Abstract: An electrolytic cell comprising a walled enclosure including a cathode sidewall has busbar structure external to the cell. The busbar structure can include a gird bar releasably secured at the sidewall. It also may include a foraminous interface member between the gird bar and the sidewall, as well as have a small cathode busbar member on the sidewall. The small busbar member is typically located above and adjacent to the gird bar. Particularly when the gird bar and foraminous interface member are present, there can be internal support members for the cathodes directly secured to the inside face of the cathode sidewall. Furthermore, intercell connection may be handled directly to the outside face of the cathode sidewall. The overall structure can provide reduced potential for sidewall stress corrosion cracking, reduced cathode manufacturing cost, and accommodation of stress relief for the cathode weldment.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: A plasma processing system (110) includes an electrode assembly (150) having a metal drive electrode (154) coupled to a source electrode (152). Source electrode (152) is further provided with an insulating layer (151) on its backside face. The insulating layer (151) is the contact layer between metal drive electrode (154) and source electrode (152). Additionally, source electrode (152) is provided with various front face contours (261, 262, 263, 264). The front face of source electrode (152) is exposed to the reactor chamber 142 of plasma processing system (110) during use. The source electrode is attached to metal drive electrode (154) using fasteners (133) that do not introduce contaminants into the plasma processing chamber.

Abstract: The present invention is an electropolishing process means for inner and outer surfaces of a metal, especially applied to a metal that inner and outer surfaces both needing high clean and passivation. The present invention comprises: an electrode device, which includes a positive electrode guide, a negative electrode guide, a positive electrode plate, a negative electrode plate and a negative working electrode; a clamping apparatus, which includes at least an insulated screw, an upper insulated piece and a lower insulated piece; an insulated structure, which includes an upper insulated cover and a lower insulated cover.

Abstract: In a cable system for connecting to an electrical apparatus, an earthing electrode assembly includes an earthing electrode, a mechanism for attaching the electrode to the cable while maintaining electrical insulation from the cable, and an electrical connection of the electrode to the electrical apparatus, the connection being long enough that the electrode is located at a distance from the apparatus such that the apparatus is substantially protected from the electrochemical effects resulting from operation of the electrode. The earthing electrode may include a titanium core which is coated with platinum or a mixed metal oxide of tantalum and iridium. Methods of attachment are also disclosed.

Abstract: An electrode assembly for electroplating conducting portions of nonconductors comprises an insulating frame having a first projection opposite a second projection. Preferably the insulating frame comprises a resin selected from the group consisting of acrylic resins, polyvinyl chloride resins and polycarbonate resins. A metal filament, for connection to the negative pole of a source of electrical energy, extends from the first projection to the second projection. Adjacent to the metal filament a first conductive plate is attached to the insulating frame at a first distance from the metal filament. A second conductive plate attaches to the insulating frame at a second distance from the metal filament. The first plate and the second plate are adapted for connection to the positive pole of a source of electrical energy.

Abstract: A rack for hanging workpieces in industrial coating systems having a horizontal bar or beam with a first flange, a second flange, and a web joining those flanges, wherein the first flange has a hook receiving aperture and the second flange has a hook receiving slot. The aperture and the slot are aligned to receive a hook from which a workpiece may be hung. The hook is bent to form a spring having a terminal leg and a depending leg. The terminal leg extends into the aperture in the first flange and the depending leg extends through the slot in the second flange, behind a detent. The web is formed so as to providee a fulcrum against which the spring bears, biasing the depending leg against release from behind the detent.

Abstract: The invention relates to a substrate carrier for holding substrates, especially semiconductor wafers. Good sealing of the wafer surface and electrical contact are made possible in that the substrate carrier has a first and a second part having a central opening matching the form of the substrate, wherein the substrate is received between the first and the second part and a peripheral seal having at least one undercut is provided in the inner periphery of the second part.

Abstract: An electrolytic cathode consists of a solid copper hanger bar and a stainless-steel mother plate attached to a receiving groove in the underside of the hanger bar. In the preferred embodiment of the invention, the entire length of connection is welded, thereby establishing a large boundary surface for good electrical conductance. The solid hanger bar further includes a cladding of stainless steel wrapped over the copper bar and the upper portion of the mother plate, leaving only the ends of the copper bar exposed for electrical connection with conventional bus-bars. The lower edges of the cover are attached to the mother plate by a steel-to-steel weld that produces a strong and durable connection. The lateral edges of the cover are also connected to the copper bar by a conventional copper weld that completely seals the cover over the copper bar, thereby preventing contamination from the electrolytic solution. The cover is then welded to the mother plate and sealed around the copper bar.

