Abstract: A semiconductor device includes a high-breakdown-voltage transistor having a semiconductor layer. The semiconductor layer has an element portion and a wiring portion. The element portion has a first wiring on a front side of the semiconductor layer and a backside electrode on a back side of the semiconductor layer. The element portion is configured as a vertical transistor that causes an electric current to flow in a thickness direction of the semiconductor layer between the first wiring and the backside electrode. The backside electrode is elongated to the wiring portion. The wiring portion has a second wiring on the front side of the semiconductor layer. The wiring portion and the backside electrode provide a pulling wire that allows the electric current to flow to the second wiring.

Abstract: A semiconductor device includes a device isolation pattern, a gate line, and an epitaxial pattern. The device isolation pattern is disposed in a semiconductor substrate to define an active area. The gate line intersects the active area. The epitaxial pattern fills a recess region in the active area at one side of the gate line and includes a different constituent semiconductor element than the semiconductor substrate. The recess region includes a first inner sidewall that is adjacent to the device isolation pattern and extends in the lengthwise direction of the gate, and a second inner sidewall that extends in the direction perpendicular to the lengthwise direction of the gate line. The active area forms the first inner sidewall of the recess, while the device isolation layer forms at least a portion of the second inner sidewall of the recess. The epitaxial pattern contacts the first inner sidewall and the second inner sidewall of the recess region.

Abstract: Disclosed is a transistor that incorporates epitaxially deposited source/drain semiconductor films and a method for forming the transistor. A crystallographic etch is used to form recesses between a channel region and trench isolation regions in a silicon substrate. Each recess has a first side, having a first profile, adjacent to the channel region and a second side, having a second profile, adjacent to a trench isolation region. The crystallographic etch ensures that the second profile is angled so that all of the exposed recess surfaces comprise silicon. Thus, the recesses can be filled by epitaxial deposition without divot formation. Additional process steps can be used to ensure that the first side of the recess is formed with a different profile that enhances the desired stress in the channel region.

Abstract: Atomic layer deposition is enhanced using plasma. Plasma begins prior to flowing a second precursor into a chamber. The second precursor reacts with a first precursor to deposit a layer on a substrate. The layer may include at least one element from each of the first and second precursors. The layer may be TaN, and the precursors may be TaF5 and NH3. The plasma may begin during purge gas flow between a pulse of the first precursor and a pulse of the second precursor. Thermal energy assists the reaction of the precursors to deposit the layer on the substrate. The thermal energy may be greater than generally accepted for ALD (e.g., more than 300 degrees Celsius).

Abstract: A semiconductor device which eliminates the need for high fillability through a simple process and a method for manufacturing the same. A high breakdown voltage lateral MOS transistor including a source region and a drain region is completed on a surface of a semiconductor substrate. A trench which surrounds the transistor when seen in a plan view is made in the surface of the semiconductor substrate. An insulating film is formed over the transistor and in the trench so as to cover the transistor and form an air-gap space in the trench. Contact holes which reach the source region and drain region of the transistor respectively are made in an interlayer insulating film.

Abstract: A semiconductor power device includes a substrate, a first semiconductor layer on the substrate, a second semiconductor layer on the first semiconductor layer, and a third semiconductor layer on the second semiconductor layer. At least a recessed epitaxial structure is disposed within a cell region and the recessed epitaxial structure may be formed in a pillar or stripe shape. A first vertical diffusion region is disposed in the third semiconductor layer and the recessed epitaxial structure is surrounded by the first vertical diffusion region. A source conductor is disposed on the recessed epitaxial structure and a trench isolation is disposed within a junction termination region surrounding the cell region. In addition, the trench isolation includes a trench, a first insulating layer on an interior surface of the trench, and a conductive layer filled into the trench, wherein the source conductor connects electrically with the conductive layer.

Abstract: The present invention discloses a transistor having the saddle fin structure. The saddle fin transistor of the present invention has a structure in which a landing plug contact region, particularly, a landing plug contact region on an isolation layer is elevated such that the landing plug contact SAC (Self Aligned Contact) fail can be prevented.

Abstract: A semiconductor device includes a semiconductor substrate, a first diffusion region, a gate insulating film, a gate electrode, a second diffusion region and a contact plug. The semiconductor substrate includes a base and at least a pillar. The first diffusion region is disposed in the base. The gate insulating film covers a side surface of the pillar. The gate electrode is separated from the pillar by the gate insulating film. The second diffusion region is disposed in an upper portion of the pillar. The contact plug is connected to the second diffusion region. The contact plug is connected to the entirety of the top surface of the pillar.

