Abstract: The disclosure provides a method for producing a stack of layers on a semiconductor substrate. The method includes producing a substrate a first conductive layer; and producing by ALD a sub-stack of layers on said conductive layer, at least one of said layers of the sub-stack being a TiO2 layer, the other layers of the sub-stack being layers of a dielectric material having a composition suitable to form a cubic perovskite phase upon crystallization of said sub-stack of layers. Crystallization is obtained via heat treatment. When used in a metal-insulator-metal capacitor, the stack of layers can provide improved characteristics as a consequence of the TiO2 layer being present in the sub-stack.

Abstract: Systems and methods are provided for fabricating a thin film capacitor involving depositing an electrode layer of conductive material on top of a substrate material, depositing a first layer of ferroelectric material on top of the substrate material using a metal organic deposition or chemical solution deposition process, depositing a second layer of ferroelectric material on top of the first layer using a high temperature sputter process and depositing a metal interconnect layer to provide electric connections to layers of the capacitor.

Abstract: A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being partially exposed on an external surface of the component main body, and forming an external terminal electrode on the external surface of the component main body such that the external terminal electrode is electrically connected to the internal electrodes. The step of forming the external terminal electrode includes the steps of forming a first plating layer on exposed surfaces of the internal electrodes of the component main body, applying a water repellant at least on a surface of the first plating layer and on a section in the external surface of the component main body at which an end edge of the first plating layer is located, and then forming a second plating layer on the first plating layer having the water repellant applied thereon.

Abstract: In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin.

Abstract: A dielectric ceramic composition comprising a compound expressed by a formula of ABO3, where “A” is Ba alone, or Ba and at least one selected from Ca and Sr, and “B” is Ti alone, or Ti and Zr, and having a perovskite-type crystal structure, and an oxide of a rare-earth element including Sc and Y. The dielectric ceramic composition includes a dielectric particle having a core-shell structure which has a core and a shell, the shell being present around the core and including at least “R” element, and in the shell, a region showing a maximum content rate of “R” element is a boundary region between the core and the shell.

Abstract: In a laminated ceramic electronic component including a ceramic element body including a plurality of effective sections, each of which constitutes a circuit element such as a laminated capacitor unit, bumps generated between the effective portions and a gap interposed between the effective portions can be made minimized. Specifically, the ceramic element body includes a first effective section including a first circuit element and a second effective section including a second circuit element. A gap is provided between the first and second effective section. Floating internal conductors are arranged in the gap at least in one of first and second external layer sections, the first external section being interposed between a first main surface and the first and second effective sections, and the second external layer section being interposed between a second main surface and the first and second effective sections.

Abstract: An electronic component includes a substantially rectangular parallelepiped electronic component body and first to fourth external electrodes. The first to fourth external electrodes are arranged such that a shaped defined by joining the centers of portions of the first to fourth external electrodes on a first main surface with a substantially straight line is substantially square. The first main surface is provided with a substantially linear orientation identifying mark disposed thereon. The orientation identifying mark passes through an intersection of two diagonals of the substantially square shape and extends along the longitudinal direction or the width direction.

Abstract: A printed circuit board (PCB) includes a positive differential signal line including first and second segments, a negative differential signal line including third and fourth segments, first and second connecting elements soldered on opposite surfaces of the PCB. The first segment and the fourth segment are located in a first straight line which has a first permittivity. The third segment and the second segment are located in a second straight line which has a second permittivity different from the first permittivity. The first connecting element is connected between the first segment and the second segment. The second connecting element is connected between the third segment and the fourth segment.

Abstract: A ceramic electronic component has a ceramic element assembly, external electrodes, and metal terminals. The external electrodes are arranged on the surface of the ceramic element assembly. The external electrodes contain a sintered metal. The metal terminals are electrically connected to the external electrodes, respectively. The external electrode and the metal terminal are directly diffusion-bonded by diffusion of metal in the metal terminals into the external electrodes. The above arrangement provides a ceramic electronic component having highly reliable metal particle bonding and a method for manufacturing the same.

