Hermetic Sealed Envelope Type Patents (Class 174/50.5)
  • Publication number: 20100051308
    Abstract: An in-floor receptacle or electrical conduit box with a compartment divider removably attached to a gang-plate divider, a gang-plate divider removably attached to a gang-unit holder, at least one gang-unit holder removably attached to the inside of the box, and at least one knockout located on each side or floor of the box. The in-floor electrical conduit box enables the connection of permanent cables, wires or cords to temporary cables, wires or cords. The in-floor electrical conduit box further comprises a lid with at least one removable door whereby the removal of the door permits cable access to the box while the box is still covered.
    Type: Application
    Filed: August 28, 2008
    Publication date: March 4, 2010
    Inventors: David Hansen, John Macaluso
  • Publication number: 20100012472
    Abstract: A waterproof electronic device includes an upper shell and a lower shell configured for detachably and hermetically assembling with the upper shell. At least one of the upper shell and lower shell comprising a rubber layer disposed thereon to hermetically assemble with each other. The invention further provides a method for making the waterproof electronic device.
    Type: Application
    Filed: May 19, 2009
    Publication date: January 21, 2010
    Applicant: FIH (HONG KONG) LIMITED
    Inventors: MU-WEN YANG, CHIH-CHIANG CHANG
  • Publication number: 20100012343
    Abstract: The present invention provides a building integrated photovoltaic (BIPV) junction box having a housing and a connection assembly disposed within the housing. The housing includes first sidewalls positioned opposite to each other and second sidewalls adjacent and connecting to the two first sidewalls. Additionally, an opening is provided opposite a bottom wall, with the bottom wall connecting the first and second sidewalls. The second sidewalls include extensions that extend beyond a height of the first sidewalls, so that an edge of a solar cell panel is sandwiched between the extensions when the junction box is mounted on the edge of the solar cell panel. The BIPV junction box of the present invention may be applied to the connection of BIPV solar cell modules.
    Type: Application
    Filed: July 15, 2009
    Publication date: January 21, 2010
    Inventors: Wanqin Ji, Hui-Meng Wu, Dong Wang
  • Publication number: 20100006315
    Abstract: There is provided an electronic component package, in which electronic component element is mounted on a metal base, the electronic component element is covered by placing a metal cap over the metal base, and the metal base and the metal cap are joined by resistance welding to hermetically seal the electronic component element. With this electronic component package, a protrusion is provided to a portion of the metal base that comes into contact with the metal cap, and a projection tip of the protrusion has a flat face. Alternatively, the protrusion has a cross sectional shape that combines an arc member with the top side of an isosceles trapezoid.
    Type: Application
    Filed: October 19, 2007
    Publication date: January 14, 2010
    Applicant: DAISHINKU CORPORATION
    Inventors: Kazuhiko Kumatani, Yoshihisa Takano, Naotoshi Nakamura, Mototsugu Ogasa, Takashi Nakamura, Minoru Iizuka
  • Publication number: 20100006314
    Abstract: Disclosed herein is a waterproof case for protecting electronic devices. The waterproof case includes a flexible waterproof bag attached to a rigid lid that can be opened to allow electronic devices to pass into the bag. When closed, the lid forms a watertight seal that protects the inside of the bag from ingress of water. The lid can include a pass-through jack which allows a user to connect an electronic device, such as an audio device, to an output through the lid. The case may also be incorporated into a flexible attachment system, such as an armband or swimbelt. Methods of connecting an electronic device to an electronic output, such as an audio output, through a waterproof case are also provided.
    Type: Application
    Filed: August 6, 2008
    Publication date: January 14, 2010
    Applicant: H2O Audio, Inc.
    Inventors: Ron Wilson, II, Carl Pettersen, Kristian Rauhala, Pete Dirksing, Cory McCluskey, Jim Pena
  • Publication number: 20100006313
    Abstract: The present invention reduces the amount of lead used in a display device and improves its long-term moisture resistance. This display device includes: a panel (1b) provided with a hole (11) formed therein; a phosphate glass member (13); and a tube (12) mounted on the panel (1b) via the glass member (13) so as to cover the hole (11). The glass member (13) is bonded to at least a partial area of the inner wall surface of the tube (12) and to a partial area of the panel (1b), so that the entire periphery of the end face of the tube (12) located on the side of the hole (13) is in contact with the panel (1b).
