Abstract: A server heat dissipating system includes two server assemblies, an airflow producing device configured to produce airflow, and a main airflow guiding pipe. Each server assembly includes a server cabinet configured to receive a first server and an airflow guiding device. The airflow guiding device is configured to guide airflow to the first server to dissipate heat generated by the first server. The main airflow guiding pipe is connected to the two airflow guiding devices to guide airflow from the airflow producing device to the airflow guiding devices.

Abstract: A power conversion apparatus includes a casing and an inverter unit housed in the casing. The inverter unit includes a unit case, a capacitor block removably provided at a position on an inner side of a detachable side plate of the unit case, and a fan block placed in the unit case in such a manner as to be removable from a front side. The capacitor block includes a capacitor case having a plurality of capacitor insertion holes, a plurality of electrolytic capacitors placed in the capacitor insertion holes, respectively, and a laminated bus bar connected to the electrolytic capacitors. The fan block includes a fan case and a cooling fan provided in the fan case.

Abstract: Provided is an electronic apparatus capable of preventing an unnecessary space from being made inside the housing, and of improving ventilation efficiency of the air flowing along the power circuit. An electronic apparatus includes: a power circuit; a power circuit case (4) housing the power circuit; and a housing (2) for housing the electronic apparatus and the power circuit case (4). The power circuit case (4) includes a rear wall portion (43) having an air outlet (43a) formed therein, and the housing (2) having an opening (2a) formed therein, a shape of the opening corresponding to the rear wall portion (43) of the power circuit case (4). The power circuit case (4) is arranged such that the rear wall portion (43) is exposed through the opening (2a).

Abstract: In a casing, a printed circuit board is arranged such that a first side of the printed circuit board has a first angle of ? ° with respect to a first side surface plate. A cooling device is arranged to have a second angle of ? with respect to the first side surface plate. Accordingly, an amount of cooling air flowing in and out via an air intake port and an air discharge port may be increased. Furthermore, by reducing the angle of the change in the flow direction of the cooling air flowing over the printed circuit board, the cooling air flowing over the printed circuit board may be made to efficiently flow through an air discharge port 119a. Furthermore, the efficiency with which a heat-generating component on the printed circuit board is cooled may be improved.

Abstract: A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.

Abstract: A horizontal subrack includes a ventilation box, a fan box and a board area. The ventilation box is located on the top and/or at the bottom of the board area, and includes an air partition plate, an air inlet, and a first air outlet; the air partition plate is set inside the ventilation box, and divides the ventilation box into an air-in chamber and an air-out chamber; the fan box is installed in the air-in chamber, and a fan is installed on the fan box; the air inlet is set on the front wall of the ventilation box; and the first air outlet is set on the rear wall of the ventilation box. The board area includes board slots, an air-in duct and an air-out duct. The air-in duct is located on one side of the board slots, and the air-out duct is located on the other side of the board slots. The air-in duct is linked to the air-in chamber, and the air-out duct is linked to the air-out chamber.

Abstract: A computer system has a chassis, a plurality of interconnected panels mounted on the chassis in a manner defining an interior space at least partially encompassed by the panels, a circuit assembly, an electrically-powered fan within the interior space, and an energy conversion device mounted within the interior space. One or more of the panels has an airflow opening therein. The circuit assembly is mounted on the chassis within the interior space and includes a heat generating system component. The heat generating system component includes a surface from which energy in the infrared (IR) electromagnetic spectrum is emitted during operation thereof. The energy conversion device is configured for converting the emitted infrared energy to electrical energy and is electrically connected to the electrically-powered fan for providing the electrical energy thereto.

Abstract: A first conduit is externally attached to one of two opposing sidewalls of electronic equipment and a second conduit is externally attached to the other of the opposing sidewalls. Each conduit has an open end, a closed end, and a side having a vent that is aligned with a vent in the sidewall of the electronic equipment to which that conduit is attached. The first conduit takes air in through its open end, channels the air in a direction substantially orthogonal to the direction of air flowing through the electronic equipment, and directs the air into the electronic equipment through its aligned vents. The second conduit receives air from the electronic equipment through its aligned vents, channels the air in a direction that is substantially orthogonal to the direction of air flowing through the electronic equipment, and exhausts the air through the open end of the second conduit.

