Abstract: A heat dissipation device is adapted for dissipating heat generated from an add-on card which has a plurality of processors thereon. The heat dissipation device includes a vapor chamber and a mounting member. The vapor chamber thermally contacts with the processors. The mounting member is mounted on a bottom surface of the vapor chamber. A plurality of screws extends through the add-on card and engages with the mounting member to assemble the vapor chamber on the add-on card.

Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler. Accordingly, the air drawn by the cooling fans is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler, thereby cooling the notebook computer.

Abstract: A heat transfer system is provided. The system includes a heat sink disposed proximate a first circuit. An air mover is adapted to provide airflow, and at least a portion of the airflow can flow through the heat sink along a flow path having a path length. A first portion of the airflow flows along the entire path length through the heat sink. A remaining portion of the airflow exits the heat sink prior to flowing the entire path length.

Abstract: A fan detecting apparatus for detecting at least two fans includes a processing unit, at least two airflow switches, and at least two indicating units. The processing unit includes a first terminal configured to output a driving signal, a second terminal configured to receive the driving signal, and a third terminal, the processing unit alarming when the second terminal does not receive the driving signal from the first terminal. The at least two airflow switches are serially coupled between the first and second terminals, monitor airflow from at least two fans in a computer room, and turn on or off according to strength of airflow from the at least two fans. The indicating units are respectively coupled between corresponding airflow switches and the third terminal of the processing unit, and indicate status of corresponding fans according to on or off status of the airflow switches.

Abstract: A cooling system for a rotary tablet press with which a rotor is driven by an electrical drive motor and the rotor and drive motor are arranged in a closed housing, and a control cabinet for the drive motor and further units in the housing, wherein arranged within the housing is a cooling machine whose evaporator is part of a first heat exchanger, whose other part is arranged in a coolant circuit for the drive motor, a fan is arranged in a channel in the housing closed relative to the housing interior, where the fan draws cool air in via an air inlet of the housing and gives it off via an air outlet of the housing, wherein the cool air is engaged in heat exchange with a condenser of the cooling machine.

Abstract: A system for managing air flow through a body of an information handling system is disclosed. The disclosure provides a blank including a blank base plate and a blank ridge extending from the blank base plate. The blank base plate may be configured to match an architecture of both a processor socket and a bank of memory chip sockets. The blank may be configured to provide an impedance to air flow substantially similar to a total impedance provided by a processor and associated heat sink disposed in the processor socket and a bank of memory chips disposed in the bank of memory chip sockets.

Abstract: In general, in one aspect, the disclosure describes a laptop computer that can allow for enhanced cooling of a passively cooled notebook while maintaining the desired waterproof and dust resistance of the design. This is achieved by creating a separate cooling channel where air can flow through to provide cooling to an electronics enclosure connected thereto. The cooling channel may utilize membranes (e.g., hydrophobic membranes) to protect again water and dust penetration. In some cases, two fans are used in opposite directions in order to automatically clean the membranes from dust accumulation.

Abstract: An electronic module. The electronic module includes a chassis, a plurality of capacitors, and a heat sink. The chassis includes a first end and a second end. The first end is opposite the second end. The chassis also includes a first side, a second side, a third side, and a fourth side. The second side is opposite the first side. The third side is connected to at least one of the first and second sides. The fourth side is connected to at least one of the first and second sides, and is opposite the third side. The chassis is fabricated from a material which stops component debris from passing through the sides of the chassis. The capacitors are positioned within the chassis. The heat sink is positioned between the capacitors and the second end.

Abstract: This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.

Abstract: A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

Abstract: A portable heat dissipation device is provided for operation with various devices of different purposes for heat dissipation therefrom and includes an enclosure and an air flow generation device. The air flow generation device is set in a given chamber inside the enclosure to effect flowing of air, causing air to enter through an inlet opening defined in a top of the enclosure and forcing the air flowing out through an outlet opening defined in a front wall of the enclosure. The portable heat dissipation device, when applied to remove heat, provides high performance of heat dissipation and effectively extended time interval of operation to thereby extend the lifespan of the device.

Abstract: The invention proposes a cooling structure of a storage apparatus in which cooling air in a chassis is stirred or evened out without affecting the layout in the chassis. The storage apparatus includes fan devices that introduce outside air to heat areas generated from heat generating members arranged on a logical substrate which constitutes a controller unit section for inputting and outputting a data to and from a hard disk drive in response to a data I/O request from a host system, cool the heat areas by stirring the cooling air therein or by causing the cooling air to blow evenly thereon, and discharge the outside air passed through the heat areas to the outside.