    Type: Application
    Filed: November 10, 2006
    Publication date: January 14, 2010
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Yoshiaki Kai, Shinya Hasegawa
  • Publication number: 20090301749
    Abstract: A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap (1, 30) includes a base member (2), a first plating layer (3, 31) that is formed on the surface of the base member, and a second plating layer (4, 32) that is formed on the surface of the first plating layer and is less oxidized than the first plating layer, wherein a part of the second plating layer in an area (S1, S5) inside an area (S2, S6) to which an electronic component accommodation member is joined is removed so that the surface of the first plating layer is exposed, and the surface of the first plating layer that is exposed in the area from which the second plating layer is removed is oxidized.
    Type: Application
    Filed: February 13, 2007
    Publication date: December 10, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Tsuyoshi Tanaka, Masaharu Yamamoto
  • Publication number: 20090283290
    Abstract: An object is to sufficiently keep the airtightness in a vacuum container even when it is made smaller. A photomultiplier tube 1 comprises a flat sheet-like lower substrate 4, a casing-like frame 3b erected on the lower substrate 4, an upper substrate 2 including a frame 3a airtightly joined to an opening part of the frame 3b while holding a low-melting metal therebetween, and a frame-like projection 25b arranged in parallel with the frame 3b on the inner side of the frame 3b on the lower substrate 4.
    Type: Application
    Filed: June 28, 2006
    Publication date: November 19, 2009
    Inventors: Hideki Shimoi, Hiroyuki Sugiyama, Hiroyuki Kyushima
  • Patent number: 7616448
    Abstract: An improved overmolded electronic assembly includes a backplate provided with a recessed edge, a circuit substrate on the backplate, at least one electronic component mounted on the circuit substrate, conductive traces on the circuit substrate which together with the electronic component(s) defines a circuit device, an electrical connector, and an overmold body that has peripheral edges that wrap around sides of the backplate and onto the edge recesses. The resulting over wrap feature eliminates delamination problems that would otherwise occur during thermal cycling of the electronic assembly, improves corrosion resistance at connector-to-backplate interfaces, and enhances securement of the printed circuit board assembly and electrical connector to the assembly.
    Type: Grant
    Filed: September 14, 2007
    Date of Patent: November 10, 2009
    Assignee: Delphi Technologies, Inc.
    Inventors: Thomas A. Degenkolb, Scott D. Brandenburg, Larry M. Mandel, Kin Yean Chow, Ching Meng Fang, Sim Ying Yong
  • Publication number: 20090260844
    Abstract: A waterproof casing is adapted for enclosing an electronic device therein. The electronic device includes at least one operating portion. The waterproof casing includes a casing unit and at least one pliable transparent film. The casing unit includes first and second casing halves that are coupled together and that cooperatively define an internal receiving space for accommodating the electronic device. The casing unit is formed with at least one opening that corresponds in size and position to the at least one operating portion of the electronic device. The film corresponds in number to the opening, and is connected to a peripheral edge of the opening. The waterproof casing allows a user to press the operating portion through the film when operating the electronic device under water.
    Type: Application
    Filed: January 27, 2009
    Publication date: October 22, 2009
    Applicant: WISTRON CORPORATION
    Inventor: Tien-Chung Tseng
  • Publication number: 20090260845
    Abstract: The present invention reduces the amount of lead used in a display device and improves its long-term moisture resistance. This display device includes: a panel (1b) provided with a hole (11) formed therein; a phosphate glass member (13); and a tube (12) mounted on the panel (1b) via the glass member (13) so as to cover the hole (11). The glass member (13) is bonded to at least a partial area of the inner wall surface of the tube (12) and to a partial area of the panel (1b), so that the entire periphery of the end face of the tube (12) located on the side of the hole (13) is in contact with the panel (1b).
    Type: Application
    Filed: June 30, 2009
    Publication date: October 22, 2009
    Applicant: PANASONIC CORPORATION
    Inventors: Yoshiaki KAI, Shinya HASEGAWA
  • Publication number: 20090236114
    Abstract: An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.
