Abstract: An anode holder is used to hold an anode in a plating tank. The anode holder includes a bar having a conductive portion connected to a power source, a conductive anode shaft attached to the bar, and an anode connected to the conductive anode shaft. The conductive anode shaft includes an external thread portion provided at an end of the conductive anode shaft, an O-ring, and a step portion provided between the O-ring and the external thread portion. The step portion has a diameter larger than a diameter of the external thread portion but smaller than a diameter of the O-ring. The anode includes an internal thread hole to which the external thread portion of the conductive anode shaft is screwed. The anode also includes a receiving portion for receiving the step portion of the conductive anode shaft in a state such that the O-ring of the conductive anode shaft is brought into contact with an inner surface of the receiving portion.

Abstract: The invention relates to a method for achieving a good contact surface on an aluminium electrode support bar used in electrolysis. In the method the support bar is fabricated as a continuous bar and a highly electroconductive layer is formed on its end. The highly electroconductive layer forms a metallic bond with the support bar and can be achieved for example with thermal spray coating. The invention also relates to an electrode support bar, the end of which is coated with a highly electroconductive material.

Abstract: An ionic foot bath array for generating an ionic foot bath includes an upper rod support structure, at least one electrically non-conductive support structure leg depending downwards from the upper rod support structure and a plurality of generally cylindrical electrically conductive ionic rods each having the same diameter, the ionic rods being removably mounted and depending downwards from the upper rod support structure, each of the ionic rods extending generally parallel with one another in spaced-apart relationship in at least two generally parallel rows, the ionic rods having an intra-row spacing therebetween of no greater than two times the diameter of each ionic rod, the rows being spaced no greater than three times the diameter of each ionic rod, with at least one of the rows being positively charged and at least one of the rows being negatively charged.

Abstract: Apparatus for electroplating a workpiece includes an unassembled electroplating anode assembly having weldable first and second structural anode members. The first structural anode member includes a positioning slot. The second structural anode member includes a positioning tab disposable in the positioning slot. A method for making an electroplating anode assembly includes obtaining an electroplating-anode-assembly first structural anode member having a positioning slot and obtaining an electroplating-anode-assembly second structural anode member having a positioning tab. The method also includes locating the positioning tab in the positioning slot and welding together the first and second structural anode members.

Abstract: A linear guide, in particular for a device for electrochemical metal machining, that guides a linear movement of a quill that is moved periodically in a machine frame in order to periodically modify a working gap between a cathode situated on the quill and a workpiece in the direction of the longitudinal axis of the quill, the quill being connected to the machine frame by a plurality of connecting rods, the connecting rods being situated, in the no-load, non-deflected state, essentially parallel to the longitudinal axis of the quill , and the connecting rods having at the point of connection to the quill, as well as at the point of connection to the machine frame, a notch hinge in order to enable, via the hinge, the periodic linear movement of the quill, and the flexibilities of these notch hinges being based on elasticities in their structures formed by targeted thinning of the material.

Abstract: A carrier for effectuating semiconductor processing on a non-planar substrate is disclosed. The carrier is configured for holding at least one non-planar substrate throughout a semiconductor processing step and concurrently rotating non-planar substrates as they travel down a translational path of a processing chamber. As the non-planar substrates simultaneously rotate and translate down a processing chamber, the rotation exposes the whole or any desired portion of the surface area of the non-planar substrates to the deposition process, allowing for uniform deposition as desired. Alternatively, any predetermined pattern is able to be exposed on the surface of the non-planar substrates. Such a carrier effectuates manufacture of non-planar semiconductor devices, including, but not limited to, non-planar light emitting diodes, non-planar photovoltaic cells, and the like.

Abstract: A substrate holding and transporting assembly is disclosed. The substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation, the spaced apart orientation of the pair of clamps enable support of a substrate with at least two independent points. The substrate holding and transporting assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.

Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

Abstract: An electrolysis treatment apparatus for performing electrolytically treating a metal strip that is running in a certain direction is provided. A number of electrolysis cells continuously perform the electrolysis treatment with alternating currents in acidic electrolyte solutions. The electrolysis cells are arranged in series along the running direction of the metal strip. In each of the electrolysis cells, one electrode or two or more electrodes is/are provided. Each electrode is disposed so as to face a running path of the metal strip and applies alternating current. A soft start portion is provided at an entry region of the electrode at which the metal strip is fed in. Current density of the alternating current in the plural electrolysis cells is set so as to be the lowest in the electrolysis cell disposed furthest downstream with respect to the running direction of the metal strip. In at least one electrolysis cell except the electrolysis cell that is disposed furthest downstream.