Abstract: The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.

Abstract: An inexpensive workpiece holder having high reliability and a processing apparatus equipped with the workpiece holder are provided, in which damage caused by oxygen in the air is prevented The holder comprises: a ceramic body which has an electrode and a heater circuit and which can holds a workpiece; a tubular member having an end portion connected to the ceramic body; a sealing member which is disposed inside the tubular member and which isolates a space inside the tubular member into two regions: a region on the first end portion (“sealed portion”) and a region on the opposite side (“opposite region”); and power supply conductive members which extend from the opposite region side, penetrating the sealing member to the sealed region side, and which are electrically connected to the electrode and the heater circuit.

Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.

Abstract: For manufacturing printed circuit boards and films 7 with little variations in the layer thickness of the circuit structures without damaging the surfaces of the boards and films, a rotatory element 9, 10, more specifically a contact roll, is used for placing the printed circuit boards and films in electric contact, an elastic, electrically conductive material 2, 5, 6 being at least partially applied on the running tread unreeling on the printed circuit boards and films.

Abstract: A cathode arrangement having a mounting rail (1) and a cathode plate (2) bonded to the mounting rail (1). Two parallel, flanges extending in its longitudinal direction are formed on the underside (5) of the mounting rail (1). The cathode plate (2) is accommodated and bonded to the flanges (8, 9) by explosion welding between the parallel flanges. A full-surface metal-to-metal bond is thus obtained, which has very good current-conducting properties at the contact surfaces between the flanges (8, 9) and the cathode plate (2). The ends of the mounting rail (1) projecting over the cathode plate (2) have a flangeless design and have oblique surfaces (6, 7) intersecting in the shape of a wedge on the underside.

Abstract: Contact assemblies, electroplating machines with contact assemblies, and methods for making contact assemblies that are used in the fabrication of microelectronic workpieces. The contact assemblies can be wet-contact assemblies or dry-contact assemblies. A contact assembly for use in an electroplating system can comprise a support member and a contact system coupled to the support member. The support member, for example, can be a ring or another structure that has an inner wall defining an opening configured to allow the workpiece to move through the support member along an access path. In one embodiment, the support member is a conductive ring having a plurality of posts depending from the ring that are spaced apart from one another by gaps. The contact system can be coupled to the posts of the support member. The contact system can have a plurality of contact members projecting inwardly into the opening relative to the support member and transversely with respect to the access path.

Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers, such as copper, onto a semiconductor workpiece. The workpiece holder includes electrodes which extend and are partially submerged in a liquid plating bath. The electrodes have a contact face which bears against the workpiece and conducts current therebetween. The submersible portions of the electrodes are partially covered with a dielectric layer or surface and partially covered with a conductive layer or surface. The conductive surface is preferably spaced from the contact face and placed in direct contact with the plating bath to allow diversion of some of the plating current directly between the electrode and plating bath. Associated methods are also described.

Abstract: An electrochemical reactor is used to electrofill damascene architecture for integrated circuits or for electropolishing magnetic disks. An inflatable bladder is used to screen the applied field during electroplating operations to compensate for potential drop along the radius of a wafer. The bladder establishes an inverse potential drop in the electrolytic fluid to overcome the resistance of a thin film seed layer of copper on the wafer.

Abstract: The invention relates to a substrate holder (1) for holding substrates (5), especially semiconductor wafers. The inventive holder comprises first and second components (3, 4). The substrate (5) can be received between said components. The invention is characterized in that the first component (3) is provided with a base body (7) and at least one support element (70) which can be moved in relation to said body and is elastically pre-stressed in the direction of the second component (4).

Abstract: Apparatus for securing a substrate in an electrochemical deposition system are provided. In one aspect, an apparatus is provided for securing a substrate in an electrochemical deposition system having a contact ring for contacting a plating surface of the substrate, a thrust plate having an annular shoulder at least partially formed therein, the thrust plate adapted to move axially relative to the contact surface, and a flexible seal disposed on the thrust plate comprising a base portion for attaching to the annular shoulder of the thrust plate and a body portion extending outwardly from the base portion and defining a sealing surface for engaging a back surface of the substrate. The apparatus may be disposed in an electrochemical deposition system.