    Type: Application
    Filed: March 6, 2009
    Publication date: September 24, 2009
    Inventors: Susumu Obata, Michinobu Inoue, Takeshi Miyagi
  • Publication number: 20090223695
    Abstract: A storage case (300) includes a case body (320) formed by joining a plurality of members (301, 302) with a joint structure (303a, 303b, 304) an opening (16) formed in the case body (320), a closure member (14) capable of closing the opening (16), a seal structure (17) provided between the case body (320) and the closure member (14), and a foreign-matter guide portion (10) provided on an outer surface of the case body (320), aside from the joint structure (303a, 303b, 304), such that the foreign-matter guide portion is located above the seal structure in the vertical direction of the storage case.
    Type: Application
    Filed: April 18, 2007
    Publication date: September 10, 2009
    Applicant: Toyota Judosha Kabushiki Kaisha
    Inventors: Yukari Inoue, Hitoshi Imura
  • Patent number: 7582969
    Abstract: A hermetic interconnect is fabricated on a substrate by forming a stud of conductive material over a metallization layer, and then overcoating the stud of conductive material and the metallization layer with a layer of compliant dielectric material. In one embodiment, the layer of compliant dielectric material is low Young's modulus silicon dioxide, formed by sputter-deposition at low temperature, in a low pressure argon atmosphere. The interconnect may provide electrical access to a micromechanical device, which is enclosed with a capping wafer hermetically sealed to the substrate with an AuInx alloy bond.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: September 1, 2009
    Assignee: Innovative Micro Technology
    Inventors: Gregory A. Carlson, Jeffery F. Summers
  • Publication number: 20090211775
    Abstract: A waterproof electronic appliance has a casing including a bottom panel, a top panel, and a side wall which is divided into an upright wall adjacent to the bottom panel and a vertical wall adjacent to the top panel. A first double-sided adhesive tape is adhered on a top end surface of the upright wall. A second double-sided adhesive tape is adhered on a bottom end surface of the vertical wall. A cable including signal lines and a tube covering the signal lines, extends from inside to outside of the casing through the upright wall and the vertical wall. The first and second double-sided adhesive tapes adhere to an outer surface of the tube sandwiched between the upright wall and the vertical wall, and the adhesive tapes adhere to each other in an area adjacent to the sandwiched tube.
    Type: Application
    Filed: January 29, 2009
    Publication date: August 27, 2009
    Applicant: FUJITSU LIMITED
    Inventors: Shigeru YAMAGUCHI, Shingo Yamaguchi
  • Publication number: 20090205849
    Abstract: A hermetic envelope includes a first plate, a second plate, and a frame provided between the first plate and the second plate to form an interior space. A first bonding part is provided between the frame and the first plate to bond the frame and the first plate to each other, and a first abutting part is provided between the frame and the first plate, and positioned closer to the interior space than the first bonding part. A second bonding part is provided between the frame and the second plate to bond the frame and the second plate to each other, and a second abutting part is provided between the frame and the second plate and positioned closer to the interior space than the second bonding part. The second bonding part is positioned closer to the interior space than the first bonding part.
    Type: Application
    Filed: February 17, 2009
    Publication date: August 20, 2009
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Akihiro Kimura, Masateru Yasuhara, Shigeto Kamata
  • Publication number: 20090200489
    Abstract: The invention relates to a hermetically sealed housing with an electrical feed-in. A standard printed circuit board 120 seals against housing 100. The sealing is carried out on a flat side of printed circuit board 120. The printed circuit board contains electrically conducting tracks (130, 132, 134, 136) which make the electrical connection. By making the electrical connection so that at least part of it lies parallel with the surface of the printed circuit board, no gas can leak through the printed circuit board along the conductor. The inside of the hermetically sealed space 102 may be a gas-filled space, but may also be a vacuum space, for example.
    Type: Application
    Filed: October 27, 2006
    Publication date: August 13, 2009
    Applicant: FEI COMPANY
    Inventors: Hendrik Gezinus Tappel, Cornelis Sander Kooijman
  • Patent number: 7561435
    Abstract: There is proposed an engine controller which is excellent in reliability in that the outer peripheral edge face (cut surface) of covering member can be prevented from being rusted while securing the water-proofness and dust-proofness. This engine controller comprises a circuit board (12) for controlling an engine; an aluminum die-cast main case body (20) having an open top; and a covering member (30) made of an iron-based metal plate which is preliminarily applied with surface treatment, the covering member (30) being fixedly clamped to the main case body (20) by means of a setscrew (40) so as to hermetically close the open top of the main case body (20); wherein the main case body (20) is provided thereon with a pedestal (24) or groove (25) on which a liquid or jellied water-proofing adhesive (50) is coated or filled (piled), thereby enabling entire outer peripheral edge face (33a) of the covering member (30) to be covered by the water-proofing adhesive (50).