Abstract: A device containing a printed wire board (PWB), wherein the PWB comprises a fluid channel, wherein the fluid channel is a closed channel having a noble metal-containing layer on a surface of the fluid channel is disclosed. A method of making a device containing providing a substrate of a PWB; and fabricating a fluid channel in the PWB, wherein the fluid channel is a closed channel having a noble meal-containing layer on a surface of the fluid channel is disclosed. Also, a method containing providing a printed wire board (PWB), wherein the PWB comprises a fluid channel, wherein the fluid channel is a closed channel having a noble metal-containing layer on a surface of the fluid channel, and flowing fluid the fluid channel is disclosed.

Abstract: A semiconductor device including a drain region of a first conductivity type formed on a semiconductor substrate; an element forming region that is provided on the drain region and that has a concave portion reaching the drain region; a gate electrode disposed in the concave portion; a superjunction structure portion that is disposed in the element forming region and that is formed by alternately arranging a drift layer of the first conductivity type penetrated by the concave portion and a resurf layer of a second conductivity type being in contact with the drift layer on the semiconductor substrate; and a base region of the second conductivity type that is disposed on the superjunction structure portion so as to be in contact with the drift layer in the element forming region, that is penetrated by the concave portion, and that faces the gate electrode with the gate insulating film therebetween.

Abstract: A high-voltage LDMOSFET includes a semiconductor substrate, in which a gate well is formed. A source well and a drain well are formed on either side of the gate well, and include insulating regions within them that do not reach the full depth. An insulating layer is disposed on the substrate, covering the gate well and a portion of the source well and the drain well. A conductive gate is disposed on the insulating layer. Biasing wells are formed adjacent the source well and the drain well. A deep well is formed in the substrate such that it communicates with the biasing wells and the gate well, while extending under the source well and the drain well, such as to avoid them. Biasing contacts at the top of the biasing wells bias the deep well, and therefore also the gate well.

Abstract: An offset gate semiconductor device includes a substrate and an isolation feature formed in the substrate. An active region is formed in the substrate substantially adjacent to the isolation feature. An interface layer is formed on the substrate over the isolation feature and the active region. A polysilicon layer is formed on the interface layer over the isolation feature and the active region. A trench being formed in the polysilicon layer over the isolation feature. The trench extending to the interface layer. A fill layer is formed to line the trench and a metal gate formed in the trench.

Abstract: A fabrication method of a semiconductor device includes: forming a gate insulating film and a gate electrode on an N type well; forming first source/drain regions by implanting a first element in regions of the N type well on both sides of the gate electrode, the first element being larger than silicon and exhibiting P type conductivity; forming second source/drain regions by implanting a second element in the regions of the N type well on the both sides of the gate electrode, the second element being smaller than silicon and exhibiting P type conductivity; and forming a metal silicide layer on the source/drain regions.

Abstract: An idling time period after applying a bias to a conversion element until a start of an accumulation of the conversion element for deriving an image and an accumulation period from the start of the accumulation to a termination of the accumulation are measured. An offset correction of the image is conducted by using a dark current accumulation charge quantity in the accumulation calculated based on the measured idling time period and accumulation period and stored dark current response characteristics. Thus, even just after applying the bias to the conversion element, the offset correction can be properly conducted. An imaging apparatus which can execute a good radiographing without increasing costs and a size even just after applying the bias to the conversion element is provided.

Abstract: A MOS transistor suppressing a short channel effect includes a substrate, a first diffusion region and a second diffusion region separated from each other by a channel region in an upper portion of the substrate, a gate insulating layer including a first gate insulating layer disposed on a surface of the substrate in the channel region and a second gate insulating layer having a specified depth from the surface of the substrate to be disposed between the first diffusion region and the channel region, and a gate electrode disposed on the first gate insulating layer.

Abstract: The invention is related to a semiconductor device with alternately arranged P-type and N-type thin semiconductor layers and method for manufacturing the same. For P-type device, the method includes trench formation, thermal oxide formation on trench sidewalls, N-type silicon formation in trenches, N-type impurity diffusion through thermal oxide into P-type epitaxial layer, oxidation of N-type silicon in trenches and oxide removal. In the semiconductor device, N-type thin semiconductor layers are formed by N-type impurity diffusion through oxide to P-type epitaxial layers, and trenches are filled with oxide. With this method, relatively low concentration impurity in high voltage device can be realized by current mass production process, and the device development cost and manufacturing cost are decreased.

