Abstract: In a non-limiting embodiment, a device may include a substrate having conducting lines thereon. One or more fin structures may be arranged over the substrate. Each fin structure may include a sensor arranged over the substrate and around the fin structure. The sensor may include a self-aligned first sensing electrode and a self-aligned second sensing electrode arranged around the fin structure. The first sensing electrode and the second sensing electrode each may include a first portion lining a sidewall of the fin structure and a second portion arranged laterally from the first portion. At least the first portion of the first sensing electrode and the first portion of the second sensing electrode may define a sensing cavity of the sensor. The second portion of the first sensing electrode and the second portion of the second sensing electrode may be electrically coupled to the conducting lines.

Abstract: Provided is a method of manufacturing a circuit board involves: preparing a composite laminate including a support, a release layer, and a multilayered circuit board; disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 200 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage. The method according to the present invention can prevent the occurrences of defects, for example, breaking in the support and cracking and wire disconnections in the multilayered circuit board in manufacturing of circuit boards, such as coreless circuit boards, and ensure stable release of the support or the multilayered circuit board.

Abstract: A passive current sensor includes a pair of electrically conductive busbars, a shunt resistor electrically connecting the busbars, and a support having a first pair of voltage drop measuring contacts. At least one of the voltage drop measuring contacts is attached to each of the busbars and forms a direct electrical contact between the at least one voltage drop measuring contact and the busbar.

Abstract: A bush assembly configured to be disposed between a first component and a second component movably coupled to the first component, the bush assembly comprising a first bush portion comprising a self-lubricating material; and a second bush portion, the second bush portion having greater electrical conductivity than the first bush portion, wherein the second bush portion provides a conductive path between the first component and the second component.

Abstract: A resin substrate includes a resin body, an interlayer connection conductor provided in the resin body, and a conductor pattern bonded to the interlayer connection conductor. The resin body includes a gap provided adjacent to or in a vicinity of a bonding portion of the interlayer connection conductor and the conductor pattern, and a contact portion that contacts the interlayer connection conductor.

Abstract: A prepreg is used to fabricate a semiconductor package including a chip and a substrate to mount the chip thereon. The prepreg is in a semi-cured state. The substrate includes a cured product of the prepreg. The chip has: a first chip surface located opposite from the substrate; and a second chip surface located opposite from the first chip surface. The prepreg satisfies the relational expression: 0.9?X2/X1?1.0 (I), where X1 is a coefficient of thermal expansion of the first chip surface of the chip before the chip is mounted on the substrate, and X2 is a coefficient of thermal expansion of the first chip surface of the chip after the chip has been mounted on the substrate.

Abstract: A printed circuit board includes: an insulating layer having one surface and the other surface; metal layers respectively disposed on the one surface and the other surface of the insulating layer; a through-hole penetrating through the insulating layer and the metal layers; a first plating layer disposed in a center portion of the through-hole in a thickness direction thereof; and a plug disposed in the through-hole.

Abstract: The present disclosure provides an AC power adapter comprising plural connectors, plural first power conveying wires, a junction box, a power conveying wire assembly and a plug. The first power conveying wire is connected with the connector and comprises an input neutral wire, an input live wire and an input ground wire. The first power conveying wire is inserted into the junction box. The power conveying wire assembly is inserted into the junction box and comprises plural output neutral wires, plural output live wires and an output ground wire. The output neutral wires are connected with the input neutral wires one-to-one, the output live wires are connected with the input live wires one-to-one, and the output ground wire is connected with the input ground wires. The plug comprises a housing and an electrical connector. The power conveying wire assembly is inserted into the housing and connected with the electrical connector.

Abstract: The present disclosure provides an AC power adapter comprising input connectors, first power conveying wires, a junction box, a power conveying wire assembly and a plug. The first power conveying wire is coupled to the input connector and includes an input neutral wire, an input live wire and an input ground wire. The power conveying wire assembly is electrically connected to the first power conveying wire through the junction box and includes plural output neutral wires, plural output live wires and an output ground wire. The output neutral wires are coupled to the input neutral wires respectively, the output live wires are coupled to the input live wires respectively, and the output ground wire is coupled to the input ground wires. The plug includes a housing and an electrical connector. The power conveying wire assembly is inserted into the housing and connected with the electrical connector.

