Abstract: A photoelectric conversion semiconductor layer having high photoelectric conversion efficiency is provided at a low cost. Photoelectric conversion semiconductor layer is a layer that generates a current by absorbing light and is formed of a particle layer in which a plurality of plate-like particles is disposed only in a plane direction or a sintered body thereof, or a particle layer in which a plurality of plate-like particles is disposed in a plane direction and a thickness direction or a sintered body thereof.

Abstract: A solid-state imaging apparatus including pixels each including a photoelectric conversion element, and a light shielding layer covering the photoelectric conversion element is provided. For each of the photoelectric conversion elements, the light shielding layer includes a light shielding portion which shields a portion of incident light to the photoelectric conversion element, and an aperture which passes another portion of the incident light. The pixels include first and second pixels which have different areas on a planar view of the photoelectric conversion element. The area of the photoelectric conversion element in the first pixel is larger than the area of the photoelectric conversion element in the second pixel on the planar view. An area of the light shielding portion included in the first pixel is larger than an area of the light shielding portion included in the second pixel.

Abstract: A device for generating electricity from solar radiation is disclosed. The device includes a wafer doped with a first dopant, the wafer including a front-side and a back-side, wherein the front-side is configured to be exposed to the solar radiation. The device also includes a fused Group IV nanoparticle thin film deposited on the front-side, wherein the nanoparticle thin film includes a second dopant, wherein the second dopant is a counter dopant. The device further includes a first electrode deposited on the nanoparticle thin film, and a second electrode deposited on the back-side, wherein when solar radiation is applied to the front-side, an electrical current is produced.

Abstract: A solar cell includes: a substrate; a photoelectric conversion cell which has a first electrode layer provided with permeability, a photoelectric conversion layer, and a second electrode layer, and is arranged on the substrate; and a protection layer which covers at least the second electrode layer. The protection layer includes a silicon nitride compound.

Abstract: A solid-state imaging device includes photoelectric conversion units, vertical transfer units including vertical transfer electrodes, a horizontal transfer unit, a distribution transfer unit including distribution transfer electrodes, and first light-shield layers and second light-shield layers provided on the vertical transfer units and the distribution transfer unit. The first light-shield layers and the second light-shield layers are conductive. The first light-shield layers are provided in a layer different from a layer in which the second light-shield layers are provided. At least one of the first light-shield layers serves as an interconnect electrically connected to the vertical transfer electrodes included in the same row, and at least one of the first light-shield layers on the distribution transfer unit serves as an interconnect electrically connected the distribution transfer electrodes. The first light-shield layers are disposed so as not to overlap with the horizontal transfer unit.

Abstract: A carrier substrate, includes a substrate especially having a glass function, transparent at least in the visible and near-infrared ranges and receiving a conducting electrode which is transparent at least in the visible and near-infrared ranges, this electrode carrier substrate being intended to constitute, in combination with functional elements, a solar cell. This carrier substrate is such that: the electrode includes a micromesh made of conducting material having submillimeter-sized openings; and this micromesh is in contact with an at least slightly conducting antireflection coating facing that one of the functional elements with which it is intended to be in contact. An aspect of the present invention also relates to the use of such a carrier substrate as constituent element of a solar cell and to a process for fabricating the substrate.

Abstract: A photovoltaic device includes at least one photovoltaic cell, a flexible glass layer formed over the at least one photovoltaic cell, and a transparent planarizing hardcoat formed on the glass layer. The planarizing hardcoat may be in compressive stress and the glass layer may be in tension.

Abstract: Embodiments of the invention provide a thin single crystalline silicon film solar cell and methods of forming the same. The method includes forming a thin single crystalline silicon layer on a silicon growth substrate, followed by forming front or rear solar cell structures on and/or in the thin single crystalline silicon film. The method also includes attaching the thin single crystalline silicon film to a mechanical carrier and then separating the growth substrate from the thin single crystalline silicon film along a cleavage plane formed between the growth substrate and the thin single crystalline silicon film. Front or rear solar cell structures are then formed on and/or in the thin single crystalline silicon film opposite the mechanical carrier to complete formation of the solar cell.