Abstract: A recessed channel transistor includes an isolation layer provided in a semiconductor substrate to define an active region. A trench is provided in the semiconductor substrate to extend across the active region. A gate insulation layer covers a sidewall and a bottom face of the trench and an upper face of the semiconductor substrate adjacent to an upper edge of the trench, wherein a portion of the gate insulation layer on the upper surface of the semiconductor substrate adjacent to the upper edge of the trench and on the sidewall of the trench extending to a first distance downwardly from the upper edge of the trench has a thickness greater than that of a portion of the gate insulation layer on the remaining sidewall and the bottom face of the trench. A gate electrode fills up the trench having the gate insulation layer formed therein.

Abstract: Provided are a semiconductor device and a method of fabricating the same. At least one mold structure defining at least one first opening is formed on a substrate, wherein the mold structure comprises first mold patterns and second mold patterns that are sequentially and alternatingly stacked. Thereafter, side surfaces of the first mold patterns are selectively etched to form undercut regions between the second mold patterns. Then, a semiconductor layer is formed to cover a surface of the mold structure where the undercut regions are formed, and gate patterns are formed, which fill respective undercut regions where the semiconductor layer is formed.

Abstract: A stack pad layers including a first pad oxide layer, a pad nitride layer, and a second pad oxide layer are formed on a semiconductor-on-insulator (SOI) substrate. A deep trench extending below a top surface or a bottom surface of a buried insulator layer of the SOI substrate and enclosing at least one top semiconductor region is formed by lithographic methods and etching. A stress-generating insulator material is deposited in the deep trench and recessed below a top surface of the SOI substrate to form a stress-generating buried insulator plug in the deep trench. A silicon oxide material is deposited in the deep trench, planarized, and recessed. The stack of pad layer is removed to expose substantially coplanar top surfaces of the top semiconductor layer and of silicon oxide plugs. The stress-generating buried insulator plug encloses, and generates a stress to, the at least one top semiconductor region.

Abstract: A method of forming a buried digit line is disclosed. Sacrificial spacers are formed along the sidewalls of an isolation trench, which is then filled with a sacrificial material. One spacer is masked while the other spacer is removed and an etch step into the substrate beneath the removed spacer forms an isolation window. Insulating liners are then formed along the sidewalls of the emptied trench, including into the isolation window. A digit line recess is then formed through the bottom of the trench between the insulating liners, which double as masks to self-align this etch. The digit line recess is then filled with metal and recessed back, with an optional prior insulating element deposited and recessed back in the bottom of the recess.

Abstract: A method for producing an electrode in a semiconductor layer includes providing a substrate with a first surface and a second surface, forming a first trench having sidewalls and extending into the substrate from the first surface and forming a plug in the first trench. The method further includes reducing a thickness of the semiconductor substrate by removing semiconductor material beginning at the first surface so as to at least partially uncover sidewalls of the plug and forming a semiconductor layer on the semiconductor substrate, the semiconductor layer at least partially covering the uncovered sidewalls of the plug, and having an upper surface.

Abstract: A trench type IGBT as disclosed herein includes a plurality of channel regions having one threshold voltage for the normal operation of the device and a plurality of channel regions having a threshold voltage higher than the threshold voltage for the normal operation of the device.

Abstract: Winged via structures to increase overlay margin are generally described. In one example, a method comprises depositing a sacrificial layer to an interlayer dielectric, the interlayer dielectric being coupled with a semiconductor substrate, forming at least one trench structure in the sacrificial layer wherein the trench structure comprises a first direction along a length of the trench structure and a second direction along a width of the trench structure wherein the second direction is substantially perpendicular to the first direction, depositing a light sensitive material to the trench structure and the sacrificial layer, and patterning at least one winged via structure in the light sensitive material to overlay the trench structure wherein the winged via structure extends in the second direction beyond the width of the trench structure onto the sacrificial layer.

Abstract: A memory cell includes a FinFET select device and a memory element. In some embodiments a memory cell has a contact element coupled between a surface of the fin and the memory element.

Abstract: A semiconductor device includes a gate electrode having ends that overlap isolation regions, wherein the gate electrode is located over an active region located within a semiconductor substrate. A gate oxide is located between the gate electrode and the active regions, and source/drains are located adjacent the gate electrode and within the active region. An etch stop layer is located over the gate electrode and the gate electrode has at least one electrical contact that extends through the etch stop layer and contacts a portion of the gate electrode that in one embodiment overlies the active region, and in another embodiment is less than one alignment tolerance from the active region.

