Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrodes which have a contact face which bears against the workpiece and conducts current therebetween. The contact face is provided with a contact face outer contacting surface which is made from a contact face material similar similar to the workpiece plating material which is to be plated onto the semiconductor workpiece. The contact face can be formed by pre-conditioned an electrode contact using a plating metal which is similar to the plating materials which is to be plated onto the semiconductor workpiece.

Abstract: To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising contact carriers, more specifically clamps, clips and like, with contact elements for supplying the current to the work is utilized, and at least the contact areas of the contact elements that may be brought to contact the work are made from an elastic, electrically conductive material.

Abstract: A system for electroplating a semiconductor wafer is set forth. The system comprises a first electrode in electrical contact with the semiconductor wafer and a second electrode. The first electrode and the semiconductor wafer form a cathode during electroplating of the semiconductor wafer. The second electrode forms an anode during electroplating of the semiconductor wafer. A reaction container defining a reaction chamber is also employed. The reaction chamber comprises an electrically conductive plating solution. At least a portion of each of the first electrode, the second electrode, and the semiconductor wafer contact the plating solution during electroplating of the semiconductor wafer. An auxiliary electrode is disposed exterior to the reaction chamber and positioned for contact with plating solution exiting the reaction chamber during cleaning of the first electrode to thereby provide an electrically conductive path between the auxiliary electrode and the first electrode.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: A method and apparatus for automatically refilling reference electrodes used in chemical analysis. The apparatus generally includes a reference electrode including an outer chamber with an electrolyte contained therein, an adapter to secure the plumbing to the reference electrode, and a computer to control the refill unit. The refill unit further includes a pump, a refill bottle, and plumbing to connect the refill bottle to the pump and the pump to the reference electrode. The method generally includes drawing refill electrolyte from a refill bottle and pumping the refill electrolyte to the reference electrode. Embodiments of the invention further include an automatically refillable reference electrode.

Abstract: An improved anode, cup and conductor assembly for a reactor vessel includes an anode assembly supported within a cup which holds a supply of process fluid. The cup is supported around its perimeter within the reactor vessel. The anode assembly has an anode shield carrying an anode, the anode shield having upwardly extending brackets with radially extending members. A diffusion plate is supported above the anode by the anode brackets using first bayonet connections. The anode shield and the anode are supported from below by a delivery tube which also serves to deliver process fluid to the cup. A second bayonet connection is provided between a top portion of the delivery tube and the anode assembly. The fluid delivery tube has a fixed height within the vessel. The anode elevation is adjusted by the interposing of a spacer of desired thickness between the anode and the tube. An electrical conductor is connected to the anode, and passes through the tube to be electrically accessible outside the vessel.

Abstract: In an electroplating reactor for plating a spinning wafer, a diffusion plate is supported above an anode located within a cup filled with process fluid within the reactor. The diffusion plate includes a plurality of openings which are arranged in a spiral pattern. The openings allow for an improved plating thickness distribution on the wafer surface. The openings can be elongated slots curved along the direction of the spiral path.

Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.

Abstract: Embodiments of the invention generally provide an electrochemical plating cell having an electrolyte container assembly configured to hold a plating solution therein, a head assembly positioned above the electrolyte container, the head assembly being configured to support a substrate during an electrochemical plating process, and an anode assembly positioned in a lower portion of the electrolyte container. The anode assembly generally includes a copper member having a substantially planar upper surface, at least one groove formed into the substantially planar upper surface, each of the at least one grooves originating in a central portion of the substantially planar anode surface and terminating at a position proximate a perimeter of the substantially planar upper surface, and at least one fluid outlet positioned at a perimeter of the substantially planar upper anode surface.

Abstract: The present invention provides an electrolytic processing apparatus which is capable of increasing the in-plane uniformity of the film thickness of a plated film by making more uniform an electric field distribution over the entire surface to be processed of a substrate even if the substrate has a large area and controlling more uniformly the speed, over the entire surface to be processed of the substrate.

