Abstract: A semiconductor package comprises: a substrate comprising a semiconductor device; a cap comprising a seal ring disposed over a surface of the cap; and a gap between the substrate and the surface of the cap. The seal ring comprises a tread comprising at least two columns.

Abstract: A backside illumination type solid-state imaging device includes stacked semiconductor chips which are formed such that two or more semiconductor chip units are bonded to each other, at least a first semiconductor chip unit is formed with a pixel array and a first multi-layered wiring layer, and a second semiconductor chip unit is formed with a logic circuit and a second multi-layered wiring layer, a connection wire which connects the first semiconductor chip unit and the second semiconductor chip unit, and a first shield wire which shields adjacent connection wires in one direction therebetween.

Abstract: A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

Abstract: An encapsulating sheet includes a transparent layer in which a concave portion that is dented from the surface inwardly is formed and a phosphor encapsulating layer which fills the concave portion. The transparent layer is formed from a transparent composition containing a first silicone resin composition and the phosphor encapsulating layer is formed from a phosphor encapsulating composition containing a phosphor and a second silicone resin composition.

Abstract: An image pickup apparatus includes a semiconductor chip including a light receiving section, a frame-like spacer arranged on the semiconductor chip to surround the light receiving section, a transparent flat plate section arranged on the semiconductor chip via the spacer and having a plan view dimension larger than a plan view dimension of the spacer and smaller than a plan view dimension of the semiconductor chip, and a reinforcing member for filling a gap between the semiconductor chip and the transparent flat plate section on the outer side of the spacer and having a plan view dimension larger than the plan view dimension of the transparent flat plate section and smaller than the plan view dimension of the semiconductor chip.

Abstract: The present invention provides a sealing material for a solar cell that seals a solar cell element of a solar cell in a short time in the production of a solar cell module, thereby enabling efficient production of solar cell modules. The sealing material for a solar cell of the present invention has a feature of containing 100 parts by weight of a modified butene-based resin that is produced by graft-modifying a butene-ethylene copolymer having a butene content of 1 to 25% by weight with maleic anhydride and has a total content of the maleic anhydride of 0.1 to 3% by weight, and 0.1 to 15 parts by weight of a silane compound having an epoxy group.

Abstract: An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.

Abstract: A light-receiving package for flat-plate mounting which can make monitor reception sensitivity of an optical signal constant without increasing the size of a module.

Abstract: In a method for assembling a camera module, a sensor module, a lens holder, and a lens assembly are first provided. The sensor module includes a substrate and a sensor positioned on the substrate. The lens holder is positioned on the substrate and accommodates the sensor. The lens assembly is held in the lens holder. At least one of the lens holder and the lens assembly has a chamfer at an end thereof opposite to the substrate and located between the lens holder and the lens assembly. Then, curable adhesive is applied to the chamfer. The tilt of the lens is adjusted until the lens assembly is optically aligned with the sensor. The curable adhesive is cured.

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract: A semiconductor detector head comprises a detector chip having a front side and a back side, and a substrate on the back side of said detector chip. Contact points are located on at least one of said substrate and said detector chip. A first set of contact pins protrude on an opposite side of said substrate than said detector chip. At least one of the contact pins of said first set is conductively coupled to at least one of said contact points. A base plate holds a second set of contact pins that protrude from said base plate towards the contact pins of said first set. Electric connections are made between matching pairs of contact pins of said first and second sets.

Abstract: There is provided a light emitting apparatus including: at least one pair of lead frames; a light emitting device electrically connected to the lead frames to emit ultraviolet rays; a body including a side wall surrounding the light emitting device, and a groove portion formed in an upper surface of the side wall to receive an adhesive; and a lens part disposed above the light emitting device and fixed to the upper surface of the side wall of the body by the adhesive.

Abstract: The present invention provides a sealing material for a solar cell that seals a solar cell element of a solar cell in a short time in the production of a solar cell module, thereby enabling efficient production of solar cell modules. The sealing material for a solar cell of the present invention has a feature of containing 100 parts by weight of a modified butene-based resin that is produced by graft-modifying a butene-ethylene copolymer having a butene content of 1 to 25% by weight with maleic anhydride and has a total content of the maleic anhydride of 0.1 to 3% by weight, and 0.1 to 15 parts by weight of a silane compound having an epoxy group.

Abstract: An embodiment of the invention provides a chip package, which includes: a semiconductor substrate having a device region; a package layer disposed on the semiconductor substrate; a spacing layer disposed between the semiconductor substrate and the package layer and surrounding the device region; and an auxiliary pattern having a hollow pattern formed in the spacing layer, a material pattern located between the spacing layer and the device region, or combinations thereof.

