Abstract: Next, a shield is positioned in the mold. The shield is made of a metallic material and has a substantially tubular shape. Next, a resistor is positioned inside the shield and the mold. Once the shield and the resistor are in place in the mold, a rubber material is injected into the mold between the shield and the resistor. Once the rubber material has cooled, then the spark plug boot resistor assembly is removed from the mold.

Abstract: A method for manufacturing an insulation displacement connector is provided. The method includes steps of providing an injection molding device, providing a first and a second terminals, putting the first and the second terminals into the injection molding device, and injecting a molding material into the injection molding device for forming a first and a second terminal seats and a middle connecting portion, so that the first and the second terminals are simultaneously encapsulated and assembled by the first and the second terminal seats for completing the insulation displacement connector.

Abstract: A method of fabricating a FCBGA (Flip-Chip Ball-Grid-Array) package without causing mold flash is proposed, which is characterized by the forming of a dummy pad over the back surface of the substrate to allow the portion of the solder mask formed over a vent hole in the substrate to be substantially raised to an elevated flat surface where a groove is then formed to surround the exit of the vent hole. During a molding process, when the encapsulation material infiltrates to the exit of the vent hole, it can be confined within the groove in the elevated flat surface over the dummy pad, thereby preventing it from flashing to nearby solder-ball pads.

Abstract: A hearing aid instrument of the in-the-ear type (and preferably CIC) provides a receptacle with electronic hearing aid components mounted thereto. The receptacle has a cavity for holding electronic components (eg. battery, microphone, amplifier). A soft polymeric body is preliminarily formed by encapsulating a plurality of the electronic hearing aid component shaped inserts. The body is soft and is shaped to conform to the ear canal of the user. After forming, the insert is removed to provide an insert cavity that can carry electronic components. The soft polymeric body and encapsulated electronic hearing aid components define a soft structure compliant to the ear canal during use and that is substantially solid and free of void spaces between at least some of the components and the ear canal.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: A pressure detecting apparatus is composed of a first case insert-molded with connector pins, and a second case made of metal. The first case and the second case are assembled together to form a pressure detection chamber hermetically sealed with an O-shaped ring sandwiched between seal surfaces of the two cases. The first case is formed by using a molding die that has a gate for injecting resin approximately in parallel with a seal correspondence surface for forming the seal surface of the first case.

Abstract: An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contains a first section and a second section, which form a cavity around the assembly. The mold contains an aperture for transferring encapsulating material into the mold cavity. One of the mold sections has a design feature, such as a raised rib or groove interconnecting at approximately the separation or saw-cut regions of the individual dies of the assembly. Encapsulation material is inserted into the mold cavity until the cavity is filled. The mold section design feature shapes the top surface of the encapsulation layer. The mold is removed leaving the exterior surface of the encapsulation layer patterned with the design feature.

Abstract: A circuit assembly comprises a substrate comprising one or more conductors. An integral frame of frame elements supports the substrate. The frame elements spaced apart to expose intervening regions of the substrate between adjacent frame elements. A dielectric layer overlies the intervening regions, as a protective barrier for at least one of the conductors, a component, and a circuit feature of the substrate.

Abstract: An electronic device having an extensive narrow passageway may be effectively encapsulated by forming openings in one or more of the surfaces defining the encapsulation region. Encapsulation material may then be injected through these openings to fill a narrow, difficult to access region between two surfaces being encapsulated. In some cases, the encapsulant may be applied progressively, starting with a central port and applying the encapsulant in a radially expanding front through radially displaced ports.

Abstract: An optical pickup device includes a housing having an upper-open recess, a plurality of optical components mounted at their predetermined positions in the recess of the housing, and a resin member capable of transmitting laser light, wherein the resin member is provided for covering the optical components and fixing them at their predetermined positions in the recess.

Abstract: A method of manufacturing an electronic apparatus having a plastic housing. The method includes blow molding with a one-piece plastic housing around an electronic circuit board populated with components. The circuit board is fastened and held in-situ during the blow molding. Fastening locations are defined by contiguously sandwiched portions of the housing and the electronic circuit board.

Abstract: Placing a flow modifier on a package substrate to create two flow fronts on a molded matrix array package. A flow modifier may be laid on a package substrate to a height that blocks off the bottom of other substrates (e.g., dice) coupled to the package substrate. By separating the top flow front and the bottom flow front, this process prevents the top flow front from wrapping around the sides of the substrates and trapping air below each substrate and in front of the bottom flow front.

