Abstract: A method comprising: a first process of placing a laminated rotor core in a preheating device to preheat the laminated core; a second process of removing the preheated laminated core from the preheating device and disposing the laminated core between upper and lower dies of a resin sealing apparatus; a third process of pressing the laminated core by the upper and lower dies and liquefying resin material in resin reservoir pots by heating; and a fourth process of ejecting the liquefied resin material from the pots into the magnet insertion holes by plungers inserted and moving vertically in the pots and thermally curing the resin material. The method improves efficiency of resin sealing the permanent magnets in the laminated core.

Abstract: A method of manufacturing an electronic component assembly is disclosed comprising disposing an electronic component in a housing such that there is at least one void space between the component and the housing, disposing non-conductive microspheres in the void space to substantially fill the void space, and disposing a fluid potting material in the housing and hardening or curing the potting material to pot the component in the housing. An assembly is also disclosed comprising a housing, an electronic component disposed in the housing such that there is at least one space between the component and the housing and the space is substantially filled with non-conductive microspheres, and a material that potting the first electronic component in the housing. The invention enables an electronic component in a housing with a space left between the housing to be potted with reduced formation of bubbles in the hardened potting material.

Abstract: A method of manufacturing a jaw member of an end effector assembly for use with an electrosurgical instrument is disclosed that includes the steps of providing an electrically conductive tissue engaging plate and a jaw support; covering one side of the electrically conductive tissue engaging plate with an electrically insulative, thermally non-degrading coating; placing and securing the electrically conductive tissue engaging plate and the jaw support into a jaw mold; and introducing a liquid substance into the jaw mold and allowing the liquid substance to cure around the electrically conductive tissue engaging plate and the jaw support. Alternatively, the method includes the steps of: providing an electrically conductive tissue engaging plate and a jaw support; covering one side of the electrically conductive tissue engaging plate with an electrically insulative, thermally non-degrading coating; and securing the side of the electrically conductive tissue engaging plate onto the jaw support with an adhesive.

Abstract: Portable electronic devices with sealed connectors are provided. A sealed connector may be formed using a multi-shot insert molding process. The sealed connector may include contacts. A first shot of thermoplastic may be injected to form a contact housing that is molded around the contacts. The contact housing may be encased in a metal shell. A second shot of thermoplastic material may be inserted to form a connector housing that is molded around the contact housing. An elastomeric sealing member may be integrated into the connector housing. A sealed connector formed in this way may be fitted into a device housing of an electronic device. The sealed connector may prevent ingress of liquid, dirt, or other undesirable debris that may enter into the device through the connector port. A flex circuit within the device may have solder pads that may be soldered to corresponding contacts in the connector.

Abstract: A front cover for a vehicle lighting fixture is attached to the front opening part of the vehicle lighting fixture having a lamp body and a light source installed in the lamp body. A part of the surface of the front cover opposed to the light source includes a heating element having a three-dimensional curved surface. The heating element includes a mesh pattern having intersections of a large number of grids formed of conductive metallic filaments and a first electrode and a second electrode formed at both opposed ends of the mesh pattern. The projection shape of the outline of the entire mesh pattern is formed in a rectangular shape having the longitudinal direction, for example, between the first electrode and the second electrode.

Abstract: A housing for portable electronic device is disclosed. The portable electronic device includes a base, a bracket fixed in the base and an embedding assembly. The embedding assembly is embedded into the base and fixedly connecting to the bracket. The invention also discloses a method for manufacturing the housing.

Abstract: The present invention provides a fuel cell separator having an airtight gasket, in which a gasket is integrally injection-molded in a region that requires airtightness of a fuel cell separator to maintain airtightness of each flow field of the separator and to smoothly guide the fluid flow in each flow field. For this purpose, the present invention provides a fuel cell separator having an airtight gasket, which is integrally injection-molded on both surfaces of the separator to form a closed curve.