Abstract: The disclosure relates to a method of obtaining a good current contact on the support bar of a cathode used in electrolysis. In this method a highly electroconductive layer is formed on the contact piece on the end of the support bar of the cathode, especially at the point that comes into contact with the electrolysis cell busbar. The electroconductive layer forms a metallic bond with the contact piece of the support bar. The disclosure also relates to the cathode support bar, wherein a highly electroconductive layer is formed to the contact piece on the end of said bar, in particular the area that touches the electrolysis cell busbar.

Abstract: A system for use in manufacturing semiconductor devices, is provided. The system includes an electrochemical processing tool and an image sensor. The electrochemical processing tool includes an electrode located at a central region of a platen. The electrode is adapted for contacting a wafer workpiece during certain processing of the wafer workpiece using the tool. At least part of the electrode is viewable from above the platen when the electrochemical processing tool is operably assembled. The image sensor is capable of capturing an image of the viewable part of the electrode. The image sensor is positioned above the platen. The image sensor is adapted to be aimed at the electrode when an image of the electrode is to be taken with the image sensor.

Abstract: A wafer plating apparatus has a rotor in a head including wafer retainers which properly hold a wafer on the rotor in position. A seal on the head seals plating bath liquid away from the edges of the wafer. After plating is completed and the wafer is moved away from the seal, the wafer retainers prevent the wafer from sticking to the seal. The rotor may include a backing plate adapted to support a wafer during processing, with the wafer retainers pivotally attached to the backing plate. Movement of the backing plate relative to a seal may move the wafer retainers between open and closed or engaged positions.

Abstract: An apparatus forms a plated film in fine trenches and plugs for interconnects and in the openings of a resist formed in the surface of a substrate such as a semiconductor wafer, and forms bumps (protruding electrodes) on the surface of a semiconductor wafer. The apparatus includes a substrate holder capable of opening and closing for holding a substrate such that the front surface of the substrate is exposed while the backside and the edge thereof are hermetically sealed. A plating tank accommodates a plating liquid in which an anode is immersed. A diaphragm is provided in the plating tank and disposed between the anode and the substrate held by the substrate holder. Plating liquid circulating systems circulate the plating liquid to respective regions of the plating tank, separated by the diaphragm. A deaerating unit is disposed in at least one of the plating liquid circulating systems.

Abstract: An anode rod is placed between two hooks fixed to an anode beam and onto which a connector bears, including two levers, two coaxial lateral rods and a screw that can pivot levers between a clamping position of the anode rod in contact with the anode beam and a release position. The geometry of at least one hook, a lever and/or a lateral rod and the material from which they are formed are such that the elastic deformation of the holding device with respect to the anode beam when the screw is tightened is sufficient. Thus, this device can compensate for a change in the position of the anode rod by elastic return towards its unstressed position, and thus continues to keep the anode rod firmly in contact with the anode beam.

Abstract: In order to treat solar cells in an electroplating device, they can be inserted into a grid-like or tray-like picking-up device. They are thus mechanically held and electrical contact is made with them via contacts. Instead of individual solar cells, the picking-up devices are moved with a large number of inserted solar cells through the electroplating device for treatment. Electrical contact with the solar cells is in this case made via the contacts and the frame limbs on a projecting angle section together with edge strips of the pick-up. Contact rollers rest on the edge strips and are connected to an electrical power source.

Abstract: A loading apparatus for use in electroplating processes includes a container designed to sealingly receive a plurality of airfoil blades fitted with gaskets. Each fitted airfoil blade is disposed in contact with a plurality of electrical contact assemblies having a spring-like design which ensures an adequate connection is made and complete plating of the airfoil blades occurs.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assembly (400) can comprise a support member (410) that includes an inner wall (412) which defines an opening (414) configured to receive the workpiece and a plurality of contacts (420). The individual contacts (420) include a conductor (440) and a cover (430). The conductor (440) can comprise a proximal section (435) projecting inwardly into the opening (414) relative to the support member (410), a distal section (436) extending from the proximal section (435), and an inert exterior (444) at least at the distal section (436). The cover (430) comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: A method and apparatus for transmitting electrical signals and fluids to and/or from a microelectronic workpiece. An apparatus in accordance with one embodiment of the invention includes a shaft rotatable about a shaft axis and having a first end with a first electrical contact portion toward the first end, a second end opposite the first end, and an internal channel along the shaft axis between the first and second ends. The shaft can further have at least one first hole toward the first end with the first hole extending radially from the channel to an external surface of the shaft. The shaft can still further have at least one second hole toward the second end with the second hole extending from the channel to the external surface. A housing rotatably receives the shaft and has an aperture coupleable to a fluid source and/or fluid sink.

