Abstract: A method for producing stator packs for long-stator linear motors of magnetic levitation vehicles is described. At first steel sheets are stacked to form a sheet stack, cross members are inserted into grooves of the sheet stack and the sheet stack and the cross members are connected with each other to form a solid structural unit. Further it is provided to so insert the structural unit into an open-top casting mold that the cross members are laid onto rims of the casting mold by means of head parts provided at their ends and are positioned by means of positioning pins provided at said ends. Afterwards the filling of the casting mold with a casting resin mixture takes place, advantageously pressureless, for the formation of a corrosion protection layer surrounding the sheet stack. After the hardening of the casting resin mixture the finished stator pack can be removed from the casting mold.

Abstract: A method of making a fluid cooled microelectronic package in which fluid is circulated through the package in fluid-carrying channels defined at least in part by voids in an encapsulant that surrounds the package components. Preferably, the encapsulant channels are defined in part by heat producing components of the package so that coolant fluid directly contacts such components. The coolant fluid can be electrically conductive or non-conductive depending on the type of components being cooled. The coolant channels are formed by insert-molding a form in the encapsulant, and removing the form following the molding process. Alternately, the encapsulant is formed in two or more pieces that are joined to form the package, and the coolant channels are defined by recesses formed in at least one of the encapsulant pieces.

Abstract: In general, the invention is directed to techniques for forming a seal between parts of an overmold component. The overmold component includes a first part forming one or more thorough-holes and a second part overmolded to the first part. A through-hole may be, for example, a screw hole or an overmold material entrance hole. The through-holes formed by the first part are surrounded by an adhesive prior to overmolding the second part. After overmolding, the adhesive locally bonds the surface of the first part to the overmold part to make a seal around the through holes. For example, the overmold component may combine with a cover to form a housing of a disc drive or other electronic device defining an internal environment. In this example, the adhesive prevents external contaminants from entering the internal environment via the through-holes.

Abstract: Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded compositions. The pre-forms are molded in molds that are formed using modified images obtained from printed circuit boards having the electronic components thereon. Images of the printed circuit boards are obtained and modified to improve vibrational dampening and/or heat transfer. The molded pre-forms allow for access to the printed circuit boards for purposes of replacing or repairing the printed circuit boards. The molded pre-forms are particularly suitable for down hole applications.

Abstract: A technology is provided that can seal the opening in a wiring board using a transfer mold insulating resin from the opening. A mold die is used which includes a first die having a recess in a predetermined form and a second flat die. The first die is disposed on a surface of a wiring board which has a plurality of openings and on which a semiconductor chip is mounted via an elastic material. The second die is disposed on a back surface of the wiring board opposite the surface on which the semiconductor chip is mounted. The mold is used for sealing with an insulating resin the periphery of the semiconductor chip and at least one of the openings of the wiring board, wherein the above-described second die has a protrusion around an area overlapping the opening to be sealed with the insulating resin.

Abstract: At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7, is sandwiched between the top mold member 10 and bottom mold member 20, a movable disc 12 is urged by a spring device 13, into close engagement with the bottom mold member 20. While the movable disc 12 is closely engaged with the bottom mold member 20, the stack 2 of the resolver is sandwiched between the bottom mold member 20 and the top mold member 10. This method prevents the generation of gaps between the stator stack 2 and mold 10, 20 due to unevenness of the thickness in the stator stack 2.

Abstract: A process is provided for manufacturing a hybrid electrical component (40), which has as electrical conductors connection elements (2, 3, 4, 5). The electrical conductors connection elements are punched out of a pressed screen (1) and are in turn extrusion-coated with a plastic housing (24). To make it possible to manufacture such a hybrid component in a possibly continuous process, the connection elements (2, 3, 4, 5) are connected to one another at least before the extrusion coating with stabilizing webs (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16) and are stationarily in connection with the pressed screen (1) via holding webs (17, 18, 19, 20). The pressed screen (1) is extrusion coated with a plastic housing (24) together with the connection elements (2, 3, 4, 5) that are in connection with the pressed screen (1) in one injection molding operation.