Abstract: An electrochemical deposition method and apparatus that encapsulates a substrate's edge to prevent deposition thereon is generally provided. In one embodiment, the apparatus includes a contact ring, one or more electrical contact pads disposed on the contact ring and a thrust plate axially movable relative to the contact ring. A first seal is disposed inward of the contact pad and seals with the contact ring. A second seal is coupled to the thrust plate. The first and second seals are adapted to sandwich the substrate therebetween when the contact ring and the thrust plate are moved towards each other. In another embodiment, a third seal provides a seal between the thrust plate and contact ring, and, with the first and second seals, defines an exclusion zone encapsulating the substrate's edge. One or more electrical contact pads are protected from the electrolyte by being disposed within the exclusion zone.

Abstract: A wafer chuck for holding a wafer during electropolishing and/or electroplating of the wafer includes a top section, a bottom section, and a spring member. In accordance with one aspect of the present invention, the top section and the bottom section are configured to receive the wafer for processing. The spring member is disposed on the bottom section and configured to apply an electric charge to the wafer. In accordance with another aspect of the present invention, the spring member contacts a portion of the outer perimeter of the wafer. In one alternative configuration of the present invention, the wafer chuck further includes a seal member to seal the spring member from the electrolyte solution used in the electropolishing and/or electroplating process.

Abstract: A plating clamp assembly for use with a plating system including a plating bath and an article transport assembly to selectively engage an article to be plated as the article is moved through the plating bath by the article transport assembly to coat at least a selected portion of the surface of the article with material without creating faults on the selected portion of the surface of the article.

Abstract: An improvement to a cathode used in an electrorefining or electrowinning of copper. The cathode has a solid copper head bar with a horizontal groove on its undersurface. The upper edge of a stainless steel flat sheet has several holes along its width and is vertically inserted into the groove. The stainless steel sheet is then mechanically attached to the copper head bar by pressing the copper head bar against the stainless steel at the perforated points along the head bar. To increase the joint strength, the stainless steel sheet may be welded to the copper head bar at its upper edges at the underside of the head bar.

Abstract: The invention concerns a motorized device for adjusting the interelectrodic gap in mercury cathode electrolysis cells, mainly consisting of a frame, to which a number of anodes are suspended, movable in the vertical direction by means of a single jackscrew driven by a gear motor acting on double levers. The jackscrew with the motor and the lever system are fixed to a main frame, supported on the cell bottom by means of supports positioned on adjustable columns, while the above mentioned movable frame (also called sub-frame) carrying the anodes, is connected to the lever arms by means of four hinged supports. The shifting of the movable frame and, consequently, of the anodes can be controlled by a centralized and computerized system (which is not part of the invention) as a function of voltage and current variation measurements.

Abstract: A particular anode assembly can be used to supply a solution for any of a plating operation, a planarization operation, and a plating and planarization operation to be performed on a semiconductor wafer. The anode assembly includes a rotatable shaft disposed within a chamber in which the operation is performed, an anode housing connected to the shaft, and a porous pad support plate attached to the anode housing. The support plate has a top surface adapted to support a pad which is to face the wafer, and, together with the anode housing, defines an anode cavity. A consumable anode may be provided in the anode cavity to provide plating material to the solution. A solution delivery structure by which the solution can be delivered to said anode cavity is also provided. The solution delivery structure may be contained within the chamber in which the operation is performed. A shield can also be mounted between the shaft and an associated spindle to prevent leakage of the solution from the chamber.

Abstract: The present invention provides a bladder assembly for use in an electroplating cell. The bladder assembly comprises a mounting plate, a bladder, and an annular manifold. One or more inlets are formed in the mounting plate and are coupled to a fluid source. The manifold is adapted to be received in a recess formed in the lower face of the mounting plate and secures the bladder thereto. Outlets formed in the manifold communicate with the inlets to route a fluid from the fluid source into the bladder to inflate the same. A substrate disposed on a contact ring opposite the bladder is thereby selectively biased toward a seating surface of the contact ring. A pumping system 159 coupled at the backside of the substrate 121 provides a pressure or vacuum condition.

