Abstract: An apparatus for fixing a fan on a specific surface is disclosed, which comprises: a bracket, formed with a hollow section; a plurality of side panels, disposed on the specific surface as an array while enabling each side panel to be disposed perpendicular to the specific surface and the bracket; a first clamping piece; and a second clamping piece. The fan is sandwiched between any two neighboring side panels while enabling an end of the fan module where the first clamping piece is mounted to face toward the hollow section. The first clamping piece is configured with a spring that is capable of moving relatively to the fan so as to enable a first protrusion formed on the spring to inset into the hollow section when the spring is moved to a first position, and detach from the hollow section when the spring is move to a second position.

Abstract: Electronic components of an energy meter are mounted in an encapsulated compartment within a sealed outer enclosure of the meter. The encapsulated compartment is advantageously positioned to form air channels between the encapsulated compartment and the sealed outer enclosure to deliver thermal air circulation there-between to promote sufficient heat transfer through an outer skin of the sealed outer enclosure for maintaining acceptable thermal conditions for the encapsulated electronic components.

Abstract: An enclosure includes a bracket with a bottom wall, a circuit board mounted to the bottom wall but spaced from the bottom wall, an electronic element mounted to the circuit board, a fan arranged on the bottom wall and facing the space between the circuit board and the bottom wall, and a guiding member attached to the circuit board to block the space between the circuit board and the bottom wall.

Abstract: An airflow adjustment device is disclosed. The airflow adjustment device is used for a blade server provided for plugging in an interface card, and the interface card includes a bracket. The airflow adjustment device is installed in the blade server, and the airflow adjustment device includes a top cover, a plurality of sidewalls, a bracket plate, and at least one deflector. The bracket plate is used for sheltering the bracket, and air enters the blade server through the at least one deflector and at least one gap area formed by the bracket plate and at least one of the plurality of sidewalls whereby the flow resistance of the blade server is not affected by the type of the bracket.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: An exemplary container data center includes a container, servers received in the container; and a ventilating system for cooling the servers. The ventilating system includes a filter, an exhaust pipe and a blower. The filter includes a chamber and filtering fluid received in the chamber for dissolving dust in ambient air. The chamber defines an air inlet for entering the ambient air and an air outlet. The exhaust pipe has one end coupled to the air outlet of the filter and another end communicating an interior of the container. The blower drives the ambient air out of the filter to flow along the exhaust pipe to the container to cool the servers.

Abstract: A liquid cooling system includes a monolith that is configured to be coupled to a motherboard of the computer. The monolith may be monolithic planar body having a first surface and an opposite second surface, and may include a heat absorption region and a heat dissipation region. The heat absorption region may be at least one location on the monolith that is configured to be in thermal contact with a heat generating component of the motherboard, and the heat dissipation region may be at least one location on the monolith where a liquid-to-air heat exchanger is attached to the monolith. The liquid cooling system may also include a channel extending on the second surface of the monolith and a pump that is configured to circulate the liquid coolant through the channel. The channel may be a trench on the second surface of the monolith that is configured to circulate a liquid coolant between the heat absorption region and the heat dissipation region.

Abstract: An exemplary server rack includes a box adapted for receiving a plurality of servers therein, a plurality of pivoting members pivotally connected to the box; and a plurality of covers fixed to the pivoting members respectively. The box includes a front board and a back board opposite to the front board. The front board and the back board both define a plurality of though holes adapted for airflow to pass therethrough. Each cover is operable to pivot relative to the box via the corresponding pivoting member, and thereby cover some of the through holes of the front board of the box.

Abstract: The invention provides modular air management devices for directing or diverting air flow within an equipment cabinet or enclosure to provide adequate cooling for non-“front to back” breathing electronic devices, and include a scoop assembly, a tray assembly, a vertical mount assembly, and a shroud assembly. The air management devices are designed to direct air flow to and from “side to side” breathing and “side inlet, rear exhaust” electronic equipment. The assemblies may be mounted inside or outside enclosure rails and may be augmented with fan assemblies.