Abstract: A cabinet having a pair of vertically stacked chassis separated by a central, vertically extending region. A pair of laterally spaced, vertically extending panels is disposed in the central region, the panels forming: a pair of outer compartments for receiving air exiting a corresponding one of the pair of laterally spaced vertically stacked chassis; and an inner compartment for receiving air exiting the pair of vertically stacked chassis. The panels have therein an array of openings in a lower portion thereof for passing portions of air in the outer compartments into the inner compartment. An upper portion of the panels inhibits portions of air in the outer compartments from passing into the inner compartment. The openings extend in rows horizontally across the panel. The number of opening in lower ones of the rows is greater than the number of opening in upper ones of the rows.

Abstract: An enclosure for electronic assemblies is provided, with a first deck surface and a first side wall with a short side and a long side and a second deck surface, disposed such that it faces the first deck surface, and a second side wall, disposed such that it faces the first side wall, with a short side and a long side, as well as with a first venting element, which extends in the direction of the long side along one of both side walls, and a plurality of plug-in slots for electronic assemblies that are arranged in parallel to one another, whereby the electronic assemblies are disposed, in the plugged-in state, vertically to both long sides of both side walls, and the first deck surface includes, along the end oriented toward the first side wall, a first opening and the first venting element, on the enclosure's outer side of the first deck surface, is disposed at least partially above the first opening, and the first and/or the second deck surface includes a second opening, along the end that faces the second

Abstract: A thermal module (10) includes a fin assembly (14), a heat pipe (16) thermally contacting with a heat generating electronic component (60) disposed on a printed circuit board (50) and the fin assembly, and a resilient fastener (20) attaching an evaporation section (164) of the heat pipe to the heat generating electronic component. The fastener includes a mounting element (40) being attached to the printed circuit board, and an engaging element (30) embedded in the mounting element. The engaging element includes a base plate (32) having a first surface contacting with the evaporation section of the heat pipe and a second surface thermally contacting with the heat generating electronic component, and at least a resilient strip (34) sandwiched between the first surface of the base plate of the engaging element and the mounting element.

Abstract: An electronic device can conveniently change and assemble a heat dissipation apparatus which is received in the electronic device and dissipates heat for the electronic device. The electronic device with a fan heat dissipation apparatus can be replaced by a blower heat dissipation apparatus, without changing a chassis of the electronic device.

Abstract: A cooling device including: a fan configured to rotate and produce airflow; a fan case accommodating the fan, the fan case having an outlet for discharging the airflow produced by the fan; a heat exchanger having an inlet disposed to oppose the outlet of the fan case, the inlet being configured to take in the airflow discharged from the outlet; a wire disposed between the heat exchanger and the fan case to stretch along an end face of the inlet of the heat exchanger, the wire having a first end being fixed to a fulcrum and a second end; and a wire driving mechanism configured to swing the wire about the fulcrum to scrape the end face of the inlet of the heat exchanger by the wire.

Abstract: An information technology enclosure has a processing subsystem and infrastructure subsystem in separate shipping containers that cooperate to process information. The processing subsystem has increased information processing density by concentrating information handling systems in a first processing shipping container that is supported with infrastructure equipment in a second infrastructure shipping container. In one embodiment, the shipping containers are arranged in a stacked configuration so that cooled air and exhausted air are exchanged through aligned vents formed in the ceiling and floor of stacked shipping containers.

Abstract: In one aspect, a cooling device comprising a heat exchanger body comprising a cooling channel for a coolant, a mounting surface to which the electronic component is mountable and an outer heat exchange surface is provided. The cooling device comprises a feeding line connection for feeding the coolant and a draining line connection for draining the coolant. The cooling channel is interconnected to the feeding line connection and the draining line connection. The cooling channel is fanned within the heat exchanger body in such a way that the coolant in the cooling channel is in thermal contact with the mounting surface and the outer heat exchange surface for providing a heat exchange.

Abstract: An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.

Abstract: A computer enclosure includes an absorber plate, a thermoelectric converter, and a refrigerator. The absorber plate is arranged in the computer enclosure to absorb heat generated in the computer enclosure. The thermoelectric converter is arranged in the computer enclosure to receive heat absorbed by the absorber plate, and then convert the absorbed heat to electrical energy. The refrigerator is arranged in the computer enclosure to receive the electrical energy generated by the thermoelectric converter, and then work to generate cold air to dissipating heat in the computer enclosure.

