electric storage device to the effector system, and at least one thermal connection via which the coolant can be transferred from the thermal storage device to the effector system.

Abstract: An appliance includes a water heater storage tank, a heating assembly configured to heat water within the water heater storage tank, and a heat exchange device disposed within the heat storage unit in a fixed relationship relative to a position of the heating assembly. The heat exchange device includes a hollow object and a phase change material within the hollow object.

Abstract: A heat dissipating system is disclosed to be disposed in a casing of an electronic apparatus in which a heat source is disposed. The heat dissipating system includes a heat dissipating device and a heat insulating device. The heat dissipating device is in contact with the heat source and has a predetermined heat dissipating path for dissipating heat generated by the heat source. The heat insulating device includes a first layer that is in contact with one of the heat source and the heat dissipating device, and a second layer that is bonded to the first layer and that cooperates with the first layer to define an evacuated space therebetween.

Abstract: A heat-dissipation structure is disclosed. The heat-dissipation structure is used on an electronic apparatus including a heating element and a vent structure. The heat-dissipation structure includes a heat pipe, a fin group, a fan, a heat-dissipation gate and a shape memory element. One end of the shape memory element is connected with the heat pipe and another end is connected with the heat-dissipation gate. Heat deformation of the shape memory element causes the heat-dissipation gate to move so as to open or close the vent structure.

Abstract: A machine for a temperature regulation arrangement that includes a closed area within the machine leading a temperature regulating chamber positioned adjacent a heat source, in which there are a number of liquid collectors arranged so that each has a feed take off that provides a elevated passage way from one liquid collector to the next.

Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.

Abstract: A welding implement and a method of extracting heat from a welding implement are disclosed. The welding implement includes one or more heat pipes which transfer thermal energy away from the torch head. A fluid, such as a shielding gas, may then convectively transfer the thermal energy away from the welding implement. The present invention thus provides a handheld welding implement that is compact, such that it can be used in confined spaces, and operated for longer periods of time, since the improved heat dissipation helps to maintain the welding implement at a temperature that an operator may hold.

Abstract: The invention describes features that can be used to control flow to an array of microchannels. The invention also describes methods in which a process stream is distributed to plural microchannels.

Abstract: The present invention relates to a flat plate heat pipe and a method for manufacturing the same. The heat pipe includes a flattened pipe whose inner surface is coated with a wick structure layer. The interior of the flattened pipe is provided with a sintered supporting layer and a working fluid. The sintered supporting layer has a plurality of posts arranged in the flattened pipe to vertically support therein. With this arrangement, the thickness of the pipe can be reduced but the whole structural strength can be maintained to prevent deformation. Further, a return path for the working fluid can be provided in the pipe. By only sealing two sides of the pipe, a sealed chamber can be formed for the operation of the working fluid. By the inventive method, the manufacturing process can be simplified and a larger space inside the chamber can be obtained.

Abstract: A heat pipe cooling system adapted for exemplary use with a gas metal arc welding torch, includes a container enclosing a capillary structure and quantity of working fluid, and functions to accelerate the dissipation of heat energy from a heated zone generated by the torch through the vaporization and condensation of the fluid and the capillary action of the structure.

Abstract: A cooling module includes a casing with a thermal-transmittance wall having an interior surface and an exterior surface, a coolant inlet, a vapor outlet, and a converting component with a plurality of orifices and dividing an interior of the casing into a coolant chamber and a vaporization chamber. A liquid coolant is ejected through the plurality of orifices to form plumes toward the interior surface of the thermal-transmittance wall and exchange heat with the thermal-transmittance wall resulting in coolant vapor. In a cooling system, a vapor conduit then carries the vapor to a condenser, and a coolant conduit returns the condensed coolant to the cooling module. The cooling system is used to cool a lamp device.

Abstract: A heat sink is disclosed including a cold plate, a plurality of heat pipes, and a plurality of fins. The cold plate has a first surface arranged substantially vertical and adapted to thermally couple to a heat source. Each of the plurality of heat pipes have an evaporator section arranged substantially vertical and thermally coupled to the cold plate, a condenser section arranged at an incline, and a single bend section coupling the evaporator section and the condenser section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes.