Abstract: A heat dissipation device is used to dissipate heat generated by a number of memory chips of a motherboard. The heat dissipation device includes two brackets attached to the motherboard and at opposite sides of the memory chips, are a support, and a fan. The support includes a fixing plate and two clamping plates extending from opposite ends of the fixing plate. The clamping plates are rotatably mounted to the brackets, and are positioned above the memory chips. The fan is sandwiched between the clamping plates or mounted to the fixing plate.

Abstract: A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current.

Abstract: An enclosure for a power supply is disclosed. The enclosure may include a control compartment configured to receive one or e control components, a transformer compartment positioned adjacent to the con c compartment and configured to receive a transformer, and a power cell compartment positioned adjacent to the control compartment and the transformer compartment. The power cell compartment may be configured to receive a plurality of power cells arranged into a plurality of pods. The power cells may be received in the power cell compartment such that each power cell in a first pod is adjacent to at least two other power cells in the first pod. A voltage difference between adjacent power cells in a pod may be less than an acceptable voltage tolerance.

Abstract: A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.

Abstract: The present invention relates generally to tuning the flow of cooling air across converter and inverter heat sinks in a motor drive system. More specifically, present techniques relate to motor drive duct systems including heat sinks with separate, sequential heat sink fin sections disposed in a common cooling air path and having different geometries to optimize the flow of cooling air across and between fins of the separate heat sink fin sections. For example, the heat sink fin sections may have different fin lengths, fin heights, fin counts, fin pitch (e.g., distance between adjacent fins), and so forth. Each of these different geometric characteristics may be tuned to ensure that temperatures and temperature gradients across the heat sinks are maintained within acceptable ranges.

Abstract: In a storage device accommodating a plurality of memory devices in a general-purpose chassis provided from both of the surface sides thereof, a cooling device is provided on the front of the memory devices. This cooling device is allowed to freely move to leave available the area in front of the memory devices, thereby enabling maintenance and replacement of the memory devices from the both surface sides of the chassis. With such a storage device of a type using a general-purpose chassis, and inserting therein a plurality of memory devices from the both surface sides thereof, even if a cooling device is located on the front of the chassis, the memory devices can be subjected to maintenance and replacement.

Abstract: A projector apparatus includes a housing having an air inlet and an air outlet, a light source device provided in the housing, an image projection unit provided in the housing and configured to emit an image projection light beam so as to project an image onto a screen, and a cooling device configured to cool the light source device and the image projecting unit. The cooling device includes a cooling passage extending from the air inlet to the air outlet, and a fan configured to suck in outside air from the air inlet and to exhaust the outside air passing through the cooling passage, out of the housing from the air outlet. The air filter section includes a cylindrical filter body, a filter support member configured to support the filter body, and a rotating unit configured to rotate the filter support member.

Abstract: An electronic device having enhanced heat dissipation capabilities includes an electronic device, a heat sink, a channel, a piezoelectric element, and a blade. The heat sink is in thermal communication with the electronic device. The channel includes an inlet, an outlet and a constriction disposed along the channel between the inlet and the outlet. The heat sink defines at least a portion of the channel. The blade includes a free end and an attached end. The blade is disposed in the channel and connected to the piezoelectric element. The piezoelectric element is activated to move the blade side to side in the channel to create air vortices. The constriction in the channel and the blade cooperate with one another such that a vortex that is generated as the blade moves toward a first side of the channel is compressed against the first side of the channel and expelled towards the outlet of the channel.

Abstract: An embodiment of the present invention provides a heat-dissipating device of electronic equipment that comprises a housing, a heat source, a speaker, and a vibration film arranged inside the housing. The vibration film will vibrate when receiving the energy transmitted from the speaker, resulting in that the heat convection is accelerated and the heat generated by the heat source is removed.

Abstract: A system for controlling the temperature of a rack includes a connecting plenum configured to receive incoming cooling air from outside a rack for cooling the rack; a front plenum connected to the connecting plenum and configured to receive cooling air from the connecting plenum and deliver the cooling air to the rack, the cooling air being warmed by powered electrical components as it passes through the rack; at least one ventilator for recycling warmed cooling air from the rack back to the connecting plenum to be mixed with incoming cooling air; a sensor for sensing temperature of air in the rack; and a controller for controlling the at least one ventilator based at least on the sensed temperature.

