Abstract: A memory device includes a first memory block. The first memory block includes a first memory sub-array and a first interface portion disposed next to the first memory sub-array. The first interface portion has a plurality of first control structures formed as a first staircase profile. The first memory block further includes a plurality of first interconnect structures landing on a corresponding one of the plurality of first control structures, and a plurality of second interconnect structures configured to electrically couple a corresponding one of the plurality of first interconnect structures to a first transistor. The memory device further includes a first test structure and a second test structure disposed next to the first memory block, each configured to simulate electrical connections of the plurality of second interconnect structures. The first and second test structures are electrically coupled to each other and are electrically isolated form the first memory block.

Abstract: A method for forming a trench capacitor without an additional mask adder and the resulting device are provided. Embodiments include forming a buried implant layer over a substrate; forming an EPI layer over the buried implant layer; forming an oxide layer over the EPI layer; forming a nitride layer over the oxide layer; forming first and second trenches in the nitride layer, the oxide layer, the EPI layer, the buried implant layer and the substrate, the first trench being wider and deeper than the second trench; forming a dielectric layer in the trenches; forming a first polysilicon layer over the dielectric layer in the trenches; removing the first polysilicon layer and the dielectric layer above the EPI layer in the trenches and at a bottom of the first trench; and forming a second polysilicon layer filling the first trench and above the EPI layer in the second trench.

Abstract: In a method for fabricating a fine structure, a metal oxide layer is formed by using an atomic layer deposition over a substrate, and the metal oxide layer is removed. An interfacial oxide layer is formed between the metal oxide layer and the substrate. The interfacial oxide layer is an oxide of an element constituting the substrate, and the interfacial oxide layer is removed.

Abstract: A memory device including an SOI substrate with a buried dielectric layer having a thickness of less than 30 nm, and a trench extending through an SOI layer and the buried dielectric layer into the base semiconductor layer of the SOI substrate. A capacitor is present in a lower portion of the trench. A dielectric spacer is present on the sidewalls of an upper portion of the trench. The dielectric spacer is present on the portions of the trench where the sidewalls are provided by the SOI layer and the buried dielectric layer. A conductive material fill is present in the upper portion of the trench. A semiconductor device is present on the SOI layer that is adjacent to the trench. The semiconductor device is in electrical communication with the capacitor through the conductive material fill.

Abstract: Disclosed is an integrated circuit having at least one deep trench isolation structure and a deep trench capacitor. A method of forming the integrated circuit incorporates a single etch process to simultaneously form first trench(s) and a second trenches for the deep trench isolation structure(s) and a deep trench capacitor, respectively. Following formation of a buried capacitor plate adjacent to the lower portion of the second trench, the trenches are lined with a conformal insulator layer and filled with a conductive material. Thus, for the deep trench capacitor, the conformal insulator layer functions as the capacitor dielectric and the conductive material as a capacitor plate in addition to the buried capacitor plate. A shallow trench isolation (STI) structure formed in the substrate extending across the top of the first trench(es) encapsulates the conductive material therein, thereby creating the deep trench isolation structure(s).

Abstract: Disclosed are integrated circuit structures each having a silicon germanium film incorporated as a local interconnect and/or an electrical contact. These integrated circuit structures provide improved local interconnects between devices and/or increased capacitance to devices without significantly increasing structure surface area or power requirements. Specifically, disclosed are integrated circuit structures that incorporate a silicon germanium film as one or more of the following features: as a local interconnect between devices; as an electrical contact to a device (e.g., a deep trench capacitor, a source/drain region of a transistor, etc.); as both an electrical contact to a deep trench capacitor and a local interconnect between the deep trench capacitor and another device; and as both an electrical contact to a deep trench capacitor and as a local interconnect between the deep trench capacitor and other devices.

