Abstract: Disclosed is a contact bar for use on a capping board of a given length in order to electrically connect a plurality of anodes and cathodes extending in spaced apart, alternate positions in adjacent electrolytic cells all along the capping board. The contact bar extends over the length of the capping board and is of a given average cross-section. This contact bar comprises a central core that is made of an insulating material and extends all over its length. This contact bar also comprises a plurality of contact pieces that are made of an electrically conductive material and are positioned in spaced apart positions all along the core, each of the pieces defining a segment on which only a short number of the anodes and cathodes are connected.

Abstract: An electrolytic mortar for fabricating galvanic anode panels is strengthened with fibers to improve green strength and resistance to cracking. Elongated reinforcing fibers are introduced into a flowing stream of mortar and deposited in multiple layers upon a platen or mold. A sacrificial zinc anode of open construction is embedded between the multiple layers to allow for electrolytic conduction between the layers and over all surfaces of the zinc anode.

Abstract: A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.

Abstract: Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Abstract: In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.

Abstract: An electrode assembly comprising of a plurality of planar electrodes and rods axially ringed with pairs of washer-style fasteners and washer-style spacers, held on the rod by fasteners on the distal ends. Electrode gap spacing is provided by distancing spacers placed along the rod axis in-between pairs of the washer-style fasteners. The electrode assembly is formed by sliding the proximal electrodes edges in-between pairs of the washer-style fasteners and tightening the end fasteners on the rods, which in turn clamps a portion of each proximal electrode edge holding the electrodes together in parallel under compression. At least two rod subassemblies are configured as charging buses of distinct polarity providing their respective monopolar charge to at least two planar electrodes in the assembly. Monopolar charge is provided to a planar electrode by varying the washer-style fastener pairs on the rod subassemblies from electrically-conductive to electrically-insulating types.

Abstract: The invention relates to an electrolytic cell for the production of chlorine from an aqueous alkali halide solution, which mainly consists of two semi-shells, an anode, a cathode and an ion exchange membrane arranged between the electrodes. Spacer elements are arranged between the ion-exchange membrane and the electrodes for fixing the membrane in position and distributing the compressive forces, made of electrically conductive and corrosion-resistant material on at least one side of the membrane.

Abstract: The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Abstract: A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

Abstract: A conducting belt is used with an anode holder for supplying an electric current to an anode for plating a surface of a substrate such as a semiconductor wafer. The anode and the substrate are vertically disposed so as to face each other in a plating tank of a plating apparatus. The conducting belt includes a belt capable of contacting an outer circumferential edge of the anode and holding the anode.

Abstract: An anode rod is placed between two hooks fixed to an anode beam and onto which a connector bears, including two levers, two coaxial lateral rods and a screw that can pivot levers between a clamping position of the anode rod in contact with the anode beam and a release position. The geometry of at least one hook, a lever and/or a lateral rod and the material from which they are formed are such that the elastic deformation of the holding device with respect to the anode beam when the screw is tightened is sufficient. Thus, this device can compensate for a change in the position of the anode rod by elastic return towards its unstressed position, and thus continues to keep the anode rod firmly in contact with the anode beam.

Abstract: An anode mount assembly is provided for facilitating rapid replacement of an anode component. The adapter mount assembly can comprise a mount component comprising a component body having at least one mounting aperture disposed therein and at least one protrusion or recess that can engage a recess or protrusion of the anode component for restricting movement of the anode component with respect to the mount component in at least one of a rotational and a translational direction of movement. Further, the anode component can comprise an engagement aperture, and the mounting aperture and the engagement aperture can be configured to receive a fastener for securing the anode component to the mount component and for restricting at least one additional degree of movement of the anode component with respect to the mount component to thereby secure the anode component to the mount component.