Abstract: The invention concerns a unit with electronic components, which, when in operation, generate heat. The unit comprises a carrier plate, upon the first section of which a first group of electronic components is placed. Upon a second section thereof is installed a plurality of cooling ribs for the removal of heat produced by the electronic components. The cooling ribs are designed to be curved to a predetermined extent along their longitudinal axis and to lie in a plane parallel to the said carrier plate.

Abstract: An apparatus is provided to remove heat from a heat-generating component of a computer, such as a processor. The apparatus comprises a first heat sink having a plurality of leader fins, wherein the first heat sink is thermo-conductively coupled to a heat-generating component that is coupled to a first portion of a chassis; and a second heat sink having a plurality of follower fins, wherein the second heat sink is thermo-conductively coupled to a second portion of the chassis, and wherein the plurality of follower fins are disposed in an interlaced configuration with the plurality of follower fins to promote radiative heat transfer from the leader fins to the follower fins. Optionally, one or more alignment structures may be used to facilitate the relative movement of the first and second chassis portions into an operative position in which the leader and follower fins are in the interlaced configuration.

Abstract: A shipping container having an interior and a plurality of electronic equipment modules disposed within the interior of the container is cooled by an air conditioning unit adapted to be disposed within the interior of the container. The electronic equipment may include computing equipment and electronic data storage equipment.

Abstract: An electronic device includes an enclosure, and an airflow guiding duct. The enclosure includes a bottom panel. The airflow guiding duct is pivotably mounted to the enclosure. The airflow guiding duct includes a positioning portion. The bottom panel defines a sliding slot. A positioning opening is defined in the bottom panel communicating with the sliding slot. The positioning portion is used for being driven to slide along the sliding slot to move into the positioning opening when the airflow guiding duct is rotated.

Abstract: A mounting apparatus for fixing a fan defining fixing notches in an exterior surface of the fan to a chassis includes a frame. The frame includes a base panel fixed to the chassis, two side panels respectively extending up from opposite ends of the base panel, and two elastic fixing portions respectively extending up from the side panels away from the base panel. When the fan is disposed in the frame, the base panel, the side panels, and the fixing portions of the frame resist the exterior surface of the fan and the fixing portions are received in the corresponding fixing notches of the fan.

Abstract: A fan (20) has: a motor having a stator (40) and having a rotor (60) with at least one fan blade; at least one air inlet having an air entrance opening (102) for the inlet of air; at least one air outlet having an air exit opening (32) for the outlet of air; a circuit board (80) having at least one recess, which circuit board (80) is arranged in the region of the air inlet in such a way that air can enter the fan (20) through the recess, motor electronics (88) being arranged on the circuit board (80). In a preferred embodiment, a Negative Temperature Coefficient (NTC) resistor (84) is surface-mounted on a PC board portion (83) extending into the air passage, to thereby sense air temperature. This facilitates compact, automated construction.

Abstract: A case includes a box, a top cover, a first airflow guide member, and a second airflow guide member. The box has an opening sealed by the top cover. The first airflow guide member and the second airflow guide member are fixed on at least one of the top cover and a side plate of the box. The first airflow guide member and the second airflow guide member are spaced from each other, and cooperatively define a guide channel. The box defines an inlet and an outlet communicating with the guide channel.

Abstract: An exemplary data center includes two server systems arranged back to back. Each server system includes a server cabinet, a rail system, at least two servers and a fan module. The servers are accommodated in the server cabinet. The fan module is located at a rear side of the two servers and perpendicular to the servers to provide a horizontal airflow to cool the servers. The fan module is capable of rolling on the rail system between a rear side and a front side of the server cabinet to interchange between a vertical state and a horizontal state. Assembly or disassembly of the fan module is performed from the front side of the server cabinet where there is a greater amount of workspace.

Abstract: Provided is an outdoor display apparatus having an improved configuration to effectively prevent deterioration of a panel included therein. The outdoor display apparatus includes: a casing body having an air inlet and an air outlet; first and second display panel modules in the casing body to display images on front and rear surfaces of the casing body, respectively; transparent members fitted respectively to the front surface and the rear surface of the casing body to protect the first and second display panel modules; an air suction unit to suction the air into the casing body through the inlet and to discharge the air through the outlet; and an air distribution unit to distribute the air discharged from the air suction unit to at least one of the first display panel module and the second display panel module.