Abstract: A mask layer formed over a semiconductor substrate is lithographically patterned to form an opening therein. Ions are implanted at an angle that is normal to the surface of the semiconductor substrate through the opening and into an upper portion of the semiconductor substrate. Straggle of the implanted ions form a doped region that laterally extends beyond a horizontal cross-sectional area of the opening. A deep trench is formed by performing an anisotropic etch of a semiconductor material underneath the opening to a depth above a deep end of an implanted region. Ion implantation steps and anisotropic etch steps are alternately employed to extend the depth of the doped region and the depth of the deep trench, thereby forming a doped region around a deep trench that has narrow lateral dimensions. The doped region can be employed as a buried plate for a deep trench capacitor.

Abstract: Disclosed are integrated circuit structures each having a silicon germanium film incorporated as a local interconnect and/or an electrical contact. These integrated circuit structures provide improved local interconnects between devices and/or increased capacitance to devices without significantly increasing structure surface area or power requirements. Specifically, disclosed are integrated circuit structures that incorporate a silicon germanium film as one or more of the following features: as a local interconnect between devices; as an electrical contact to a device (e.g., a deep trench capacitor, a source/drain region of a transistor, etc.); as both an electrical contact to a deep trench capacitor and a local interconnect between the deep trench capacitor and another device; and as both an electrical contact to a deep trench capacitor and as a local interconnect between the deep trench capacitor and other devices.

Abstract: A structure is provided herein which includes an array of trench capacitors having at least portions disposed below a buried oxide layer of an SOI substrate. Each trench capacitor shares a common unitary buried capacitor plate which includes at least a portion of a first unitary semiconductor region disposed below the buried oxide layer. An upper boundary of the buried capacitor plate defines a plane parallel to a major surface of the substrate which extends laterally throughout the array of trench capacitors. In a particular embodiment, which starts from either an SOI or a bulk substrate, trenches of the array and a contact hole are formed simultaneously, such that the contact hole extends to substantially the same depth as the trenches. The contact hole preferably has substantially greater width than the trenches such that the conductive contact via can be formed simultaneously by processing used to form trench capacitors extending along walls of the trenches.

Abstract: A charge trapping memory cell is described, having pocket implants along the sides of the channel and having the same conductivity type as the channel, and which implants have a concentration of dopants higher than in the central region of the channel. This effectively disables the channel in the region of non-uniform charge trapping caused by a bird's beak or other anomaly in the charge trapping structure on the side of the channel. The pocket implant can be formed using a process compatible with standard shallow trench isolation processes.

Abstract: A deep trench structure process for forming a deep trench in a silicon on insulator (SOI) substrate. The SOI substrate has a bulk silicon layer, a buried oxide (BOX) layer and an SOI layer. In the process, the trench fill is recessed only to a level within the SOI layer so as to avoid lateral etching of the BOX layer. The buried strap is then formed followed by the STI oxide.

Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a plurality of active regions which are defined in a semiconductor substrate, a plurality of gate lines which are formed as zigzag lines, extend across the active regions, are symmetrically arranged, and define a plurality of first regions and a plurality of second regions therebetween, and wherein the first regions being narrower than the second regions. The semiconductor device further includes an insulation layer which defines a plurality of contact regions by filling empty spaces in the first regions between the gate lines and, extending from the first regions, and surrounding sidewalls of portions of the gate lines in the second regions, and wherein the contact regions partially exposing the active regions and a plurality of contacts which respectively fill the contact regions.

Abstract: A method for fabricating an interconnect arrangement with increased capacitive coupling is described. A trench structure is formed in a first dielectric having a capacitor region with a first aspect ratio and an interconnect region with a second aspect ratio connected thereto. The trench structure of the interconnect region is completely filled by a first interconnect. The trench structure of the capacitor region is only partially filled by a first capacitor electrode and is completely filled by a capacitor dielectric and a second capacitor electrode. In a second dielectric formed thereon, a second interconnect with a contact via is formed, which is connected to the second capacitor electrode.