Abstract: After a second plate member 3 is inserted into a space which is surrounded by side walls 6a through 6d of a first plate member 2, the bonded surface 3a of the second plate member 3 is bonded and fixed to the bonded surface 2a of the first plate member 2 by an adhesive to form a sample handling unit 1. At this time, the second plate member 3 is positioned by protrusions 35 and 36 of the first plate member 2 in X and Y directions, and positioned and fixed by holding members 8 through 13 and inside holding members 26 and 27 in Z directions (normal directions on an external surface 7). A microfluidic device 101 includes microchips 106 through 108 of plural kinds having passages 132 through 134 for transporting a sample, and a base member 102 on which the microchips 106 through 108 are arranged.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: A cell for the electrowinning of aluminium (50) from alumina, comprises an inclined plate-like or grid-like open anode structure (25) which has a generally v-shaped configuration in cross-section. The anode structure (25) has a downwardly-oriented sloping electrochemically active surface that is generally v-shaped in cross-section and spaced above an upwardly-oriented corresponding sloping cathode surface (11) by an anode-cathode gap (40) in which alumina dissolved in a circulating electrolyte (60) is electrolysed. The anode structure (25) has a plurality of anode through-passages (45) distributed thereover for an up-flow of alumina-depleted electrolyte (60) from the anode-cathode gap (40).

Abstract: A cathode cartridge of a testing device for electroplating is provided, and includes a dummy plate 7 as a negative pole provided outside a tabular front insulator 6. The dummy plate includes an orifice a having the same shape as a plated part 2a of a plated base 2 as a negative plate. Protruding portions 4 press contact to a peripheral part of the plated base 2a. A tabular cathode conductor 4 connects with a direct voltage source not soaked in a plating solvent. A tabular rear insulator 5 covers rear sides of the plated base 2 and the cathode conductor 4, and has a recess, into which the plated base 2 and the cathode conductor 4 are retained. A tabular front insulator 6 having an orifice having the same shape as the plated base 2a covers a front side of the cathode conductor 4. An elastic thin board 9 is sandwiched between the plate base 2 and the tabular front insulator.

Abstract: A pipe electrochemical polishing system (10) for in place polishing of a pipe (12) has a cathode puller cable (16) having a plurality of balls (34, 34a) distributed along the length of the cable (16). The balls (34, 34a, 34b) support the cable (16) within the pipe (12) and provide rigidity to the cable (16) so that the cable (16) can be pushed through the pipe (12) rather than having to be initially pulled therethrough. The cable (16) can be readily pulled through the pipe (12), and particularly around bends therein, because the balls (34, 34a, 34b) prevent the cable (16) from binding and coming into contact with the interior walls of the pipe (12).

Abstract: A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.

Abstract: Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.

Abstract: The present invention relates to a molded tooling fixture for supporting an airfoil during an electrochemical stripping process. The tooling fixture comprises a holder for receiving the airfoil, which holder has a slot in which a serrated portion of the airfoil is positioned. The holder is formed from an electrically non-conductive material such as molded plastic. The first slot has at least one serrated surface which mates with at least one serration on the airfoil. The fixture further includes a support arm on which the holder is supported. The support arm is also formed from an electrically non-conductive material such as molded plastic. Still further, the fixture includes a rod formed from an electrically conductive material which sits in a groove in the support arm and which contacts a lower surface of the airfoil.

Abstract: An electrochemical cell includes a first electrode, a second electrode, and a proton exchange membrane disposed between and in intimate contact with the electrodes. The proton exchange membrane is configured to be integral with a frame structure and includes a substrate disposed in contiguous contact with the frame structure and a proton exchange material disposed at the substrate.

Abstract: The present invention includes apparatus and methods for measuring impedance of a layer of deposited metal on a substrate and controlling deposition uniformity during electroplating. A first circuit delivers plating current to a metal layer on the substrate, and a second circuit, electrically isolated from the first, measures the impedance. Methods of the invention provide multi-point sheet resistance measurements before and during an electroplating process on a substrate. In a specific example, resistance is measured via a copper seed layer during electroplating.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: A wafer plating apparatus includes a wafer clamp for holding a wafer, a wafer support member for supporting the peripheral edge of the surface to be plated, and a plating tank which circulates a plating solution while making the plating solution overflow from an upper opening of the tank. The wafer plating apparatus is arranged to perform plating, while the surface to be plated is laid face down, being in contact with the surface of the plating solution, in a state in which the wafer is clamped by the wafer clamp and the wafer support member. The wafer support member is equipped with air-vent grooves for discharging the air which remains on the peripheral edge of the surface to be plated while the surface of the plating solution and the wafer make contact. The air-vent grooves are formed at the lower end of the wafer support portion.

Abstract: A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position, the wafer chuck is opened. When in the second position, the wafer chuck is closed.

Abstract: A cathode current control system employing a current thief for use in electroplating a wafer is set forth. The current thief comprises a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer. A first plurality of resistance devices are used, each associated with a respective one of the plurality of conductive segments. The resistance devices are used to regulate current through the respective conductive finger during electroplating of the wafer. Various constructions are used for the current thief and further conductive elements, such as fingers, may also be employed in the system. As with the conductive segments, current through the fingers may also be individually controlled. In accordance with one embodiment of the overall system, selection of the resistance of each respective resistance devices is automatically controlled in accordance with predetermined programming.

Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Abstract: The invention relates to carriers serving to supply current to workpieces to be treated electrolytically or counter-electrodes and a method for the electrolytic treatment of workpieces. The carriers according to the invention comprise at least three elongate electric current conductors, disposed parallel to one another, a first current conductor being configured in such a way that the workpieces or counter-electrodes can, for supplying electric current or for mechanical attachment, be attached to the conductor directly or via holding devices, respectively a second to nth current conductor is provided, the second current conductor being connected to the first current conductor, the third current conductor to the second current conductor etc.

Abstract: An electrochemical gas sensor is provided which can be assembled economically and in a few steps. The electrodes (1, 2, 3) with associated electric lines are applied in a planiform manner to a membrane strip, which is impermeable to the electrolyte but permeable to gases. The membrane strip (6) is deposited in the sensor housing in a zigzag-folded pattern, so that the membrane strip limits the opening of the sensor housing for the entry of the measured gas. The electrodes (1, 2, 3) are arranged stacked in the sensor housing (5, 7) at spaced locations from one another due to the membrane strip (6) deposited in a zigzag-folded pattern.

Abstract: A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silicon wafer (W) and holds the cathode conductor (10), and a second insulator (30) that covers a back side of the silicon wafer (W) and holds the silicon wafer (W). Negative portions other than the surface (Wa) to be plated of the silicon wafer (W) are insulated from plating solution with a first O-ring (22) fitted in the first insulator (20) and a second O-ring (32) fitted in the second insulator (30).

Abstract: A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink.

Abstract: The invention relates to a transverse conveyor for electrodes used in the production of metals. This transverse conveyor consists of a transfer device, located below the electrodes to be transferred and which device moves back and forth on a horizontal plane, as well as of lifters used for lifting the electrodes. The transfer device consists of a frame, on which there is a moving transfer bar, which is designed to cover the frame at all stages of its movement.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: A plating apparatus continuously plates a surface of a substrate with metal and performs its supplementary process in one housing unit. The plating apparatus comprises a cassette stage for placing a substrate cassette thereon, a pre-treatment unit for pre-treating a surface of a substrate, and a plating unit for plating a surface of the substrate pre-treated in the pre-treatment unit. The plating apparatus further comprises a first substrate stage disposed between the cassette stage and the pre-treatment unit, a cleaning and drying unit disposed between the cassette stage and the first substrate stage, a first transfer device, and a second transfer device. The first transfer device transfers a substrate between the substrate cassette, the cleaning and drying unit, and the first substrate stage. The second transfer device transfers a substrate between the first substrate stage, the pre-treatment unit, and the plating unit.

Abstract: A system for depositing materials on a surface of a wafer includes an anode, a shaping plate, a liquid electrolyte contained between the anode and the surface of the wafer, and electrical contact members contacting selected locations on the surface of the wafer. The shaping plate defines a recessed edge and is supported between the anode and the surface of the wafer such that an upper surface of the shaping plate faces the surface of the substrate. The shaping plate can have a plurality of channels such that each puts the surface of the wafer in a fluid communication with the anode. The deposition process progresses through the shaping plate. The upper surface of the shaping plate has a substantially larger area than the area of the surface of the wafer.

Abstract: One or more fractal antennas are produced in an electroforming circuit. A stainless steel on glass mandrel is covered with a dielectric in an inverse image of a fractal antenna to be formed. The portion of the stainless steel uncovered by the dielectric is chemically washed so that a fractal antenna formed thereon can be more efficiently removed. The mandrel is made a cathode in an electroforming circuit, which results in a fractal antenna being formed on the mandrel. The fractal antenna is separated from the mandrel and mounted on a rigid or semi-rigid substrate.

Abstract: The invention relates to a device for at least partly removing a deposit created in the electrolytic refining or electrowinning of metal from the surface of the mother plate used as an electrode in the refining or electrowinning process, said device comprising at least one member for removing the deposit and at least one member for controlling the removal member with respect to the deposit to be removed. According to the invention, the device comprises at least one gripping element that is used for creating a mechanical contact between the deposit and the removal member, said gripping element being connected to a control member, to which there are coupled both the shaft part of the gripping element and the deposit removal member.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece.