Abstract: An apparatus is provided which comprises: a plurality of organic dielectric layers forming a substrate, a plurality of first conductive contacts on a top surface of the substrate, a plurality of second conductive contacts on a bottom surface of the substrate, a plurality of third conductive contacts on a side wall surface of the substrate, and one or more discrete capacitor(s) coupled with the third conductive contacts on the side wall surface. Other embodiments are also disclosed and claimed.

Abstract: Methods of forming packages include forming an encapsulant laterally encapsulating a die over an active surface of the die. The active surface has an electrical pad. A first opening is formed through the encapsulant to the electrical pad. In some embodiments the first opening is formed using a photolithographic technique. In some embodiments the first opening is formed using a temporary pillar by forming the temporary pillar over the electrical pad, forming the encapsulant, and then exposing and removing the temporary pillar. A conductive pattern is formed over the encapsulant including a via formed in the first opening to the electrical pad of the die's active surface. In some embodiments, a dielectric layer is formed over the encapsulant, and the conductive pattern is over the dielectric layer. Embodiments may include forming additional dielectric layers and conductive patterns.

Abstract: An electrical connector includes a flexible circuit with a flexible material and traces at least partially embedded in the flexible material. The electrical connector further includes a first set of conductive bumps, a second set of conductive bumps, and a stiffener. The first set of conductive bumps is coupled to respective first end portions of the traces and extends from a first side of the flexible circuit. The second set of conductive bumps is coupled to respective second end portions of the traces. The stiffener is coupled to the flexible circuit on a second side of the flexible circuit opposite the first side.

Abstract: In a method of manufacturing a highly stretchable three-dimensional (3D) percolated conductive nano-network structure, a 3D nano-structured porous elastomer including patterns distributed in a periodic network is formed. A surface of the 3D nano-structured porous elastomer is changed to a hydrophilic state. A polymeric material is conformally adhered on the surface of the 3D nano-structured porous elastomer. The surface of the 3D nano-structured porous elastomer is wet by infiltrating a conductive solution in which a conductive material is dispersed. A 3D percolated conductive nano-network coupled with the 3D nano-structured porous elastomer is formed by evaporating a solvent of the conductive solution and removing the polymeric material.

Abstract: A composition of matter includes a first compatible material having particles containing chemical elements similar to a first substrate, and second compatible material having particles containing chemical elements similar to a second substrate, wherein the first substrate and the second substrate are chemically different. The particles are dispersed into a matrix that is in between the first and the second substrate. A deposition system has a multi-material printhead, a first reservoir of a first compatible material having particles containing chemical elements similar to a first substrate, a second reservoir of a second compatible material having particles containing chemical elements similar to a second substrate, a third reservoir of an polymer precursor material, and at least one mixer.

Abstract: A device substrate includes a first substrate, a second substrate, a plurality of first bonding pads, a plurality of second bonding pads, a plurality of first leads, and a plurality of second leads. The first and second bonding pads are separated from each other. The first bonding pads are arranged in a first column. The second bonding pads are arranged in a second column. The first and second leads respectively overlap the first and second bonding pads. The first lead includes a first extension portion and a first branch portion. The first extension portion extends from the first column to the second column. The first branch portion is connected to an end of the first extension portion close to the second column. An angle is present between the first extension portion and the first branch portion.

Abstract: A package carrier structure includes an insulating substrate, a first wiring layer, a second wiring layer, at least one conductive via, a plurality of first and second conductive pads, a first insulating layer, a plurality of first and second conductive structures, and an encapsulated layer. The first and second wiring layers are disposed on the upper and lower surfaces of the insulating substrate respectively. The conductive via penetrates through the insulating substrate and electrically connected to the first and second wiring layers. The first and second conductive pads are disposed on the upper surface and electrically connected to the first wiring layer. The first insulating layer is disposed on the upper surface and exposing the first and second conductive pads. The first and second conductive structures are disposed on the first and second conductive pads respectively. The lower surface of the insulating substrate is covered by the encapsulation layer.