Abstract: A capacitor comprises a substrate layer, a first electrode layer disposed on the substrate layer, and a first dielectric layer disposed on the electrode layer. The dielectric layer comprises a polymeric material having an elongation less than or equal to about 5 percent.

Abstract: A laminated ceramic capacitor capable of achieving both a high dielectric constant and high electrical insulation property even when the thickness of the dielectric ceramic layer is less than 1 ?m, contains a plurality of laminated dielectric ceramic layers and a plurality of internal electrodes at interfaces between the dielectric ceramic layers, where dielectric ceramic layers are made of dielectric ceramic containing a perovskite-type compound represented by ABO3 as a main ingredient, and R (R is La or the like), M (M is Mn or the like) and Si as accessory ingredients.

Abstract: A dielectric ceramic includes crystal grains containing barium titanate as a main component, magnesium, a rare-earth element, and manganese, wherein the crystal grains have a cubic crystal structure; and the dielectric ceramic contains, per mole of barium, 0.033 to 0.085 mol of magnesium in terms of MgO, 0.1 to 0.2 mol of the rare-earth element (RE) in terms of RE2O3, and 0.006 to 0.018 mol of manganese in terms of MnO. Such a dielectric ceramic has a high relative dielectric constant, stable temperature characteristic of the relative dielectric constant, and no spontaneous polarization.

Abstract: A ceramic electronic component includes a first reinforcement layer. The first reinforcement layer is arranged in a first outer layer portion so as to extend in the length direction and in the width direction. Portions of the first reinforcement layer face a first portion of a first external electrode and a first portion of a second external electrode in the thickness direction. The first reinforcement layer is not exposed at a first end surface or a second end surface of the ceramic electronic component. In a portion of a first main surface of the ceramic electronic component in which the first portion of the first or second external electrode is provided, a portion that does not face the first reinforcement layer is closer to the center in the thickness direction than a portion that faces the first reinforcement layer.

Abstract: An electronic component includes a ceramic body including first to fourth side surfaces, a first external electrode provided on one side surface of the ceramic body, a second external electrode, and a plurality of reinforcing electrodes. Each of the first and second external electrodes includes a thick-film electrode layer including sintered metal, a plated layer arranged so as to cover the thick-film electrode layer, an external electrode main body portion covering the side surface of the ceramic body, and turnback portions extending to the top surface and the bottom surface of the ceramic body. An end portion of at least one reinforcing electrode of the plurality of reinforcing electrodes is exposed on the top surface or the bottom surface of the ceramic body on the center portion of the ceramic body in relation to the thick-film electrode layer in the turnback portion.

Abstract: A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

Abstract: A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t0?t1?(?)t0 is satisfied, where t0 is the thickness of each of the first and second external electrodes and t1 is the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

Abstract: A ceramic electronic component 100 includes a ceramic body 1 in which internal electrodes containing a metal component is buried, and a pair of terminal electrodes 3 provided to cover both end surfaces 11 of the ceramic body to which the internal electrodes are exposed. Each of the terminal electrodes 3 has a first electrode layer and a second electrode layer formed by baking a conductive green sheet from a side close to the ceramic body 1. The second electrode layer contains the metal component diffused from the internal electrodes.

Abstract: A method for manufacturing a multilayer ceramic electronic component includes a first substep of depositing precipitates primarily made of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated sublayer, and a second substep of heat-treating the laminate including the plated sublayer at a temperature of at least about 800° C., wherein a plated layer including a plurality of plated sublayers is formed by continuously performing at least two cycles of the first substep and the second substep.

Abstract: An array-type ceramic electronic component C1 includes a ceramic body 1 in which internal electrodes are buried and a plurality of terminal electrodes 11 to 16 formed on the ceramic body 1. The terminal electrodes 11 to 16 have electrode layers formed by baking a conductive green sheet.