Abstract: Disclosed is a transistor that incorporates epitaxially deposited source/drain semiconductor films and a method for forming the transistor. A crystallographic etch is used to form recesses between a channel region and trench isolation regions in a silicon substrate. Each recess has a first side, having a first profile, adjacent to the channel region and a second side, having a second profile, adjacent to a trench isolation region. The crystallographic etch ensures that the second profile is angled so that all of the exposed recess surfaces comprise silicon. Thus, the recesses can be filled by epitaxial deposition without divot formation. Additional process steps can be used to ensure that the first side of the recess is formed with a different profile that enhances the desired stress in the channel region.

Abstract: A charge trap type non-volatile memory device has memory cells formed on a silicon substrate at a predetermined interval via an element isolation trench along a first direction in which word lines extend. Each of the memory cells has a tunnel insulating film formed on the silicon substrate, a charge film formed on the tunnel insulating film, and a common block film formed on the charge film. The common block film is formed in common with the memory cells along first direction. An element isolation insulating film buried in the element isolation trench has an upper portion of a side wall of the element isolation insulating film which contacts with a side wall of the charge film in each of the memory cells and a top portion of the element isolation insulating film which contacts with the common block film. A control electrode film is formed on the common block film.

Abstract: Methods of forming pad structures are provided in which a first contact region and second contact regions are formed in an active region of a substrate. An insulating interlayer is formed on the substrate. The insulating interlayer has a first opening that exposes the first contact region and the second contact regions. First conductive pads are formed in the first opening. Each first conductive pad is in electrical contact with a respective one of the second contact regions. Spacers are formed, where each spacer is on a sidewall of a respective one of the first conductive pads. Finally, a second conductive pad is formed between the first conductive pads and in electrical contact with the first contact region to complete the pad structure.

Abstract: An idling time period after applying a bias to a conversion element until a start of an accumulation of the conversion element for deriving an image and an accumulation period from the start of the accumulation to a termination of the accumulation are measured. An offset correction of the image is conducted by using a dark current accumulation charge quantity in the accumulation calculated based on the measured idling time period and accumulation period and stored dark current response characteristics. Thus, even just after applying the bias to the conversion element, the offset correction can be properly conducted. An imaging apparatus which can execute a good radiographing without increasing costs and a size even just after applying the bias to the conversion element is provided.

Abstract: A semiconductor device includes an active region. A gate electrode is disposed on the active region. An isolation region adjoins the active region, and is recessed with respect to a top surface of the active region underlying the gate electrode. The isolation region may be recessed a depth substantially equal to a height of the gate electrode. In some embodiments, the gate electrode is configured to support current flow through the active region along a first direction, and a tensile stress layer covers the gate electrode and is configured to apply a tensile stress to the gate electrode along a second direction perpendicular to the first direction. The tensile stress layer may cover the recessed isolation region and portions of the active region between the isolation region and the gate electrode. In further embodiments, an interlayer insulating film is disposed on the tensile stress layer and is configured to apply a tensile stress to the gate electrode along the second direction.

Abstract: An integrated circuit device with a semiconductor body and a method for the production of a semiconductor device a provided. The semiconductor body comprises a cell field with a drift zone of a first conduction type. In addition, the semiconductor device comprises an edge region surrounding the cell field. Field plates with a trench gate structure are arranged in the cell field, and an edge trench surrounding the cell field is provided in the edge region. The front side of the semiconductor body is in the edge region provided with an edge zone of a conduction type complementing the first conduction type with doping materials of body zones of the cell field. The edge zone of the complementary conduction type extends both within and outside the edge trench.

Abstract: In a semiconductor device including multiple unit cells arranged in an array, transistors are affected by a stress from an STI at different degrees depending on the position in the array. As a result, a variation occurs in transistor characteristic. In a semiconductor device according to the present invention, each of predetermined transistors in outermost unit blocks in the array has a transistor size according to the stress from the STI.

Abstract: A method for producing an integrated circuit including a trench transistor and an integrated circuit is disclosed.

Abstract: Disclosed is a method of fabricating a semiconductor device. The method can include forming a gate material layer on an inner surface of a trench which extends into a part of a semiconductor substrate by passing through an insulating layer formed on the semiconductor substrate, etching the gate material layer to an initial height in the trench above a top surface of the semiconductor substrate, etching the insulating layer such that the thickness of the insulating layer is reduced, forming a gate electrode in the trench by secondarily etching the etched gate material layer, and removing the insulating layer having the reduced thickness.