Abstract: The present invention provides a high volume, foul-resistant electrolytic process for treating contaminated water comprising at least one upflow electroflocculation cell consisting of (i) a lower (or “bottom”) electrode (3) in form of a porous, non-fluidized bed of loose iron or aluminium granules kept in periodic motion by pulsed gas injections and (ii) an upper (or “top”) vibrating electrode (4) made of an iron or aluminium grid mesh or ribmesh. A voltage potential between the upper (4) and lower (3) electrode causes ions to be released from the moving electrodes. These ions oxydise and/or render insoluble contaminants in the ascending flow of wastewater and create easy filterable insoluble contaminants resulting in substantially cleansed water. Such moving electrodes electroflocculation cells are useful at municipal water works and commercial and industrial applications were large amounts of raw water have to be processed.

Abstract: A mounting plate assembly for selectively securing a sacrificial anode to the exposed surface of a tank or boat hull. The mounting plate assembly provides for a pair of watertight space mounting studs to be extended through the attached surface and provide anode engagement thereon. The studs are welded to both the mounting plate and a fixation nut on the plate to which the anode is correspondingly registerably engaged.

Abstract: Disclosure of an electrode arrangement (1) as high voltage electrode for continual plasma treatment or plasma coating of web material with several knife electrodes (3) arranged at a right angle to any transport direction of the web material and essentially located parallely to each other which is characterized by the fact that the distances (a?e) of adjacent knife electrodes (3) vary. In tests it has turned out that a more uniform coating result or, respectively, treatment result can be achieved with such an electrode arrangement than with comparable arrangements in which the knife electrodes are arranged equidistant. Preferably, the distances (a) between adjacent knife electrodes (3) are larger at the edges of the electrode arrangement (1) than the distances (e) between adjacent knife electrodes (3) in its center.

Abstract: This invention relates to pot tending module intended for aluminium production plants by fused bath electrolysis. According to the invention, the turret (9) of the pot tending module (7) is equipped with a determined set of tools, in which the tool (101, 102, 103) is mounted on a telescopic arm (111, 112, 113) fixed to the turret (9) through an articulated support (121, 122, 123) that enables pendular movements of the telescopic arm with respect to a determined articulation point while preventing rotation movements of the telescopic arm about its principal axis. The telescopic arms are connected to each other through a mechanical connecting device (200) capable of maintaining the relative angular difference between the pendular movements of the telescopic arms within a determined tolerance range. The invention enables the tools to be arranged closer to each other without any risk that they will collide during use.

Abstract: A symmetrical double-double contact mechanism for an electro-deposition mechanism. Using a base insulator, a cap block insulator is formed to support four series of electrodes of two different types (anode and cathode). Because of the contact mechanism employed, redundant contacts are provided so that should a short occur, alternative electrical pathways are available to maintain operation of the affected cathode or anode.

Abstract: A process employing a rack having an article carrier that is movably supported on a frame and mechanically coupled for translating movement from a motor to the article carrier to effect movement of an article during processing to provide more uniform surface treatment, reducing or eliminating the need for shielding.

Abstract: A semiconductor wafer holder includes first and second holding members between which a semiconductor wafer is held. The second holding member includes a second conductive element placed in contact with a first conductive element of the first holding member and the semiconductor wafer. A ring clamp is used to press the second holding member against the first holding member for holding of the semiconductor wafer.

Abstract: An electroplating apparatus includes: a wafer holder that is detachable from an engaging hole of a cathode holder and capable of moving in a up and down direction; a spring contact type cathode electrode that is fixed to an electrode housing recess on a top surface of the wafer holder and presses against a backside of a wafer placed on the wafer holder; and a suction pad that is fixed to a pad housing recess on a top surface of the wafer holder and suctions the backside of the wafer placed on the wafer holder.

Abstract: The present invention can provide 1 which barrel plating apparatus where a plating barrel has permeable holes and slits in a size of order of micrometers on the wall thereof. The plating barrel is fabricated with porous plastic materials which have permeable holes and slits to the plating liquid and no piece materials to be plated are dropped thereof. Further advantage of the present invention is to provide a drain tool to drain the plating liquid L staying in the plating barrel.