Abstract: A capacitor, and methods of its manufacture, having improved capacitance efficiency which results from increasing the effective area of an electrode surface are disclosed. An improved “three-dimensional” capacitor may be constructed with electrode layers having three-dimensional aspects at the point of interface with a dielectric such that portions of the electrode extend into the dielectric layer. Advantageously, embodiments of a three-dimensional capacitor drastically reduce the space footprint that is required in a circuit to accommodate the capacitor, when compared to current capacitor designs. Increased capacitance density may be realized without using high k (high constant) dielectric materials, additional “electrode-dielectric-electrode” arrangements in an ever increasing stack, or serially stringing together multiple capacitors.

Abstract: When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.

Abstract: A multilayer capacitor comprises a capacitor element body; a first signal terminal electrode, a second signal terminal electrode, and a ground terminal electrode which are arranged on an outer surface of the capacitor element body; and a ground internal electrode and first to third signal internal electrodes which are arranged within the capacitor element body. The ground internal electrode is connected to the ground terminal electrode. The first signal internal electrode is connected to the first signal terminal electrode and opposes the ground internal electrode so as to construct a first capacitor. The second signal internal electrode is connected to the first signal terminal electrode and opposes the ground internal electrode so as to construct a second capacitor. The third signal internal electrode is connected to the second signal terminal electrode and opposes the ground internal electrode so as to construct a third capacitor.

Abstract: A multilayer electronic component includes a ceramic body including ceramic layers that are laminated to one another and internal conductors having exposed portions at side surfaces of the ceramic body. Substantially linear connection portions extend in the lamination direction of the ceramic layers so as to connect the exposed portions to one another. External terminal electrodes cover the exposed portions of the internal conductors and the connection portions and include base plating films directly disposed on the side surfaces by plating. The connection portions are formed by polishing the side surfaces in which the internal conductors are exposed using, for example, a brush so as to elongate the exposed portions of the internal conductors.

Abstract: A monolithic ceramic electronic component includes a dummy electrode having a dummy body portion and an internal electrode having an extended portion, in which the conductor density of the dummy body portion is less than the conductor density of the extended portion of an internal electrode. With this configuration, the fixing strength of an external terminal electrode to a ceramic element assembly is improved, and undesirable deformation caused by a dummy conductor provided in a monolithic ceramic electronic component is prevented.

Abstract: The invention relates to a multilayer ceramic capacitor having dielectric layers and internal electrode layers disposed alternately. The dielectric layers include a dielectric ceramic containing barium titanate as a main component, and also calcium, magnesium, vanadium, manganese, and a rare-earth element. Crystals constituting the dielectric ceramic are constituted by grains containing barium titanate as their main component and containing calcium in a concentration of 0.2 atomic % or less or containing the calcium in a concentration of 0.4 atomic % or more. The crystals grains are also distinct in their relative distributions of magnesium and rare-earth elements between the center of the grain and the surface of the grain. Finally, the relative areas of the two kinds of crystals observed in the plane of a polished surface of the dielectric ceramic are described by a ratio b/(a+b), which is 0.5 to 0.8.

Abstract: Provided are a high voltage multi-layer ceramic capacitor (MLCC) that may enable a surface mounting, and may form a guide electrode between inner electrodes or between sealing electrodes to thereby prevent a decrease in an inner voltage, caused by a parasitic capacitance, and a director current (DC)-link capacitor module using the MLCC.

Abstract: A method for manufacturing a ceramic electronic component capable of preventing degradation of the self alignment property and product characteristics due to absorption of flux into pores of a ceramic element assembly during soldering in mounting and a ceramic electronic component. In the method, a ceramic element assembly is subjected to an oil-repellent treatment by using an oil-repellent agent containing a polyfluoropolyether compound as a primary component and hydrofluoroether as a solvent, so as to avoid absorption of the flux by the ceramic element assembly.

Abstract: Provided is a method for easily and surely removing projections formed on the surface of an active material layer by a vacuum process when producing an electrochemical element electrode. Carried out to produce the electrochemical element electrode are: a first step of forming an active material layer on a current collector by a vacuum process, the active material layer being capable of storing and emitting lithium; a second step of storing the lithium in the active material layer; and a third step of removing projections on the surface of the active material layer storing the lithium.