    Type: Grant
    Filed: June 26, 2007
    Date of Patent: July 14, 2009
    Assignee: Hitachi, Ltd.
    Inventors: Masaru Kamoshida, Masahiro Sasaki, Takeshi Igarashi, Masahiko Asano
  • Publication number: 20090151972
    Abstract: A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld material is sealed to a package base 405 containing integral device 445 then cold welded with an external force mechanism to compress and flow cold seal preform material 435 creating a hermetic peripheral seal in an inert or vacuum atmosphere. Arrays of devices can be sealed with individual caps or arrays of caps which are interconnected.
    Type: Application
    Filed: July 24, 2008
    Publication date: June 18, 2009
    Applicant: Stellar MicroDevices, Inc.
    Inventor: Curtis Nathan Potter
  • Publication number: 20090151973
    Abstract: A mobile device has a push-button type operation unit at a side surface of a body case. The body case has a dual-partitioned structure of a first case and a second case. The first case includes a main portion having a plane substantially parallel to a partitioning surface of the cases, and a side wall extending in a direction substantially orthogonal to the main portion from four side ends of the main portion. The side wall and the second case are separably coupled. A waterproof rubber is attached on an inner side of the main portion and the side wall of the first case. An electronic circuit substrate mounted with a switch corresponding to the operation unit is at least accommodated on an inner side of the waterproof rubber. The waterproof rubber includes a sandwiching portion inserted to a bonding site of the first case and the second case, and a side wall interposed between the operation unit and the switch.
    Type: Application
    Filed: December 12, 2008
    Publication date: June 18, 2009
    Applicant: OMRON CORPORATION
    Inventors: Akihiro Fujimoto, Norihisa Kataya
  • Publication number: 20090139740
    Abstract: A high voltage wiring system for an electric powertrain is disclosed. The system includes a power conversion unit sealed in a first enclosure. The system also includes at least one second enclosure configured to be sealed and having at least one cable disposed therein. The disclosed system further includes a plurality of wiring termination compartments configured to provide a plurality of electrical termination points. The plurality of wiring termination compartments are separately encased in a material configured to provide a sealed barrier between an outside environment and the plurality of electrical termination points. The disclosed system further includes a source of at least one pressurized gas configured to substantially prevent the ingress of moisture into the first enclosure, the at least one second enclosure, and the plurality of wiring termination compartments.
    Type: Application
    Filed: November 30, 2007
    Publication date: June 4, 2009
    Inventors: Robert Wayne Lindsey, Robert Roy Sychra
  • Publication number: 20090126967
    Abstract: A transmission controller includes a printed circuit board that mechanically supports and electrically connects circuitry of the transmission controller to a vehicle bus. The printed circuit board includes a lower layer of carbon composite and an upper layer of high temperature substrate. A flex circuit is laminated on the printed circuit board to provide an interconnect between the circuitry of the transmission controller and the vehicle bus. The circuitry is encased within a cover. The cover can formed by an overmolding process that encapsulates the circuitry on the upper layer of high temperature substrate or by lamination. The transmission controller can then be attached at a desired location within or on an outer surface of a transmission.
    Type: Application
    Filed: November 17, 2008
    Publication date: May 21, 2009
    Applicant: CONTINENTAL AUTOMOTIVE SYSTEMS US, INC.
    Inventor: Charles A. Spellman
  • Publication number: 20090122492
    Abstract: The invention relates to a junction box for solar panels, with which the heat produced in the protecting diodes, MOSFETs or other corresponding power semiconductors of a solar panel can be reliably dissipated. In the junction box, the electronic components are pressed against the housing (1) or into recesses (3) corresponding to the geometry of the components by means of pressure elements, and electrical isolation, preferably a thermally conductive silicone rubber, is provided between the housing (1) and the components.