Abstract: The invention relates to a circuit board having a light source for illumination purposes, having at least one LED electrically conductively connected to conductors of the circuit board, and the light thereof being converted into directed light by means of at least one mirror disposed on the circuit board, characterized in that the mirror is designed as a reflective coating printed onto the circuit board.

Abstract: A light emitting device package according to embodiments comprises: a package body; a lead frame on the package body; a light emitting device supported by the package body and electrically connected with the lead frame; a filling material surrounding the light emitting device; and a phosphor layer comprising phosphors on the filling material.

Abstract: A system for mounting solar modules comprising a plurality of racks and clamps. Each rack has an inclined upper mounting surface to support one of the solar modules and an inclined lower mounting surface to support one of the other solar modules. Each upper mounting surface and lower mounting surface define a slot. One of the clamps slidably receivable by a slot of one of the upper mounting surfaces and configured to secure the one solar modules to the upper mounting surfaces and an other of the clamps slidably receivable by a slot of one of the lower mounting surfaces and configured to secure said one of the other solar modules to one of the lower mounting surfaces. Each rack has a tray having a first tower supporting the upper mounting surface and a second tower supporting the lower mounting surface.

Abstract: A camera module includes a lens and a lens holder. The lens has a connecting barrel. The lens holder includes a base plate, a number of claws extending up from the base plate and sleeving on the connecting barrel, a fixing block extending up from the base plate and defining a fixing hole, a tightening ring sleeving on the claws and having two end sections sandwiching the fixing block. The tightening ring also includes a tightening screw for threadedly passing the threaded holes to tightening the tightening ring such that the claws deforms and grasps the connecting barrel.

Abstract: An image capturing unit includes: a glass substrate having a first surface and a second surface on an opposite side to the first surface, with a first wiring pattern being provided upon at least the first surface; an image sensor that is electrically connected to the first wiring pattern, and that is mounted upon the first surface of the glass substrate; and a piezoelectric element that is disposed upon the first surface or upon the second surface, and that is electrically connected to the first wiring pattern.

Abstract: A proximity sensor with multi-directional movement detection is provided. The proximity sensor may include an ASIC chip; at least three light sources configured to emit light in a particular sequence; and a photo detector configured to receive light and generate an output signal. The multi-directional proximity sensor may have a first proximity sensor with at least one side surface and a second proximity sensor connected to the first proximity sensor configured to detect object movement over a plane substantially parallel to the at least one side surface of the first proximity sensor. The multi-directional movement detection proximity sensor may include a PCB, in which more than one proximity sensor may be disposed on the PCB and operatively integrated to detect multi-directional movement.

Abstract: A micro electro mechanical systems (MEMS sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon., a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.

Abstract: A solar module includes a solar cell, a heat spreader layer disposed above the solar cell, and a cell interconnect disposed above the solar cell. From a top-down perspective, the heat spreader layer at least partially surrounds an exposed portion of the cell interconnect.

Abstract: A method for manufacturing a semiconductor device including: forming a wiring layer on a surface side of a first semiconductor wafer; forming a buried film so as to fill in a level difference on the wiring layer, the level difference being formed at a boundary between a peripheral region of the first semiconductor wafer and an inside region being on an inside of the peripheral region, and the level difference being formed as a result of a surface over the wiring layer in the peripheral region being formed lower than a surface over the wiring layer in the inside region, and making the surfaces over the wiring layer in the peripheral region and the inside region substantially flush with each other; and opposing and laminating the surfaces over the wiring layer formed in the first semiconductor wafer to a desired surface of a second semiconductor wafer.

Abstract: An optoelectronic semiconductor component includes a carrier with a carrier top, at least one optoelectronic semiconductor chip mounted on the carrier top and having a radiation-transmissive substrate and a semiconductor layer sequence which includes at least one active layer that generates electromagnetic radiation, and a reflective potting material, wherein, starting from the carrier top, the potting material surrounds the semiconductor chip in a lateral direction at least up to half the height of the substrate.

Abstract: One pixel is divided into a first region including a first light emitting element and a second region including a second light emitting element, wherein the first region emits light in one direction and the second region emits light in the direction opposite to that of the first region. Independently driving the first light emitting element and the second light emitting element allows images to be displayed independently on the surface.