Abstract: A ventilation member (1) comprises a support body (2), a ventilation membrane (10), and a cover part (3). The support body (2) includes a bottom surface portion (4) connected to the casing (50) and a side surface portion (5) on which the ventilation membrane (10) is installed. A first opening (4h) is formed in the bottom surface portion (4), and a second opening (5h) is formed in the side surface portion (5). The ventilation membrane (10) is installed on the side surface portion (5) so as to close the second opening (5h). The cover part (3) has a cylindrical side wall part (3b) that circumferentially surrounds the support body (2) in such a state that the support body (2) is assembled therein. The position of the second opening (5h) to be formed in the side surface portion (5) of the support body (2) is adjusted so that the ventilation membrane (10) is protected when the membrane faces the cylindrical side wall part (3b).

Abstract: A communications cabinet includes a housing defining a location for mounting communications equipment, the housing having a wall formed of a first material with a first penetration resistance, a vent opening in the wall, and a door. At least one plate of material having a second penetration resistance greater than or about equal to the first penetration resistance is mounted between the vent opening and the location for mounting the communications equipment, and the plate is positioned to stop projectiles larger than a given size from traveling in a straight line from the at least one vent opening to the location for mounting communication equipment while leaving an airflow path from the vent opening to the location for mounting the communications equipment that passes around at least one edge of the plate of material through a gap between the at least one plate and the wall.

Abstract: Air flow ducts for improving the air flow within data processing units are described herein. In some embodiments, a duct includes an inlet portion and an outlet portion. An interior surface of the outlet portion of the duct defines, at least in part, a portion of a flow path. The duct is configured to be coupled to a printed circuit board within a data processing unit such that a first portion of a cooling fluid can flow within the flow path between the inlet portion of the duct and an electronic device coupled to the printed circuit board. An exterior surface of the outlet portion of the duct is configured to redirect a second portion of the cooling fluid to a volume within the data processing unit apart from the electronic device.

Abstract: A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Abstract: An assembly configured for attachment to a media drive can include a handle with a front side, a back side, a hinge end, a swing end and front side to back side air flow passages disposed intermediate the hinge end and the swing end; and a base with a front side, a back side, a hinge end, an opposing end, a pair of front side bevels disposed intermediate the hinge end and the opposing end, and front side to back side air flow passages disposed intermediate the pair of front side bevels, the air flow passages of the base configured to receive air flow from the air flow passages of the handle for a latched orientation of the handle with respect to the base. Various other apparatuses, systems, methods, etc., are also disclosed.

Abstract: A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract: The present invention provides for repeatedly pulsing coolant through a first channel exposed to heat-generating computer components. The pulsing involves a relatively low baseline coolant flow rate with repeated excursions to a relatively high expulsion coolant flow rate.

Abstract: A display apparatus includes an accommodation chamber having a sealed structure, a display panel accommodated in the accommodation chamber, a cooling part which cools the air inside the accommodation chamber, a drain pipe extending from a bottom part of the accommodation chamber, and a check valve provided in the drain pipe.

Abstract: An electronic apparatus has a case having a bottom wall in which a first vent is formed and a circumferential wall connected to a perimeter of the bottom wall; a printed circuit board housed in the case; an electronic component which is mounted on the printed circuit board and generates heat when powered; a fan which has an air outlet and sends out a wind through the air outlet in such a direction that the wind goes away from a rotation axis of a rotor; a heat radiation member opposed to the first vent and the air outlet of the fan; and a heat pipe which is disposed between an associated part of the circumferential wall and the heat radiation member and transmits heat generated by the electronic component from the electronic component to the heat radiation member.

Abstract: An air containment cooling system for containing and cooling air between two rows of equipment racks includes a canopy assembly configured to enclose a hot aisle defined by the two rows of equipment racks, and a cooling system embedded within the canopy assembly. The cooling system is configured to cool air disposed within the hot aisle. Other embodiments and methods for cooling are further disclosed.