Abstract: An optical pickup apparatus is described which includes a movable unit with an objective lens, a focus servo coil for moving the moveable unit containing the objective lens in the optical-axis direction, and tracking servo coils for moving the moveable unit containing the objective lens in the horizontal directions, and a liquid crystal element disposed for correcting the refractive index. Springs simultaneously provide support for the moveable unit and feed power to the liquid crystal element, the focus servo coil, and the tracking servo coils. A method for making said optical pickup apparatus is described. Two sheets, each having four springs extending across an opening formed by punching, are disposed parallel to each other at a predetermined distance. On these sheets, a fixed unit and a movable unit are formed by insert-molding. Excess portions of the metal sheets are removed, and a through-hole is formed so that connected portions of the wirings, lying side by side, are disconnected.

Abstract: Composite structures having an integral intelligent skin are made of one or more plies of a structural base material and an intelligent or smart film by molding one or more plies and the film into an integral unitary body with the intelligent film outermost. The intelligent or smart film contains or bears a functionally active or interactive component such as antennae, electronic sensors, electric and/or electronic circuitry, and/or spectrally tailored coatings. A method of making the composite structure in a very economical manner is disclosed.

Abstract: An apparatus for bonding a transmission line to the central bore of a downhole tool includes a pre-formed interface for bonding a transmission line to the inside diameter of a downhole tool. The pre-formed interface includes a first surface that substantially conforms to the outside contour of a transmission line and a second surface that substantially conforms to the inside diameter of a downhole tool. In another aspect of the invention, a method for bonding a transmission line to the inside diameter of a downhole tool includes positioning a transmission line near the inside wall of a downhole tool and placing a mold near the transmission line and the inside wall. The method further includes injecting a bonding material into the mold and curing the bonding material such that the bonding material bonds the transmission line to the inside wall.

Abstract: A personal hygiene article, such as a toothbrush, includes a handle configured to accommodate an electric power source, a head carrying a treatment tool, and a neck between the handle and the head. The head or neck includes a mechanical motorized vibratory device, including a drive that causes the head to vibrate. Electrical connections are operably connected to the mechanical vibratory device and the electric power source to power the mechanical vibratory device via the electrical connections. In various embodiments, a vibration-damping structure dampens vibration transmission from the head to the handle.

Abstract: A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.

Abstract: This invention relates to a method for coating an elastomeric component with a coating that has a low coefficient of friction and the articles formed by the method. The method includes preparing an elastomeric coating; applying the coating to a substrate; contacting the coated substrate with an elastomeric compound; and heating the elastomeric compound and the coated substrate under pressure to bond the coating to the elastomeric compound and form a coated elastomeric component.

Abstract: A smart card and a method for manufacturing the same wherein the smart card is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board, a filler board, attached to the top surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a thermosetting polymeric layer positioned between the top surface of the printed circuit board and the top overlay.

Abstract: Disclosed is a method of manufacturing a BPF (bandpass filter) for GHz bands of the structure that an input signal line (2) and an output signal line (3) run with a small gap on one surface of a sheet (1) made by dispersing soft magnetic metal powder in a sheet-formed polymer matrix, an internal line (6) bridges on the signal lines, and a GND line (4) runs on the reverse surface of the sheet. The method comprises inserting an intermediate product made by disposing on both the sides of an insulating film (5) the above-mentioned input signal line (2), output signal line (3) and internal line (6), on one side of the cavity of a mold for injection, and inserting a metal piece for the GND line (4) on the other side of the cavity; and injecting a polymer compound to obtain a molded article.

Abstract: A pre-casting multi-layer PCB process has steel plate mold engraved with circuitry and the epoxy coated on the mold for the epoxy to cover up a fiber glass substrate; conductive material coated on the epoxy to insert molding the former into the latter to form recessed circuitry; then baked and solidified, sandblasted to remove film for the conductive material to become conducted circuitry; the lamination made by layer for achieving even thinner PBC circuitry while maintaining sufficient structural strength.

Abstract: The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 104 ?·cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.