Abstract: A method for manufacture of a resin block includes setting high-voltage and low-voltage side conductors in dies, assembling the dies, extruding resin so as to form a resin block having the high-voltage side conductor and the low-voltage side conductor embedded therein, cooling the molded resin block, and taking out the molded resin block from the dies.

Abstract: Substrate, in particular a multilayer substrate constituting a mounting and electrical-connection support, having a face (2) for mounting at least one integrated-circuit chip (3) and capable of being placed, provided with this chip, in an injection mould (8) having two parts which take between them the periphery of the substrate and one of which defines a cavity (15) for moulding an encapsulation material for the purpose of encapsulating the said chip and has a face for bearing on the said mounting face, in which at least one recess (16) is provided, the said recess defining, above the said mounting face, a slot (17) constituting a vent for venting gases. Its aforementioned mounting face (2) has a region on which a metal outer layer (6) is placed, this layer being placed so as to extend along the said recess (16) and on the said bearing face (12) on either side of this recess.

Abstract: A method for making a fuel cell has steps of forming a sacrificial layer on a substrate, forming a fuel cell on the substrate, forming a connector that connects the fuel cell to the substrate, and removing the sacrificial layer. After the sacrificial layer has been removed, the fuel cell is generally free standing over a planar surface of the substrate with a gap defined therebetween.

Abstract: A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.

Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.

Abstract: A method for preparing a hollow tube of shrinkable polymeric material by providing a hollow tube in an expanded state and partially contracting a portion of the length of the hollow tube. A first length in the expanded state is folded over a second length in the partially contracted state. A body such as a length of electrical cable is inserted into the hollow tube, and the first length is unfolded so that it no longer overlies the second length. The first length and the second length are contracted to the fully contracted state over the body.

Abstract: A method of manufacturing an improved comb for a disk wound transformer. The method comprises the steps of providing a web of cellulose material; removing a portion of the cellulose material to create a plurality of longitudinal slits along the length of the web, wherein the longitudinal slits have a fixed length and width; and folding the web along a line proximate the midpoint of the length of each of the longitudinal slits such that the cellulose material adjacent the longitudinal slits defines a plurality of tooth members.

Abstract: The invention concerns a method for manufacturing an electrical insulator that includes a body (1) and a coating (5, 5a) of insulating material arranged on the body (1) where the coating is applied onto the body in a screw-like form or a helical-like form, whereby the coating is applied by extrusion directly on the body (1). In this way, the build-up trapped pockets of air between the applied coating and the body (1) is prevented, and good adhesion is achieved. The invention also concerns an apparatus for manufacturing an insulator as well as the use of the said method or apparatus for the manufacturing of a high voltage insulator.

Abstract: An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The electrical signal produced by the detector is conducted to a hub located at the central aperture of the polishing pad. The disposable polishing pad is removably connected, both mechanically and electrically to the hub. The hub contains electronic circuitry that is concerned with supplying power to the optical sensor and with transmitting the electrical signal to a non-rotating station. Several techniques are described for accomplishing these tasks. The system permits continuous monitoring of an optical characteristic of a surface that is being polished, even while the polishing machine is in operation, and permits the end point of the polishing process to be determined.

Abstract: A hearing aid instrument of the in-the-ear type (and preferably CIC) provides a plate member with electronic hearing aid components mounted thereto. The plate member is preferably of a harder material such as hard plastic. A soft polymeric body is bonded to the plate member and encapsulates preferably a plurality of the electronic hearing aid components. The body is soft and is shaped to conform to the ear canal of the user. The soft polymeric body and encapsulated electronic hearing aid components define a soft structure compliant to the ear canal during use and that is substantially solid and free of void spaces between at least some of the components and the ear canal. This combination of soft compliant structure and encapsulated electronic hearing aid components addresses problems of peripheral leakage, poor fit, pivotal displacement that occurs with jaw motion and internal cross talk of components housed in prior art hollow type hearing aids.

Abstract: A method of producing a vehicle panel. The method comprises the steps of: laying wire on a first sheet of thermoplastic or thermoset composite material in a desired configuration; placing or forming a second sheet of thermoplastic or thermoset material on the first sheet of material thereby sandwiching the wire; and, pressing the sheets together so that they encase and insulate the wire, wherein the wire is left exposed at connection points formed by apertures in the sheets. A vehicle panel made according to the method is also disclosed.