Abstract: A substrate prevented from being deformed due to thermal stress or deposition stress includes a deformation preventing layer arranged on one surface of the substrate. The substrate can include a thin film transistor arranged on one surface of the substrate and the deformation preventing layer, arranged on the another surface of the substrate, and including at least one layer.

Abstract: An integrated circuit is disclosed that includes a first layer made of active semiconductor material and extending along a first side of a buried layer, and trench structures, which cut through the layer made of active semiconductor material and have dielectric wall regions, whereby the dielectric wall regions isolate electrically subregions of the layer, made of active semiconductor material in the lateral direction, and whereby the trench structures, furthermore, have first inner regions, which are filled with electrically conductive material and contact the buried layer in an electrically conductive manner. The integrated circuit is notable in that the first wall regions of the trench structures completely cut through the buried layer and the second wall regions of the trench structures extend into the buried layer, without cutting it completely. Furthermore, a method for manufacturing such an integrated circuit is disclosed.

Abstract: The present invention discloses semiconductor devices that can be manufactured utilizing standard process of manufacturing and that can hold information. In accordance with a presently preferred embodiment of the present invention, one or more semiconductor devices can be formed in a well on a substrate where isolation trenches surround one or more devices to create storage regions (floating wells) that is capable of holding a charge. Depending on the charge in the storage region (floating well), it can represent information. The semiconductor devices of the present invention can be manufactured using the standard process of manufacturing (bulk cmos processing).

Abstract: A trench MIS device is formed in a P-epitaxial layer that overlies an N-epitaxial layer and an N+ substrate. In one embodiment, the device includes an N-type drain-drift region that extends from the bottom of the trench to the N-epitaxial layer. Preferably, the drain-drift region is formed at least in part by fabricating spacers on the sidewalls of the trench and implanting an N-type dopant between the sidewall spacers and through the bottom of the trench. The drain-drift region can be doped more heavily than the conventional “drift region” that is formed in an N-epitaxial layer. Thus, the device has a low on-resistance. The device can be terminated by a plurality of polysilicon-filled termination trenches located near the edge of the die, with the polysilicon in each termination trench being connected to the mesa adjacent the termination trench.

Abstract: On a semiconductor substrate, a well is formed. In the well, one MOS transistor including a gate electrode, a source region, a source field limiting layer and a source/drain region, and another MOS transistor including a gate electrode, a drain electrode, a drain field limiting layer and a source/drain region are formed. The one and another MOS transistors are connected in series through the source/drain region common to the two transistors. Accordingly, a semiconductor device can be provided in which increase in pattern layout area is suppressed when elements including a high-breakdown voltage MOS transistor are to be connected in series.

Abstract: The invention includes semiconductor constructions having trenched isolation regions. The trenches of the trenched isolation regions can include narrow bottom portions and upper wide portions over the bottom portions. Electrically insulative material can fill the upper wide portions while leaving voids within the narrow bottom portions. The trenched isolation regions can be incorporated into a memory array, and/or can be incorporated into an electronic system. The invention also includes methods of forming semiconductor constructions.

Abstract: A method facilitates generally simultaneously fabricating a number of shallow trench isolation structures such that some selected ones of the shallow trench isolation structures have rounded corners and other selected ones of the shallow trench isolation structures do not have rounded corners. The method includes forming patterned photoresist over a hard mask so that portions of the hard mask are exposed over a portion of a cell region and over a portion of a periphery region, and then removing the exposed hard mask layer in the periphery region while removing a portion of the exposed hard mask layer in the cell region. A trench having rounded corners is then partially formed in the periphery region and more of the hard mask layer is removed in the cell region, before the trench in the periphery region is deepened while a trench in the cell region is formed.

Abstract: A method of forming a buried digit line is disclosed. Sacrificial spacers are formed along the sidewalls of an isolation trench, which is then filled with a sacrificial material. One spacer is masked while the other spacer is removed and an etch step into the substrate beneath the removed spacer forms an isolation window. Insulating liners are then formed along the sidewalls of the emptied trench, including into the isolation window. A digit line recess is then formed through the bottom of the trench between the insulating liners, which double as masks to self-align this etch. The digit line recess is then filled with metal and recessed back, with an optional prior insulating element deposited and recessed back in the bottom of the recess.