Abstract: A method of manufacturing a hearing aid preferably includes the steps of: placing a moldable material in the ear canal of a patient to cast a form; using the form to form a hollow shell with an outer surface that approximates the shape of the patient's ear canal, the shell being of a soft polymeric material providing a mounting member; mounting electronic hearing aid components to the mounting member; joining the mounting member to the hollow shell to define a mold cavity; and filling the shell with a soft polymeric material that substantially encapsulates at least one of the electronic components and bonds to the mounting member, wherein the combination of shell, electronic components and soft polymeric material define a soft structure that is compliant to ear canal movement during use.

Abstract: A robust, low cost, compact and highly accurate rotary position sensor is disclosed for measuring the relative angular position (within a range ?180°) of a housing or stator and a rotor. The housing carries a galvanomagnetic sensing element and is adapted for fixation to a relatively fixed portion of a host system. The rotor carrying a magnet is disposed for rotation about a fixed axis with respect to the stator and is interconnected to a relatively moving portion of the host system through intermediate linkage. The magnet is juxtaposed in substantially axial alignment with the galvanomagnetic sensing element for magnetic interaction therewith. The housing defines a cavity to receive potting material for encasing the galvanomagnetic sensing element and an adjacent buffer cavity interconnected by a weir, which diverts ant excess potting material into the buffer cavity.

Abstract: A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a circuit member-installing portion formed on and projecting from a front surface of a base mold. In the second step, a heated and softened panel material is laid on the front surface of the base mold. In the third step, the air between the panel material and the base mold is drawn via notch spaces and air-drawing holes.

Abstract: An object of the present invention is to improve operability. Stoppers (74) are detachably mounted in a lower mold (70) of a mold. Nuts (30) are screwed down onto the stoppers (74) while being held upside down. After the mold is closed in this state and molten resin is filled into a cavity (77) and solidified therein, the mold is opened. The stoppers (74) are separated from the lower mold (70) as the mold is opened. When the stoppers (74) are separated from the nuts (30) thereafter, a casing 10 having no pin withdrawal hole can be obtained. Accordingly, it is not necessary to apply potting or the like to close the pin withdrawal hole.

Abstract: A method of manufacturing a jaw member for use with a jaw assembly includes the step of: providing a jaw housing, an electrically conductive plate and an insulated wire for conducting a first electrical potential. The method also includes the step of: molding a first plastic onto a surface of the jaw housing such that the plastic forms a datum for receiving the electrically conductive plate and forms an elongated slot therein for receiving the insulated wire therealong. The method also includes the steps of: engaging a lead end of the wire with the electrically conductive plate such that the first electrical potential is conducted to the electrically conductive plate; aligning the electrically conductive plate atop the jaw housing and within the plastic datum such that the insulated wire aligns within the elongated slot; and molding a second plastic to secure the electrically conductive plate and the insulated wire atop the jaw housing.

Abstract: A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.

Abstract: An ignition coil and a method for its manufacturer are provided, the ignition coil including a housing, a primary winding and a secondary winding disposed in the housing, and a terminal including a connection portion in electrical communication with the secondary winding and a threaded portion engaging the housing. The threaded portion of the terminal may include a self-tapping threaded portion. Furthermore, the terminal may include a first body portion having a first threaded portion and a first median diameter and a second body portion having a second threaded portion and a second median diameter, where the second median diameter is greater than the first median diameter. The terminal may also include a shoulder portion having a diameter greater than the second median diameter and a third body portion having a third median diameter greater than the second median diameter.

Abstract: An electrical box for use with insulated concrete form building systems includes a main body having an electrical box cavity for housing electrical outlets, switches, and electrical connections. The insulated concrete form building systems utilize insulated forms to form concrete and the insulated forms are left in place after the concrete has been poured thereby creating an overall insulated concrete element that includes the concrete and the insulated forms. In accordance with the method and the arrangement of the invention, the electrical box includes an arrangement for attaching the electrical box to the insulated form without requiring the use of any additional fasteners.

Abstract: A disk drive includes an enclosure that defines an exterior surface, the enclosure including a base, a cover and a hinge mechanically coupling the base to the cover such that the hinge forms a portion of the exterior surface of the enclosure. A spindle motor is attached to the base, a disk is mounted to the spindle motor, and a head stack assembly is pivotally coupled to the base. A method of manufacturing a disk drive includes a single molding step to form an enclosure including the base, the cover and a hinge that mechanically couples the base to the cover such that the hinge forms a portion of the exterior surface of the enclosure. The spindle motor may then be attached to the base, the disk or disks mounted to the spindle motor and the head stack assembly may be pivotally coupled to the base.