Abstract: A SrTiO3-based grain boundary insulation type semiconductor ceramic contains a donor element in solid solution in crystal grains, an acceptor element at least in crystal grain boundaries, an integral width of (222) face of the crystal face of 0.500° or less, and an average powder grain size of crystal grains of 1.0 ?m or less. A semiconductor ceramic is obtained by firing this ceramic, and a monolithic semiconductor ceramic capacitor is obtained by using the semiconductor ceramic. The SrTiO3-based grain boundary insulation type semiconductor ceramic powder has a large apparent relative dielectric constant ?rAPP of 5,000 or more even when the average ceramic grain size of crystal grains is 1.0 ?m or less and which has an excellent insulating property. The monolithic semiconductor ceramic capacitor is capable of having a large capacity through reduction in thickness and multilayering.

Abstract: It is provided a ceramic multilayer substrate obtained by co-sintering a low dielectric constant layer made of an insulating material of a low dielectric constant and a high dielectric constant layer of a dielectric material of a high dielectric constant. The low dielectric constant layer includes a ceramic component of xBaO-yTiO2-zZnO (“x”, “y” and “z” represent molar ratios, respectively, and satisfy the relationship: x+y+z=1; 0.09?x?0.20; 0.49?y?0.61; 0.19?z?0.42) and 1.0 to 5.0 weight parts of a glass component comprising boron oxide with respect to 100 weight parts of the ceramic component. The high dielectric layer is made of a barium titanate based dielectric material with CuO and Bi2O3 added thereto.

Abstract: A capacitor device with a capacitance is introduced. The capacitor device includes at least one capacitive element. The at least capacitive element comprises a pair of first conductive layers being opposed to each other, at least one first dielectric layer formed on a surface of at least one of the first conductive layers, and a second dielectric layer being sandwiched between the first conductive layers. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant. The capacitance of the capacitor device depends on dielectric parameters of the first dielectric layer and the second dielectric layer. The dielectric parameters comprise the first dielectric constant and thickness of the at least one first dielectric layer and the second dielectric constant and thickness of the second dielectric layer.

Abstract: A ceramic electronic component includes a first dielectric layer, a second dielectric layer, and an intermediate layer. The first dielectric layer is a layer containing BaO, Nd2O3, and TiO2, the second dielectric layer is a layer containing a different material from the material of the first dielectric layer, and the intermediate layer is a layer formed between the first dielectric layer and the second dielectric layer and containing main components that are not contained in the first dielectric layer and the second dielectric layer in common as the main components.

Abstract: A laminate includes ceramic layers laminated to each other. Internal conductors are embedded in the laminate and include exposed portions that are exposed between the ceramic layers at a lower surface and an upper surface of the laminate. External electrodes are directly plated on the lower surface and the upper surface so as to cover the respective exposed portions. Regions of the lower surface at which the exposed portions are provided are arranged to protrude from the other regions of the lower surface, and regions of the upper surface at which the exposed portions are provided are arranged to protrude from the other regions of the upper surface.

Abstract: A dielectric ceramic composition enabling one to obtain a laminated capacitor which hardly causes degradation of insulation resistance with time under high-humidity even in using a base metal such as Ni as an internal electrode, contains as a main constituent, a constituent represented by (CaxSr1-x)(TiyZr1-y)O3 in which x and y are 0?x?1 and 0?y?0.50, and, as accessory constituents, at least 0.5 parts by mol and at most 15 parts by mol of SiO2, at least 0.1 parts by mol and at most 10 parts by mol of MnO, and at least 0.01 parts by mol and at most 0.079 parts by mol of Al2O3, with respect to 100 parts by mol of the main constituent.

Abstract: A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surface, an internal conductor including nickel, the internal conductor being disposed in the ceramic body and having an exposed portion exposed at least one of the side surfaces, and an external terminal electrode disposed on at least one of the side surfaces of the ceramic body, the external terminal electrode being electrically connected to the internal conductor. The external terminal electrode includes a first conductive layer including a Sn—Cu—Ni intermetallic compound, the first conductive layer covering the exposed portion of the internal conductor at least one of the side surfaces of the ceramic body.