    Type: Application
    Filed: April 26, 2007
    Publication date: May 14, 2009
    Applicant: FPE Fischer GmbH
    Inventors: Ulrich Fischer, Roland Pfeffer, Bernd Willer, Charles Hsu
  • Publication number: 20090107692
    Abstract: According to an aspect of the present invention, there is provided a method for manufacturing a MEMS package, the method including: forming a MEMS device on a substrate; forming a sacrificing member on the MEMS device; forming a cavity formation film on the sacrificing member; forming a through hole in the cavity formation film at a portion other than above the MEMS device; removing the sacrificing member through the through hole, thereby forming a cavity around the MEMS device; and forming a seal layer on the cavity formation film to block the through hole and to seal the cavity, by performing a film forming process in which a seal layer material is straightly applied in a direction of perpendicular to a surface of the substrate.
    Type: Application
    Filed: October 16, 2008
    Publication date: April 30, 2009
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Yoshiaki SHIMOOKA
  • Publication number: 20090101384
    Abstract: With a waterproof structure for the space between a first case and a diaphragm doubling as a display panel provided facing the first case, a first resilient member is integrally formed at a surface of the diaphragm facing the first case, and the first resilient member is press-fitted into a groove formed in a surface of the first case facing the diaphragm side.
    Type: Application
    Filed: October 23, 2008
    Publication date: April 23, 2009
    Applicant: Casio Hitachi Mobile Communications Co., Ltd.
    Inventors: Yasuhiko Kawasaki, Yutaka Koyama
  • Publication number: 20090101383
    Abstract: A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which contains an inorganic material, is provided on a principal surface of the substrate, covers the micromachine through a hollow section containing a gaseous body therein, and is provided with opening shape sections allowing the hollow section to communicate with the outside, an organic sealing film which contains an organic material, is formed on the inner inorganic sealing film, and blocks up the opening shape sections, and an outer inorganic sealing film which contains an inorganic material with lower moisture permeability than the organic material, is formed on the organic sealing film, and covers the organic sealing film.
    Type: Application
    Filed: October 21, 2008
    Publication date: April 23, 2009
    Inventors: Takeshi MIYAGI, Michinobu Inoue, Susumu Obata, Yoshiaki Sugizaki
  • Publication number: 20090090531
    Abstract: A micromechanical component having a substrate, having a cavity and having a cap that bounds the cavity. The cap has an access opening to the cavity. The cap has a diaphragm for closing the access opening.
    Type: Application
    Filed: November 30, 2006
    Publication date: April 9, 2009
    Inventors: Volker Schmitz, Axel Grosse
  • Publication number: 20090090532
    Abstract: A housing structure includes an upper housing, a lower housing, a first waterproof member and a second waterproof member. The upper housing has a first connecting portion, and the lower housing has a second connecting portion. The upper housing and the lower housing are connected to each other by the first connecting portion and the second connecting portion. The first waterproof member is disposed between the first connecting portion and the second connecting portion. The second waterproof member is disposed between the first connecting portion and the second connecting portion. Wherein, a distance is formed between the first waterproof member and the second waterproof member.
    Type: Application
    Filed: September 17, 2008
    Publication date: April 9, 2009
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Chin-Chung Lai, Mu-Tsai Chang
  • Patent number: 7511967
    Abstract: An enclosure for compact computer boards is described that allows a user to easily configure, or reconfigure, a microserver stack using an interchangeable common bus as a data and power backbone. One application requiring robust and rigorous design constraints is use within an aircraft.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: March 31, 2009
    Assignee: United Technologies Corporation
    Inventor: David C. Loda
  • Publication number: 20090078441
    Abstract: The present invention is directed to a sealing member for establishing a water resistant seal between two elements which includes a resilient gasket having opposed gasket surfaces for engagement between the two elements; and a water resistant coating applied to the gasket. The water resistant coating providing releasable adhesive sealing contact with at least one of the elements. The present invention is also directed to a method of making a gasket seal for an electrical box.
    Type: Application
    Filed: September 16, 2008
    Publication date: March 26, 2009
    Applicant: Thomas & Betts International, Inc.