Abstract: The invention relates to a process for producing a toothbrush having a body, which comprises a handle region, a head region and a neck region located between the handle region and the head region, and having functional elements which are arranged, at least in part, within the body and comprise an electrically operated functional unit and an electric supply device which has an energy store and is intended for the functional unit, in the case of which the body is produced, by injection molding, from at least one hard component, which serves as a reinforcement, and at least one soft component, and at least some of the functional elements, during the production of the body, are encapsulated, at least in part, directly by the plastic which forms the soft component.

Abstract: An RFID assembly includes a base having a peripheral wall, an RFID inlay including an RFID tag disposed within the peripheral wall, and a disk having a periphery engaged by the peripheral wall to capture the inlay between the base and the disk within the peripheral wall. One of the base and the disk has external fingers for releasably securing the assembly to a support structure, such as a projection on a mold core for disposition within a mold cavity to mold a container preform around the mold core within which the RFID assembly is embedded. The container preform can be blow molded into a hollow plastic container within which the RFID assembly is embedded. The projection preferably is on an end of the mold core, so that the RFID assembly is embedded in an end wall of the preform and a bottom wall of the container.

Abstract: A metallic resin cover constitutes a portion of an outer wall of a human detection device in which a detection electrode of a capacitance sensor is provided, and which detects whether a human touches or approaches the human detection device. The metallic resin cover includes a covered body; and a metal layer that has a metal-object discretely arranged structure in which a plurality of metal objects are discretely arranged. The metal layer covers an outer surface of the covered body.

Abstract: A seal is provided around a vacuum interrupter and an air-filled cavity, and a tube is provided within the seal. The tube has a first end open to the air-filled cavity and a second end open to an exterior of the seal. The seal, the vacuum interrupter, and the air-filled cavity are encapsulated.

Abstract: An enclosure for electronics includes a body with a metal component and a polymeric component overmolded onto the metal component so as to be connected to the metal component without fasteners. The body defines a recess. A heat sink is defined in the metal component. A printed circuit board is located in the recess and includes a plurality of electronic components mounted thereon.

Abstract: Methods for making and using vacuum switching devices are disclosed. A vacuum switching device has an operating rod for actuating a movable electrical contact within the device. The operating rod may be a hollow epoxy glass tube with an electrical sensor disposed within it, and there may be an elastomeric polymer filling compound disposed within the tube and encasing the sensor. The operating rod may be attached to the movable electrical contact on one end by a steel end-fitting that has been press-fit into the tube and secured with at least one cross pin. In this way, a very secure electromechanical connection may be made between the operating rod and the rest of the vacuum switching device, and the sensor is protected from shock associated with the operation of the device. Moreover, the vacuum switching device is compact and easy to construct.

Abstract: An RFID assembly includes an RFID inlay, with an RFID tag, encapsulated within a plastic housing. The housing has a peripheral array of flexible resilient fingers for mounting the housing within a pocket on a support structure, such as a pocket on a mold core. The pocket preferably is on an end of the mold core so that the RFID assembly preferably is disposed substantially beneath the end surface of the mold core. Plastic material, which preferably is the same plastic material as forms the plastic housing in which the inlay is contained, can be injected into a mold cavity surrounding the mold core and the assembly housing without eroding the material of the housing.

Abstract: A fairing has a moulded body and an electrical wire embedded therein. The body may be constructed from a moulded plastics material or a composite material.

Abstract: A memory element mounting method includes: a disposing step of disposing a memory element at a sheet of paper that is composed of plural layers including a first layer serving as a base and a second layer serving as a surface with a thermoplasticity; and a surface treatment step of melting at least the surface of the sheet of paper with the memory element disposed thereat and processing the molten surface of the sheet of paper into a predetermined surface shape. Since the memory element is mounted on the sheet of paper during the surface treatment of the sheet of paper rather than during production of the sheet of paper, the memory element can be mounted on the sheet of paper as required.