Abstract: A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.

Abstract: A data center includes a housing and a number of server module assemblies received in the housing. Airflow interspaces are formed between neighboring server module assemblies, and between the two outmost server module assemblies and corresponding sidewalls of the housing. The airflow interspaces are alternately used for cold aisles and hot aisles. An inside of each server module is communicated with one of the hot aisles and one of the cold aisles at opposite sides of the server module. A number of cooling units are installed in the housing over the server module assemblies. A number of fans are installed in the housing to draw hot air from the hot aisles to flow through the corresponding cooling units to be cooled, and the cooled air flow into the corresponding cold aisles, thereby creating air differences in air pressure between the cold aisles and the hot aisles.

Abstract: An exemplary self-cleaning computer includes an enclosure defining an air inlet therein, a control processing unit (CPU) received in the enclosure, a vibration element mounted on the enclosure, and a control device electrically connected between the CPU and the vibration element. The control device is configured to direct the vibration element to vibrate when the computer is in a particular predefined state, and thereby the enclosure is agitated and clogged dust dislodges therefrom.

Abstract: A fan module for dissipating heat from a computer server includes a mounting bracket and a fan mounted on the mounting bracket. The mounting bracket is mounted to an outside of the computer server. The mounting bracket is hollow and forms an air passage in an interior of the mounting bracket. The air passage is communicated with an interior of the computer server. An airflow generated by the fan flows into the interior of the computer server through the air passage to take heat away from the interior of the computer server.

Abstract: An electronic equipment includes an air flow control unit that controls an air flow generated by an air blow. The electronic equipment includes an expanding unit that is disposed behind the air flow control unit, includes an additional electronic circuit for an electronic circuit mounted on a main board, which are cooling targets of the air blow, and expands a function of the electronic circuit of the main board. The expanding unit has a hollow structure casing and includes the additional electronic circuit in an inside of the hollow structure casing. The air flow control unit has an opening part to allow the air flow to pass through and a blocking part to block the air flow, and supplies most of the air flow into the inside of the hollow structure casing of the expanding unit by the opening part and the blocking part, the blocking part including a vent.

Abstract: A data center inside a shipping container having a lower plenum and an upper plenum in its interior. Heated air in the upper plenum exits therefrom into a plurality of heat exchangers adjacent thereto. Air cooled by the heat exchangers travels toward and enters the lower plenum. The data center includes a plurality of carriages each having an equipment receiving portion located between an open bottom portion in open communication with the lower plenum, and an open top portion in open communication with the upper plenum. Fans inside each of the carriages draw cooled air up from the lower plenum into the open bottom portion of the carriage, blow the cooled air up through the equipment receiving portion thereby cooling any computing equipment received therein, and vent the cooled air through the open top portion into the upper plenum.

Abstract: A video/audio computer display processor comprising a chassis, a video processor, a graphics card, and a ventilation duct. The chassis has first, second and third fans mounted therein and the video processor has a processor heatsink mounted thereon, wherein the processor heatsink has fins extending therefrom. The first fan is mounted on the processor heatsink and the second fan is positioned to direct an airflow parallel to and along the fins of the processor heatsink. The graphics card has a graphics card heatsink mounted thereon, and the graphics card heatsink has fins extending therefrom. The ventilation duct extends along a side of the chassis and has an opening therein adjacent the graphics card heatsink. The third fan is positioned to direct airflow through the ventilation duct, out through the opening and parallel to and along the fins of the graphics card heatsink.

Abstract: A scalable space-optimized and energy-efficient computing system is provided. The computing system comprises a plurality of modular compartments in at least one level of a frame configured in a hexadron configuration. The computing system also comprises an air inlet, an air mixing plenum, and at least one fan. In the computing system the plurality of modular compartments are affixed above the air inlet, the air mixing plenum is affixed above the plurality of modular compartments, and the at least one fan is affixed above the air mixing plenum. When at least one module is inserted into one of the plurality of modular compartments, the module couples to a backplane within the frame.

