Abstract: A lid material is provided which comprises: a core layer composed of an Fe—Ni alloy or an Fe—Ni—Co alloy; a nickel-based (Ni-based) metal layer press- and diffusion-bonded onto the core layer and composed of a Ni-based metal, such as pure Ni, mainly comprising Ni; and a brazing material layer press-bonded onto the Ni-based metal layer. The Ni-based metal layer has a maximum-to-minimum thickness ratio T1/T2 of 1.4 to 15. The lid material is produced by press-bonding a Ni-based metal foil onto a core sheet for formation of the Ni-based metal layer on the core layer, then diffusion-annealing the Ni-based metal layer and the core layer, and press-bonding a brazing material foil onto the Ni-based metal layer with a reduction ratio of 30 to 65%.
Abstract: A lid-member holder is used to define envelopers encapsulating electronic components in production of hollow-package type electronic products. A plurality of lid members are temporarily held by the holder body. The lid members are arranged so as to be consistent with an arrangement of surrounding wall members, which are to be sealed with the lid members in a lump to define the envelopers, and the temporary holding of the lid members by the holder body is realized such that lid members can be separated from the lid members after the surrounding wall members are completely sealed with the lid members, without the lid members being removed from the surrounding wall members.
Type:
Grant
Filed:
July 21, 2003
Date of Patent:
October 18, 2005
Assignee:
NEC Compound Semiconductor Devices, Ltd.
Abstract: A sealing feature for a multiple-piece housing for optoelectronic devices. The housing provides EMI shielding and axial stain suppression for optical fibers coupled to optoelectronic devices retained within the housing. In an exemplary embodiment, the scaling feature includes a corrugated channel having a cross-sectional area that varies along the longitudinal direction of said channel and the channel retains a gasket having a substantially constant cross-sectional area. The corrugated channel, which receives the gasket, includes varying wide and narrow sections. The sealing feature provides for sufficient compression throughout the gasket and a tight, EMI-shielding seal formed between the pieces of the housing.
Type:
Grant
Filed:
March 30, 2004
Date of Patent:
April 19, 2005
Assignee:
Optical Communication Products, Inc.
Inventors:
Blake Mynatt, Dennis King, Jason Yorks, William Kit Dean, Mark Stiehl
Abstract: The current invention provides a optical MEM device and system with an angled lid for hermetically sealing an active MEMS structure. The lid is sealed through an asymmetric seal formed with sealing rings having an asymmetric distribution of solder wetting surfaces which tilts the lid, when the lid and a substrate are soldered together. The asymmetric distribution wetting surfaces can be provided by forming one or more edge features, by patterning portions of the sealing rings or both. Preferably, the lid is transparent to one or more wavelengths of light in a range of 300 to 3000 Angstroms and hermetically seals a grating light valve structure having a plurality of movable ribbon for modulating light through the lid.
Abstract: A hermetically sealed compressor assembly including a housing, an electric motor disposed in the housing, a compression mechanism disposed in the housing and operatively coupled to the motor, a cover attached to the housing and including an integral fitting having at least one clip therein. The clip is structured and arranged such that a conduit to be electrically connected to the compressor assembly enters the cover wherein the clip engages the conduit and prevents the egress of the conduit.
Abstract: A protective, biocompatible coating or encapsulation material protects and insulates a component or device intended to be implanted in living tissue. The coating or encapsulation material comprises a thin layer or layers of alumina, zirconia or other ceramic, less than 25 microns thick, e.g., 5-10 microns thick. The alumina layer(s) may be applied at relatively low temperature. Once applied, the layer provides excellent hermeticity, and prevents electrical leakage. Even though very thin, the alumina layer retains excellent insulating characteristics. In one embodiment, an alumina layer less than about 6 microns thick provides an insulative coating that exhibits less than 10 pA of leakage current over an area 75 mils by 25 mils area while soaking in a saline solution at temperatures up to 80° C. over a three month period.
Type:
Grant
Filed:
September 20, 2002
Date of Patent:
January 18, 2005
Assignee:
Medtronic Minimed, Inc.
Inventors:
Joseph H. Schulman, Joseph Y. Lucisano, Rajiv Shah, Charles L. Byers, Shaun M. Pendo
Abstract: A macroencapsulation container having in combination an inner container member with an inner lid member and an inner body member, and an outer container member with an outer lid member and an outer body member, the inner container member being composed of a thermoplastic polymer material that can be thermo-welded or thermo-bonded to itself by melting. The outer container is composed of a metal. At least one electric resistance wire is embedded in or mounted onto the inner lid member along the area of contact with the inner body member, such that the inner lid member may be thermo-bonded to the inner body member to create an integral, one-piece inner container member encapsulating any material or containers disposed within.