Abstract: A method and apparatus for an electrochemical processing cell that is configured to minimize bevel and backside deposition. The apparatus includes a contact ring assembly for supporting a substrate, a thrust plate movably positioned to engage a substrate positioned on the contact pins, and a lip seal member positioned to contact the thrust plate and the contact ring to prevent fluid flow therebetween. The lip seal includes at least one bubble release channel formed therethrough. The method includes positioning an electric field barrier between a backside substrate engaging member and a frontside substrate supporting member to prevent electric field from traveling to the bevel and backside of the substrate. The electric field barrier including at least one bubble release channel formed therethrough.

Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.

Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.

Abstract: A dual contact ring for contacting a patterned surface of a wafer and electrochemical plating of a metal on the patterned central region of the wafer and removing the metal from the outer, edge region of the wafer. The dual contact ring has an outer voltage ring in contact with the outer, edge region of the wafer and an inner voltage ring in contact with the inner, central region of the wafer. The outer voltage ring is connected to a positive voltage source and the inner voltage ring is connected to a negative voltage source. The inner voltage ring applies a negative voltage to the wafer to facilitate the plating of metal onto the patterned region of the wafer. A positive voltage is applied to the wafer through the outer voltage ring to remove the plated metal from the outer, edge region of the substrate.

Abstract: Embodiments of the invention may generally provide a small volume electrochemical plating cell. The plating cell generally includes a fluid basin configured to contain a plating solution therein, the fluid basin having a substantially horizontal weir. The cell further includes an anode positioned in a lower portion of the fluid basin, the anode having a plurality of parallel channels formed therethrough, and a base member configured to receive the anode, the base member having a plurality of groves formed into an anode receiving surface, each of the plurality of grooves terminating into an annular drain channel. A membrane support assembly configured to position a membrane immediately above the anode in a substantially planar orientation with respect to the anode surface is provided, the membrane support assembly having a plurality of channels and bores formed therein.

Abstract: Disclosed in a capping board for use to support hanging legs of anodes and cathodes within adjacent electrolytic cells. This capping board has a main body having a bottom surface shaped to fit onto upper edges of the adjacent cells, and a top surface. A first set of spaced part insulating blocks project from the top surface. This first set of blocks extends in line all over the length of the capping board on one side of the main body. A second set of spaced part insulating blocks also projects from the top surface. This second set of blocks also extends in line all over the length of the capping board at a given lateral distance from the first set of blocks. Thus, the two sets of blocks form two rows that together define a central path on the top surface. Each of the blocks has a recess forming an upwardly and laterally opening compartment to receive and support one of the hanging legs of the anodes and cathodes.

Abstract: A contact ring for an electrochemical plating system is provided. The contact ring includes an annular substrate supporting member, a plurality of radially positioned conductive substrate contact pins extending from the substrate supporting member, an annular conductive thief element attached to the substrate supporting member, and at least one source of electrical power in electrical communication with the contact pins and the conductive thief element.

Abstract: On a fixture for electro-chemical machining for the production of long, curved cavities (11) in a component (12), the working electrode (3) of the electro-chemical machining tool (1) is connected to a guide body (1a) which moveably rests against the inner walls of the respective cavity by means of power-actuated guide elements (2), with the guide body being connected to a flexurally soft and torsionally stiff guide linkage (5) coupled to a feed and rotary drive. Control of the movement of the guide body is accomplished in dependence of at least one wall thickness measured with a measuring device (13, 14) during feed movement.

Abstract: Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.

Abstract: The present invention provides improvements in methods for the manufacture of stents. Specifically, the invention provides methods wherein stents are placed on jigs of various designs which facilitate manufacture, stents carried by the jigs are immersed in liquid baths which contain an electrolyte, the stents are urged into contact with their associated electrodes while current is applied to those electrodes, and wherein the positions of contact between the stents and their respective electrodes are altered during processing without removing the stents from the jig. The method is applicable for electropolishing and electro-plating.