Abstract: A heat sink is disclosed including a cold plate, a plurality of heat pipes, a plurality of fins, and a heating unit. The cold plate has a first surface adapted to thermally couple to a heat source. Each of the heat pipes has an evaporator section thermally coupled to the cold plate and a condenser section coupled to the evaporator section. The plurality of fins are thermally coupled to the condenser sections of the plurality of heat pipes. The heating unit is adapted to heat condenser sections of a subset of the plurality of heat pipes.

Abstract: The present invention relates to compositions for use in refrigeration, air-conditioning, and heat pump systems wherein the composition comprises a fluoroolefin and at least one other component. The compositions of the present invention are useful in processes for producing cooling or heat, as heat transfer fluids, foam blowing agents, aerosol propellants, and fire suppression and fire extinguishing agents.

Abstract: A heat pipe includes a metal cylindrical body including a sealed storage space for storing water, a heat absorbing portion at one end portion of the cylindrical body to absorb heat by means of evaporation of the water, and a heat radiating portion at another end portion of the cylindrical body to radiate heat by means of condensation of steam generated by the evaporation. The cylindrical body includes a base material mainly including a stainless steel, a first metal layer mainly including a nickel and a second metal layer mainly including a copper, the first metal layer being formed on an inner surface of the base material and the second metal layer being formed on an inner surface of the first metal layer. The second metal layer is exposed to the storage space.

Abstract: A nanocomposite fluid includes a fluid medium; and a nanoparticle composition comprising nanoparticles which are electrically insulating and thermally conductive. A method of making the nanocomposite fluid includes forming boron nitride nanoparticles; dispersing the boron nitride nanoparticles in a solvent; combining the boron nitride nanoparticles and a fluid medium; and removing the solvent.

Abstract: Provided are mixed refrigerant systems and methods and, more particularly, to a mixed refrigerant system and methods that provides greater efficiency and reduced power consumption.

Abstract: Heat transfer compositions, methods and use wherein the composition comprising: (a) from about 5 to about 20% by weight of HFC-32; (b) from about 70% to about 90% by weight of HFO-1234ze; and (c) from about 5% to less than about 20% by weight of HFC-152a and/or HFC-134a.

Abstract: Disclosed is a thermosyphon system for cooling a platen in an ion implantation system. The thermosyphon system may include a vacuum chamber housing at least one wafer platen and a phase separator tank operative to contain both a liquid and gas phases of an element. A re-condensing cold head is exposed within the phase separator tank and is operative to condense the element from its gas phase to its liquid phase. This creates a convection driven closed loop pipe configuration. The closed loop pipe configuration includes a liquid phase pipe to carry the lower temperature liquid phase from the phase separator tank to the platen in the vacuum chamber. A reaction with the warmer platen converts the liquid phase to the gas phase. A gas phase pipe carries the higher temperature gas phase from the platen in the vacuum chamber back to the phase separator tank.

Abstract: In an example embodiment, a cooling system is a pumpless passive system, and includes a cold plate configured to receive a flow of liquid coolant and to output a flow of vapor phase coolant, where the cold plate includes at least one heat pipe adapted therein to provide for transfer of the liquid coolant to the vapor phase coolant, a first connection member coupled to the at least one heat pipe, a first conduit coupled to the first connection member, the first conduit extending vertically to enable at least the vapor phase coolant to travel through the first conduit, and a heat exchanger located above and coupled to the first conduit, where the heat exchanger is to transfer the vapor phase coolant to the liquid coolant.

Abstract: An air cooled condenser (ACC) system is described having a first street having at least one air cooled condenser module and a second street having at least one air cooled condenser module. The system employs a steam inlet conduit provides steam to the first and second streets. The air cooled condenser system has a standard vacuum system for providing suction pressure to the first and second street. The air cooled condenser system also has an auxiliary vacuum system that provides suction pressure to the first and second streets.

Abstract: According to one embodiment, a semiconductor module has a substrate, two nonvolatile memories disposed on a first surface of the substrate, a controller to control the nonvolatile memories, disposed on the first surface of the substrate and between the two nonvolatile memories, and a plurality of terminals that are electrically connected to the two nonvolatile memories and to the controller, disposed on a second surface of the substrate.