Abstract: To provide a manufacturing method for an optical pickup in which a movable member carrying an objective lens is supported by a fixed member through a pair of elastic support member groups, which are each made up of a plurality of parallel elastic support members, so as to be movable in focusing and tracking directions. In a suspension unit forming step, two holding members are formed from a synthetic resin by insert molding at different positions of each elastic support member group in a lengthwise direction of the elastic support members, thereby forming a pair of suspension units. In a connecting step, the pair of suspension units are opposed with an arrangement direction of the elastic support members being substantially the same as the focusing direction, and one holding member of each suspension unit is connected to the movable member and the other holding member to the fixed member.

Abstract: A shielded socket includes a conducting plate including a plurality of apertures, and an insulating layer. The insulating layer surrounds the conducting plate and lines at least one aperture. In an implementation, the conducting plate includes at least one grounding site.

Abstract: The present invention is a method for manufacturing an electrical connector comprising an insulative housing with a base side and an opposed side and lateral sides interposed between said base side and said opposed side and at least one conductive contact extending from the base side of the insulation in a first leg and then laterally adjacent the top side of the housing in a second leg. In this method there is provided a mold comprising a first die and an opposed second die all defining an interior cavity and an exterior area. A molding compound input port extends between the exterior area and the interior cavity and a contact receiving aperture extending through the first die from the exterior area to the interior cavity. The conductive contact is then positioned so that the first leg extends upwardly from the exterior area through the contact receiving aperture into the interior cavity. The first leg extends through said interior cavity, and the second leg extends laterally adjacent the opposed die.

Abstract: Polyamides based on reaction products of C4-C18 dicarboxylic acids and diamines are suitable as molding compositions for the production of moldings in the low pressure injection molding process, and for adhesive sealing or filling in the production of electrical or electronic devices, in particular of plugs, cables, switches, sensors, transponders, modules, printed circuit boards or smart cards. In comparison with conventional molding compositions based in known hot melt adhesives, said polyamides exhibit higher strength values, higher abrasion resistance and higher chemical resistance.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: A patch and method for mounting an electronic monitoring device to the innerliner of a pneumatic tire is provided wherein the monitoring device is potted directly to an attachment patch. A frame is built on an attachment patch and the electronic monitoring device is disposed inside the frame. An encapsulation material is poured into the frame and cured to encapsulate the monitoring device directly against the patch. The patch may then be connected to the innerliner of a pneumatic tire.

Abstract: A method for fabricating a surface acoustic wave filter chip package includes: mounting a surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the chip; forming a metal shield layer on a whole outer wall of the chip by using a spray process; and molding resins on the metal shield layer. The metal shield layer is formed from a conductive epoxy with the use of a spray nozzle.

Abstract: A method is provided for planarization of structures which minimizes step heights, reduces process steps, improves cleanliness, and provides increased ease of debond. Structures are placed with working surfaces facing down onto an adhesive layer such that structures remain fixed during heating. A bi-layer encapsulating film is used to achieve planarization. A carrier is bi-laminated with a thermoplastic film layer followed by a chemically inert protective polymer film layer that can withstand etch and cleaning processes. The thermoplastic layer is laminated on top of the carrier; the polymer layer is laminated on top of the joined thermoplastic layer and carrier. The carrier with bi-layer film is then placed onto the backside of the structures to resist chemical attack from the front side during photostrip and enable planarization. When heat is applied, the bi-layer encapsulating film melts and pushes the polymer layer into the gaps between structures thereby achieving complete planarization.

Abstract: An improved method of integrally attaching a heat sink to an IC package for enhancing the thermal conductivity of the package. A heat sink matrix, which is dividable into a plurality of individual heat sinks, is attached to an IC package matrix, which is comprised of a plurality of individual IC packages abutting each other in a matrix arrangement. The IC package matrix and the heat sink matrix attached thereto are then simultaneously cut by means of a machine tool into a plurality of individually formed IC packages each with a heat sink attached; thereby, thermal conductivity of a conventional IC package is enhanced.