Abstract: A system for cooling a battery mounted on a vehicle using air within a vehicle, independently of the travelling state of the vehicle. The air within a vehicle compartment is guided to a battery mounted on a vehicle to cool the battery. A controller determines a basic fan speed v of the cooling fan based on a battery temperature and an ambient temperature. Further, the controller calculates an increment ?v of the fan speed in accordance with the vehicle speed and the degree of window opening and determines a final fan speed V according to V=v+?v, to drive the cooling fan. By controlling the fan speed to increase, it is possible to cool the battery even when the base pressure of the inlet-side static pressure of the cooling fan becomes negative pressure compared to when the windows are closed.

Abstract: A system and method for integrating sidecar liquid cooling components in-row with associated computer equipment enclosures is disclosed. It includes a fail-safe baffle to exhaust air, a transition frame and containment plenum. It uses standard hose configurations and includes a thermo-mechanical switch, not requiring power to open the component door.

Abstract: A chassis with horizontal plugged frames includes an air inlet, a board area, a first air chamber, a second air chamber, and an air outlet. The air inlet is set in the board area and is linked to the first air chamber; the air outlet is set on a wall of the second air chamber where the second air chamber contacts external air; and the first air chamber is located on one side of the board area, and the second air chamber is located on the other side of the board area.

Abstract: A modular cooling system includes a positive displacement compressor and a microchannel heat exchanger for cooling a heat generating device such as a semiconductor.

Abstract: A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.

Abstract: A data center includes a housing, a number of heat units arranged in the housing, and a fan mounted in the housing. When the data center runs, cool air comes into the housing through the front wall, the back wall, and the bottom wall of the housing, for cooling the heat units. The heated air is vented out of the housing through the top wall by the fan.

Abstract: A data center includes a housing, a number of server modules arranged in the housing, a number of cooling units arranged in the housing and above the server modules, and a fan mounted in the housing near the cooling units. When the data center is operating, heated air is driven to the cooling units by fans, and then the cooled air is driven to enter the server modules.

Abstract: A portable electronic device includes a housing, a printed circuit board, a flexible printed circuit board, and a clip. The printed circuit board is attached to one side of the housing. The flexible printed circuit board is attached to another side of the housing. The clip is attached to the housing. The clip includes at least one arcuate portion, and the arcuate portion elastically presses the flexible printed circuit board to the printed circuit board.

Abstract: An exemplary heat dissipation device includes a heat sink defining air passages therein, a fan holder fixedly mounted on the heat sink, a fan mounted on the fan holder, and an adjustable wind-guiding module located in and pivoted to the fan holder. The fan is positioned for generating an airflow flowing through the adjustable wind-guiding module generally toward the air passages of the heat sink. The adjustable wind-guiding module is selectably pivotable with respect to the fan holder such that a direction of the airflow generally toward the air passages of the heat sink is changed accordingly.

Abstract: A data center includes a server module. The server module includes a housing, and a number of heat-generating elements arranged in the housing. The housing includes a front wall, a back wall, and left and right sidewalls. When the server module runs, cool air comes into the housing through the front wall and the back wall, for cooling the heat elements, then the heated air in the housing is vented out of the housing through the left and right sidewalls by a number of fans.

Abstract: An electrical control cabinet includes a casing, a plurality of heat elements, a heat exchanger, and two fans. The casing includes a first receiving portion and a second receiving portion. The first receiving portion communicates outside of the casing through the heat exchanger. The fans are received in the second receiving portion. The heat elements include a plurality of first heat members received in first receiving portion and a plurality of second heat members received in the second receiving portion. The first heat members is isolated from airborne contaminants and moisture. The first heat members in the first receiving portion disperse heat by the heat exchanger, and the second heat members in the second receiving portion disperse heat by the fans.

Abstract: A storage apparatus S comprises a disk controller 1 for controlling data I/O processing between a host H and a disk unit 2. The disk controller 1 includes a plurality of circuit board modules each having a circuit board 210 and a module case 200 storing the same, and a chassis 100 shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module 20 is configured to introduce cooling air from a cooling fan 10F through an opening provided on at least one side surface toward a circuit component mounted on the circuit board 210. A MP module 30 is configured to introduce cooling air by a cooling fan 10R through an opening provide on a front surface of the module case 200.