Abstract: An optoisolator leadframe assembly includes: an emitter leadframe part including a first rail and a plurality of emitter leadframe units, each rail including two rows of emitter leadframes, each having a die-mounting pad; and a receiver leadframe part including a second rail and a plurality of receiver leadframe units, each including two rows of receiver leadframes, each having a die-mounting pad. The die-mounting pads of the emitter leadframes of each row of each of the emitter leadframe units are respectively aligned with and spaced apart from the die-mounting pads of the receiver leadframes of an adjacent row of an adjacent one of the receiver leadframe units. Each of the emitter and receiver leadframe parts is a single piece.

Abstract: A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

Abstract: According to one embodiment, a radiation detector includes a substrate, a scintillator layer, a moisture-proof body and an adhesive layer. The substrate is partitioned into at least an active area and a bonding area. The substrate includes a photoelectric conversion element located in the active area and configured to convert fluorescence to an electrical signal, an organic resin protective layer located at an outermost layer in the active area, and an inorganic protective film located at an outermost layer of the bonding area. The scintillator layer is formed on the organic resin protective layer so as to cover the photoelectric conversion element and configured to convert radiation to the fluorescence. The moisture-proof body is formed so as to cover the scintillator layer. The adhesive layer is formed on the inorganic protective film and bonds the moisture-proof body to the substrate.

Abstract: An optoelectronic component having an outer surface facing the environment of the optoelectronic component and which is formed by a hydrophobic layer applied at least partly on a surface of the optoelectronic component.

Abstract: A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate.

Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.

Abstract: Disclosed herein is a semiconductor device including: a first semiconductor chip having an electronic circuit section and a first connecting section formed on one surface thereof; a second semiconductor chip having a second connecting section formed on one surface thereof, the second semiconductor chip being mounted on the first semiconductor chip with the first and the second connecting sections connected to each other by a bump; a dam formed to fill a gap between the first and the second semiconductor chips on a part of an outer edge of the second semiconductor chip, the part of the outer edge being on a side of a region of formation of the electronic circuit section; and an underfill resin layer filled into the gap, protrusion of the resin layer from the outer edge of the second semiconductor chip to a side of the electronic circuit section being prevented by the dam.

Abstract: The present invention relates to a photovoltaic module comprising as an encapsulant a composition comprising at least one polyacrylate- or polymethacrylate-type block copolymer with the general formula B-(A)n, n being a natural integer no lower than one, preferably 1 to 8, the block A being selected from among methacrylates having a Tg higher than 0° C., the block B being a polyacrylate or a polymethacrylate having a Tg lower than 0° C., the block B being at least 50 wt % of the total weight of the block copolymer.

Abstract: A system and method for blocking heat from reaching an image sensor in a three dimensional stack with a semiconductor device. In an embodiment a heat sink is formed in a back end of line process either on the semiconductor device or else on the image sensor itself when the image sensor is in a backside illuminated configuration. The heat sink may be a grid in either a single layer or in two layers, a zig-zag pattern, or in an interleaved fingers configuration.

Abstract: An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.

Abstract: A method of manufacturing a semiconductor device includes: forming, on a cover glass, a film having a predetermined specific gravity and configured to shield an alpha ray that arises from the cover glass; and bonding the cover glass on which the film is formed and an image pickup device, by filling a transparent resin between the cover glass and the image pickup device.

Abstract: A solid-state imaging element including: a sensor substrate in which a photoelectric conversion section is arranged and formed; a circuit substrate in which a circuit for driving the photoelectric conversion section is formed, the circuit substrate being laminated to the sensor substrate; a sensor side electrode drawn out to a surface of the sensor substrate on a side of the circuit substrate and formed as one of a projection electrode and a depression electrode; and a circuit side electrode drawn out to a surface of the circuit substrate on a side of the sensor substrate, formed as one of the depression electrode and the projection electrode, and joined to the sensor side electrode in a state of the circuit side electrode and the sensor side electrode being fitted together.

Abstract: The invention is an optoelectronic device comprising an active portion which converts light to electricity or converts electricity to light, the active portion having a front side for the transmittal of the light and a back side opposite from the front side, at least two electrical leads to the active portion to convey electricity to or from the active portion, an enclosure surrounding the active portion and through which the at least two electrical leads pass wherein the hermetically sealed enclosure comprises at the front side of the active portion a barrier material which allows for transmittal of light, one or more getter materials disposed so as to not impede the transmission of light to or from the active portion, and a contiguous gap pathway to the getter material which pathway is disposed between the active portion and the barrier material.

Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.