Abstract: An electronic system including an enclosure and an internal air plenum within the enclosure. At least one component of the electronic system within the enclosure evolves heat and has a surface exposed to the internal air plenum. The enclosure has inlet and outlet ventilation boundaries together with an EHD air mover disposed therein to motivate airflow along a flow path between the inlet and outlet ventilation boundaries, wherein the flow path is substantially excluded from the internal air plenum by a barrier.

Abstract: Methods of managing computer equipment: the methods may comprise receiving data indicating a power dissipated by computer equipment in a portion of the server room and receiving data indicating an actual airflow through the portion of the server room. The methods may also comprise calculating a target airflow in the portion of the server room considering the power dissipated by computer equipment in the portion of the server room and an expected difference in temperature between at least one hot aisle and at least one cold aisle in the portion of the server room, and calculating a recommended action for reaching the target airflow. The recommended action may be selected from the group consisting of: changing a static pressure generated by at least one cooling unit servicing the portion of the server room; changing a number of perforated tiles present in the portion of the server room; and changing the type of one or more perforated tiles present in the portion of the server room.

Abstract: Computer systems and associated methods for cooling computer components are disclosed herein. One embodiment of a computer system includes a computer cabinet having an air inlet spaced apart from an air outlet. The computer system also includes heat exchangers positioned in the computer cabinet, and a heat removal system in fluid communication with the heat exchangers. The computer system additionally includes at least one sensor for monitoring heat transfer between the computer cabinet and the room. The computer system further includes a control system operatively coupled to the at least one sensor, the control system including a computer-readable medium holding instructions for determining whether heat transfer between the computer cabinet and the room is balanced based on information from the sensor, and if not, adjusting a parameter to balance the heat transfer.

Abstract: The present invention relates to a heat exchange device equipped with a primary fluid circulation loop and a secondary fluid circulation loop and installed between an electrical equipment and a superficial temperature maintaining member, such that the heat generated by the electrical equipment is transmitted by a primary side fluid of the heat exchange device, and a secondary side fluid passes through a heat equalizer installed in the superficial temperature maintaining member so as to dissipate heat through the superficial temperature maintaining member.

Abstract: An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver portion and a narrow second receiver portion. A fan is mounted in the wide first receiver portion. The wide first receiver portion includes a rear wall located in the opening and a first front wall that is parallel to the rear wall. The first front wall and the rear wall define vent holes. The narrow second receiver portion includes a second side wall perpendicular to the first front wall. The second side wall and the heat generation apparatus form an air flow channel therebetween. The fan drives air flow through the air flow channel.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack of a data center. The apparatus includes: an airflow director mounted to the electronics rack to redirect airflow exhausting from the electronics rack through an airflow return pathway back towards an air inlet side of the rack; an air-to-liquid heat exchanger disposed within the airflow return pathway for cooling redirected airflow before exiting into the data center near the air inlet side of the rack; an air temperature sensor for monitoring air temperature of the redirected airflow; and an automated isolation door associated with the airflow director for automatically blocking airflow exhausting from the air outlet side of the electronics rack from passing through the airflow return pathway back towards the air inlet side of the rack responsive to temperature of the redirected airflow exceeding a defined temperature threshold.

Abstract: In the present invention, miniaturization of an electric power conversion system is made possible while the reduction of a rise in temperature is achieved through a cooling operation by a cooling fan. The electric power conversion system is provided with a casing for covering cooling fins for cooling power semiconductors, a main circuit board having a driver circuit for driving the power semiconductors, and a cover for covering up the main circuit board. The system includes a first airflow hole provided at a part of the main circuit board, on the upper side of an air-intake provided in the cover, and a second airflow hole provided on the lower side of the first airflow hole, and on the lower side of the cooling fins, wherein air from the second airflow hole is driven to the cooling fins by a cooling fan.