Abstract: A method for fabricating an integrated circuit device. A plurality of MOS transistor devices are formed overlying a semiconductor substrate. Each of the MOS transistor devices includes a nitride cap and nitride sidewall spacers. An interlayer dielectric layer is formed overlying the plurality of MOS transistor devices. A portion of the interlayer dielectric material is removed to expose at least portions of three MOS transistor devices and expose at least three regions between respective MOS transistor devices. The method deposits polysilicon fill material overlying the exposed three regions and overlying the three MOS transistor devices. The method performs a chemical mechanical planarization process on the polysilicon material to reduce a thickness of the polysilicon material exposing a portion of the interlayer dielectric material until the cap nitride layer on each of the MOS transistors has been exposed using the cap nitride layer as a polish stop layer.

Abstract: Manufacturing a power transistor by forming a gate structure on a first layer, forming a trench in the first layer, self aligned with the gate structure, and forming part of the transistor in the trench. By forming a spacer next to the gate, the spacer and gate can be used as a mask when forming the trench, to allow space for a source region next to the gate. The self-aligning rather than forming the gate after the trench means the alignment is more accurate, allowing size reduction. Another aspect involves forming a trench in a first layer, filling the trench, forming a second layer on either side of the trench with lateral overgrowth over the trench, and forming a source region in the second layer to overlap the trench. This overlap can enable the chip area to be reduced.

Abstract: An integrated circuit device having a capacitor structure. In one form of the invention, an integrated circuit device includes a capacitor structure formed along a surface of a semiconductor layer. The capacitor structure includes a region formed in the semiconductor surface, a layer of dielectric material formed along a trench wall of the trench region and a first layer of doped polysilicon formed over the layer of dielectric material in the trench region. The capacitor structure further includes a second layer of doped polysilicon formed over the first layer of polysilicon.

Abstract: A method of manufacturing a memory device. The memory device comprises a trench in a substrate, a capacitor at the low portion of the trench, a collar dielectric layer overlying the capacitor and covering a portion of the sidewall of the trench, and a conductive layer filling a portion of the trench over the capacitor. First, a first mask layer is formed on the conductive layer, wherein a bottom portion of the first mask layer is thicker than the side portion thereof in the trench. A second mask layer is formed on the first mask layer. Next, a portion of the second mask layer in the trench is ion implanted. The unimplanted portion of the second mask layer is removed.

Abstract: A method of fabricating gate trench utilizing pad pullback technology is disclosed. A semiconductor substrate having thereon a pad oxide layer and pad layer is provided. Trench capacitors are formed in a memory array region of the semiconductor substrate. Each of the trench capacitors has a trench top oxide (TTO) that extrudes from a main surface of the semiconductor substrate. The pad layer is recessed from its top and covered with a polysilicon layer. Isolation trenches are formed in the substrate and then filled with photoresist. The TTO is then stripped. The pad layer that is not covered by the photoresist is pulled back to define the gate trench.

Abstract: The present invention relates to a semiconductor memory device and a method for fabricating the same. The semiconductor memory device, including: a plurality of gate structures formed on a substrate; a contact junction region formed beneath the substrate disposed in lateral sides of the respective gate structures; a trench formed by etching a portion of the substrate disposed in the contact junction region with a predetermined thickness; a dopant diffusion barrier layer formed on sidewalls of the trench; and a contact plug filled into a space created between the gate structures and inside of the trench, wherein the dopant diffusion barrier layer prevents dopants within the contact plug from diffusing out.

Abstract: According to some embodiments of the invention, transistors of a semiconductor device have a channel region in a channel-portion hole. Methods include forming embodiments of the transistor having a channel-portion hole disposed in a semiconductor substrate. A channel-portion trench pad and a channel-portion layer are sequentially formed at a lower portion of the channel-portion hole. A word line insulating layer pattern and a word line pattern are sequentially stacked on the channel-portion layer and fill the channel-portion hole, disposed on the semiconductor substrate. The channel-portion layer is formed to contact the semiconductor substrate through a portion of sidewall of the channel-portion hole, and forms a channel region under the word line pattern. Punchthrough is prevented between electrode impurity regions corresponding to source and drain regions.