Abstract: Open circuit voltage of a photovoltaic device including a p-i-n junction including amorphous silicon-containing semiconductor materials is increased by a high power plasma treatment on an amorphous p-doped silicon-containing semiconductor layer before depositing an amorphous intrinsic silicon-containing semiconductor layer. The high power plasma treatment deposits a thin layer of nanocrystalline silicon-containing semiconductor material or converts a surface layer of the amorphous p-doped silicon containing layer into a thin nanocrystalline silicon-containing semiconductor layer. After deposition of an intrinsic amorphous silicon layer, the thin nanocrystalline silicon-containing semiconductor layer functions as an interfacial nanocrystalline silicon-containing semiconductor layer located at a p-i junction.

Abstract: A semiconductor structure including a bonding layer connecting a first semiconductor wafer layer to a second semiconductor wafer layer, the bonding layer including an electrically conductive carbonaceous component and a binder component.

Abstract: An energy conversion film and a quantum dot film which contain a quantum dot compound, an energy conversion layer including the quantum dot film, and a solar cell including the energy conversion layer. The films act as cut-off filters blocking light of a particular energy level using the light absorption and emission effects of quantum dots and can convert high energy light to low energy light. The efficiency of a solar cell may be improved by providing the cell with a film that converts light above the spectrum-responsive region to light in the cell's spectrum-responsive region. The absorption wavelength region of the films can be broadened by providing the quantum dot compound in a variety of average particle sizes, for example, by providing a mixture of a first quantum dot compound having a first average particle size and a first quantum dot compound having a second average particle size.

Abstract: A solar cell with engineered spectral conversion elements or components includes a single crystal silicon solar cell having a back surface. At least one spectral conversion element is formed on the back surface. The conversion element includes single crystal rare earth oxide, and the single crystal rare earth oxide is crystal lattice matched to the back surface of the silicon solar cell. Material including silicon is formed on the back surface in a surrounding and embedding relationship to the at least one spectral conversion element. A back reflector is positioned on the material formed on the back surface so as to reflect light passing through the silicon formed on the back surface.

Abstract: The challenge for the present invention is to provide a film-forming method and for forming a passivation film which can sufficiently inhibit the loss of carriers due to their recombination; and a method for manufacturing a solar cell element with the use of the method or the device. The film-forming device comprises a mounting portion 22 for mounting a film-forming object, a high frequency power source 25, and a shower plate 23 which is provided to face the film-forming object S mounted on the mounting portion 22, which introduces a film-forming gas, and to which the high frequency power source is connected and a high frequency voltage is applied. A low frequency power source 26 for applying a low frequency voltage is connected to the shower plate or the mounting portion mounting a substrate. The film-forming method is performed using the film-forming device, and the film-forming method is carried out in forming a passivation film.

Abstract: A photoelectric converter includes a substrate, photoelectric converting elements formed in the substrate and each having a light-receiving surface, an antireflection film arranged above at least a part of the light-receiving surface of each photoelectric converting element, an element isolation region including an insulator, a plurality of transistors including read transistors configured to read electric charges of the photoelectric converting elements, an interlayer insulating film arranged above the photoelectric conversion elements and the read transistors, and contacts electrically connected to active regions of the transistors. The antireflection film is arranged above the element isolation region and the active region connected to each contact. The antireflection film serves as an etch stop film when the interlayer insulating film is etched.

Abstract: A solar cell is discussed. The solar cell includes a substrate of a first conductivity type, the substrate having a via hole, an emitter disposed at the substrate and having a second conductivity type opposite the first conductivity type, an anti-reflection layer disposed on a first surface of the substrate and inside the via hole, a first electrode disposed on the first surface of the substrate and in the via hole, a first electrode bus bar disposed on a second surface of the substrate that is opposite the first surface and in the via hole, and a second electrode disposed on the second surface of the substrate and connected to the substrate.