Abstract: Disclosed is a capping board for use to support anodes and cathodes within adjacent electrolytic cells, which has a plurality of individual seats positioned in spaced apart relationship all along its length to receive and support hanging legs projecting from these anodes and cathodes. This capping board is improved in that it has at least one sheet or wire of electrically conductive material embedded therein. This sheet or wire extends over the length of the board and is shaped and positioned so that part of its extends externally within at least some of the seats so as to allow electrical contact of the legs of either the anodes or the cathodes and to allow fast dissipation of heat in the case of a short circuit.

Abstract: A contact ring for use in electroplating of a substrate material is constructed such that fluid (e.g., electrolyte) is allowed to flow radially away from the axis of a toroidal support ring, thus preventing the trapping of fluids between the substrate and the toroidal support ring. The contact ring is constructed with a series of openings arranged about the circumference of the ring and wherein an electrical contact is placed in the path of each opening so any fluid passing through the opening also passes around the associated electrical contact. Further, the electrical contacts are also placed such that a substrate (e.g., a semiconductor wafer) can be placed inside the support ring so as to electrically contact the electrical contacts. The toroidal support ring has an aerodynamically streamlined cross-section at the openings, such that fluid flows through the openings with reduced aerodynamic drag.

Abstract: An apparatus and method for supporting a substrate is provided. In one embodiment, an apparatus for supporting a substrate includes a body having a band extending therefrom. The band is adapted to retain a fluid on the body thereby forming a shallow processing bath for processing the substrate. The band is adapted to deflect under centrifugal force to release the fluid from the substrate as the body is rotated above a predetermined rate.

Abstract: A plating apparatus (10) provided with: a plating vessel (61a to 61d) having a cylindrical side wall (361) for containing a plating liquid; a substrate holding mechanism (74a to 74d) for generally horizontally holding a generally round substrate (W) to be treated; a cathode ring (80) provided in the substrate holding mechanism and having substantially the same inner diameter as the plating vessel for sealing a peripheral edge portion of a lower surface of the substrate, the cathode ring having a cathode (83) to be brought into contact with the substrate held by the substrate holding mechanism; and a rotative driving mechanism (45) for rotating the substrate held by the substrate holding mechanism together with the cathode ring; wherein the plating vessel has an upper edge portion complementary in configuration to a portion of the cathode ring opposed to the plating vessel so that the lower surface of the substrate held by the substrate holding mechanism can approach the plating vessel so as to be substantiall

Abstract: An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.

Abstract: Embodiments of the invention may further provide a contact ring for an electrochemical plating system. The contact generally includes a substrate receiving member having a substrate support surface formed thereon, a plurality of electrical contact pins extending from the substrate support surface, a first seal positioned on the substrate support surface radially inward of the plurality of electrical contacts, and a second seal positioned radially outward of the plurality of electrical contacts. Additionally, the contact ring generally includes a fluid inlet configured to supply a fluid to a volume between the first seal and the second seal.

Abstract: A sensor including at least one electrode (3, 4) which is made of electrically conductive plastic and is connected to one end of an electrical conductor (5, 6). The electrode (3, 4) and conductor (5, 6) are surrounded by an insulating housing (2, 22), except that the electrode has an exposed surface (7, 8) for contacting an aggressive or corrosive medium inside the housing. The other end (11, 12) of the electrical conductor protrudes from the housing (2, 22). The housing (2, 22) is made of an electrically insulating plastic material which is joined to the electrode (3, 4) in a sealed manner. In a preferred embodiment, the housing (2, 22) forms a valve seat and seal for a bottom drain valve of a fluid container.

Abstract: A reactor for electroplating a workpiece includes a vessel having a ring contact arranged to support a workpiece in a horizontal orientation. In an embodiment of the invention, an electrode is arranged below the ring contact, and a pressing member is arranged above the ring contact to press a workpiece into electrical engagement with the ring contact. The vessel may be adapted to contain an electroplating fluid between a top of the ring contact and the electrode. In one embodiment, a movable intermediate workpiece support assembly is carried by the vessel, the support assembly being actuatable to lower a workpiece carried thereby to deliver the workpiece to be supported accurately and precisely on the ring contact.

Abstract: A contact assembly for supporting a substrate in an electrochemical plating system, wherein that contact assembly includes a contact ring and a thrust plate assembly. The contact ring includes an annular ring member having an upper surface and a lower surface, an annular bump member positioned on the upper surface, and a plurality of flexible and conductive substrate contact fingers extending radially inward from the lower surface. The thrust plate includes an annular plate member sized to be received within the annular ring member, and a seal member extending radially outward from the plate member, the seal member being configured to engage the annular bump member for form a fluid seal therewith.