Abstract: A structure and method of forming a body contact for an semiconductor-on-insulator trench device. The method including: forming set of mandrels on a top surface of a substrate, each mandrel of the set of mandrels arranged on a different corner of a polygon and extending above the top surface of the substrate, a number of mandrels in the set of mandrels equal to a number of corners of the polygon; forming sidewall spacers on sidewalls of each mandrel of the set of mandrels, sidewalls spacers of each adjacent pair of mandrels merging with each other and forming a unbroken wall defining an opening in an interior region of the polygon, a region of the substrate exposed in the opening; etching a contact trench in the substrate in the opening; and filling the contact trench with an electrically conductive material to form the contact.

Abstract: In a thin film capacitor, reducing a leak current by suppressing concentration of an electric filed. Forming a zirconium oxide layer (26A) on a lower electrode (22) made of a conductive material. Forming a buffer layer (28) made of an amorphous material on the first zirconium oxide layer (26A).

Abstract: This invention includes methods of forming integrated circuits, and includes DRAM circuitry memory cells. In one implementation, a method of forming an integrated circuit includes forming a trench isolation mask over a semiconductor substrate. The trench isolation mask defines an active area region and a trench isolation region. An ion implantion is conducted into semiconductive material of the substrate to form a buried region within active area of the substrate. The buried region has a first edge received proximate an edge of the trench isolation region. Using the trench isolation mask, etching is conducted into semiconductive material of the substrate to form an isolation trench. After the ion implantation and after forming the isolation trench, insulative material is formed within the buried region and insulative material is deposited to within the isolation trench. The insulative material received within the isolation trench joins with the insulative material formed within the buried region.

Abstract: A high-voltage stacked capacitor includes a first capacitor and a second capacitor. Each capacitor includes a first plate having a first semiconductive body and a second plate having a floating electrode. The first and second semiconductive bodies are electrically isolated from each other. The floating electrode includes an intercapacitor node configured to self-adjust to a value less than a working voltage impressed on the stacked capacitor.

Abstract: A memory cell includes a selection transistor and a trench capacitor. The trench capacitor is filled with a conductive trench filling on which an insulating covering layer is arranged. The insulating covering layer is laterally overgrown, proceeding from the substrate with a selectively grown epitaxial layer. The selection transistor is formed in the selectively grown epitaxial layer, comprises a source region connected to the trench capacitor and a drain region connected to a bit line. The junction depth of the source region is chosen so that the source region reaches as far as the insulating covering layer. Optionally, the thickness of the epitaxial layer can be reduced to a thickness by oxidation and a subsequent etching. Afterwards, a contact trench is etched through the source region down to the conductive trench filling, which trench is filled with a conductive contact and electrically connects the conductive trench filling to the source region.

Abstract: A method of forming a memory cell array comprising a plurality of memory cells, each of the memory cells including a trench capacitor and a transistor is disclosed.

Abstract: The present invention provides a method for fabricating a trench capacitor with an insulation collar in a substrate, which is electrically connected to the substrate on one side via a buried contact, in particular for a semiconductor memory cell with a planar selection transistor that is provided in the substrate and connected via the buried contact The invention likewise provides a corresponding trench capacitor.

Abstract: The present invention relates to a semiconductor memory device and a method for fabricating the same. The semiconductor memory device, including: a plurality of gate structures formed on a substrate; a contact junction region formed beneath the substrate disposed in lateral sides of the respective gate structures; a trench formed by etching a portion of the substrate disposed in the contact junction region with a predetermined thickness; a dopant diffusion barrier layer formed on sidewalls of the trench; and a contact plug filled into a space created between the gate structures and inside of the trench, wherein the dopant diffusion barrier layer prevents dopants within the contact plug from diffusing out.

Abstract: A storage cell field has a plurality of storage cells formed in a substrate of a first doping type, said storage cells comprising a trench capacitor arranged in said substrate and a selection transistor associated with said trench capacitor and provided with a transistor body which is arranged in said substrate. An implantation having an increased dopant concentration of the first doping type is provided in said substrate. This implantation prevents space-charge zones, which are located at the trench capacitors and which are caused in predetermined storage states of said trench capacitors, from constricting a substrate region, which is available for applying a predetermined potential to the transistor bodies, in such a way that said predetermined potential cannot be applied.