Abstract: Use of vortex generators to improve efficacy of heat sinks used to cool telecommunications, electrical and electro-optical components.

Abstract: The invention relates to cooling techniques for portable devices such as, for example, mobile telephones. In one implementation, a portable device comprises one or more printed circuit boards (“PCBs”) supporting multiple heat-generating components, an airflow generator adapted to generate an airflow internally in the portable device, and a heat sink element thermally connected to the heat-generating components, wherein the heat sink element is adapted to receive heat from the heat-generating components for dissipation by the airflow.

Abstract: A method and apparatus for substantially preventing recirculation of heated air from an exhaust outlet of an expansion card to an air inlet of the expansion card, wherein the air inlet and exhaust outlet are both on the same end of the chassis. The apparatus comprises a chassis with a chassis fan, a motherboard within the chassis having an expansion card connector, and an expansion card in communication with the expansion card connector and secured to the front end of the chassis. The expansion card also includes a card fan configured to move cooling air through the air inlet to the exhaust outlet. An air duct redirects the hot air from the exhaust outlet to prevent recirculation into the expansion card and causes the heated air to exit through the chassis fan. The air duct may include a longitudinal segment through a computer module and a lateral segment selectively securable over the exhaust outlet.

Abstract: A cooling system and a method for cooling an electronic display. A preferred embodiment utilizes a closed loop cooling system in a constricted convection cooling setup to remove heat from the backlight of a display assembly. Cooling air can be pulled or pushed through a gap between the display (or backlight) and a rear cooling chamber. The resulting warm air can then be exhausted out of the display housing. The cooling air may be air conditioned or may be exposed to a thermoelectric device. A thermostat may be used so that cooling fans are only energized when the temperature reaches a predetermined point.

Abstract: An image processing apparatus includes an image processing unit, a main control unit, a fan, a fan control unit, and an energy-saving control unit. The energy-saving control unit includes a fan-rotation maintaining unit that maintains rotation of the fan for a predetermined time after the operating state of the image processing apparatus is shifted to the energy-saving state, and then turns off the power supply to the fan control unit.

Abstract: One embodiment of the present invention uses plasma-driven gas flow to cool down electronic devices. The cooling device may comprise micro heat sink fins assembly, micro plasma actuators assembly, and magnetic circuit assembly. The plasma actuator assembly comprises electrodes and dielectric pieces. Voltages are applied to electrodes to drive the plasma gas flow. A magnetic circuit assembly may be used to provide the magnetic field to couple with plasma actuators to induce the plasma gas flow to cool down the heat sink fins and heat source.

Abstract: A power supply assembly includes two brackets, a fan detachably mounted between the brackets, and a main body. Each bracket includes an elastic member extending from an end of the bracket. The main body includes a receiving space, and two opposite mounting walls bounding the receiving space. The brackets together with the fan can be detachably mounted to the main body via being received in the receiving space and the elastic members engaging with the mounting walls.

Abstract: In one embodiment, an apparatus includes a card chamber, an air intake, an airway, an exhaust plenum, and at least one fan. At least one electronics card can be supported in the card chamber. Ambient air from outside the apparatus can flow into the card chamber via the air intake. The airway is located across the card chamber from the air intake. Air flows substantially linearly across the card chamber from the intake to the airway. The exhaust plenum is located adjacent the card chamber and the airway. The fan is operable to draw air from the airway into the exhaust plenum.

Abstract: An attachment assembly for mounting at least one electronic device is provided with a cradle (101) with a bottom part (109). Furthermore, the cradle (101) comprises a first arm (105) arranged such that the electronic device is fastened to the first arm (105) using the electronic device bottom fastening means, and a second arm (108) arranged such that the electronic device (150) is fastened to the second arm (108) using the electronic device side fastening means. To the cradle (101) can be mounted a fan (107) which can be placed under the electronic device and arranged between the first arm (105) and the second arm (108) of the cradle (101), such that air is blown towards the electronic device mounted to the cradle (101). To allow the air flowing from underneath of the cradle (101) to the fan (107), the cradle (101) has an opening (185) in the bottom part (109).

Abstract: An open frame chassis has a top opening and a bottom opening permitting ambient air flow there through. A plurality of modules, each enclosing electrical components which are in thermal contact with a heat sink area of their corresponding module, and each of which can be inserted to an inserted position in the open frame chassis. When the modules are inserted into the open frame chassis, ambient air may flow from the bottom opening of the chassis across the heat sink area of each module to the top opening in order to passively cool the modules and the electrical components enclosed therein. The heat sink area has fins which are separated by a distance of 9 mm to 12 mm and have a height 10 mm to 20 mm. Key pins are associated with the electrical connectors of the chassis to guide the modules into place and prevent incorrect insertion of a different type of electrical module not corresponding to the electrical connection of the chassis for that slot.