Abstract: An apparatus for securing a substrate in an electrochemical deposition system is provided. The apparatus generally includes a substrate support member adapted to receive the substrate and a thrust plate assembly adapted to exert a downward force on the substrate. For some embodiments, a first sealing member adapted to engage a plating surface of the substrate may be attached to the substrate support member. The apparatus may also include a second sealing member adapted to engage a non-plating surface of the substrate or a surface of the substrate support member to prevent the flow of plating fluid to a non-plating surface of the substrate. The apparatus may also include electrical contacts to electrically contact the plating or non-plating surface of the substrate.

Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented. The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.

Abstract: A substrate measurement system including a measurement chamber and a substrate handling chamber possessing a substrate transfer and a substrate container interface arranged to receive a substrate to container. The handling chamber contains a first interface to connect the measurement chamber and the measurement chamber contains a second interface to connect the handling chamber. The transfer means is arranged to transfer substrates between the container and the measurement chamber through the handling chamber, in which system a second measurement chamber is provided, having the same second interface as the first measurement chamber to replace latter chamber.

Abstract: An apparatus for performing an electrochemical process on a metallic surface of a workpiece, comprised of a substantially incompressible workpiece support plate. A platen for supporting the workpiece support plate, has at least one opening coupled to a source of electrolyte for receiving an electrolyte solution therethrough and placing the electrolyte solution in contact with the support plate and workpiece. A first conductive element is coupled to, a first potential and positioned proximate the metallic surface, and the carrier is configured to position the workpiece proximate the support plate.

Abstract: A semiconductor wafer holder including first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: Apparatus and method of incorporating a resistive interface between an anode rod and a water heater tank connector. The resistive interface can include a conductive polymer material or coating.

Abstract: An electrochemical cell includes a first electrode, a second electrode, and a proton exchange membrane disposed between and in intimate contact with the electrodes. The proton exchange membrane is configured to be integral with a frame structure and includes a substrate disposed in contiguous contact with the frame structure and a proton exchange material disposed at the substrate.

Abstract: A copper welding rod is used in an arc-welding operation to form a bead that joins a copper starter sheet and a stainless steel hanger bar. The amperage level of the arc-welding equipment is set to generate heat at the weld site which is above the melting point of copper and below the melting point of stainless steel. This results in a welded joint between the copper bead and the hanger bar and a brazed joint between the copper bead and the starter sheet. Since brazing produces little or no fusion, the area of contact between the two dissimilar metals is limited to the interface between them, which significantly reduces the damaging effects of galvanic corrosion. Another improvement lies in the application of a corrosion-resistant metallic coating on the joint between the hanger bar and the starter sheet using a high velocity oxygen fuel flame spray technique.

Abstract: An electroplating panel having a strip of components to be electroplated. The components are spaced apart from one another along an edge of the strip. The panel includes a main buss and a plating thickness-compensation structure electrically connecting the main buss to the components at the edge of the strip. The plating thickness-compensation structure includes a first buss member and a second buss member. The first buss member extends along the edge of the strip and electrically connected to each component. The second buss member is electrically connected to main buss. The plating thickness-compensation structure further includes one or more links electrically connecting the first and second buss members.

Abstract: Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: A ceramic oxygen generator is described which is capable of modular construction to permit the oxygen generation capacity to be expanded. An ionically conducted ceramic electrolyte is formed into a series of rows and columns of tubes on a tube support member and like electrolyte bodies can be connected together to form a manifold therebetween of oxygen produced in the interiors of the rubes. An electrical connection between tubes is formed such that the anodes and cathodes of tubes in a column are connected in parallel while the tubes in the row are, respectively, connected anode to cathode to form a series connection.

Abstract: The invention provides an apparatus and a method for achieving reliable, consistent metal electroplating or electrochemical deposition onto semiconductor substrates. More particularly, the invention provides uniform and void-free deposition of metal onto metal seeded semiconductor substrates having sub-micron, high aspect ratio features. The invention provides an electrochemical deposition cell comprising a substrate holder, a cathode electrically contacting a substrate plating surface, an electrolyte container having an electrolyte inlet, an electrolyte outlet and an opening adapted to receive a substrate plating surface and an anode electrically connect to an electrolyte. Preferably, a vibrator is attached to the substrate holder to vibrate the substrate in at least one direction, and an auxiliary electrode is disposed adjacent the electrolyte outlet to provide uniform deposition across the substrate surface.