    Inventor: Mark R. Drane
  • Publication number: 20090010629
    Abstract: The method and apparatus for a submersible electronic device provides an electronic device such as, for example, a digital camera (100), PDA, computer, or the like, which may comprise a user interface, a body (101), and an electronic assembly disposed within the body, the device being characterized in that the housing is completely filled with a perfluorocarbon (PFC) liquid, or a hydrofluoroether (HFE), or a perfluoropolyether (PFPE), or an aqueous coolant composition comprising a mixture of an alkylene glycol (such as propylene glycol), de-ionized water, and a corrosion inhibitor (such as benzotriazole). A method of introducing any of the aforementioned liquids into the device includes submersion into the liquid inside a vacuum chamber (150) so that air pockets are removed to provide total liquid dispersion into device cavities, and the like. The device is then sealed and removed from the chamber (150).
    Type: Application
    Filed: February 28, 2007
    Publication date: January 8, 2009
    Inventor: David J. Vondracek
  • Publication number: 20080271908
    Abstract: Cap for airtight sealing (1) that not only suppresses any deterioration of the properties of electronic parts (20) to thereby reduce material costs but also enables use of Pb-free solders, and that is capable of suppressing any airtightness deterioration. This cap for airtight sealing comprises low thermal expansion layer (2); Ni—Co alloy layer (3) superimposed on the surface of the low thermal expansion layer and composed mainly of Ni wherein a diffusion acceleration material is contained; Ni layer (4) superimposed on the surface of the Ni—Co alloy layer; and solder layer (5) superimposed on the surface of the Ni layer at regions for bonding of electronic part accommodation member (10) and composed mainly of Sn. The Ni layer has the functions of not only suppressing any diffusion of the Ni—Co alloy layer into the solder layer at about 235° C. (first temperature) but also at bonding of the solder layer with the electronic part accommodation member at about 300° to about 320° C.
    Type: Application
    Filed: September 26, 2005
    Publication date: November 6, 2008
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masaharu Yamamoto, Kenji Takano, Junji Hira
  • Publication number: 20080264666
    Abstract: An electrical component box which can be provided under a maintenance opening in an engine compartment on a water vehicle, can include a box body provided with an electrical unit and a cover member. The box body can be attached to a bulkhead so that a mounting surface for an electrical unit extends generally vertically. Engaging frames can be provided on the upper face of the box body. Also, engaging clamps can be provided on the upper side of the cover member to be engaged with the engaging frames by one-touch operation. A bottom cover can be provided under the box body to cover the bottom side of the electrical unit and the upper side, both lateral sides and the front side of the electrical unit can be covered by the cover member.
    Type: Application
    Filed: December 3, 2007
    Publication date: October 30, 2008
    Applicant: Yamaha Marine Kabushiki Kaisha
    Inventor: Naoki Harada
  • Publication number: 20080223598
    Abstract: A communications enclosure apparatus for use in a power line communications network, including a box, the box including a connection mechanism to connect the box to a standard interface of an electricity device, and the box including a water proofing system to provide the communications enclosure with all environment functionality.
    Type: Application
    Filed: March 12, 2008
    Publication date: September 18, 2008
    Inventor: Michael Burd
  • Publication number: 20080202788
    Abstract: A capsule housing has at least three housing sections, extends along an axis, and has a substantially tubular-shaped frame. The housing sections are connected together on the front side thereof and they surround a receiving chamber on the inside. The inside has an electric circuit device. The receiving chamber has a smaller transversal cross-section than the respective cross-section in the region of the second and the third housing section in the region of the first housing section which connects the second and the third housing sections.
    Type: Application
    Filed: June 23, 2006
    Publication date: August 28, 2008
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Andrzej Nowakowski
  • Publication number: 20080196918
    Abstract: An electrical device having a housing and moisture-sensitive electrical structural units situated in the housing, having a pressure compensation element situated in a housing part, which avoids, preferably prevents, the ingress of moisture, the pressure compensation element including a diaphragm which is permeable to gas, having an impact protection element situated in front of the diaphragm, which at least avoids spraying a liquid directly onto the diaphragm, wherein the impact protection element is in one piece part of the housing part.
    Type: Application
    Filed: October 11, 2005
    Publication date: August 21, 2008
    Inventors: Peter Zadach, Jochen Kuhn
  • Publication number: 20080196920
    Abstract: A stepping switch S has a housing filled with a dielectric liquid and devices for compensating for thermally related volume variations of the liquid. A bellows/compensator switch K is used to take up the volume variation of the dielectric liquid. The compensation device forms a compact structural component devoid of an additional conduit and mounted directly on the switch. The inventive expansion tank configuration makes it possible to integrate pressure-relieving devices and to place the monitoring units of the stepping switch in a space-saving manner.