Abstract: A hard material layer deposited on a hard metal work piece is removed by electrolytic passivation in which a maximum current density equal to at least 0.01 A/cm2 is generated on the work piece at the beginning of the layer removal process. The hard material layer rapidly flakes off without causing substantial damage to the hard metal material located underneath.

Abstract: An apparatus is provided for depositing and polishing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a basin, a cover, a permeable disc, an anode and a polishing head. The permeable disc is disposed in the basin between the cover and the basin's bottom. The cover has an aperture disposed therein that includes a plurality of pins. The pins extend radially into the aperture and are adapted to support the substrate. The anode is disposed in the basin between the disc and the bottom of the basin. The polishing head is adapted to retain the substrate during processing and includes a retaining ring. The retaining ring has a plurality of grooves disposed therein that mate with the pins when the polishing head is disposed in the aperture. When the substrate is biased via the pins, the potential between the substrate and the anode causes material to be deposited on the substrate's surface.

Abstract: An apparatus and associated method for deposition of metal ions contained in an electrolyte solution to form a metal film primarily on a seed layer formed on at least a first side of a substrate. The substrate has a second side that is opposed the first side and an edge joining the first side and the second side. The apparatus comprises a substrate holder system and an electric contact element. The electric contact element physically contacts one of the second side or the edge of the substrate. In one aspect, the substrate is rotated about its vertical axis when the seed layer of substrate is immersed in the electrolyte solution during the metal film deposition. In another aspect, the substrate is not rotated about its vertical axis when the seed layer on the substrate is immersed in the electrolyte solution during the metal film deposition.

Abstract: The present cup-type plating apparatus improves a conventional cup-type plating apparatus and prevents the surface of a wafer due to a mist of the plating solutions from being contaminated. A plating solution is supplied to a wafer which is placed on a wafer support provided along an opening at the top of a plating tank from a solution-supply port provided at the bottom of the plating tank by an upward-moving stream; the plating solution is made to flow out of a solution-outlet port provided for the plating tank; and plating is performed while the plating solution is brought into contact with a surface of the placed wafer, which is to be plated, wherein the solution-outlet port has a solution-outlet path in which the discharged plating solution is isolated from the outer space.

Abstract: The invention relates to an intermediate component for protecting hangers associated with electrostatic coating processes. The component is an electrically conductive, pliable, tubular member, and inexpensive relative to the hanger which it serves to protect. The component lessens the cost associated with traditional hanger cleaning and preserves hanger life and integrity. The tubular member may have a longitudinal slit for installing the member over a cross bar of a hanger.

Abstract: An anode system (10) in contact with a molten salt bath (34) in an electrolysis apparatus, contains a 50% to 95% dense refractory support (12) which comprises refractory material and from 2 wt %. to 20 wt. % of metal fibers (40), where the metal fibers are from 1 cm to 4 cm long.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: An electrochemical analysis system includes a chamber (34) that defines a fluid receiving reservoir therein. A working electrode (40), a reference electrode (42), and a counter electrode (44) is mounted to the chamber. An electrochemical analysis circuit (38) applies appropriate voltages to the electrodes and reads appropriate currents from the electrodes to provide an indication of the peroxyacetic acid concentration in a sample. The working electrode includes a glassy carbon rod (60) which is surrounded by a compressible polymeric sleeve (64) and a metal sleeve (66). One end of the metal sleeve is swaged (68) to form a fluid tight compression seal with the insulating sleeve and the glassy carbon rod. An electrically conductive thermal extension joint between the glassy carbon rod and an electrically conductive rod (70) includes a bore (72) in the conductive rod in which the glassy carbon rod is slidably received and a compressed spring (74) in the bore.

Abstract: To electrically contact and electrolytically treat, more specifically to electroplate, very thin, electrically conductive layers, especially with a high electrolytic current, a device comprising contact carriers 4, 5, 10, 11, more specifically clamps, clips and the like, with contact elements 8 for supplying the current to the work 6 is utilized, at least the contact areas of the contact elements 8 that may be brought to contact the work 6 are made from an elastic, electrically conductive material.

Abstract: An electroplating apparatus for wheel disk comprises an electrolytic cell containing electrolytic bath, a cathode plate, an auxiliary anode, at least one anode plate and a driving mechanism. Part of the auxiliary anode is provided with an insulating shielding, one end of the insulating shielding passes through the center hole of the disk wheel. Part of the auxiliary anode is exposed on both sides of the wheel disk. Therefore, the auxiliary anode forms a dual anodes scheme with the anode plate to provide complete and smooth plating. The wheel disk is rotated by the driving mechanism to prevent tip-discharging.