Abstract: A manufacturing method of a semiconductor device includes arranging a melted resin on a substrate, arranging a semiconductor chip on the melted resin, pressing the semiconductor chip and flip-chip mounting the semiconductor chip on the substrate, and hardening the melted resin with the melted resin being subjected to a fluid pressure and forming a resin portion.

Abstract: A grommet for an electrical connector that comprises a main insulative body that defines a longitudinal axis and at least one inner bore extending through the main insulative body along the longitudinal axis and adapted to receive a wire. The inner bore is defined by a funnel shaped entry area, a contact receiving area opposite the entry area, and an extended longitudinal sealing web that is disposed between the entry area and the contact receiving area. The extended longitudinal sealing web being configured to provide a large surface area for continuous sealing contact with the wire.

Abstract: A housing functioning as an antenna includes: a decorative film, an antenna member having a connecting pole, and a base body. The housing is formed by injection molding a molten plastic material over the decorative film, the base body is formed from the molten plastic material, and the antenna member is embedded between the decorative film and the base body, the connecting pole is exposed to the outside. A method for fabricating the housing is also described.

Abstract: A touch panel module includes a capacitive touch panel and a seamless shell body. The capacitive touch panel includes a touch surface actuated by a touch action. The seamless shell body is formed by a molding material, and includes a touch portion which is transparent and a peripheral portion which is integrally formed with the touch portion, wherein the touch portion is molded to the capacitive touch panel. A method of making the touch panel module is also disclosed.

Abstract: A method and system for molding an electronic device which is located next to a molding cavity and clamped to the molding cavity during molding, comprising providing molding compound in a mold supply pot, discharging the molding compound from the mold supply pot into a runner, and distributing the molding compound through the runner into the molding cavity in order to fill the molding cavity. A movable surface comprised in the molding cavity is positioned to form a first gap between the movable surface and the electronic device when the molding cavity is being filled. After filling the molding cavity with molding compound, the movable surface is driven to form a second gap between the movable surface and the electronic device which is smaller than the first gap, thereby compressing the molding compound in the molding cavity. A molded electronic device thus produced is then separated from the molding cavity.

Abstract: An electronic device case having an antenna pattern embedded therein according to an aspect of the invention may include: a radiator having an antenna pattern portion transmitting and receiving a signal and a connection terminal portion allowing the signal to be transmitted to and received from a circuit board of an electronic device; a connection portion partially forming the radiator and connecting the antenna pattern portion and the connection terminal portion to be arranged in different planes; a radiator frame manufactured by injection molding on the radiator so that the antenna pattern portion of the radiator is provided on one side of the radiator frame and the connection terminal portion is provided on the other side thereof; and a case frame covering the one side of the radiator frame on which the antenna pattern portion is provided so that the antenna pattern portion is embedded between the case frame and the radiator frame.

Abstract: A housing with a built-in antenna includes a film layer, an antenna layer, a base layer; and at least a connecting pole. The antenna layer is comprised from electro-conductive inks and printed on the film layer, the housing is formed by injection molding a molten plastic material over the film layer, the base layer is formed after the molten plastic material cooled, the antenna layer is embedded between the film layer and the base layer, the connecting pole is embedded in the base layer with an end of the connecting pole contacting the antenna and the other end of the connecting pole exposed to the out side.

Abstract: An electronic device with a light source is provided. The electronic device includes a base substrate, one or more electrical components placed on the base substrate, and a light source placed on the base substrate. The electrical components and the light source are electrically connected in a pre-defined manner. A molding material is molded over the electrical components and the light source, wherein the light source is partially visible.

Abstract: An hermetic sealing apparatus is discussed. The apparatus may include one or more of the following a glass mask disposed on an upper surface of a first substrate, a support member disposed on an upper surface of the glass mask, a laser irradiation member positioned spaced on the upper surface of the glass mask, a plurality of lower support members disposed in a contour region of a lower surface of the second substrate, and pressing members disposed on a lower surface of the lower support members.