Abstract: The invention provides an anti-UV electronic device and fabrication method thereof. The anti-ultraviolet (anti-UV) electronic device includes an integrated circuit die, wherein the integrated circuit die has an ultraviolet (UV) light erasable memory; and an anti-UV light layer is formed on and covers the ultraviolet (UV) light erasable memory.

Abstract: The present invention generally provides a method of forming a high efficiency solar cell device by preparing a surface and/or forming at least a part of a high quality passivation layer on a silicon containing substrate. Embodiments of the present invention may be especially useful for preparing a surface of a p-type doped region formed on a silicon substrate so that a high quality passivation layer can be formed thereon. In one embodiment, the methods include exposing a surface of the solar cell substrate to a plasma to clean and modify the physical, chemical and/or electrical characteristics of the surface.

Abstract: A photovoltaic cell (10) is provided which includes a substrate carrier (11), a first transparent conductive layer (12) positioned on the substrate carrier (11) comprising a plurality of discrete transparent conductive protruding regions (13) or a plurality of discrete indentations. A silicon layer (14) comprising a charge separating junction covers the first transparent conductive layer (12) and the plurality of discrete transparent conductive protruding regions (13) or the plurality of discrete indentations and a second transparent conductive layer (15) is positioned on the silicon layer (14).

Abstract: A method of manufacturing a solar cell having an effective minority charge carrier lifetime (?eff) of at least 500 ?s, said method comprising: providing a semiconductor wafer; and passivating a surface of said wafer by ALD-depositing a metal oxide layer on said surface by sequentially and alternatingly: (iii) exposing said surface to a first precursor, resulting in a coverage of the surface with the first precursor, and (iv) exposing said surface to a second precursor, resulting in a coverage of the surface with the second precursor, wherein at least one of steps (i) and (ii) is stopped before the coverage of the surface reaches a saturation level.

Abstract: The present invention is a front-side contact, back-side illuminated (FSC-BSL) photodiode arrays and front-side illuminated, back-side contact (FSL-BSC) photodiode arrays having improved characteristics, including high production throughput, low-cost manufacturing via implementation of batch processing techniques; uniform, as well as high, photocurrent density owing to presence of a large continuous homogeneous, heavily doped layer; and back to front intrachip connections via the homogenous, heavily doped layers on the front and back sides of the substrate.

Abstract: Provided is a semiconductor device for performing photoelectric conversion of incident light, including: a p-type substrate (1), an n-type well (2) having a predetermined depth and formed in a predetermined region of the p-type substrate (1), and a depletion layer generated at a junction interface between the p-type substrate (1) and the n-type well (2). In the trenches (22) having a depth larger than that of a depletion layer (K1) generated on a bottom side of the n-type well (2) and a width larger than that of depletion layers (K2, K3) generated on sides of the n-type well (2) are provided so as to remove junction interfaces (J2, J3) on the sides of the n-type well (2), and an insulating layer (21) is buried in the trenches (22).

Abstract: Systems and methods for fabrication of nanostructured solar cells having arrays of nanostructures are described, including nanostructured solar cells having a repeating pattern of pyramid nanostructures, providing for low cost thin-film solar cells with improved PCE.

Abstract: In order to provide an LED light emitting device that can easily control a color temperature of white light, the LED light emitting device is provided with a plurality of types of light emitting parts that: respectively have LED elements that emit ultraviolet radiation or violet color visible light, and phosphors that absorb the ultraviolet radiation or violet color visible light to emit colored light; and emit the colored light, wherein: the colored light emitted by the plurality of types of light emitting parts become white light when all mixed with each other; the LED elements of the plurality of types of light emitting parts are all the same ones, and mounted on a single base material; and two or more light emitting parts overlap with each other in their parts.

Abstract: Embodiments of the invention include a solar cell and methods of forming a solar cell. Specifically, the methods may be used to form a passivation/anti-reflection layer having combined functional and optical gradient properties on a solar cell substrate. The methods may include flowing a first process gas mixture into a process volume within a processing chamber generating plasma in the processing chamber at a power density of greater than 0.65 W/cm2 depositing a silicon nitride-containing interface sub-layer on a solar cell substrate in the process volume, flowing a second process gas mixture into the process volume, and depositing a silicon nitride-containing bulk sub-layer on the silicon nitride-containing interface sub-layer.