Abstract: An embodiment of the present invention provides a heat-dissipating device of electronic equipment that comprises a housing, a heat source, a speaker, and a vibration film arranged inside the housing. The vibration film will vibrate when receiving the energy transmitted from the speaker, resulting in that the heat convection is accelerated and the heat generated by the heat source is removed.

Abstract: A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Abstract: A blocking device adapted in a blade server and a blade server are provided. The blade server includes a chassis and a plurality of blocking devices. The chassis includes an opening, a plurality of connecting interfaces and a plurality of convection holes. The connecting interfaces are placed in parallel to connect respective CPU blades. Each convection hole corresponds to a connecting interface. Each of the blocking devices corresponds to a convection hole and includes two blocking plates and a pushing object. The two blocking plates block the convection hole and include a hinge and a torsion spring. When a CPU blade is connected to the connecting interface, the pushing object displaces to make the two blocking plates rotate about a respective hinge to expose the convection hole. When the CPU blade is removed, the torsion springs make the two blocking plates rotate back to block the convection hole.

Abstract: A cooling unit to cool the display apparatus including a heat generating unit to generate heat and a casing to accommodate the heat generating unit, the cooling unit includes a cooling fan to generate air flow; a duct which is coupled with the casing and forms a cooling path to connect the cooling fan and the heat generating unit; an inlet portion which is provided to one side of the casing to communicate with the duct; an inlet grill which is provided in the inlet portion to guide air to be inhaled in a direction inclined to a rear surface of the casing; an outlet portion which is provided to an other side of the casing to communicate with the duct, being spaced from the inlet portion; and an outlet grill which is provided in the outlet portion to guide air to be exhaled in a direction inclined to a rear surface of the casing, wherein the exhaled direction provided by the outlet grill is different from the air-inhaling direction provided by the inlet grill.

Abstract: A computer system includes a chassis and a fan module attached to the chassis. The fan module includes a rotor, a side panel coaxial with the rotor, and a cylindrical cover extending from the side panel for encasing the rotor. One side of the rotor is covered and protected by the side panel, while another side of the rotor is bare. The chassis includes an air vent for exposing the bare side of the rotor. An airflow-guiding part inwardly protrudes from an edge of the air vent and abuts the cylindrical cover of the fan module.

Abstract: An article for supporting a computer on a user's lap that cools the computer and isolates the user from heat, and methods of manufacture. Some embodiments include a body, a top surface, a bottom surface, a hollow area in between, an aperture through the top surface to the hollow area, and either a fan to move air through the aperture or an indentation in the top surface to allow air to circulate by the computer. Embodiments include a foam portion, a plastic portion that provides stiffness, a fabric covering and one or more side or rear openings to allow airflow. The fan may be powered from a USB port on the computer.

Abstract: An information handling center includes an information handling system (IHS) rack configured to receive cooled fluid from a pressurized plenum. The IHS rack includes at least one ventilator that is operable to cause cooled fluid to be drawn from the pressurized plenum into the IHS rack. A cooling fluid supply unit is coupled to the pressurized plenum and operable to cool a fluid passing through the cooling fluid supply unit and direct that cooled fluid into the pressurized plenum. A fluid flow control is located in the cooling fluid supply unit and coupled to a pressure sensor that is operable to determine a pressure in the pressurized plenum. The fluid flow control is operable to adjust the flow rate of the fluid passing through the cooling fluid supply unit based on the pressure determined by the pressure sensor.

Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

Abstract: An electronic apparatus that includes: a housing having two surfaces extending in parallel, and a side surface connecting edges of the two surfaces; a circuit board placed in the housing and extends in parallel with the two surfaces; a plate member that extends to face a first surface of the circuit board; and a fan provided on a second surface of the circuit board, wherein the circuit board has a heat-generating electronic component mounted on the first surface and an opening through which air flows to the second surface side, and the plate member includes a concave groove formed in the first surface; a convex line formed on the second surface facing the circuit board on a portion corresponding to a back surface of the concave groove; and a guiding inclined surface formed on the back of the convex line to guide air to the opening.