Abstract: A display device includes: a substrate including a pad area; a plurality of first conductive pads disposed in a matrix form in the pad area in a first direction and in a second direction intersecting the first direction; protrusions disposed on the plurality of first conductive pads; and a plurality of second conductive pads disposed on the plurality of first conductive pads and the protrusions. The plurality of second conductive pads include: contact portions in contact with the first conductive pads; and raised portions configured to extend from the contact portions, to cover the protrusions, and to have heights greater than that of the contact portions. The plurality of second conductive pads include an ultrasonic bondable material.

Abstract: An oximetry sensor assembly connector, and a method for making the same, is provided that includes a flexible circuit and a stiffener panel. The flexible circuit has a plurality of layers including at least one electrical trace layer and at least one electromagnetic interference (EMI) shield layer. The stiffener panel has a first side surface and a second side surface, which second side surface is opposite the first side surface. The flexible circuit includes a first segment and a second segment, and one or more of the plurality of layers are disposed within the first segment and the second segment. The flexible circuit is folded such that the first segment is contiguous with the first side surface of the stiffener panel, and the second segment is contiguous with the second side surface of the stiffener panel.

Abstract: A component of a vehicle structure is obtained by a hot forming operation on a hybrid panel having a sheet element of light alloy and a sheet of plastic material. The hybrid panel is hot formed by pressing it against a forming surface of a mould element by a pressurized gas or by a second mould element. Following this operation, the hybrid panel assumes a configuration corresponding to the forming surface, whereas the light alloy sheet element and the plastic material sheet constituting the hybrid panel adhere to each other following softening by heat of the plastic material. Before the hot forming step, a surface of said light alloy sheet element which must contact the plastic material sheet is subjected to a roughening treatment, thereby defining surface asperities between which the plastic material of the plastic material sheet is inserted when it is softened by heat.

Abstract: The present invention provides a method of feeding an agent, capable of stabilizing a remaining agent of a feeding part in characteristic and amount just before definitively feeding an agent to each definitive portion. The method includes intermittently moving a feeding part to a plurality of definitive portions defined on a structural object to definitively feed a flowable agent with a predetermined amount to each one of the definitive portions. The structural object includes a semi-finished product part with the definitive portions and a frame to be separated from the semi-finished product part. The frame includes a waste portion for the flowable agent. The waste portion has a same form as the definitive portions. The feeding part wastefully feeds the flowable agent to the waste portion with a same amount as the predetermined amount and thereafter starts the intermittently moving for the definitively feeding of the flowable agent.

Abstract: The present disclosure provides an AC power adapter comprising plural connectors, plural first power conveying wires, a junction box, a power conveying wire assembly and a plug. The first power conveying wire is connected with the connector and comprises an input neutral wire, an input live wire and an input ground wire. The first power conveying wire is inserted into the junction box. The power conveying wire assembly is inserted into the junction box and comprises plural output neutral wires, plural output live wires and an output ground wire. The output neutral wires are connected with the input neutral wires one-to-one, the output live wires are connected with the input live wires one-to-one, and the output ground wire is connected with the input ground wires. The plug comprises a housing and an electrical connector. The power conveying wire assembly is inserted into the housing and connected with the electrical connector.

Abstract: In described examples, a first metal layer is arranged along a periphery of a cavity to be formed between a first substrate and a second substrate. A second metal layer is arranged adjacent to the first metal layer, where the second metal layer includes a cantilever. The cantilever is arranged to deform in response to forces applied from a contacting structure of the second substrate during bonding of the first substrate to the second substrate. The deformed cantilevered is arranged to impede contaminants against contacting an element within the cavity.

Abstract: A method for manufacturing a multilayer printed circuit board includes: preparing a first wiring substrate having a first insulating resin film having a first circuit pattern formed on a first main surface, and a first protective film releasably bonded to a second main surface; partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; filling the bottomed via hole with a conductive paste; disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; and peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion is removed.