Abstract: A solar cell includes a semiconductor layer which includes a p-type impurity containing layer and an n-type impurity-containing layer; a dielectric layer disposed on one side of the semiconductor layer, wherein the dielectric layer has an isotropically etched portion on the surface thereof; a first electrode electrically connected with the p-type impurity-containing layer in the semiconductor layer; and a second electrode electrically connected with the n-type impurity-containing layer in the semiconductor layer.

Abstract: A reflection-type photointerrupter of the present invention includes a substrate, a light emitting element and a light receiving element. The substrate includes a first surface, a second surface opposite the first surface, and a first and a second recesses that are open in the first surface side. The light emitting element is arranged in the first recess, while the light receiving element is arranged in the second recess. The light emitting element is capable of emitting light. The light receiving element is capable of receiving the light emitted from the light emitting element and reflected by an object to be detected.

Abstract: A circuit for implementing an ambient light sensing mode and a proximity sensing mode includes a light sensor, a light source, and a controller coupled to the light sensor and the light source. The controller is configured to process outputs from the light sensor before and after the light source is energized to obtain an ambient light level output and to compare the ambient light level output with an output from the light sensor when the light source is energized to implement the proximity sensing mode.

Abstract: An apparatus and related process are provided for vapor deposition of a sublimated source material as a thin film on a photovoltaic (PV) module substrate. A deposition head is configured for sublimating a source material supplied thereto. The sublimated source material condenses onto a transport conveyor disposed below the deposition head. A substrate conveyor is disposed below the transport conveyor and conveys substrates in a conveyance path through the apparatus such that an upper surface of the substrates is opposite from and spaced below a lower leg of the transport conveyor. A heat source is configured adjacent the lower leg of the transport conveyor. The source material plated onto the transport conveyor is sublimated along the lower leg and condenses onto to the upper surface of substrates conveyed by the substrate conveyor.

Abstract: A method for forming a back contact for a photovoltaic cell that includes at least one semiconductor layer is provided. The method includes applying a continuous film of a chemically active material on a surface of the semiconductor layer and activating the chemically active material such that the activated material etches the surface of the semiconductor layer. The method further includes removing the continuous film of the activated material from the photovoltaic cell and depositing a metal contact layer on the etched surface of the semiconductor layer.

Abstract: The invention relates to semiconductor electronics and can be used for producing high-efficient broad-band electromagnetic radiation converters for directly converting incident radiation into electromotive force in both, the optically visible and optically invisible ranges. The inventive electromagnetic radiation converter comprises a semiconductor substrate with N=1 discrete local domains of a first conductivity type formed thereon, and since said substrate is of a second conductivity type, the above-mentioned domains of a first conductivity type form together with the substrate N=1 p-n junctions combined into a current node. Furthermore, isotype junctions generating repulsive isotype barriers to the minority charge carriers are formed on the face side of the substrate beyond the domains of a first conductivity type.

Abstract: A thin film solar cell comprises: a back contact layer, an absorber layer adjacent to the back contact layer and comprising an absorber material and a dopant, a buffer layer, a dopant barrier layer between the absorber layer and the buffer layer, and a window layer adjacent to the buffer layer. Associated method for making the thin film solar cell is also provided.

Abstract: A photodetector is formed from a body of semiconductor material substantially surrounded by dielectric surfaces. A passivation process is applied to at least one surface to reduce the rate of carrier generation and recombination on that surface. Photocurrent is read out from at least one electrical contact, which is formed on a doped region whose surface lies entirely on a passivated surface. Unwanted leakage current from un-passivated surfaces is reduced through one of the following methods. (a) The un-passivated surface is separated from the photo-collecting contact by at least two junctions (b) The un-passivated surface is doped to a very high level, at least equal to the conduction band or valence band density of states of the semiconductor (c) An accumulation or inversion layer is formed on the un-passivated surface by the application of an electric field. Electrical contacts are made to all doped regions, and bias is applied so that a reverse bias is maintained across all junctions.