Abstract: Better high-temperature load characteristics are obtained in a laminated ceramic capacitor including a dielectric ceramic layer with a thickness of 1 ?m or less. The laminated ceramic capacitor includes a plurality of stacked dielectric ceramic layers, a plurality of internal electrode layers, each disposed between dielectric ceramic layers, and external electrodes that are electrically connected to internal electrode layers. In this laminated ceramic capacitor, when the thickness of each dielectric ceramic layer is denoted by tc and the thickness of each internal electrode layer is denoted by te, tc is 1 ?m or less, and tc/te is equal to or less than 1.

Abstract: A metal capacitor in which an electric conductivity is significantly improved by applying a metal material, instead of a solid electrolyte and electrolyte of an aluminum electrolytic capacitor, and a manufacturing method thereof is provided. A metal capacitor 10 includes a metal member 11 including a plurality of grooves 11a on both surfaces of the metal member 11, a metal oxide film 12 being formed on the metal member 11, a seed electrode layer 13 being formed on the metal oxide film 12, a main electrode layer 14 being formed on the metal oxide film 12 to fill the plurality of grooves 11a, a plurality of lead terminals 15 being installed in the main electrode layer 14, and a molding member 16 being disposed so that the plurality of lead terminals may be externally protruded from the molding member 16, and the metal member 11, the metal oxide film 12, the seed electrode layer 13, and the main electrode layer 14 may be sealed.

Abstract: The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing. A method for manufacturing the multi-layer ceramic capacitor comprising first external electrode, dielectric, internal electrode and second external electrode prints simultaneously the first external electrode; the internal electrode which is connected with the first external electrode and formed at an invaginated portion of the dielectric invaginated to allow one side to be opened at one portion; and the second external electrode which is formed integrally with the internal electrode by employing an inkjet printing. According to the present invention, a method for manufacturing the multi-layer ceramic capacitor resolves contact problems by printing integrally the internal electrode and the external electrode and reduces the manufacturing process.

Abstract: The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to form the capacitors. The capacitors use different metallization patterns to form the metal layers, and different via patterns to couple adjacent metal layers. In embodiments, optional shields are included as the top-most and/or bottom-most layers of the capacitors, and/or as side shields, to reduce unwanted parasitic capacitance.

Abstract: A chip-type electronic component has: a ceramic element body; a plurality of first and second internal electrodes arranged in the ceramic element body so as to be opposed at least in part to each other; a first external connection conductor to which the plurality of first internal electrodes are connected; a second external connection conductor to which the plurality of second internal electrodes are connected; first and second terminal electrodes; a first internal connection conductor arranged in the ceramic element body and connecting the first external connection conductor and the first terminal electrode; and a second internal connection conductor arranged in the ceramic element body and connecting the second external connection conductor and the second terminal electrode.

Abstract: (1) A niobium monoxide powder for a capacitor represented by formula: NbOx (x=0.8 to 1.2) and optionally containing other elements in an amount of 50 to 200,000 ppm, having a tapping density of 0.5 to 2.5 g/ml, an average particle size of 10 to 1000 ?m, angle of repose from 10° to 60°, the BET specific surface area from 0.5 to 40 m2/g and a plurality of pore diameter peak tops in the pore distribution, and a producing method thereof; (2) a niobium monoxide sintered body, which is obtained by sintering the above niobium monoxide powder and, having a plurality of pore diameter peak tops in a range of 0.01 ?m to 500 ?m, preferably, the peak tops of two peaks among the plurality of pore diameter peak tops having a highest relative intensity are present in the range of 0.2 to 0.7 ?m and in the range of 0.7 to 3 ?m, respectively, and a producing method thereof; (3) a capacitor using the above sintered body and a producing method thereof; and (4) an electronic circuit and electronic device using the above capacitor.

Abstract: The present invention provides several scalable integrated circuit high density capacitors and their layout techniques. The capacitors are scaled, for example, by varying the number of metal layers and/or the area of the metal layers used to from the capacitors. The capacitors use different metallization patterns to form the metal layers, and different via patterns to couple adjacent metal layers. In embodiments, optional shields are included as the top-most and/or bottom-most layers of the capacitors, and/or as side shields, to reduce unwanted parasitic capacitance.