Abstract: A stretchable electronic circuit that includes a stretchable base substrate having a plurality of stretchable conductors formed onto a surface thereof, with both the stretchable base substrate and conductors being bendable together about two orthogonal axes. The stretchable circuit also includes a stretchable sensor layer attached to the base substrate with a cavity formed therein which has a contact point exposing one of the plurality of stretchable conductors. The stretchable electronic circuit further includes a surface mount device (SMD) package with a conductor contact protrusion installed into the cavity, and wherein a substantially constant electrical connection is established between the conductor contact protrusion and the stretchable conductor at the contact point by tensile forces interacting between the stretchable base substrate and the stretchable sensor layer.

Abstract: A display housing includes an injection-molded enclosure, configured for attachment to a base of a portable computer at a hinge region, and a conductor, insert-molded into the enclosure, extending from the hinge region.

Abstract: A method to furnish the edge portion of sheet (1) with a strip, as a strip (2) of plastic material using device (3) comprising a die space (7). The edge of sheet (1) is fitted inside device (3) that feeds plastic material to die space (7) and by means of restrictive organs (8) and die surfaces, of which device the escape of heated plastic material from a die space (7) is avoided, the sheet is arranged to move in regard to the feeding (3) device, the sheet edge being inside said device, die space (7) of device (3) is heated during the process.

Abstract: A cable fixture device for routing at least one cable element from a first location on the cable fixture device to a second location on the cable fixture device is provided. The cable fixture device includes a strip element and a plurality of pin elements disposed on at least one surface of the strip element. Each of the plurality of pin elements includes a stem element and a head element. The stem element of the each pin element is attached to the strip element. Further, each pin element is capable of elastic deformation and the at least one cable element is routed through the plurality of pin elements. The head elements of the plurality of pin elements prevent disengagement of the at least one cable element from the cable fixture device.

Abstract: A method of manufacturing an antenna-embedded case for a mobile communications terminal includes providing an antenna pattern, forming a first injection-molded member covering one surface of the antenna pattern, and disposing the first injection-molded member, provided with the antenna pattern on one surface thereof, in a second mold with the antenna pattern disposed in a space inside the second mold, and injection-molding a second injection-molded member covering the other surface of the antenna pattern to embed the antenna pattern between the first injection-molded member and the second injection-molded member.

Abstract: A connector includes a plate-shaped contact; and an insulator including a fixing hole into which the contact is pressed to be fixed. At least a part of the fixing hole has a cross section in a cruciform shape.

Abstract: The invention relates to a panel part of the outer panel or inner panel of a motor vehicle. Said panel part comprises a base body (10) at least partially consisting of a transparent plastic material (12) carrying at least one solar module (16), the plastic material entirely surrounding the solar module (16) in a form-fitting manner, at least on the sun-facing side or the outer side of the panel part. The sun-facing side or outer side of the panel part is covered, at least in sections, by an essentially opaque and/or coloured covering layer (14) comprising a recess (18) associated with the solar module, in the arrangement region of the solar module (16).

Abstract: The invention relates to a method and a device for producing a magnetic field sensor (13), particularly a rotary speed and/or rotational direction sensor for the wheel rotation or for the drivetrain of a motor vehicle, wherein an electrical component (10) and the end of a connecting cable (28) are encapsulated in plastic (32) by injection molding, and a mounting tab (38) is injection molded. After a first injection process step, wherein the electrical component (10) and the connecting cable (28) are encapsulated in a core-like first molded part (30, 32), and a mounting tab (38) is injected onto the core-like insert (30) in a second injection process step in a longitudinal and/or angular position that can be prescribed. The core-like insert (30) is thereby longitudinally displaceably and/or rotatably held in the injection mold (46, 58), together with the connecting cable, whereby various positions of the insert (30) can be defined relative to the mounting tab (38).