Abstract: A method of forming a receptacle connector insert capable of maintaining constant distances between terminal groups even when a receptacle connector has the terminal groups of three rows or more and of being easily produced, comprising the steps of locking a terminal group (2) positioned at both ends to a pair of metal mold main bodies (4) as shown in FIG. 3(a) and holding a terminal group (2) arranged at the center in a rear core (6), moving a front core (5a) arranged on the right side of a curved part (2b) downward while bending the curved part (2b) as shown in FIG. 3(b), storing the curved part (2b) in a second storing part (10a) as shown in FIG. 3(c), moving a front core (5b) arranged on the left side toward the curved part (2b) as shown in FIG. 3(d) and storing the curved part (2b) in a second storing part (10b) as shown in FIG.

Abstract: A device for accomodating at least one, preferably electrical or electronic, component, comprising a housing forming an interior defined by an inner wall surface, in which interior the at least one component is arranged, the at least one component occupying less than all of the interior of the housing, the balance being filled with a casting material, wherein a projection from the inner wall surface encircles the interior and forms an undercut filled by the casting material to lock the casting material to the inner wall surface.

Abstract: A wireless ad hoc pico network is formed by eyewear and other devices such as a computer, a bracelet and a telephone having similar transceivers mounted on them. Master slave relationships are configurable. Other devices, such as a radio, a CD player, a hand held global positioning satellite system and a heart rate monitor, having similar transceivers, can also be connected with the transceiver of the eyewear. The transceivers operate on globally available, unlicensed radio band, 2.45 gigahertz (GHz) and conforms to the Bluetooth standard. The power consumption of Bluetooth enabled devices is less than three percent of the power consumption of a mobile phone. The eyewear includes a frame and connected to the frame are two temples. Temples are connected to frame via hinges. Temples have a male portion of a connector incorporated in them. Female portion of the connector is made integral with the hinges. When the male portion is inserted in the female portion the temple is attached to the frame.

Abstract: An integrated circuit leadframe is specially adapted to adhere to injection mold cleaning compounds in the area of vents for an injection mold. An area of a leadframe rail that is normally positioned adjacent a mold vent is provided with apertures, surface roughness or a surface coating to cause the cleaning compound to more tightly adhere to the leadframe rail. As a result, cleaning compound flash is removed from the vents when the leadframe is removed from the mold.

Abstract: A hardener for an epoxy resin includes an accelerator having a tetraalkylphosphonium salt.

Abstract: A method of encapsulating a plurality of OLED devices fabricated upon a substrate is described, the steps of said method comprising: fabricating a plurality of OLED devices on a substrate; depositing at least one planarization layer upon said OLED devices; hardening said at least one planarization layer in a patterned manner such that the hardened region substantially covers said OLED device; removing areas of the at least one planarization layer that are not hardened; and selectively depositing at least one barrier layer over said hardened region.

Abstract: A fluid containment fence apparatus provides a border around the perimeter of an area to be potted on one or both sides of a circuit board. First, or first and second (top and bottom), containment walls are secured in place using interlocking elements integral to the walls such that no external fasteners are needed. The interlocking elements permit snug adhesion of the fence to the board even when the board has variations in thickness. The interlocking elements extend through and interlock through engagement with another fence or the board. The size of the holes is minimized. As a result, a minimum amount of board space is occupied by the fence, and the overall size of the board is maintained.

Abstract: A system and method is disclosed that uses an empirically-derived thermal transfer function for an ignition coil taken with respect to an ambient temperature and responsive internal temperatures. The system combines the transfer function with a minimum cure-induced stress profile, in order to obtain a time-temperature profile for minimizing cure-induced residual stress in an epoxy resin impregnated ignition coil. An accelerated minimal-stress profile is obtained by increasing an initial gel isotherm temperature of the above-mentioned time-temperature profile.

Abstract: A method for making a piezoelectric composite transducer is disclosed. A block of piezoelectric material having a common base and a plurality of uniform-length rods is utilized. An electric conductor is positioned to extend through a side region of the block. Spaces between the rods are filled up to a first surface region with a viscoelastic material. The common base of the block is removed forming a second surface region. Electrodes are deposited at the first surface region to be in contact with the rods and in electrical contact with the electric conductors. A ground electrode is deposited at the second surface region to be in contact with the rods. The resulting piezoelectric composite transducer can be heated and shaped to conform to complex curves.