Type:
Grant
Filed:
May 1, 2003
Date of Patent:
January 4, 2005
Assignee:
UltraTech International, Inc.
Inventors:
Mark D. Shaw, J. Tad Heyman, Laurence M. Bierce
Abstract: This invention aims to provide a through terminal capable of maintaining air-tightness stably and an X-ray tube having the through terminal. The through terminal includes a tubular member, a plate member formed of an insulating ceramic material and bonded to an inner periphery of the tubular member in a hermetically sealed state, and pins extending through the plate member so that the portions thereof fitted through the plate member are located inside metallic tubes respectively and bonded to the plate member in a hermetically sealed state through the tubes. The tubular member is provided on an inner periphery thereof with a stepped portion for abutment thereagainst of a plate face of the plate member. The tubular member is formed of an alloy including at least iron, nickel, and cobalt.
Type:
Grant
Filed:
April 29, 2003
Date of Patent:
October 26, 2004
Assignee:
GE Medical Systems Global Technology Company, LLC
Inventors:
Gorur N. Sridhar, Uma Sridharan, Manohar G. Kollegal
Abstract: In a submarine branching unit which comprises in a pressure-tight cylinder, a circuit board, at least one circuit unit and plural vacuum relays each having terminals and wirings, the circuit unit is mounted on one side of the circuit board; the vacuum relays are mounted on the other side of the circuit board; and insulator covers accommodate the respective vacuum relays, terminals and wirings to insulate the vacuum relays from each other. The submarine branching unit further comprises a pair of cables extending out of a cover of the pressure-tight cylinder, which cables are each spiraled and engaged with each other in an interleaved and overlapped fashion.
Abstract: A hermetically sealed current conducting terminal assembly for installation in an opening in the wall of a housing. The terminal assembly includes a current conducting pin assembly comprising a first pin member electrically connected to a second pin member at a conductive core and a first and second seal that electrically isolate the pin assembly from the housing.
Abstract: An electrical device with a pressure proof metal protection casing with at least two casing parts and a shape matching profile clamp connecting the casing parts in the region of an ignition punch safe slot against the force of an internal pressure in the casing.
Type:
Grant
Filed:
December 11, 2000
Date of Patent:
June 22, 2004
Assignee:
Bartec Componenten und Systeme GmbH
Inventors:
Reinhold Barlian, Hans-Jürgen Linström, Josef Bach
Abstract: A hermetically sealed compressor assembly including a housing, an electric motor disposed in the housing, a compression mechanism disposed in the housing and operatively coupled to the motor, a cover attached to the housing and including an integral fitting having at least one clip therein. The clip is structured and arranged such that a conduit to be electrically connected to the compressor assembly enters the cover wherein the clip engages the conduit and prevents the egress of the conduit.
Abstract: The junction box according to the invention includes a housing defined by a lower case and an upper case. A busbar substrate disposed within the housing includes a plurality of busbar substrates. The pier assembly is disposed on at least one of the lower case and one of the plurality of busbar substrates. The pier assembly either accommodates another of the plurality of busbar substrates or supports another of the plurality of busbar substrates. In one embodiment, the pier assembly is disposed on the lower case. In another embodiment, the pier assembly is disposed on one of the busbar substrates. In yet another embodiment, the pier assembly is disposed on the upper case. A method for assembling the junction box according to the invention includes providing a pier assembly for positioning a busbar substrate assembly and disposing a busbar substrate of the busbar substrate assembly in the lower case. The busbar substrate either receives the pier assembly therethrough or is supported on the pier assembly.
Abstract: A hermetically sealed housing for power electronics includes a sheet metal tank, and an aluminum cover. The tank has a surrounding edge which is provided with a plurality of bending lugs, and the edge of the cover has a shoulder at which the bending lug rests, so that the cover is pressed against the edge of the tank and a hermetic sealing is obtained.
Abstract: In order to be able to produce an electrically conductive, positive connection between an end electrode of a gas-filled discharge path and a lead more simply in fabrication-oriented terms, the raised terminal region, which is provided at the end electrode, is provided with a blind hole into which the one end of the lead is introduced and joined thereat to the terminal region with a laser welding.
Abstract: The purpose of the present invention is to provide a cover for a hard disk drive which can prevent the outflow of a damping resin material and the loosening of a screw fixing the cover to a storage-enclosing case.