Abstract: According to one embodiment, a cooling structure includes a first heat radiating member receiving heat generated by a first heat generating body, and including a plurality of first heat radiating fins projecting toward a second housing, a first flow-in portion provided to the first housing to be open in one of first directions, a second heat radiating member receiving heat generated by a second heat generating body, and including a plurality of second heat radiating fins projecting toward a first housing, and a first flow-out portion provided to the second housing to be open in one of second directions crossing the first directions. The cooling structure includes a cooling fan unit configured to supply the air that has flown from outside to the first heat radiating fins, thereafter supply the air to the second heat radiating fins and cause the air to flow to the outside.

Abstract: The invention relates to a cooling arrangement with a first and at least one second heat-creating computer component, each coupled to at least one heatsink (40, 50). Heatsinks (40, 50) are arranged one after the other in a plane (10) in the direction of a provided coolant air stream (30). The cooling arrangement is distinguished in that heatsinks (40, 50) are of identical construction, and each heatsink (40, 50) comprises at least two side-by-side areas (41, 42, 51, 52) with heat transfer properties different from one another. In addition, heatsinks (40, 50) are arranged in plane (10) rotated relative to one another in such a manner that areas (42, 52) of heatsinks (40, 50) with a higher respective heat transfer power than the adjacent area (41, 51) are arranged one after the other in the direction of coolant air stream (30).

Abstract: A high density switching platform arranges multiple circuit cards interconnected by a single backplane. A single backplane has three sets of circuit cards on one side. A shared ventilation chamber on the other side of the backplane draws ambient air through each of the three sets of circuit cards independently. The air flow also allows cooling of power modules that supply power to the circuit cards. The platform allows interconnection of its circuit cards with circuit cards in adjacent platforms.

Abstract: A computing system includes a rack system that allows air to flow into the rack system on a first side of the rack system and to discharge from the rack system on a second side of the rack system. One or more air directing devices are coupled to the rack system on the first side of the rack system or the second side of the rack system. At least one of the air directing devices includes a duct having an upwardly increasing interior cross section over at least a portion of the height of the duct. The duct segregates air passing through the duct from air outside the duct. The air directing device may include a louver that couples to the rack system. The louver may include one or more airflow control members that allow air to pass through the louver.

Abstract: An airflow restrictor door is pivotably supported by and extends from a support towards a card receiving bay.

Abstract: A fastening system for a heat sink mounted on a circuit board utilizes a self-clinching stud assembly constructed by axially interfitting two flat sheet metal members. Each member has forked ends which when axially plugged together in criss-cross fashion create a unified fastener with side structures that can permanently clinch into a heat sink. After attachment to the heat sink, the stud presents two opposite attachment ends with tines which extend from the top and bottom of the heat sink. As finally assembled, a fan attaches to the top end of the studs above the heat sink while the opposite end of the stud which extends from the bottom of the heat sink passes through the circuit board to attach to a retaining leaf spring which presses against the back side of the board. Thus, all of the components are joined by a single stud.

Abstract: A fan unit holds a cooling fan and is detachable from a main body of an inverter apparatus. The fan unit is provided with a fan-unit retainer plate having keyhole-shaped apertures and provided between an upper case and a lower case. The fan unit is fixed by pressing the fan-unit retainer plate with fixing screws. The fan unit is easily and reliably removed by moving the fan-unit retainer plate without directly moving the fan unit and without removing the fixing screws.

Abstract: A display device according to the present invention comprises a display panel, an accommodating part accommodating the display panel, circulating means for circulating air in the accommodating part around the display panel, a heat exchanger collecting heat from the air, which is arranged on a rear surface side of the display panel, and a heat insulating member provided between the heat exchanger and the display panel. Another display device according to the present invention comprises a display panel, an accommodating part accommodating the display panel, a fan forming an air flow on a display screen of the display panel, a heat exchanger collecting heat from air, which is arranged on a rear surface side of the display panel, and a heat insulating member provided between the heat exchanger and the display panel.