Abstract: A wafer-level bonding method for fabricating wafer level camera lenses is disclosed. The method includes: providing a lens wafer including lenses arranged in an array and a sensor wafer including sensors arranged in an array; measuring and analyzing an FFL of each lens to obtain a corresponding FFL compensation value for each lens; forming a thin transparent film (TTF) on each sensor of the sensor wafer, and the thickness of TTF is determined by the FFL compensation value of the corresponding lens; aligning and bonding the lens wafer with the sensor wafer having TTFs formed thereon. Since the focal length of each lens is adjusted to compensate the FFL of the lens by adding a TTF of transparent optical material with an index of refraction that is similar to the index of refraction of the sensor cover glass, the FFL variation of each camera lens can be reduced.

Abstract: A method to manufacture an optical module is disclosed, wherein the optical module has an optically active device on a lead frame and a lens co-molded with the active device and the lead frame by a transparent resin as positioning the lens with respect to the lead frame. The molding die of the present invention has a positioning pin to support the lens during the molding. Because the lead frame is aligned with the molding die, the precise alignment between the active device on the lead frame and the lens is not spoiled during the molding.

Abstract: In accordance with various exemplary embodiments, solar energy shade structures and methods of design and revenue generation are disclosed. These systems comprise structures capable of supporting solar panel at heights greater than 18 feet above their mounting surface. These systems may be installed in confined spaces. These systems also comprise structures that are customizable, allowing an installation to be configured with a desired lighting and environmental effect. The methods discussed herein describe processes for achieving desired design effects based on natural elements. Moreover, the methods discussed herein describe processes for reducing the costs of generating solar energy and/or reducing the costs of providing a solar structure.

Abstract: A device fabrication method includes: (1) providing a growth substrate including a base and an oxide layer disposed over the base; (2) forming a metal layer over the oxide layer; (3) forming a stack of device layers over the metal layer; (4) performing interfacial debonding of the metal layer to separate the stack of device layers and the metal layer from the growth substrate; and (5) affixing the stack of device layers to a target substrate.

Abstract: The present disclosure provides various embodiments of an image sensor device. An exemplary image sensor device includes an image sensing region disposed in a substrate; a multilayer interconnection structure disposed over the substrate; and a color filter formed in the multilayer interconnection structure and aligned with the image sensing region. The color filter has a length and a width, where the length is greater than the width.

Abstract: The electromagnetic radiation detection device includes, on a same substrate: at least one active detector of the electromagnetic radiation provided with a first element sensitive to said radiation, at least one reference detector including a second element sensitive to said electromagnetic radiation, and a lid provided with first reflective means reflecting the incident electromagnetic radiation, said lid covering without contact the second sensitive element and defining with the substrate a cavity having the reference detector housed therein. The lid is designed to improve the sensitivity of the detection device.

Abstract: A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I?): (R12SiO2/2)a1(R23SiO1/2)b1(CH2CH2)e1; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1, R2 and R4 to R7 and a1, b1, e1 and f to j are as defined in the specification.

Abstract: A curable composition comprises the following: (A) a branched polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R7, a? to c?, e? and f to j are as defined in the specification.

Abstract: Optoelectronic devices with bypass diodes are described. An optoelectronic device includes a bypass diode, a heat spreader unit disposed above, and extending over, the bypass diode, and a heat sink disposed above the heat spreader unit. Another optoelectronic device includes a bypass diode, a heat spreader unit disposed above, but not extending over, the bypass diode, and a heat sink disposed above the heat spreader unit.

Abstract: An implantable, miniaturized platform and a method for fabricating the platform is provided, where the e platform includes a top cover plate and a bottom substrate, top cover plate including an epitaxial, Si-encased substrate and is configured to include monolithically grown devices and device contact pads, the Si-encased substrate cover plate including a gold perimeter fence deposited on its Si covered outer rim and wherein the bottom substrate is constructed of Si and includes a plurality of partial-Si-vias (PSVs), electronic integrated circuits, device pads, pad interconnects and a gold perimeter fence, wherein the device pads are aligned with a respective device contact pad on the top cover plate and includes gold bumps having a predetermined height, the top cover plate and the bottom substrate being flip-chip bonded to provide a perimeter seal and to ensure electrical connectivity between the plurality of internal devices and at least one external component.

Abstract: A magnetoresistive random access memory (MRAM) package may include an MRAM die, a package defining a cavity and an exterior surface, and a magnetic security structure disposed within the cavity or on the exterior surface of the package. The MRAM die may be disposed in the cavity of the package, and the magnetic security structure may include at least three layers including a permanent magnetic layer and a soft magnetic layer.