Abstract: A sealed assembly, includes a telecommunications enclosure having an inner rim with an upwardly facing tilted surface. The tilted surface of the enclosure has a tilt angle between about 30 degrees and about 60 degrees, preferably about 45 degrees. At least one, and preferably two, o-rings are provided. An end cap is shaped to fit the enclosure. The end cap has a groove. The groove has at least two sides for holding the o-ring in a position to contact the tilted surface of the rim, so that the o-ring is compressed between at least three surfaces when the end cap is in place on the enclosure. This construction forms a high-pressure seal between the rim and the end cap. The groove may include a curved surface for trapping the o-ring. Alternatively, the groove may include three flat surfaces instead of a flat surface and a curved surface.
Abstract: In one embodiment of the invention, an enclosure for an electronic component and a plurality of lead traces that connect the electronic component to a circuit board is used. The enclosure has a flexible diaphragm on one side and a sealing flange supporting said diaphragm and providing an attaching surface to fix the enclosure to the circuit board. This enclosure surrounds the electronic component and creates a barrier resistant to the external environment.
Abstract: A hermetically sealed housing for power electronics comprises a tank consisting of sheet metal, and a cover consisting of an aluminum material. The tank has a surrounding edge which is provided with a plurality of bending lugs, and the edge of the cover has a shoulder at which the bending lug rests, so that the cover is pressed against the edge of the tank and a hermetic sealing is obtained.
Abstract: A low-cost, high-performance, reliable micromirror package (300) that replaces the ceramic substrate in conventional packages with a printed circuit board substrate (30) and a molded plastic case (33), and the cover glass with a window (36), preferably an optically clear plastic window. The printed circuit board substrate (30) allows for either external bond pads or flex cable connection of the micromirror package to the projector's motherboard. These packages support flexible snap-in, screw-in, ultrasonic plastic welding, or adhesive welding processes to overcome the high cost seam welding process of many conventional packages.
Abstract: A waterproof enclosure (100) for electrical devices includes a front frame (114), a base plate (116), and a roof assembly (118) attached to a component mounting section (120). Front frame (114) extends from the front of component mounting section (120), and includes doors (122) for protecting electrical components mounted within the component mounting section (120). Roof assembly (118) is attached to the top of front frame (114) and component mounting section (120) for preventing the ingress moisture into front frame (114) and component mounting section (120). Roof assembly (118) includes ventilation channels (124, 126, 128, 130) disposed along the length of caps (132, 134, 136) to increase air flow through the enclosure (100) for cooling the electrical components mounted therein.
Type:
Application
Filed:
December 22, 1999
Publication date:
April 25, 2002
Inventors:
RICHARD J. STENDARDO, WILLIAM W. KERR, MELANIE A. LEWIS, THOMAS F. VRNAK, GENARO FLORES ALBA
Abstract: A weather resistant cabinet for housing electrical equipment includes a one-piece, unitary tubular housing. The tubular housing has two open ends and is preferably formed from aluminum using a deep-drawing process. Two covers are attached to the two open ends of the tubular housing. The two covers include heat sinks and are preferably formed from aluminum using an extruding process. The covers are attached to the tubular housing using either mechanical fasteners and a gasket, or by a dip-brazing process.
Type:
Grant
Filed:
December 30, 1998
Date of Patent:
April 23, 2002
Assignee:
Lucent Technologies
Inventors:
Richard T. LaGrotta, Manuel G. Orellana
Abstract: A solder glass comprising, by weight: about 60 to 67% Sb2O3; about 27 to 32% B2O3; and from greater than 0 to 10% ZnO. The glass has a softening point between 388 and 466° C., depending on the ZnO content. The glass can be employed as a molten seal in electrical devices such as tungsten halogen or metal halide lamps.
Abstract: An environmentally sealed power distribution module is disclosed having a hybrid peripheral seal disposed around a power distribution panel and within an interface between a top housing and a base housing. The peripheral seal is comprised of a traditional o-ring type seal having an open segment and a gel pad type seal located within the open segment, thereby completing the peripheral seal. Plate-like power distribution bus bars are reliably sealed by the gel pad type seal as the bus bars exit the power distribution module. A sealed releasable cover is provided to access fuses and other electrical components of the power distribution module.
Abstract: A waterproof LED display has a housing and a circuit board with a plurality of LEDs provided in the housing. A back seat is formed at a rear portion and a back cover is mounted on the back seat. The back seat forms a first rim defining an opening and has a channel defined around the opening. A gasket is provided in the channel. The back seat and the back cover respectively have complementary teeth to engage with each other to form a zigzag path between them. The back cover further has a plurality of vertical slots defined in a bottom portion thereof and a plurality of flexible conduits respectively received in the vertical slots and extended out from the slots. Wires of the circuit board are extended out along the flexible conduits.