    Type: Application
    Filed: July 14, 2006
    Publication date: August 21, 2008
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Jorg Findeisen
  • Publication number: 20080196919
    Abstract: The invention relates to electrical sensors, which are tight against longitudinal water, and to a process for a simple and cost efficient manufacture, with a tightly closed housing, a sensor element, at least one cable leading out of the housing, wherein the electrical conductors of the cable in the housing comprise a massive cross section without a cavity at least in one longitudinal section, a conductor seal seals the massive cross section against the lead insulation, a lead seal seals the lead insulation against the jacket of the cable, and against all other jackets, and a jacket seal seals the cable jacket against the housing.
    Type: Application
    Filed: May 29, 2007
    Publication date: August 21, 2008
    Inventor: Klaus Manfred SteinIch
  • Patent number: 7397003
    Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: July 8, 2008
    Assignee: Weightech, Inc.
    Inventors: Timothy R. Cox, Ronald T. Pagan, Stephen S. Newell, Steve D. Tull
  • Publication number: 20080156511
    Abstract: A control unit for a vehicle component such as a transmission ideally has a reduced production cost. The aim is achieved by transferring parts from a rigid circuit board to a flexible circuit board. The flexible circuit board is guided through a housing that accommodates the rigid circuit board and a portion of the flexible circuit board.
    Type: Application
    Filed: January 30, 2006
    Publication date: July 3, 2008
    Applicant: SIEMENS VDO AUTOMOTIVE AG
    Inventors: Gerald Hauer, Josef Loibl, Thomas Rohrl, Mike Vogel
  • Patent number: 7372701
    Abstract: A work machine includes a bulkhead separating an operator cab from an engine compartment. An electronic module includes a cantilever arranged mounting flange mounted to the bulkhead. The electronic module includes a rigid and thermally conductive frame. An electronics board is mounted to one side of the frame, and a power board is mounted to an opposite side of the frame. The electronics board carries a plurality of electronic components, and the power board carries a plurality of replaceable power elements. Each power element is a fuse, relay and/or circuit breaker. A housing encloses the electronics board and the power board. The housing includes an access cover to the power board.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: May 13, 2008
    Assignee: Deere & Company
    Inventors: Jon Thomas Jacobson, David Scott Gordon, Jason Robert Weishaar, Michael Andrew Hajicek, Michael Ray Schlichtmann
  • Publication number: 20080105450
    Abstract: An electrical junction box can be used as both a watertight type and a nonwatertight type by improving a fitting structure between a cover and a casing and restricting the cover and casing from rattling even in the nonwatertight configuration in which a rubber packing is not mounted on the box. An electrical junction box that can be used as a watertight type and a nonwatertight type includes a casing and a cover. Terminals connected to ends of electrical wires may be contained in the casing. The electrical wires may be drawn out from a bottom of the casing. An electrical element may be detachably connected to the casing through an upper opening in the casing to be coupled to the terminals. The cover is joined to the casing. A pair of clearance-filling ribs, which have recessed configuration in section, project from one side of a peripheral wall of the cover toward the casing. The casing is provided on an outer surface with fitting ribs adapted to engage the clearance-filling ribs.
    Type: Application
    Filed: November 5, 2007
    Publication date: May 8, 2008
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Seiji Ooi, Eiji Higuchi
  • Publication number: 20080041607
    Abstract: The microcavity (6) is delineated by a cover, comprising a first layer (4), in which at least one hole (5) is formed. A second layer hermetically seals the microcavity. A third layer (9) is arranged between the first (4) and the second layer. An additional microcavity (11), communicating with the hole (5), is arranged between the first (4) and the third (9) layer. At least one additional hole, adjacent to the additional microcavity (11), formed in the third layer (9) and offset with respect to the hole (5), is sealed by the second layer, after sacrificial layers have been removed through the additional hole. The microcomponent comprises at least one mechanically stressed layer arranged above the first layer (4).
    Type: Application
    Filed: December 14, 2004
    Publication date: February 21, 2008
    Inventor: Philippe Robert
  • Patent number: 7279634
    Abstract: A wire structure for a power supply. It includes a power supply having a casing on which a wire structure is transfixed out for outputting the power source. The wire structure is composed of a cluster of connection wires, a motherboard power cord, and at least one power cord set. The cluster of connection wires is provided with a plurality of connection seats for connecting with the power cord set, and the other end of the power cord set is provided with a power connector corresponding to future expanded equipments and elements for various different specifications.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: October 9, 2007
    Assignee: Andyson International Co., Ltd.