Abstract: The present invention is directed to a frame for an electrolyser module as well as to an electrolyser module and an electrolyser incorporating such frames. The frames include a variety body having at least one electrolyser chamber opening and at least one degassing chamber defined therein. The degassing chamber opening preferably has a rounded shape as does the unitary body and the electrolyser chamber opening.

Abstract: A system to monitor, control and management of a plant where hydrometallurgical processes of electrowinning or electrorefining of non ferrous metals which enables measuring the process variables which comprises: at least one group of electrolytic cells, said cells having means for the collection and transmission of the variables of the process; a plurality of electrodes (5) installed in the interior of each electrolytic cell, making up, alternately, anodes and cathodes of basic cells; a plurality of electrode (5) hanger bars forming, alternately, hanger bars for electrical contact of anodes (20) and hanger bar for electrical contact of cathodes (18); a plurality of support electrical insulators (15) which are positioned in the upper portion of the lateral walls between two adjacent cells; a plurality of electrical bus bars (6) which are fitted on top of each support electrical insulator (15) and underneath the plurality of electrodes (5); a plurality of electrical spacer insulators (16) each spacer insulator

Abstract: A wafer plating apparatus has a rotor in a head including wafer retainers which properly hold a wafer on the rotor in position. A seal on the head seals plating bath liquid away from the edges of the wafer. After plating is completed and the wafer is moved away from the seal, the wafer retainers prevent the wafer from sticking to the seal. The rotor may include a backing plate adapted to support a wafer during processing, with the wafer retainers pivotally attached to the backing plate. Movement of the backing plate relative to a seal may move the wafer retainers between open and closed or engaged positions.

Abstract: A substrate holding and transporting assembly is disclosed. The substrate holding and transporting assembly includes a base plate and a pair of clamps connected to the base plate in a spaced apart orientation, the spaced apart orientation of the pair of clamps enable support of a substrate with at least two independent points. The substrate holding and transporting assembly also includes an electrode assembly connected to the base plate at a location that is substantially between the pair of clamps. The electrode assembly defined to impart an electrical contact to the substrate when present and held by the pair of clamps.

Abstract: An electroplating jig which includes: a first insulator plate having an aperture; a second insulator plate sandwiching a body to be plated between the first insulator plate and the second insulator plate so that the body to be plated is faced outside from the aperture; and a conductive plate for conducting electric current supplied from outside to the body to be plated, the conductive plate being arranged between the first or second insulator plate and the body to be plated, wherein the conductive plate is formed using a conductive rubber contacting elastically with the body to be plated.

Abstract: A problem during electrolytic treatment of printed circuit boards having a very thin basic metallization is that the treatment yields irregular results in various regions on the surface of the printed circuit board. In overcoming this problem the invention provides a device for electrolytically treating an at least superficially electrically conducting work piece having at least two substantially opposing side edges. The device comprises current supply devices for the work piece, said current supply devices each comprising contact strips located on the opposing side edges which are capable of electrically contacting the work piece at the substantially opposing side edges.

Abstract: Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Abstract: An insulating end cap for a cylindrical electrolysis cell the type comprising at least two tubular electrodes with a cylindrical membrane arranged co-axially between them, comprises a first annular section with first and second axial ends, having at its first axial end a circular seating or one end of an outer cylindrical electrode and at its second end a circular aperture, of smaller diameter than the circular seating and co-axial therewith, to accommodate one end of the membrane. A second annular section of the end cap is detachably secured to the first and has a central circular aperture of smaller diameter than the central aperture of the first section and co-axial therewith, to accommodate one end of the inner cylindrical electrode. The two part construction of the end cap facilitates the assembly of the cell, and reduces the likelihood of breakage of the fragile ceramic membrane.