Abstract: A thermal management system (201) is provided which includes a housing (203) equipped with a first set of apertures S1={a1, ai} (213), a second set of apertures S2={b1, . . . bj} (215) and a set of entrainment features S3={c1, Ck} (217), wherein i, j, k?1, and wherein, for any pair of adjacent apertures Pa={am, bn}, wherein am ? S1 and m ? I={1, . . . , i}, and wherein bn ? S2 and n ? J={1, . . . , j}, there is at least one entrainment feature cp ? S3 which is disposed between aperture am and aperture bn, wherein p ? K={1, . . . , k} . The thermal management system also includes a synthetic jet actuator disposed in said housing which is in fluidic communication with the sets of apertures S1 and S2 and which operates to create a synthetic jet at each aperture dr ? { S1, S2}, wherein r ? I?J.

Abstract: A phase-change chamber, a method for fabricating a phase-change chamber and a heat dissipation apparatus for electronic device cooling are disclosed. The phase-change chamber includes: a phase-change medium capable of transitioning between a plurality of phases; a first surface for transitioning a portion of the phase-change medium from a first phase into a second phase; a second surface for transitioning a portion of the phase-change medium from the second phase into the first phase; and at least one supporting member along the circumference of the first surface and the second surface for separating and enclosing the first surface and the second surface. The first surface is patterned on a first plate and includes regions of high and low affinity to the phase-change medium. The second surface is received on a second plate and comprises low affinity to the phase-change medium.

Abstract: A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.

Abstract: An apparatus comprising a base layer, a distribution of separated micro-nucleation sites thereon. The apparatus also includes a distribution nanostructures located on the base layer, each of the micro-nucleation sites being adjacent to some of the nanostructures. Each of the micro-nucleation sites has a hydrophilic surface and the distribution of nanostructures form a superhydrophobic surface.

Abstract: A method of manufacturing a heat dissipating device includes steps of providing a base, wherein the base includes a clamping portion, a supporting portion and two side portions, the clamping portion is arc-shaped, a first recess structure is formed on an outer surface toward an inner surface of each side portion, the two side portions connect the clamping portion and the supporting portion, and an accommodating space is formed between the clamping portion, the supporting portion and the two side portions; disposing a first end of a heat pipe in the accommodating space, wherein the first end is supported on the supporting portion; and punching the clamping portion toward the supporting portion such that the clamping portion cooperates with the supporting portion to clamp the first end in a tight-fitting manner, wherein the clamping portion is capable of deforming through the first recess structure during punch processing.

Abstract: An apparatus. The apparatus comprises a distribution of microstructures on an area of a surface, each of the microstructures having one or more sloping sides. The apparatus comprises a distribution of nanostructures being located on the one or more sloping sides. The distribution of microstructures on the area of the surface is configured to nucleate and grow droplets of liquid from a gas. The distribution of nanostructures forms a superhydrophobic surface for the liquid.

Abstract: A heat sink for a processor includes: a main heat exchange zone that bears in contact with a processor; at least one peripheral heat exchange zone that bears in contact with a cooling source, and at least one heat pipe connecting the main heat exchange zone with the peripheral heat exchange zone, the heat pipe containing a cooling fluid.

Abstract: The present invention relates to a heat exchange system comprising:—a single apparatus (N) having an area immersed in a fluid bath (N2) and a free space (N1) at the head in which a vapour phase is accumulated,—at least one interspace (P) open at both ends, situated inside said apparatus and completely immersed in the fluid bath,—one or more heat exchange surface (s) (6, 7, 8, 9, 10, 11), said system characterized in that it contains all the heat exchange surfaces in a single apparatus and said surfaces are completely immersed in the fluid bath and are fluidly connected to the hot and cold sources, external to said system, through flows of matter. At least one of the heat exchange surfaces (6, 7, 8) is situated inside the interspace and at least another surface (9, 10, 11) is situated in the space between said interspace and the walls of the apparatus.

Abstract: Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.