Abstract: Leakage pathway layers for solar cells and methods of forming leakage pathway layers for solar cells are described.

Abstract: A sealant disposed between substrates for sealing, a dye-sensitized solar cell including the same, and a method of manufacturing the dye-sensitized solar cell, the sealant including hot melt adhesives for absorbing heat and adhering to the substrates; and heat generation particles absorbing energy and generating heat.

Abstract: To provide a dye-sensitized solar cell capable of significantly improving power extraction efficiency, and a manufacturing method of the dye-sensitized solar cell. The dye-sensitized solar cell includes a substrate, a porous semiconductor layer adsorbing a dye, a conductive metal layer, and a conductive substrate. The conductive metal layer 16 is a current collector provided on the side of the porous semiconductor layer, the side being opposite to the side on which the substrate is arranged. The conductive metal layer 16 is configured by a conductive metal section 17 made of a mesh member, and a coating section 19 formed on the conductive metal section 17. The coating section 19 is configured by an inner layer 19a and an outer layer 19b, and has a graded composition structure in which the degree of oxidization of the coating section is increased from the side of the conductive metal section 17 toward the side of the porous semiconductor layer 14.

Abstract: Provided is a semiconductor light receiving device including: a semiconductor substrate; a semiconductor layer laminated on the semiconductor substrate and including an upper surface portion; a reflecting film formed to cover the upper surface portion of the semiconductor layer and including a principal reflecting region and an upper surface; and an upper electrode formed to cover at least one portion of the upper surface of the reflecting film, and including a junction portion extending through the reflecting file to be provided in contact with the upper surface portion of the semiconductor layer, the junction portion of the upper electrode surrounding a portion of a circumference of the principal reflecting region of the reflecting film, the principal reflecting region being connected to a region of the reflecting film located outside the junction portion, in which the semiconductor light receiving device detects light entering from another side of the semiconductor substrate.

Abstract: An inkjet ink comprises phosphoric acid; one or more solvents for the phosphoric acid, preferably ethyl lactate and water; and one or more aprotic organic sulfoxides, preferably dimethyl sulfoxide (DMSO) or dimethyl sulfone (SMSO2). The inks do not leave a carbon residue on heating and so are suited to use in etching and/or doping silicon wafers, e.g. in the production of crystalline silicon solar cells.

Abstract: In one embodiment, a detector includes an AlxIn(1-x)Sb absorber layer, and an AlyIn(1-y)Sb passivation layer disposed above the AlxIn(1-x)Sb absorber layer, wherein x<y. The detector further includes a junction formed in a region of the AlxIn(1-x)Sb absorber layer, and a metal contact disposed above the junction and through the AlyIn(1-y)Sb passivation layer.

Abstract: In one embodiment, a detector includes an AlzIn(1-x)Sb passivation/etch stop layer, an AlxIn(1-x)Sb absorber layer disposed above the Alzn(1-x)Sb passivation/etch stop layer, and an AlIn(1-y)Sb passivation layer disposed above the AlxIn(1-x)Sb absorber layer, wherein x<z and x<y. The detector further includes a junction formed in a region of the AlxIn(1?x)Sb absorber layer, and a metal contact disposed above the junction and through the AlyIn(1-y)Sb passivation layer.

Abstract: The present invention is an apparatus and method for the realization of a photovoltaic solar cell that is able to achieve greater than 50% efficiency and can be manufactured at low cost on a large scale. The apparatus of the present invention is an integrated optical and solar cell design that allows a much broader choice of materials, enabling high efficiency, the removal of many existing cost drivers, and the inclusion of multiple other innovations.

Abstract: A process for the production of a silicon solar cell comprising application and firing of an aluminum paste which comprises magnesium oxide and/or magnesium compounds capable of forming magnesium oxide on firing on the back-side of a silicon wafer provided with a silicon nitride antireflective coating on its front-side and being contaminated with silicon nitride on its back-side, and firing the aluminum paste after its application.