Abstract: A wireless ad hoc pico network is formed by eyewear and other devices such as a computer, a bracelet and a telephone having similar transceivers mounted on them. The eyewear includes a frame and connected to the frame are two temples. Temples are connected to frame via hinges. Temples have a male portion of a connector incorporated in them. Female portion of the connector is made integral with the hinges. When the male portion is inserted in the female portion the temple is attached to the frame. The temples can be removed by pulling the connector apart, and a temple with different apparatus within it can be inserted in place of the removed temples. The temple may have co-molded within its body, an apparatus such as an audio device, a camera, a speaker, and a microphone, and a display device such as liquid crystal or an alarm.

Abstract: A stereolithographic method and apparatus for applying packaging material to workpieces, such as preformed electronic components, including semiconductor dice, with a high degree of precision, and resulting articles. A machine vision system including at least one camera is operably associated with a computer controlling a stereolithographic system for application of material so that the system may recognize the position and orientation of workpieces, such as semiconductor dice, to which the material is to be applied. The requirement for precise mechanical workpiece alignment is eliminated, and the ability of the system to recognize size, configuration and topography of different workpieces affords greater manufacturing flexibility. The method includes stereolithographic application of material for packaging electronic components, and the electronic components so packaged are also part of the invention.

Abstract: A semiconductor device (21) can include, e.g., a recessed portion (25) on the reverse surface (224) of an insulating resin (22) which is the mounting surface of the semiconductor device (21). Additionally, on the outer peripheral surface of the recessed portion (25), the exposed region of leads (26) and the reverse surface (224) of the insulating resin (22) form generally the same plane. This allows, e.g., a QFN semiconductor device (21) according to preferred embodiments herein to place dust particles in the recessed portion (25) even in the presence of dust particles such as crushed burr particles of the leads (26) or plastic burrs, thereby avoiding mounting deficiencies when mounting the semiconductor device.

Abstract: An apparatus for enclosing logic chips includes a substrate upon which a logic chip is mounted and a mold cap disposed upon the substrate and covering the logic chip. The mold cap includes at least one extension of sufficient size and shape to provide structural support to a corner section of the substrate.

Abstract: Disclosed is a film key sheet with a key top protruding from a resin film which allows a further reduction in thickness and provides a sufficient degree of clarity in visually recognizing a display portion thereof, and a method for manufacturing such a film key sheet. The film key sheet has a film removal hole piercing through the resin film, with a hole edge portion raised from the surface of the resin film being secured to the side surface of the key top. Thus, no resin film exists on the upper and bottom surfaces of the key top, so that it is possible to achieve a further reduction in thickness independently of the foldability of the resin film and drawing accuracy and to provide clarity in visual recognition of a display portion at the bottom of the key top.

Abstract: A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.

Abstract: An aromatic polyimide film for producing an electro-conductive sealing element of a packaged semi-conductor device, has a thickness of 20 to 60 ?m, a moisture vapor transmission coefficient of 0.05 to 0.8 g/mm/m2·24 hrs, a water absorption ratio of 2.0% or less, and an elastic modulus in tension of 5,000 MPa or more, in which a surface of the polyimide film has been treated with reduced-pressure plasma discharge.

Abstract: A method for forming a direct chip attach device (1) includes attaching an electronic chip (3) to a lead frame structure (2), which includes a flag (18). Next, conductive studs (22) are attached to bond pads (13) on electronic chip (3) and flag (18) to form a sub-assembly (24). Sub-assembly (24) is then placed in a molding apparatus (27,47), which includes a first plate (29,49) and second plate (31,51). Second plate (31,51) includes a cavity (32,52) for receiving electronic chip (3) and flag (18), and pins (36,56). During a molding step, pins (36,56) contact conductive studs (22) to prevent encapsulating material (4) from covering studs (22). This forms openings (6) to receive solder balls (9) during a subsequent processing step.