Abstract: In a method of manufacturing an electronic device, an electronic element is disposed on a wiring plate that is electrically coupled with a connector terminal, a first surface of the wiring plate is covered with a first casing element and a second surface of the wiring plate is covered with a second casing element to form an electronic circuit part, the electronic circuit part is disposed in a case cavity of a molding tool, and a resin is filled into the case cavity to form the resin-molded case while keeping a state where a first pressure that pushes the first casing element toward the wiring plate and that changes with time is substantially equal to a second pressure that pushes the second casing element toward the wiring plate and that changes with time.

Abstract: Embodiments of the present invention include apparatus and methods for aerosolizing liquid. One embodiment of the invention provides an apparatus for generating an aerosol. The apparatus includes an actuator having a first face and a second face and defining an opening therethrough, as well as a vibratory element in mechanical communication with the actuator, and a sealing member configured to isolate the vibratory element from a surrounding environment. In accordance with certain embodiments, the apparatus further comprises an aerosolization element mounted on the actuator and disposed substantially over the opening, wherein the aerosolization element defines at least one aperture therethrough. Hence, the vibratory element may be operated to vibrate to cause movement of the aerosolization element in such a manner that a liquid at the first face of the aerosolization element can be dispensed as an aerosol through the at least one aperture.

Abstract: A housing assembly (100), used, e.g., in a mobile device (300), includes a housing body (10) and a display unit (20). The housing body a view opening (110). The display unit is received in the view opening and is configured for providing information and/or graphics. The housing body moldingly receives the view lens therein, via an injection molding process.

Abstract: A method being applied to manufacture a water-proof electronic device (200, 200a) is disclosed in the present invention. In the method, at least one inner component is assembled into at least one water-proof shell to form at least one sub-assembly, which has a first water-proof portion and a water-permeable portion; a injection molding die is fitted around the water-permeable portion; and an injection molding treatment is executed for the injection molding die with the water-permeable portion therein to form a second water-proof portion; and then the injection molding die is removed after a cooling process, so as to manufacture the water-proof electronic device with the first water-proof portion and the second water-proof portion.

Abstract: A bushing can include a shoulder, a ring, and a ground shield. The ring can be arranged circumferentially around a first outside diameter of the bushing, wherein the ring includes a channel. The ground shield can include a semiconductive rubber collar that forms part of an outer surface of the bushing and extends circumferentially under a portion of the ring. The insulative portion can be adjacent to the ring and disposed over a portion of the ground shield. A method of manufacturing the bushing can include placing the ring and the ground shield into a mold, the ground shield including holes therein, and injecting insulative material into the mold to create an insulative layer within a cavity formed by the ring and the ground shield, the holes in the ground shield allowing some of the insulating material to flow therethrough to create the insulative portion adjacent the ring.

Abstract: An interference shielded, for example a RFI and/or EMI shielded, for an electronics module which forms a contact with at least one edge zone of a circuit board, is provided. The contact functions in the electronics module as a ground. The circuit board includes an outermost electrically conductive layer providing the interference shield of the electronics module; at least one circuit card layer unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer; and encapsulating activation material layer. The activation material layer is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer, and which is arranged into a space between the outermost layer and topmost circuit board layer to be therein conformingly against the inner surface of the outermost layer for isolating the electronic components and the wiring pattern from outermost layer.

Abstract: The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.

Abstract: In a process for producing a multilayered information recording medium of the present invention, a process for forming a second signal substrate (110) serving as a resin layer provided between a first thin film layer (102), which is a first information recording layer, and a second thin film layer (108), which is a second information recording layer, includes the steps of: (I) applying a liquid resin (104) onto the first information recording layer; (II) placing, on the resin (104), a signal transfer substrate (105) having a signal surface with a shape of projections and depressions; (III) curing the resin (104) while the signal transfer substrate (105) is placed on the resin (104); and (IV) separating the signal transfer substrate (105) from the resin (104).