Abstract: The present invention provides a strained/SGOI structure that includes an active device region of a relaxed SiGe layer, a strained Si layer located atop the relaxed SiGe layer, a raised source/drain region located atop a portion of the strained Si layer, and a stack comprising at least a gate dielectric and a gate polySi located on another portion of the strained Si layer; and a raised trench oxide region surrounding the active device region. The present invention also provides a method of forming such a structure. In the inventive method, the gate dielectric is formed prior to trench isolation formation thereby avoiding many of the problems associated with prior art processes in which the trench oxide is formed prior to gate dielectric formation.

Abstract: An integrated power semiconductor device has an isolation structure having two or more isolation trenches, and one or more regions in between the isolation trenches, and a bias arrangement coupled to the regions to divide a voltage across the isolation structure between the isolation trenches. By dividing the voltage, the reverse breakdown voltage characteristics such as voltage level, reliability and stability can be improved for a given area of device, or for a given complexity of device, and avalanche breakdown at weaknesses in isolation structures can be reduced or avoided.

Abstract: A semiconductor device includes a gate insulation film provided on a semiconductor substrate, a gate electrode provided on the gate insulation film, a pair of first diffusion layers, a pair of second diffusion layers which are provided in the semiconductor substrate in such a manner that the gate electrode is interposed between the second diffusion layers, the second diffusion layers have a lower impurity concentration than the first diffusion layers, contact wiring lines provided on the first diffusion layers, respectively, and a first insulation layer which is an insulation layer formed in at least one of the second diffusion layers between the gate electrode and the contact wiring lines, the first insulation layer having a greater depth in the semiconductor substrate than the first diffusion layer and a less depth than the second diffusion layer.

Abstract: Deep trench isolation structures and methods of formation thereof are disclosed. Several methods of and structures for increasing the threshold voltage of a parasitic transistor formed proximate deep trench isolation structures are described, including implanting a channel stop region into the bottom surface of the deep trench isolation structures, partially filling a bottom portion of the deep trench isolation structures with an insulating material, and/or filling at least a portion of the deep trench isolation structures with a doped polysilicon material.

Abstract: A punch-through type IGBT generally has a thick p++-type collector layer. Therefore, the FWD need be externally attached to the IGBT when the IGBT is used as a switching element in an inverter circuit for driving a motor load, and thus the number of processes and components increases. In the invention, trenches are formed penetrating through a collector layer and reaching a buffer layer. A collector electrode is formed in the trenches, too. With this structure, a current path is formed between an emitter electrode and the collector electrode without through the collector layer and functions as the FWD.

Abstract: An n-type drift region includes an active element region and a peripheral region. A p-type base region is formed at least in the active element region. A trench-type gate electrode is formed in each of the active element region and the peripheral region. An n-type source region formed in the base region. A plurality of p-type column regions is selectively formed separately from one another in each of the active element region and the peripheral region. In a peripheral region, a p-type guard region is formed below the gate electrode. In the active element region, the p-type guard region is not formed below the gate electrode. As a result, it is possible to hold the breakdown voltage in the peripheral region at a higher level than in the active element region while maintaining the low ON resistance due to a superjunction structure and to raise the breakdown voltage performance of the semiconductor device.

Abstract: A NAND nonvolatile semiconductor memory device that has a memory cell array region and a selection gate region, has a semiconductor layer; a gate insulating film disposed on said semiconductor layer; a plurality of first electrode layers selectively disposed on said gate insulating film; a first device isolation insulating film formed in said memory cell array region and extends from between said adjacent first electrode layers into said semiconductor layer for device isolation; a second device isolation insulating film formed in said selection gate region and extends from between said adjacent first electrode layers into said semiconductor layer for device isolation; an interpoly insulating film formed at least on the top of said first electrode layers and said first device isolation insulating film in said memory cell array region; a second electrode layer disposed on said interpoly insulating film; and a third electrode layer disposed on said second electrode layer, said second device isolation insulating

Abstract: A semiconductor structure includes a first semiconductor strip extending from a top surface of the semiconductor substrate into the semiconductor substrate, wherein the first semiconductor strip has a first height. A first insulating region is formed in the semiconductor substrate and surrounding a bottom portion of the first semiconductor strip, wherein the first insulating region has a first top surface lower than a top surface of the first semiconductor strip. A second semiconductor strip extends from a top surface of the semiconductor substrate into the semiconductor substrate, wherein the second semiconductor strip has a second height greater than the first height. A second insulating region is formed in the semiconductor substrate and surrounding a bottom portion of the second semiconductor strip, wherein the second insulating region has a second top surface lower than the first top surface, and wherein the first and the second insulating regions have substantially same thicknesses.