Abstract: A method and apparatus for fluid sealing a workpiece retained by a workpiece holder are described. A pressure differential can be formed across a fluid seal to counteract fluid attempting to penetrate the fluid seal, which can contaminate the underside of the workpiece. The apparatus can include a ring forming a barrier to fluid entry with the workpiece and a source providing pressure to form the pressure differential. The pressure or the pressure differential can counteract hydroscopic fluid pressure or hydrostatic fluid pressure that is acting to force fluid through the barrier between the ring and the workpiece.

Abstract: A suction pad used for use in a substrate treatment apparatus which treats a substrate by immersing the substrate in a solution while the pad attaches to the substrate, including: a main face for attaching to the substrate; an outer face disposed along the outer periphery of the substrate; and a suction opening formed in the main face. In a cross-sectional shape including the main face and the outer face, the angle formed between a line corresponding to the main face and a line corresponding to the outer face is an acute angle.

Abstract: A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

Abstract: An electrocoagulation wastewater treatment apparatus is disclosed wherein a primary electrocoagulation reactor chamber houses treatment electrodes having front and rear faces. Electrode positioners are located in the reactor chamber for holding the treatment electrodes, each of the electrode positioners having a feed core connectable with a high pressure source of fluid. A plurality of passages extend from the feed cores, the passages located so that jets of fluid are directed at both the front and rear faces of each of the electrodes held by the positioners.

Abstract: A tending module for a series of electrolysis cells designed for the manufacture of aluminum by igneous electrolysis, each cell including a series of anodes provided with a metal rod designed to fix and electrically connect the anodes to a metal anode frame. The tending module includes a frame to be fixed to a mobile component, and at least one anode handling unit connected to the frame. The module also includes, integral with the anode handling unit, an activator that can exert at least one force or impulse on the anode rod, with a force such that, although the stem is firmly maintained in contact against the anode frame, the contact surfaces are moved in relation to each other by an amount sufficient for electrical contact to be improved. Advantageously, the activator is a jack or an impulse generator integral with the anode clamp.

Abstract: The electrode cartridge for measuring an internal stress of a film of plating includes a cathode support, an anode support, a shield plate and an anode shell. The anode support supports an anode plate so that the anode plate is opposite to the cathode plate with a predetermined spacing. The shield plate is interposed between the cathode and anode plates. A through hole is made in the shield plate in such a manner that the through hole confronts a plating section and has a geometry which is reduced by a first predetermined scale factor relative to a geometry of the plating section. An opening is made in the anode shell in such a manner that the opening confronts the plating section and has a geometry which is magnified by a second predetermined scale factor relative to the geometry of the plating section.

Abstract: The invention concerns a capping board assembly and its multiple connectable sections. Each pair of sections is connected with an interlocking joint, each of which comprises at least one projection and at least one recess that cooperate and prevent the longitudinal and lateral movement of the sections. Each interlocking joint is reinforced by a rod embedded within the section and extending within the projection. The rod has a tip that anchors the projection. The interlocking joints allow precision assembly of the sections of the capping board which greatly benefits strength, installation, replacement and transportation.

Abstract: An apparatus for holding a plurality of workpieces to be electroplated includes at least one container immersed in and rotatable relative to a plating solution. The container includes two end plates, and a surrounding plate cooperating with the end plates to define a receiving space adapted to receive the workpieces, and an opening adapted for entry and exit of the workpieces into and out of the receiving space. The surrounding plate includes a curved sliding section having two opposite first and second ends, a tumbling section that is adapted to allow the workpieces to tumble thereon when the container is rotated and that has a third end connected to the first end, and a fourth end opposite to the third end, and a plurality of through holes formed in the sliding and tumbling sections. The opening is disposed between the second and fourth ends.