Abstract: In a process for manufacturing a plastic pane (1, 1′, 1″) provided with embedded electrical conductors (4), in particular a window pane, in which the conductors are joined to a surface of a plastic sheet (2, 2′, 2″) which subsequently receives another layer of plastic by injection molding via the rear for the purpose of forming a pane body (3), in which the material of the plastic sheet and the injection-molded plastic are joined together directly by mutual adhesion, and in which that surface of the plastic sheet which is located on the opposite side from the conductors forms one of the outer faces of the finished pane, the electrical conductors are, in accordance with the invention, formed by furnishing with at least one metal wire (4) that surface of the plastic sheet (2, 2′, 2″) which is to be exposed to the rear injection molding.

Abstract: An optoelectronic component has a lens that is formed in the surface of an encapsulant surrounding a semiconductor diode element. With respect to emitters, the lens reduces internal reflection and reduces dispersion to increase overall efficiency. With respect to detectors, the lens focuses photons on the active area of the detector, increasing detector sensitivity, which allows a detector having a reduced size and reduced cost for a given application. The lens portion of the encapsulant is generally non-protruding from the surrounding portions of the encapsulant reducing contact surface pressure caused by the optoelectronic component. This non-protruding lens is particularly useful in pulse oximetry sensor applications. The lens is advantageously formed with a contoured-tip ejector pin incorporated into the encapsulant transfer mold, and the lens shape facilitates mold release.

Abstract: This invention teaches methods of making a hermetic terminal assembly comprising the steps of: inserting temporary stops, shims and jigs on the bottom face of a terminal assembly thereby blocking assembly core open passageways; mounting the terminal assembly inside a vacuum chamber using a temporary assembly perimeter seal and flange or threaded assembly interfaces; mixing a seal admixture and hardener in a mixer conveyor to form a polymer seal material; conveying the polymer seal material into a polymer reservoir; feeding the polymer seal material from the reservoir through a polymer outlet valve and at least one polymer outlet tube into the terminal assembly core thereby filling interstitial spaces in the core adjacent to service conduits, temporary stop, and the terminal assembly casing; drying the polymer seal material at room temperature thereby hermetically sealing the core of the terminal assembly; removing the terminal assembly from the vacuum chamber, and; removing the temporary stops, shims.

Abstract: A polymer electrolyte fuel cell includes a stack of unit cells each including a hydrogen-ion conductive polymer electrolyte membrane, an anode and a cathode sandwiching the polymer electrolyte membrane, an anode-side separator having a gas flow channel for supplying a fuel gas to the anode, and a cathode-side separator having a gas flow channel for supplying an oxidant gas to the cathode. A pair of current collector plates sandwiches the cell stack, and a pair of end plates clamps the cell stack and the current collector plates under pressure. The current collector plates include a conductive carbon material and have a terminal section for connecting a power output coupling in the vicinity of an inlet-side manifold for the fuel gas or the oxidant gas.

Abstract: A method for producing a pressure sensor, in which a semiconductor pressure pick-up is mounted on a mounting section of a lead grid, in particular a leadframe. The semiconductor pressure pick-up is electrically connected to contact sections of the lead grid. The lead grid, together with the semiconductor pressure pick-up, is inserted into an injection molding die. A die part is brought into contact at the side of the semiconductor pressure pick-up facing away from the mounting section or at side of the mounting section facing away from the semiconductor pressure pick-up. The semiconductor pressure pick-up in the injection molding die is subsequently enclosed by a housing made of mold compound. In order to prevent the mounting section from giving way, it is proposed to clamp the mounting section of the lead grid in the injection molding die when producing the housing.

Abstract: A cost effective manufacturing process encapsulates a light emitting polymer (LEP) device between two flexible sheet materials, where one sheet may act as the substrate for the LEP device and the other sheet may act as a cover for the LEP device, and at least one of the sheets is transparent. Both encapsulating sheets and, as required, an adhesive system binding the sheets together provide sufficient environmental barriers with low moisture vapor transmission rates (MVTR) and oxygen transmission rates (OTR). The encapsulating sheets may, for example, be laminated together, sandwiching the LEP device in a vacuum, or oxygen/moisture free, and inert gas environment. Prior to encapsulation the LEP device may be heated and placed in a vacuum to remove moisture, air and residual solvents.

Abstract: A composition, apparatus, and system, as well as fabrication methods and processes therefor, may include a resin and a filler having a negative coefficient of thermal expansion.