Abstract: A multi-layer printed wiring board is manufactured by forming a wiring pattern and a component mounting portion on a first substrate. An insulating spacer, formed with a first opening, is stacked over the first substrate with the first opening in registration with the component mounting portion. A second substrate is stacked over the spacer and the resulting assembly is bonded together. A second opening, continuing to the first opening, is formed in the second substrate, exposing the component mounting portion to the outside. An LSI is mounted on the component mounting portion, the first and second openings are filled with a synthetic resin mass, and then a third substrate is stacked over the second substrate to enclose the openings.

Abstract: A device for and method of packaging electronic components (1) using injection-molding. For this purpose, a multiplicity of components (1) are arranged in predetermined positions on a first side (2) of a leadframe (3). The leadframe (3) has interconnects (5) with contact terminal areas (6) for connecting to contact areas (7) of the electronic components (1) and contact vias (8) to external contacts on a second side (10) of the leadframe (3). In this case, the leadframe (3) includes a ceramic substrate (11) with a first side (2) having edge regions (12) configured with a ductile, annular metal layer (13).

Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Abstract: The present invention provides an improved electrolytic capacitor device and a method of constructing the same. The capacitor includes a central support post that is inserted into an arbor hole in the center of the active element. The present invention provides a capacitor post that has a core material of metal or thermally conductive polymer that has an outer protective layer formed thereon. The outer protective layer is net shape insert molded over the core using a thermally conductive, electrically insulative polymer material that protects the support core from interfering with the electrical operation of the capacitor while increasing the capacitor's ability to transfer waste heat from the active element to the exterior of the device. The outer layer further includes an integrally formed thermal transfer pad that resides adjacent to the outer can of the capacitor when the capacitor post is installed.

Abstract: Several methods for fabricating an ultrasound transducer assembly having a flexible circuit are provided. Preferably, the method comprises attaching an ultrasound transducer array and integrated circuitry to the flexible circuit during fabrication of the ultrasound transducer assembly while the flexible circuit is in a:substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes.

Abstract: Disclosed are a resin material supply apparatus and a method thereof ensuring a predetermined amount of resin material to be supplied and the molding quality to be improved without the need of storing many types of tablets or managing products by separation of damaged ones or by other methods.

Abstract: A mixed potential electrochemical sensor for the detection of gases has a ceria-based electrolyte with a surface for exposing to the gases to be detected, and with a reference wire electrode and a sensing wire electrode extending through the surface and fixed within the electrolyte as the electrolyte is compressed and sintered. The electrochemical sensor is formed by placing a wire reference electrode and a wire sensing electrode in a die, where each electrode has a first compressed planar section and a second section depending from the first section with the second section of each electrode extending axially within the die. The die is filled with an oxide-electrolyte powder and the powder is pressed within the die with the wire electrodes. The wire-electrodes and the pressed oxide-electrolyte powder are sintered to form a ceramic electrolyte base with a reference wire electrode and a sensing wire electrode depending therefrom.

Abstract: A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink is affixed to a surface of the die by way of a thermally compliant material. The compliant material reduces the stresses caused by temperature fluctuations which cause the heat sink and the die to expand and contract at different rates. A first molding material is deposited around the periphery of the die, compliant material and heat sink, thereby leaving exposed substantially an entire surface of the heat sink.

Abstract: A system for dispensing a viscous material onto a substrate which includes a dispensing element, a viscous material reservoir and a metering device coupled between the reservoir and the dispensing element for metering a variable amount of a viscous material through the dispensing element. The dispensing element and metering device can be moved by a positioner along a predetermined pattern adjacent a surface of a substrate. A weigh scale located adjacent the substrate receives a metered amount of the viscous material and produces signals representative of a variable weight of the material dispensed during a predetermined time interval. A controller adjusts a speed of movement of the positioner along the predetermined pattern to cause the dispensing element to dispense a desired amount of material based on a calculated flow rate.

Abstract: Methods for forming packages for housing an integrated circuit device are disclosed. In one embodiment, a plastic sheet having an first surface is provided. An array of package sites is formed on the first surface of the plastic sheet. The package sites each include a metal die pad and leads surrounding the die pad. The package sites may be formed by applying a first metal layer on the first surface of the plastic sheet, and then applying a second metal layer in a pattern that defines the die pads and leads of the package sites. The first metal layer is then selectively etched using the second metal layer as an etch mask. Next, an integrated circuit die is placed on each die pad of the array. The die is electrically connected to the leads surrounding the respective die pad. An encapsulant is applied onto the first surface of the plastic sheets so as to cover the package sites.