Abstract: An apparatus for electropolishing a wafer includes a wafer chuck and a stationary jet. The wafer chuck is configured to rotate and translate the wafer. The stationary jet is configured to apply an electrolyte to the wafer when the wafer is translated and rotated by the wafer chuck.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers, such as copper, onto a semiconductor workpiece. The workpiece holder includes electrodes which extend and are partially submerged in a liquid plating bath. The electrodes have a contact face which bears against the workpiece and conducts current therebetween. The submersible portions of the electrodes are partially covered with a dielectric layer or surface and partially covered with a conductive layer or surface. The conductive surface is preferably spaced from the contact face and placed in direct contact with the plating bath to allow diversion of some of the plating current directly between the electrode and plating bath. Associated methods are also described.

Abstract: An electroplating tool, which includes at least of a deposition cassette which is installed on a negative electrode and copper piece in an electroplating tank, or a copper rod is installed on the positive electrode of the electroplating room. 25 wafers are installed in the electroplating room, and both ends of each of the wafers are respectively fixed in place by a wafer clamp. The wafer clamp is in contact with the negative electrode, and is electrically connected to the wafer. The copper rod or copper piece that connects to the positive electrode can be a big piece that is installed on the outer side of the deposition cassette opening. It can also assume a comb-like arrangement of 25 pieces, respectively interlocked and extending into the gaps between the wafers. Moreover, in order to increase the even distribution during copper deposition, the present invention further adds a sound wave vibration apparatus at the bottom of and on the two sides of the electroplating tank.

Abstract: The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

Abstract: The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers.

Abstract: This device for lifting the anode frame of an electrolysis cell for the production of aluminium comprises:

Abstract: In the plating solution in the plating bath, a wafer and an anode electrode are opposed to each other, between which is interposed a disk-shaped auxiliary electrode having a diameter smaller than that of the wafer. This auxiliary electrode has a plurality of holes formed therein. Through these holes, the plating solution is uniformly supplied to between the wafer and the anode electrode. The auxiliary electrode is supplied with the same positive potential as that of the anode electrode. This forms electric lines of force directed from the auxiliary electrode and the anode electrode to the wafer. The closer provision of the anode electrode (the auxiliary electrode) compensates a drop in current density on the wafer resulting from the potential drop at the portion far from cathode terminals.

Abstract: An electrode assembly for the electrowinning of copper includes an electrode in the form of a plate. An edge strip is mounted on one edge of the electrode and serves to mask the edge from an electrolyte in which the assembly is immersed. A gap exists between the edge strip and the electrode on either side of the electrode. A sealing strip is located in each gap, and the sealing strips are discrete from the electrode and the edge strip. The sealing strips are resilient and can be stretched to remove the sealing strips from the gaps so that the sealing strips can be replaced.

Abstract: A semiconductor workpiece holder for use in processing a semiconductor workpiece includes a workpiece support operatively mounted to support a workpiece in position for processing. A finger assembly is operatively mounted upon the workpiece support and includes a finger tip. The finger assembly is movable between an engaged position in which the finger tip is engaged against the workpiece, and a disengaged position in which the finger tip is moved away from the workpiece. Preferably, at least one electrode forms part of the finger assembly and includes an electrode contact for contacting a surface of said workpiece. At least one protective sheath covers at least some of the electrode contact. According to one aspect of the invention, a sheathed electrode having a sheathed electrode tip is positioned against a semiconductor workpiece surface in a manner engaging the workpiece surface with said sheathed electrode tip.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

Abstract: A contact ring applies electroplating to a substrate having an electrically conductive portion. The contact ring comprises an annular insulative body, a conductive biasing member, and a seal member. The annular insulative body defines a central opening. The conductive biasing member is configured to exert a biasing force upon the substrate.

Abstract: A workholder for an ECM process comprises a set of jaws which define an interior workpiece holding region are mounted on the surface of a diaphragm which is movable under air pressure from a flat to a more generally spheroid shape with the injection of pressurized air between the diaphragm and a backing plate. As the air is injected, and the diaphragm becomes more spheroid, the jaws are moved a substantially equal distance away from the center axis of the workholding region. The workpiece, which typically incorporates or is mounted on a circular shaft, is placed in the center of the workholding region, and the air pressure is removed, causing the diaphragm to return to its original flat shape and the jaws to snap back to their original positions resting against the shaft.