Abstract: Airflow in a computer chassis may be enhanced or reduced to affect cooling of heat generating devices using an ionic air moving device. A plurality of ionic air moving devices enhance or reduce airflow through a plurality of fluidically parallel airflow zones of the computer chassis in an airflow direction established by a nonionic air moving device. Each ionic air moving device comprises an ion emitter electrode disposed a spaced distance from a collector electrode, wherein a controller independently controls an electrical potential between the emitter and collector electrodes of each ionic air moving device for affecting the rate of airflow through one or more of the plurality of airflow zones.

Abstract: An electronic apparatus includes a body frame, a rear frame which is pivotably attached to the body frame, a hole which is formed in a front wall of the body frame, a first heat dissipating member which is placed on the front wall to cover the hole, a thermal conductive member which contacts a portion of the first heat dissipating member at a storage space side and is placed in the hole, a semiconductor chip which is placed on the rear frame, and a second heat dissipating member which is placed on the rear frame to be in contact with the semiconductor chip and receive heat from the semiconductor chip. The second heat dissipating member being in contact with the thermal conductive member in the storage space when the rear frame closes an opening at the rear side of the body frame.

Abstract: An information processing apparatus including: a main unit; a cooling fan that suctions open air into the main unit to cool inside the main unit with an air flow; and a nonvolatile semiconductor storage device that is provided within the main unit to be used as an external storage device, the device including: a printed circuit board; a nonvolatile semiconductor memory that is mounted on the printed circuit board; a memory controller that is mounted on the printed circuit board and controls the nonvolatile semiconductor memory; and a temperature sensor that is mounted on the printed circuit board and detects temperature within the nonvolatile semiconductor storage device, wherein the memory controller is disposed at an upstream side of the air flow and the temperature sensor is disposed at a downstream side of the air flow.

Abstract: An audio sound system has a printed circuit board disposed within a compact case. The PCB has a power conversion circuit for generating an operating potential, audio amplifier circuit coupled for receiving the operating potential to amplify an audio signal, and peak voltage and current limiting circuit coupled to the audio amplifier circuit to avoid hard clipping of the audio signal. The power conversion circuit has heat-generating components. A cooling tunnel is mounted over the printed circuit board. A cooling fan is mounted in the compact case adjacent a first opening of the cooling tunnel for directing air flow through a second opening of the cooling tunnel over the PCB. The cooling tunnel has a notch formed in a side of the cooling tunnel for directing air flow over the PCB. The audio amplifier circuit can generate greater than 500 watts into a 4-ohm load.

Abstract: Methods, systems, and apparatuses are described for cooling electronic devices. The electrical device includes an integrated circuit die (IC) having opposing first and second surfaces, a plurality of interconnects on the second surface of the IC die that enable the IC die to be coupled to a substrate, and a flexural plate wave device. The flexural plate wave device is configured to generate a stream of air to flow across the electrical device to cool the IC die during operation of the IC die.

Abstract: An apparatus is provided including at least one electronic component. The apparatus also includes an enclosure enclosing the at least one electronic component. The enclosure includes at least one wall defined by a membrane. The apparatus further includes a piezoelectric actuator that is fixed at a first end and rigidly attached to the membrane at a second end. Application of alternating current to the piezoelectric actuator generates a pulsating mechanical deformation of the membrane.

Abstract: A device for air-cooling an electronic apparatus, where a suction opening (4) is provided in a housing (1), discharge openings (5) are provided in housings (1, 2), an airflow passing the inside of the housings is generated by a fan (6), and heat produced by a heart-producing body (9) is released to the outside of the housings by the airflow. Air introduction plates inclined to change the direction of the airflow are arranged at the suction opening (4), and a large number of projections are formed on the surfaces of the air introduction plates. The device for air-cooling an electronic apparatus has increased capacity for cooling a heat-producing part without increase in the size of the device, and in the device, accumulation of dust on the heat-producing part can be prevented.

Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

Abstract: Electronic components of an energy meter are mounted in an encapsulated compartment within a sealed outer enclosure of the meter. The encapsulated compartment is advantageously positioned to form air channels between the encapsulated compartment and the sealed outer enclosure to deliver thermal air circulation there-between to promote sufficient heat transfer through an outer skin of the sealed outer enclosure for maintaining acceptable thermal conditions for the encapsulated electronic components.

Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

Abstract: A computer system includes a chassis, a motherboard, a heat sink and an airflow guiding duct. The chassis includes a chassis bottom wall, a first chassis sidewall, and a second chassis sidewall. The first chassis sidewall defines a first ventilation hole. The second chassis sidewall defines a second ventilation hole. The motherboard with a chip is secured to the chassis bottom wall. The heat sink is secured to the motherboard for cooling the chip. The airflow guiding duct is configured to guide airflow flowing from the second ventilation to the first ventilation hole. A fan is received inside the airflow guiding duct.

Abstract: A heat dissipation device positioned in a computer case, includes a fan, a plate positioned between the computer case and the fan, at least one motor contiguous with the fan, a motor driver, a fan driver, at least one temperature sensor sensing the temperature in the computer case, and a controller. The fan defines an air outlet facing the computer case. The plate is slidable relative to the air outlet to open or close the air outlet. The motor is configured for moving the plate. The motor driver is configured for driving the motor to work. The fan driver is configured for driving the fan to rotate. When the sensed temperature is higher than a preset threshold temperature, the controller controls the motor to move the plate from the air outlet, and controls the fan to rotate.

Abstract: A thermal management system for an embedded environment is described. The thermal management system includes a pleumo-jet that has at least one wall defining a chamber, at least one piezoelectric device on the at least one wall, and a compliant material within the at least one wall and encompassing the chamber. The compliant material has at least one opening providing fluid communication between said chamber and the embedded environment. A cooling system is also described. A method for making a pleumo-jet is also described.

Abstract: An electronic flight bag computer (EFB) includes a housing defining first and second compartments that are fluidly isolated from and in thermal communication with one another. The first compartment contains electronic components connected to a user interface on an exterior portion of the housing for providing interactive flight related computation functions to a user. The second compartment contains a forced convection cooling component in thermal communication with the electronic components. The forced convection cooling component directs a flow of cooling fluid into the second compartment to convey heat produced by the electronic components out of the housing, such that the cooling fluid in the second compartment remains fluidly isolated from the electronic components in the first compartment of the housing.

Abstract: According to one embodiment, an electronic apparatus is provided with a housing, a circuit board in the housing, fan blades configured to rotate and blow air in a centrifugal direction, and a casing which contains the fan blades. The casing includes an exhaust port and a cut portion which opens in a centrifugal direction different from a direction in which the exhaust port opens, from a perspective of a rotation center of the fan blades, and into which a part of the circuit board is inserted.

Abstract: Method and apparatus providing airflow through a chassis including an upstream column of memory modules and a downstream column of memory modules. The airflow is divided into first and second separate airflow streams extending from an upstream end of the upstream column to a downstream end of the downstream column. The first airflow stream is guided into contact with a single memory module operably-installed in the upstream column and to avoid contact with any memory module in the downstream column. The second airflow stream is guided to avoid contact with any memory module in the upstream column and into contact with a single memory module operably-installed in the downstream column. The improved cooling enables the extended use of a single memory module per channel, even though the thermal load on such a memory module is greater.

Abstract: The invention broadly contemplates an integrated thermal system that is capable of simultaneously cooling multiple, separate heat generating components of an electronic device. The integrated thermal system according to one embodiment of the invention takes the form of a CPU heat sink designed to intelligently maximize available airflow, utilizing multidirectional airflow cooling of a plurality of heat generating components on the motherboard. The heat sink is designed such that airflow provided by a single fan is captured and directed to nearby/adjacent components, thus cooling these components. The invention thus provides an integrated cooling solution and removes the need for multiple cooling systems/solutions.

Abstract: The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).

Abstract: A computer includes an enclosure, a heat sink and a fan. Two openings are defined at opposite sides of the enclosure. The heat sink is located in the enclosure. The fan is located at one opening of the enclosure. Air current generated from the fan travels through the enclosure for dissipating heat from the heat sink and entire computer.