Abstract: A dielectric ceramic composition comprises a main component composed of at least one selected from BaTiO3, (Ba, Ca)TiO3, (Ba, Sr)TiO3 and (Ba, Ca, Sr)TiO3, an oxide of rare earth element and a composite compound including Ba. 9 to 13 mol of the composite compound in terms of composite compound is included in the dielectric composition. The dielectric ceramic composition includes surface diffusion particles having surface diffusion structure composed of non diffusion phase and diffusion phase including rare earth element. In the surface diffusion particle, when an area of the non diffusion phase is defined as S1, an area of the diffusion phase is defined as S2, S1 and S2 satisfy a relation of S1:S2=20:80 to 30:70 (Note that, except S1=30 and S2=70) , when an average concentration of the rare earth element in the surface diffusion particle is defined as C, S2 and C satisfy a relation of 4.8?S2×C?5.8.

Abstract: A method for forming an alpha-tantalum layer comprising disposing a nitrogen containing base layer on a semiconductor substrate, bombarding the nitrogen containing base layer with a bombarding element, thereby forming an alpha-tantalum seed layer, and sputtering a layer of tantalum on the alpha-tantalum seed layer, thereby forming a surface layer of substantially alpha-tantalum.

Abstract: A laminated ceramic electronic component includes a ceramic element and two external electrodes on both end surfaces of the ceramic element. The ceramic element includes a function part and lead parts thinner than the function part. Internal electrode layers are provided facing each other via a ceramic layer therebetween in the function part. The internal electrode layers are drawn out of the function part in the lead part. The external electrode includes an extended part and a curled part. The extended part is formed from the lead part through the function part on the main face. On the main face, the part of the extended part in the lead part is lower than the part of the function part. The curled part is formed from the end face of the ceramic element through the surface of the part of the extended part in the lead part on the main face.

Abstract: Provided are a conductive paste for an external electrode, a multilayer ceramic capacitor including the same, and a manufacturing method thereof. The conductive paste compound for an external electrode includes a first powder and a second powder. The first powder includes copper and has a mean grain size of 3 ?m or less, and the second powder has a lower diffusion speed and a higher melting point than the copper and has a mean grain size of 180 nm or less.

Abstract: Dielectric ceramic composition includes a hexagonal type barium titanate as a main component shown by a generic formula of (Ba1-?M?)A(Ti1-?Mn?)BO3 and having hexagonal structure wherein an effective ionic radius of 12-coordinated “M” is ?20% or more to +20% or less with respect to an effective ionic radius of 12-coordinated Ba2+ and the A, B, ? and ? satisfy relations of 1.000<(A/B)?1.040, 0??<0.003, 0.03???0.2, and as subcomponents, with respect to the main component, certain contents of alkaline earth oxide such as MgO and the like, Mn3O4 and/or Cr2O3, and CuO and Al2O3 and rare earth element oxide and glass component including SiO2. According to the present invention, it can be provided the hexagonal type barium titanate powder and the dielectric ceramic composition which are preferable for producing electronic components such as a capacitor and the like showing comparatively high specific permittivity, having advantageous insulation property and having sufficient reliability.

Abstract: A dielectric device having a dielectric layer and first to nth metal layers (where n is an integer of 2 or greater) in contact with the dielectric layer. At least one of the first to nth metal layers contains a base metal. Interfaces between the first to nth metal layers and the dielectric layer have respective arithmetic mean roughnesses of Ra1 to Ran (nm), while an average value Ram (nm) of the arithmetic mean roughnesses of Ra1 to Ran (nm) and a thickness T (nm) of the dielectric layer satisfy T/Ram ?1.3.

Abstract: A self healing high energy glass capacitor is provided. The capacitor can have a glass layer with a top surface and a bottom surface. A top sacrificial layer can extend across the top surface and a bottom sacrificial layer can extend across the bottom surface. In addition, a top electrode can extend across the top sacrificial layer and a bottom electrode can extend across the bottom sacrificial layer. In some instances the glass capacitor has an energy breakdown of at least 6 joules per cubic centimeter.