Abstract: A method for manufacturing rigid-flexible circuit board includes the step of providing an adhesive sheet defining at least one first opening, a copper foil, and a flexible board. The flexible board comprises a mounting region and a folding region. A removable sheet is pressed on a pressed surface of the adhesive sheet corresponding to each first opening. The copper foil, the adhesive sheet with the removable sheet, and the flexible board are pressed together in that sequence. The removable sheet corresponds to the folding region, and is embedded in the adhesive sheet. The copper foil contacts with the pressed surface and the removable sheet. An interspace is formed between the removable sheet and the flexible board. An outer conductive layer is formed on the copper foil. A removing region of the outer conductive layer corresponding to the folding region and the removable sheet is removed.

Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.

Abstract: A semiconductor package includes: a redistribution substrate; a semiconductor chip on the redistribution substrate; and an external terminal on a bottom surface of the redistribution substrate, wherein the redistribution substrate comprises: a first insulating layer including a first opening; a second insulating layer on the first insulating layer and including a second opening, wherein the second opening is positioned in the first opening in a plan view; a first barrier metal layer disposed along a sidewall of the first opening and along a sidewall of the second opening; a first redistribution conductive pattern on the first barrier metal layer; a third insulating layer on a bottom surface of the first insulating layer; and a pad penetrating the third insulating layer and electrically connecting to the first redistribution conductive pattern, wherein the external terminal is provided on the pad, wherein the second insulating layer at least partially covers a chip pad of the semiconductor chip, and the second

Abstract: An integrated circuit (IC) device includes an IC die and a plurality of leads. Each lead includes an unplated proximal end including a first material, and an unplated distal end including the first material. A plated bond wire portion extends between the proximal and distal ends and includes the first material and a plating of a second material thereon. A plurality of bond wires extend between the IC die and the plated bond wire portions of the leads. An encapsulation material surrounds the IC die and bond wires so that the unplated proximal end and plated bond wire portion of each lead are covered by the encapsulation material.

Abstract: A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more conductor layers on the second surface of the substrate. The forming of the first structure includes laminating the insulating layers and metal layers on first surface side of the substrate and forming the conductor layers from all of the metal layers on the first surface side, and the forming of the second structure includes laminating the insulating layers and metal layers on second surface side of the substrate, forming the one or more conductor layers from one or more of the metal layers on the second surface side, and entirely removing the other metal layers on the second surface side.

Abstract: A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Abstract: A photovoltaic assembly comprising; (a) at least two photovoltaic components that are adjacent to each other in a first direction, each photovoltaic component comprising (i) a partial recess in communication with the partial recess in an adjacent photovoltaic component and (ii) one or more connector receptors aligned in a second direction which is non-parallel to the first direction; (b) a connector located at feast partially in the partial recess of the photovoltaic component and at least partially in the partial recess of the adjacent photovoltaic component so that the connector connects the photovoltaic component to the adjacent photovoltaic component, the connector comprising: (i) a flexible housing having a first end and a second end; (ii) one or more connection ports at the first end; (iii) one or more connection ports at the second end; and (iv) one more flexible electrical conductors that extend from the one or more connection ports at the first end to the one or more connection ports at the second en

Abstract: A display device is disclosed. In one aspect, the display device includes a substrate including a display area and a non-display area adjacent to the display area and a display member formed over the substrate in the display area. The display device also includes an encapsulation layer formed over the display member and encapsulating the display member together with the substrate and a plurality of first touch lines formed over the encapsulation layer in the display area. The first touch lines extend in a first direction. The display device further includes a plurality of second touch lines formed on the same layer as the first touch lines in the display area. The second touch lines extend in the first direction and are spaced apart from the first touch lines.

Abstract: An object of the invention is achieved by a method for producing a composite material, including the steps of combining a resin precursor and a reinforcing fiber and carrying out a polymerization reaction of the resin precursor. That is, a thermoplastic resin composite material having high strength can be obtained by the production method.

Abstract: An electromagnet includes a stacked body formed by stacking and thermocompression-bonding a plurality of insulating base materials having thermoplasticity and including wound linear conductors which define a spiral coil. In a region of each of the insulating base materials surrounded by each of the wound linear conductors, each of low mobility members is formed of a material having mobility lower than that of the insulating base materials at a temperature upon thermocompression-bonding of the insulating base materials.