Abstract: A method is disclosed, in at least one embodiment, for producing a scintillator for a radiation detector, in which the scintillator is produced in layers by depositing a scintillator material using a PVD process. By using a PVD process, owing to lower process temperatures of less than 300° C., it is possible to produce scintillators with decay times of less than 1.1 ns over large surfaces. In this way, the prerequisites for quantitative and energy-selective detection of individual radiation quanta can be satisfied even with fluxes of more than 108 X-ray quanta/mm2*s. At least one embodiment of the invention also relates to a scintillator produced by such a method.

Abstract: An apparatus and method for forming optical black pixels having uniformly low dark current. Optical Black opacity is increased without having to increase Ti/TiN layer thickness. A hybrid approach is utilized combining a Ti/TiN OB layer in conjunction with in-pixel metal stubs that further occlude the focal radius of each pixel's incoming light beam. Additional metal layers can be used to increase the opacity into the infrared region.

Abstract: The composition for forming a p-type diffusion layer in accordance with the present invention contains an acceptor element-containing glass powder and a dispersion medium. A p-type diffusion layer and a photovoltaic cell having a p-type diffusion layer are prepared by applying the composition for forming a p-type diffusion layer, followed by a thermal diffusion treatment.

Abstract: Silicon drift detectors are produced for location and energy measurement as well as spectroscopic applications by depositing a single high quality dielectric film followed by deposition of at least one low quality dielectric film.

Abstract: Device and method for an antireflective coating to improve image quality in an image display system. A preferred embodiment comprises a first high refractive index layer overlying a reflective surface of an integrated circuit, a first low refractive index layer overlying the first high refractive index layer, a second high refractive index layer overlying the first low refractive index layer, and a second low refractive index layer overlying the second high refractive index layer. The alternating layers of high refractive index material and low refractive index material form an optical trap, allowing light to readily pass through in one direction, but not so easily in a reverse direction. The dual alternating layer topology improves the antireflective properties of the antireflective layer and permits a wide range of adjustments for manipulating reflectivity and color point.

Abstract: High performance, high bandgap, lattice-mismatched, photovoltaic cells (10), both transparent and non-transparent to sub-bandgap light, are provided as devices for use alone or in combination with other cells in split spectrum apparatus or other applications.

Abstract: A method of manufacturing a solar cell includes providing a semiconductor substrate; disposing a reflection layer on one side of the semiconductor substrate, wherein the disposing the reflection layer comprises implanting gas into a surface of the one side of the semiconductor substrate and heating the gas; disposing an n+ region and a p+ region separated from each other on the other opposite facing side of the semiconductor substrate; disposing a first electrode connected to the n+ region; and disposing a second electrode connected to the p+ region.

Abstract: A method for the deposition of an anti-reflection film on a substrate is disclosed. A substrate including a plurality of solar cell structures is provided and placed in a vacuum chamber with a target including silicon. A flow of a nitrogen-containing reactive gas into the vacuum chamber is set to a first value while a voltage between the target and ground is switched off and then increased to a second value. A voltage is applied between the target and ground, whereby a film of silicon and nitrogen is deposited on the substrate in a flow of the nitrogen-containing reactive gas which is higher than the first value.

Abstract: The present invention is directed toward a detector structure, detector arrays, and a method of detecting incident radiation. The present invention comprises several embodiments that provide for reduced radiation damage susceptibility, decreased affects of crosstalk, reduced dark current (current leakage) and increased flexibility in application. In one embodiment, a photodiode array comprises a substrate having at least a front side and a back side, a plurality of diode elements integrally formed in the substrate forming the array, wherein each diode element has a p+ fishbone pattern on the front side, and wherein the p+ fishbone pattern substantially reduces capacitance and crosstalk between adjacent photodiodes, a plurality of front surface cathode and anode contacts, and wire interconnects between diode elements made through a plurality of back surface contacts.