    Inventor: Hsing-Ting Chang
  • Patent number: 7263401
    Abstract: An implantable medical device (IMD) including a nonhermetic battery is described. The IMD includes components and a power source module that includes the nonhermetic battery. The IMD also includes a barrier to substantially impede movement of substances from the nonhermetic battery to the components. The barrier may include a hermetic feedthrough, a gel, a polymer, or a solid electrolyte within the nonhermetic battery, and a seal member. The barrier may also be a material that encapsulates the nonhermetic battery and a getter within the IMD. In some embodiments, the IMD comprises a modular IMD including an interconnect member. In that case, the barrier may include a material that fills at least a portion of a void defined by the interconnect member. A length and a cross-sectional area of the interconnect member may also act as a barrier.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: August 28, 2007
    Assignee: Medtronic, Inc.
    Inventors: Erik R. Scott, Carl D. Wahlstrand, Robert M. Skime, Craig L. Schmidt
  • Patent number: 7226312
    Abstract: A method and apparatus for electrically interfacing between two or more distinct environments. The method and apparatus are directed to an electrical feedthru with one or more electrical transmission lines coated with one or more thin dielectric layers of material to insulate the transmission lines from a feedthru body. The dielectric layers may include a diamond-like carbon coating, which electrically insulates, but also thermally conducts. The use of thin dielectric layers facilitates smaller, more efficient electrical feedthrus. Therefore, the electrical feedthru may be used, for example, with MEMS devices. The electrical feedthru is not limited to any particular geometry, it may be adapted to fit between any two environments.
    Type: Grant
    Filed: April 4, 2006
    Date of Patent: June 5, 2007
    Assignee: Schlumberger Technology Corporation
    Inventor: Jagdish Shah
  • Patent number: 7166800
    Abstract: A macroencapsulation container having in combination an inner container member with an inner lid member and an inner body member, and an outer container member with an outer lid member and an outer body member, the inner container member being composed of a thermoplastic polymer material that can be thermo-welded or thermo-bonded to itself by melting. The outer container is composed of a metal. At least one electric resistance wire is embedded in or mounted onto the inner lid member along the area of contact with the inner body member, such that the inner lid member may be thermo-bonded to the inner body member to create an integral, one-piece inner container member encapsulating any material or containers disposed within.
    Type: Grant
    Filed: October 21, 2004
    Date of Patent: January 23, 2007
    Inventors: Mark D. Shaw, J. Tad Heyman, Laurence M. Bierce
  • Patent number: 7141739
    Abstract: A sealing device effects a seal between a first member and a second member of a hermetic chamber. The sealing device includes a body having an elongated shape forming a closed loop. The body of the sealing device includes magnetic material and further includes a) a first and a second sealing portions, and b) at least one internal compartment formed by walls undulatingly extending between the first and second sealing portions. A sealing apparatus includes a first member of a hermetic chamber, a second member of the hermetic chamber, and the above sealing device.
    Type: Grant
    Filed: April 30, 2004
    Date of Patent: November 28, 2006
    Inventors: Yuen-Sheng Hua, Chih-Shen Yang, Min-Jhe Chiang
  • Patent number: 7097501
    Abstract: A method and apparatus for electrically interfacing between two or more distinct environments. The method and apparatus are directed to an electrical feedthru with one or more electrical transmission lines coated with one or more thin dielectric layers of material to insulate the transmission lines from a feedthru body. The dielectric layers may include a diamond-like carbon coating, which electrically insulates, but also thermally conducts. The use of thin dielectric layers facilitates smaller, more efficient electrical feedthrus. Therefore, the electrical feedthru may be used, for example, with MEMS devices. The electrical feedthru is not limited to any particular geometry, it may be adapted to fit between any two environments.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: August 29, 2006
    Assignee: Schlumberger Technology Corporation
    Inventor: Jagdish Shah
  • Patent number: 7002084
    Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: February 21, 2006
    Assignee: WeighTech, Inc.
    Inventors: Timothy R. Cox, Ronald T. Pagan, Stephen S. Newell, Steve D. Tull