Abstract: The present disclosure relates to the technical field of mobile communication, and particularly to a method for manufacturing an antenna, and further relates to a mobile device. The manufacturing method provided comprises: S1: forming a paint coating on a surface of a ceramic back shell; S2: forming a concave area on the paint coating; and S3: forming the antenna in the concave area. The antenna manufactured by using the method for manufacturing an antenna provided by the present disclosure is difficult to bend, and is difficult to come into untight attachment with a back shell of a mobile phone, which can make the antenna occupy an installation space in the mobile device as little as possible.

Abstract: An input device described herein includes at least one dual purpose electrode that is used to perform both capacitive sensing to detect an input object (e.g., a finger or stylus) and force sensing to determine the force applied by the input object on the input device. During a first time period, the input device performs capacitive sensing using a first electrode of the plurality of sensor electrodes. However, during a second time period, the input device excites the first electrode and measures a resistance corresponding to the first electrode. The input device determines a force applied by an input object on the input device based on the measured resistance.

Abstract: A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 ?m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 ?m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

Abstract: A rigid-flex circuit board includes a core substrate, a first outer conductive circuit layer, and a second outer conductive circuit layer. The core substrate includes a first base layer and a second base layer. A first conductive circuit layer is formed on a surface of the first base layer, and a second conductive circuit layer is formed on a surface of the second base layer. An insulating layer is located between the first base layer and the second base layer. The first conductive circuit layer and the second conductive circuit layer are embedded within the insulating layer. A portion of the core substrate located within the first opening and the second opening is defined as a flexible board section, and the portions of the core substrate located outside of the first opening and the second opening are defined as a hard board section.

Abstract: In an embodiment of the disclosure, a touch-sensing display panel includes a substrate, connection electrodes, a touch-sensing device layer, a buffer layer, a display device, and conductive vias. The substrate has a display area and a non-display area connecting the display area. The connection electrodes are located on the non-display area of the substrate. The touch-sensing device layer is located on the substrate. The buffer layer covers the touch-sensing device layer. The display device including a first electrode layer, a second electrode layer, and a display medium layer is disposed on the buffer layer and corresponds to the display area. The first electrode layer and the second electrode layer extend from the display area to the non-display area. The conductive vias penetrate the buffer layer and correspond to the non-display area. The first electrode layer and the second electrode layer are electrically connected to the connection electrodes via the conductive vias.

Abstract: Methods of and devices for using additive processes (e.g., 3D printing) to embed components inside an object are disclosed. In some embodiments, the components include active components, such as computer chips. In other embodiments, the components include passive components, such as inductor, resistor, and capacitors. The methods and devices disclosed herein can be used for rapid prototyping and fast manufacturing.

Abstract: Disclosed is an organic light emitting display device and a touch sensing method for the same. The organic light emitting display device includes a first driving electrode disposed on a portion of a first area of a display device, a second driving electrode disposed on a portion of a second area of the display device and connected to the first driving electrode, a first sensing electrode disposed on another portion of the first area and configured to correspond to the first driving electrode, and a second sensing electrode disposed on another portion of the second area and configured to correspond to the second driving electrode. An organic light emitting display device in which a thinner thickness is implemented and calculation of a touch point is performed more quickly by effectively transmitting a driving signal and a touch sensing method for the same is provided.

Abstract: The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal face (25), wherein the first terminal face is provided with a contact bump (10), which has a raised edge (15) and has at least one displacement pin (16) in a displacement compartment (18) being surrounded by the raised edge and being open towards a head end of the contact bump, and wherein, in a contact region (31) with the first terminal face, the second terminal face has a contact bead (30), which is formed by displacement of a contact material (29) of the second terminal face into the displacement compartment and which surrounds the displacement pin, said contact bead having a bead crown (33) which is oriented to a bottom (17) of the displacement compartment and is raised relative to a level contact surface (32)

Abstract: The present disclosure relates to a dynamic lithographic exposure method, and an associated apparatus, which exposes a photosensitive material over a plurality of depths of focus respectively spanning a different region of the photosensitive material. By exposing the photosensitive material over a plurality of depths of focus, the exposure of the photosensitive material is improved resulting in a larger lithographic process window. In some embodiments, the dynamic lithographic exposure method is performed by forming a photosensitive material over a substrate. The photosensitive material is exposed to electromagnetic radiation at a plurality of depths of focus that respectively span a different region within the photosensitive material. Exposing the photosensitive material to the electromagnetic radiation modifies a solubility of an exposed region within the photosensitive material. The photosensitive material is then developed to remove the soluble region.