Abstract: The invention relates to a process for producing an oral care device, such as a toothbrush, having a body, which comprises a handle region, a head region and a neck region located between the handle region and the head region, and having functional elements which are arranged, at least in part, within the body and comprise an electrically operated functional unit and an electric supply device which has an energy store and is intended for the functional unit, in the case of which the body is produced, by injection molding, from at least one hard component, which serves as a reinforcement, and at least one soft component, and at least some of the functional elements, during the production of the body, are encapsulated, at least in part, directly by the plastic which forms the soft component.

Abstract: The invention relates to a method for producing a plastic housing, where at least one first plastic housing part with at least one guide or bearing for at least one mechanically movable component, in particular a sensor, is produced in a first molding step, the at least one first plastic housing part is overmolded in a second molding step while a second plastic housing part is being formed, in order to form an integral plastic housing. Moreover, the invention relates to a plastic housing with at least one first plastic housing part including at least one guide or bearing for at least one mechanically movable component, where the at least one plastic housing part is entirely or partially overmolded by a second plastic housing part so that the integral plastic housing is formed.

Abstract: A resin sealing device includes a lower die, an upper die which is arranged over the lower die, on a lower surface side of which a concave portion is provided, and to a bottom surface peripheral portion of the concave portion of which a projection portion projecting toward an opening portion side of the concave portion to raise partially a bottom surface is provided, and a protection film provided on a lower surface side of the upper die and adhered along a concave surface of the concave portion by adsorbing, wherein the stacked wiring substrate is sealed with a resin by making a fused resin flow into a cavity including a space between the stacked wiring substrate from a resin supplying portion, in a state that the stacked wiring substrate in which a plurality of wiring substrates are stacked via connection bumps is arranged and sandwiched between the lower die and the concave portion of the upper die.

Abstract: A miniature surface-mount electronic component which can ensure sufficient impact resistance and vibration resistance especially in an application to a severe use environment such as a vehicle-mounted coil, by putting some contrivance into a method for fixing a coil in a molding process and a method for holding a core and terminals. A miniature surface-mount electronic component including a bar-shaped core 2 on which a winding wire 3 is wound, and metal plates 5, with an outer casing 7 made of an insulating resin molded, includes flanges 2b substantially quadrangular in section at both ends of the bar-shaped core 2, and vertical grooves a and b are provided on side surfaces of the flanges 2b of the bar-shaped core 2 as fixing portions for preventing positional displacement occurring when the outer casing 7 is molded.

Abstract: This invention teaches methods of making a hermetic terminal assembly comprising the steps of: inserting temporary stops, shims and jigs on the bottom face of a terminal assembly thereby blocking assembly core open passageways; mounting the terminal assembly inside a vacuum chamber using a temporary assembly perimeter seal and flange or threaded assembly interfaces; mixing a seal admixture and hardener in a mixer conveyor to form a polymer seal material; conveying the polymer seal material into a polymer reservoir; feeding the polymer seal material from the reservoir through a polymer outlet valve and at least one polymer outlet tube into the terminal assembly core thereby filling interstitial spaces in the core adjacent to service conduits, temporary stop, and the terminal assembly casing; drying the polymer seal material at room temperature thereby hermetically sealing the core of the terminal assembly; removing the terminal assembly from the vacuum chamber, and; removing the temporary stops, shims.

Abstract: A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

Abstract: A method of making a twist-on wire connector including a method of making a sealant containing twist-on wire connector by in situ formation of a shell around the coil wherein a sealant may be injected into a cavity in the coil prior to removing the shell from the mold to form a ready-to-use sealant containing twist on wire connector without further steps outside the mold.

Abstract: Disclosed are an electronic device case provided with a touch sensor unit having an improved adherence structure and a method for manufacturing the same. The electronic device case includes a cover, and a touch sensor unit arranged on a front surface of the cover.

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.