Abstract: A vegetable oil-based polyol is made by adding a peroxyacid to vegetable oil wherein said peroxyacid reacts with said vegetable oil to form epoxidized vegetable oil and adding said epoxidized vegetable oil to a mixture of an alcohol, water, and a catalytic amount of fluoboric acid so as to form a vegetable oil-based polyol. A further embodiment of the present invention involves making a vegetable oil-based polyol using an epoxidized vegetable oil as the starting material. The epoxidized vegetable oil undergoes hydroxylation by the same process as outlined above. According to another aspect of the present invention, the vegetable oil-based polyol formed by the novel methods of this invention may be reacted with an isocyanate to form a polyurethane. Alternatively, a filler such as silica may be combined with the vegetable oil-based polyol before it is reacted with the isocyanate. These polyurethanes made from vegetable oil-based polyols may be used to form electroinsulating casting resins.

Abstract: A method for producing a monolithic, seamless, polymeric housing structure for a micromachine uses a stereolithographic method to produce the structure layer by layer by exposing sequentially formed films of photopolymer to a beam of electromagnetic radiation scanned over patterns of locations corresponding to at least partially superimposed layers of the housing structure. The housing structure may include openings through which movable elements such as shafts and linkages may extend, and may provide sealed passage for electrical conductors therethrough from the micromachine to the exterior of the housing structure. Complex housing structures including closed or almost closed chambers and interior partition walls as well as interior passages of complex configuration may be formed to accommodate individual components or component assemblies.

Abstract: A vehicle headliner assembly includes a headliner attachable to the vehicle interior roof. The headliner includes a plurality of material layers. At least one audio speaker is sandwiched between the material layers. The speaker has a thickness of less than approximately 8 millimeters. A subwoofer may be provided elsewhere in the vehicle to complete the audio system.

Abstract: A transponder contains an integrated circuit, a power transmitting component (antenna) and a capsule made of a thermoplastic resin (hot glue) that surrounds the circuit continuously at least on one surface of the circuit. The glue preferably is a polyamide and surrounds the circuit protectively, ensuring a mechanical connection between the circuit and the antenna. The encapsulation with the hot glue is conducted at pressures and temperatures that are below the pressures and temperatures encountered during conventional injection molding. The transponder can be integrated into an injection molded part, for example a coin, by being placed in an injection mold in which it is supported by feet and then surrounded by molding material in a conventional injection molding process so that it develops a more resistant sheath.

Abstract: A manufacturing method of an EL insert molding which can manufacture the EL element without damage while a temperature and a pressure of resin to be injected are maintained at an optimum forming condition. A luminous portion and a non-luminous portion are provided in an EL element. The EL element is inserted in a cavity of an injection die, and resin is injected into the cavity to manufacture the EL insert molding. In the cavity, a gate portion is provided at a position opposite to the non-luminous portion of the EL element. A decorative film 2 may be formed integrally in front of the EL element.

Abstract: An end face of a transparent electrode or a backside electrode of an EL element is not bared in an end surface of an outer periphery of an EL insert molding or an end surface of an inner periphery of a through hole portion and the end face of the transparent electrode or the backside electrode of the EL element does not short-circuit with arranged other members. A decorative film is provided on a surface side, an EL element 3 provided on a backside of the decorative film, and molding resin is injected onto a backside surface of the EL element to form a molding resin portion. An end potion of the decorative film is provided to be shifted outwardly than an end portion of the EL element. The end portion of the EL element is covered with the end portion of the decorative film in a manner that the end portion of the decorative film is bent in a projection molding of the molding resin.

Abstract: Conformal-coated devices packaged to be compatible with automated handling equipment. In one arrangement, open-sided, injection-molded shells are mounted around conformal-coated devices to provide dimensionally stable packaging that is compatible with device carriers and automated packaging tool heads that are indexed to select and place the devices. In another arrangement, the coating is heated and additional material is added and re-flowed to define unique surface regions compatible with automated handling equipment.

Abstract: A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper surface of a substrate. A terminal of the passive chip component is aligned with the solder paste. The solder paste is melted to form a solder joint between the passive chip component contact and the terminal. Solder flux residue from the solder paste is removed. A solder bump is formed on a bond pad of an active chip component. The solder bump is aligned with an active chip component contact on the upper surface of the substrate. The solder bump is melted to form a bump between the active chip component contact and the bond pad, wherein the solder joint does not melt during the melting of the solder bump.