Abstract: A system and method increase yield from semiconductor wafer electroplating. The aspects include a semiconductor wafer, the semiconductor wafer comprising a plurality of die areas. A plating ring for holding the semiconductor wafer in position during electroplating is also included, the plating ring substantially surrounding a circumference of the semiconductor wafer and having a width that varies in order to avoid overlap near edge die areas of the semiconductor wafer.

Abstract: A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.

Abstract: A retaining ring for electrochemical mechanical processing is described. The ring has a conductive portion having an upper surface and a lower surface and an insulating portion. The insulating portion has one or more openings extending therethrough, exposing the lower surface of the conductive portion. An upper surface of the insulating portion contacts the lower surface of the conductive portion. In an electrochemical mechanical polishing process, the retaining ring can be biased separately from a substrate being polished.

Abstract: The invention relates to a transfer and insulation device (1) for electrically insulating electrodes, particularly anodes (2) and cathodes (3), used in the electrolytic cleaning of metals, from each other in an electrolytic tank (4), for distributing the electrodes as they are hanging in the electrolytic tank and for enabling the electrodes to be transferred, said transfer and insulation device (1) being made of one single piece.

Abstract: Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring. The cathode contact ring comprises an inner portion and an outer portion, wherein the inner portion directly contacts the substrate. An anode is disposed in an electrolyte container. A power supply connects the substrate holder assembly and the anode.

Abstract: The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

Abstract: A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film layer and a top film layer. The bottom film layer includes a wafer placement area and a sacrificial anode surrounding the wafer placement area. The top film layer is defined to be placed over the bottom film layer. The top film layer includes an open region to be positioned over a surface of the wafer to be processed, i.e., electroplated. The top film layer provides a liquid seal between the top film layer and the wafer, about a periphery of the open region. The top film layer further includes first and second electrical circuits that are each defined to electrically contact a peripheral top surface of the wafer at diametrically opposed locations about the wafer.

Abstract: A vertical guide for electrodes characterized in that it includes 1) an upper portion or aligning head and a lower portion that corresponds to the guide itself, whose aligning head, designed to make it easier to introduce the cathode in the guide, has cylindrical-hexahedral perforations that permit attaching the vertical guide by means of bolts or another means to the electrolytic cell's support structure made of insulating material; 2) the head formed by a cylindrical housing having a horizontal axis and two inclined symmetrical surfaces that approach each other in a downward line until they become tangential to the interior faces of the “U” profile that continues downward, so that they are similar to a funnel open on one side; 3) a lower portion made up of the actual guide, whose space through which the electrode slides must be slightly wider than it, consists of a U-type profile with flanges, and which, on the outside, has triangular, or rectangular stiffening ribs, or both types, preferably separated at r

Abstract: We propose to shape the leaf by the use of electro-chemical machining (ECM). ECM is a technique by which a blank is suspended within a mould, with a small gap therebetween. A conductive fluid is caused to flow through the gap, and a large electrical current is passed from the mould to the blank. The blank steadily erodes, dissolving into the fluid. The fluid should not provoke a reaction from the material of the blank, such as a surface oxide. Sodium Chloride solution is a common choice. The current that is passed can, if desired, be controlled to a profile that will affect the manner of erosion. Thus, the current profile can be a steady on/off current, or it can be pulsed. One known arrangement is for the current to rise to a peak, then fall to zero, followed by a brief reverse flow.

Abstract: In various embodiments, the present invention provides an electrolytic cell contact bar having a first pole and a pair of second poles. The second poles are opposite in charge to the first pole and each of the pair of second poles are adjacent to and parallel to the first pole. In various embodiments, the contact bar may include an electrode holder capable of holding at least one electrode.

Abstract: A symmetrical double-double contact mechanism for an electro-deposition mechanism. Using a base insulator, a cap block insulator is formed to support four series of electrodes of two different types (anode and cathode). Because of the contact mechanism employed, redundant contacts are provided so that should a short occur, alternative electrical pathways are available to maintain operation of the affected cathode or anode.

Abstract: Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Abstract: In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.