Abstract: An electronic equipment includes: air sending unit configured to send, at a front of an inside of a casing, air in a direction from a front surface of the casing to a back surface to cool a heat generating element; air flow control unit that is disposed in the inside of the casing and behind the air sending unit and is for controlling, by a shape, an air flow generated by air blow of the air sending unit; and expanding unit that is disposed in the inside of the casing and behind the air flow control unit, includes an additional electronic circuit for an electronic circuit mounted on a main board, which are the electronic circuits as cooling targets of the air blow of the air sending unit, and is for expanding a function of the electronic circuit of the main board, wherein the expanding unit has a hollow structure casing and includes the additional electronic circuit in an inside of the casing, and the air flow control unit has an opening part for allowing the air flow to pass through and a blocking part to bl

Abstract: A computer-implemented method for cooling a modular computer system having multiple cooling devices and multiple heat-generating modules is disclosed. The method includes the steps of determining the number of cooling device installed in the system; determining the positions of the installed cooling devices; applying predefined cooling device placement rules and signaling an error condition if a cooling device is in an unacceptable location; determining locations of all installed heat-generating modules; and applying the predefined cooling device placement rules and signaling an error condition if an installed heat-generating module is in an unacceptable location.

Abstract: The present invention relates to a method of cooling a static electronic power converter device including at least one electrical circuit including an assembly of active components and of passive components mounted in a closed radiator housing from which only the inlet and the outlet of the circuit communicate with the outside of the housing, in which the distribution of the heat energy given off by the active and passive components is made uniform throughout the inside volume of the housing, and the heat energy is transferred from the radiator housing by forced convection in substantially uniform manner over the entire inside surface of the walls of the housing by causing at least one fluid contained inside the leaktight housing to circulate in a closed circuit. The invention also provides a static electronic power converter device enabling the method to be implemented.

Abstract: The invention relates to a casing for electrical and/or electronic components, in particular computer equipment, with an improved cooling. The casing comprises a frame and a number of walls in which suction openings and outlet openings for the cooling air are formed, and wherein the suction opening is provided with filter material. The casing is provided with a number of fans placed between the suction openings and the outlet openings, whereby a flow with a radial or centrifugal component is generated. Each fan can be connected to an associated electrical and/or electronic component via a connecting part and/or a hose, while a cooling block can further be connected to each electrical and/or electronic component. The invention further relates to a fan, a cooling block and a connecting part for use in such a casing.

Abstract: A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: An information processing apparatus includes a casing having a first accommodating unit, and a second accommodating unit which protrudes from at least one area of the first accommodating unit; a main body which includes at least one heat generating component which is accommodated in the first accommodating unit, and a port unit which is formed at an outer side of the first accommodating unit; and a heat radiating unit which is accommodated in the second accommodating unit, and discharges heat of the heat generating component to an outside of the casing.

Abstract: A heat-dissipating structure includes a support unit and a fan unit disposed in the receiving space. The support unit has a plane portion, a support portion extending downwards from a front side of the plane portion, and an opening passing through the plane portion. The plane portion has a board body, a concave space formed on the top surface of the plane portion, a non-skid pad detachably received in the concave space, a slender block body disposed on a base of the top surface of the board body, and a slender non-skid body disposed on a base of the bottom surface of the board body. The support portion has a support body, a receiving space formed in its inside, a plurality of slender openings formed on two opposite lateral sides of the support body, and a slender non-skid body disposed on a base of the support body.

Abstract: A cooling system for an electronic display. Transparent cooling chambers are used to extract heat from the front display surface of an electronic display. A refrigerated air source is in gaseous communication with the cooling chamber. Additional fans may be used to cool other components of the electronic display. Multiple displays may be used where each display and the refrigerated air source is housed within the housing. The housing contains air inlet and air exhaust ports. An air curtain device may be used with some embodiments. An open-loop, closed-loop, or both types of designs may be used with the cooling chambers. Temperature sensors may allow the refrigerated air source(s) to be selectively engaged depending on the temperature of the air within the cooling chamber or the temperature of the front display surface. Ambient temperature sensors may also direct the switch between open and closed loops.

Abstract: In a system for housing electronics cards, methods and systems for cooling the electronics cards are presented. Each electronics card preferably contains heat-producing electronics and a heat sink, and is preferably placed within a card guide of the chassis and secured into position with a clamping device. At least one of the heat sink, the card guide, the clamping device, and a cold wall of the chassis are used to facilitate the conduction cooling of the heat-producing electronics. Furthermore, a clamping device may rigidly secure a card into position, thus reducing the impact of vibrations (including shock) on the card. Additionally, an air flow further cools the electronics cards, the card guides, and/or the cold wall.