Abstract: Targeting mass production, the present invention provides an advanced method of manufacturing pure niobium plate end-group components from pure niobium plate material for superconducting high frequency accelerator cavity by means of innovative shear-blanking followed by innovative forging procedures, wherein the invention is to convert the procedure/production method from the conventional machining or waterjet cutting followed by the conventional cold forging to the whole press-forming The invention gives the drastic effects on cost-effectiveness and press-performance.

Abstract: The present invention provides a groove structure employed for printing film formation, wherein the groove structure is located on a substrate, comprises a dam and a groove formed by the dam surrounding, and the dam comprises at least two layers of branch dam layers, which are stacked up, and material of the branch dam layers is silicon nitride or silicon oxide, and material of a top side branch dam layer is silicon oxide, wherein the inclined circumferential surface of the groove, which is surrounded by the branch dam layer manufactured with silicon oxide and the upper surface of the top side branch dam layer are hydrophobic surfaces, and an inclined circumferential surface of the groove, which is surrounded by the branch dam layer manufactured with silicon nitride, is a hydrophilic surface.

Abstract: A mirror for use in high power optical applications, the mirror comprising: a support plate comprising a synthetic diamond material; and a reflective coating disposed over the support plate, wherein the reflective coating comprises a bonding layer of carbide forming material which bonds the reflective coating to the synthetic diamond material in the support plate, a reflective metal layer disposed over the bonding layer, and one or more layers of dielectric material disposed over the reflective metal layer, wherein the bonding layer and the reflective metal layer together have a total thickness in a range 50 nm to 10 ?m with the reflective metal layer having a thickness of no more than 5 ?m, and wherein the support plate and the reflective coating are configured such that the mirror has a reflectivity of at least 99% at an operational wavelength of the mirror.

Abstract: The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.

Abstract: A method for adjusting a qubit includes measuring a qubit characteristic of a qubit device and computing a modification to correct the qubit characteristic. A geometry of a shunt capacitor is adjusted using a laser direct write process. The qubit characteristic is verified.

Abstract: The invention provides a lighting panel, for use for example within a modular surface system, comprising one or more strips of solid state lighting elements associated with a reflector structure. The lighting panel is adapted for improved uniformity of light intensity across the width of its output area. Lighting elements comprise two or more subsets, each subset adapted to collectively generate a different light intensity profile across the width of the panel output window. The subsets are selectively adapted to generate profiles which, when blended, mutually offset one another's deviations from some common mean intensity across the width of the output window, thereby generating a combined intensity profile of improved uniformity. Embodiments include arrangements in which subsets of lighting elements are adapted to have differing actual or virtual optical path lengths to the reflector surface.

Abstract: A high density electrical connector system is disclosed which may make use of first and second connector components. The first connector component has a first substrate with a first plurality of electrical feedthroughs and at least a first plurality of electrically conductive bond pads in communication with the first plurality of electrical feedthroughs. The second connector component has a second substrate with a second plurality of electrical feedthroughs and at least a second plurality of electrically conductive bond pads in communication with the second plurality of electrical feedthroughs. An electrical coupling subsystem is disposed between the first and second connector components and makes electrical contact between associated pairs of the first and second pluralities of electrically conductive bond pads. A plurality of fasteners may be used for clamping the first and second connector components in facing relationship.

Abstract: An optical sensor module has a light receiver and a light-emitter which is surrounded by a light blocking wall, wherein the light receiver is disposed on a main plate and the light-emitter is disposed on a side plate separately from the main plate. The light blocking wall is formed as a light barrier wall between the light receiver and the light-emitter. A projecting portion projecting upward from the main plate is enclosed by the light barrier wall, and a top face of the projecting portion is higher than the light receiving face and the light-emitting face.