Abstract: An electroplating rack includes a cathode flight bar from which depends an insulated rack bar over an acid bath. A clamp is fixed to the rack bar, and has a bridge electrically connected to the flight bar through a conducting core inside the insulated rack bar. The clamp has a main body made of plastic, which includes a slot in which protrudes the bridge. An electrically conducting spring clip is installed in the slot, and is formed of two arms continuously biased into a spreaded, opened condition in the slot. A screw carried by the main body, when rotated in a first direction, can force the spring clip into a closed condition, in which it can hold an article to be electroplated between its two arms, and in which one of the spring clip arms is forced against the bridge member. Thus, electrical current can pass through the rack flight bar and conducting core, then through the bridge member, the spring clip and finally into the article to be electroplated.

Abstract: This invention applies to an electrolytic cell busbar construction for the purpose of the electrolytic recovery of metals. The construction is formed so that the gap between the electrodes can be changed easily. All parts of the construction are in the form of an integral profile longitudinally to the cell and the support lugs of the electrodes in the cell are unnotched.

Abstract: The present invention is directed to an improved electroplating method, chemistry, and apparatus for selectively depositing tin/lead solder bumps and other structures at a high deposition rate pursuant to manufacturing a microelectronic device from a workpiece, such as a semiconductor wafer. An apparatus for plating solder on a microelectronic workpiece in accordance with one aspect of the present invention comprises a reactor chamber containing an electroplating solution having free ions of tin and lead for plating onto the workpiece. A chemical delivery system is used to deliver the electroplating solution to the reactor chamber at a high flow rate. A workpiece support is used that includes a contact assembly for providing electroplating power to a surface at a side of the workpiece that is to be plated. The contact contacts the workpiece at a large plurality of discrete contact points that isolated from exposure to the electroplating solution.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: An apparatus for electroplating a workpiece is disclosed in which the apparatus includes a workpiece holding structure. The workpiece holding structure includes a workpiece support having at least one surface that is disposed to engage a front side of the workpiece and at least one electrical contact disposed for contact with at least one corresponding electrical contact on a back-side of the workpiece. The workpiece includes one or more electrically conductive paths between the at least one corresponding electrical contact and a front-side of the workpiece to facilitate electroplating of the front-side surface.

Abstract: An electrode is disclosed having a coating on part of the electrode, e.g., a front face, comprising the oxides of tin, antimony, at least one platinum group metal and at least one valve metal. Another part of the electrode, such as a back face, has a coating comprising the oxides of at least one valve metal and at least one platinum group metal. The electrode can be generally plate-shaped and most desirably has at least one chamfered corner. The electrode is particularly useful in a cell wherein brine electrolyte is electrolyzed to prepare a disinfectant solution containing hypochlorite. The disinfectant solution can be especially serviceable, such as in maritime application, for treating water, e.g., freshwater as represented by desalinated water.

Abstract: A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.

Abstract: A gas sensor has a housing integrally formed with a caulked fixation portion. A detection element is inserted into the housing and fixed therein by caulking the caulked fixation portion via a sealing member such as a metallic ring. The caulked fixation portion is composed of a caulked portion and a buckling portion, and satisfies dimensional relationships of T1<T3<T2; 2<T2/T1, and 3<L/{(T1+T2)/2}. T1 is a minimum thickness of the caulked portion, and T2 is a maximum thickness of the caulked portion. T3 is an average thickness of the buckling portion, and L is a length of the caulked portion in an axial direction of the gas sensor.

Abstract: Electrolytic apparatus of support for lithographic printing plate is disclosed that electrolyticaly treats aluminum web in acid electrolyte wherein the guide roller for aluminum web transportation comprises a skeleton section formed with strong material of intenisty, a liquid contact section on the surface of the skeleton section, and nonwoven fabric which is provided on the contact surface with the aluminum web.

Abstract: An electrochemical etching step in a semiconductor device fabrication process increases the radius of curvature of edges of metal lines deposited on the semiconductor device. The metal lines are fabricated by forming a mask, electrodepositing the metal, and removing the mask, and the electro-chemical etching step in performed subsequently. The increased radius of curvature of the metal lines simplifies subsequent planarization and decreases line-to-line capacitance, thereby enhancing device performance. In an apparatus for performing the fabrication process, wires sown into a gasket which secures the semiconductor wafer and prevents electrolyte leakage, allows the gasket to function also as a component of the cathode. A more uniform metal deposition is created by a virtual anode, i.e., a metal plate having an aperture and being located between the anode and the cathode.