Abstract: A housing for electric appliances and an electric connecting device thereof, the housing is combined as a box from two confronting parts, in combining the confronting parts, a glue passage is formed at the junction zone of the confronting parts by primary positioning; at least an injection port and an outlet in opposition to the injection port are provided on the combining parts to communicate with the glue passage, pressure is exerted to press glue via the injection port into and fully fill in the glue passage on the housing to fast complete assembling and sealing operation of the housing. The box is provided at least on one side thereof with an electric connecting device which is provided with an exposed input terminal and an output terminal.
Abstract: An overmolded electronic module and a method for forming the module. The method entails both overmolding a circuit board and underfilling one or more surface-mount circuit devices physically and electrically connected to the board with solder bump connections. The circuit board is supported on a heatsink that thermally contacts a surface of the device opposite the circuit board. The board is optionally then encased on the heatsink with a retainer that includes means for biasing the circuit device against the heatsink. Finally, the circuit board is overmolded with a polymeric material to form an overmolded body that encases the circuit board and the circuit device with the heatsink. The overmold process is carried out so that a portion of the overmolded body completely underfills the circuit device and encapsulates its solder bump connections.
Type:
Grant
Filed:
October 23, 2000
Date of Patent:
October 23, 2001
Assignee:
Delphi Technologies, Inc.
Inventors:
Jeffery Ralph Daanen, Scott David Brandenburg
Abstract: An inner and outer pressure difference alleviating device for an air tight case (10) is provided including a housing (20) and a cover (30). The cover is adapted to close an opening in housing (20). A diaphragm portion (34) that is made from a flexible material is formed integrally with cover (30) or a side wall of the housing (20). When a pressure difference between the inside and outside of the airtight case (10) is produced by heat generated by electric and electronic components contained in housing (10) diaphragm portion (34) elastically deforms to change the inner volume of airtight case (10) and eliminate the pressure difference between the inside and outside of airtight case (10) automatically, while retaining the air-tightness of the airtight case (10).
Abstract: A capacitor module which is easy to install on a car and does not need any other assistant bracket or fixer for supplying power of car audio is disclosed. A capacitor module which can securely prevent leakage of the dielectric fluid contained therein is also disclosed. Furthermore, it provides a new structure distinctively different from the conventional ones and a polygon body, which can be fixed to a car at any side surface without using other assistant bracket or fixer. In addition, the sealing process will lock up parts of the capacitor instead of deforming the parts in order to provide a higher sealing quality.
Abstract: A method and system for extending the life cycle of an circuit including the positioning of a circuit on an an elevated pedestal in a container, filling the container with a hydrophobic fluid sufficiently to form a bubble at the top of the package, and sealing the package. On the contamination of the container by a condensate, the pedestal segregates the circuit from the condensate regardless of the containers orientation.
Type:
Grant
Filed:
March 30, 1995
Date of Patent:
March 27, 2001
Assignee:
The United States of America as represented by the Secretary
of the Army
Abstract: A system and method is provided for opening a sealed engine control module in which the module includes a substrate bent around and sealed to a central housing. In one aspect of the invention, the housing is machined around its perimeter, without damaging the substrate, to expose the sealing bead. The sealing bead is disrupted by cutting a groove in the bead, in one embodiment. The modified module is placed within an opening fixture that supports the substrate against buckling or folding while the substrate is unbent about the housing. In another aspect of the invention, a handling support can be attached to the unbent substrate to prevent buckling or folding while the circuit board supported by the substrate is evaluated or modified, and while the substrate is being transported. A closing fixture is also contemplated that supports the substrate while applying a force to fold or close the substrate about a new housing.
Type:
Grant
Filed:
April 23, 1999
Date of Patent:
February 27, 2001
Inventors:
Terry N. Traver, F. Ivan Castro, Paul A. Ontiveros, Robert Fernandez, Jose L. Saad
Abstract: The invention relates to a housing for an electric or an electronic component, in particular a motor vehicle control unit, for which the housing parts or housing connections are designed such that the electric or electronic components are sealed watertight and airtight. Such housings, which are composed if only in part of a thermoplastic synthetic material, are provided with a pressure compensation feature. As a result, the pressure inside the housing is constantly adapted to the outside pressure. With this type of pressure adaptation, it is not possible for gases, particularly water vapor, to permeate the synthetic housing under pressure and reach the electric or electronic components. As a result, damage caused by humidity is greatly reduced and the service life is increased.
Type:
Grant
Filed:
June 17, 1999
Date of Patent:
January 30, 2001
Assignee:
Temic Telefunken microelectronic GmbH
Inventors:
Richard Baur, G{umlaut over (u)}nter Fendt, Engelbert Wörle