Abstract: The present invention provides an assembly structure of electronic card comprising two cover bodies. Bent portions are formed at two ends of each of the cover bodies. A plurality of positioning pieces each having an interference piece on the outer surface thereof are extended from one of the bent portions. The other bent portion is bent inwards to form a bent piece with a slot formed at the front end of the bottom face thereof. A hook body is extended from behind the slot and the bottom face of the bent piece. A plurality of connection holes are formed at the boundary between the hook body and the bent piece. Insertion pieces are formed at two sides of the font end of the cover bodies. Two ends of a frame are extended to form clamping arms having positioning grooves for clamping a connector. The two cover bodies sheathe a circuit board up and down. The positioning pieces are retained in the slot and the connection holes to engage the two cover bodies.

Abstract: Wire bonding or printed wiring board leads or, alternatively, lead frames or equivalents thereof are used to electrically connect external electrodes of high withstand voltage capacitors formed on a plurality of semiconductor chips. A driver circuit for signal transmission or receiver circuit for signal receipt formed on the semiconductor chips are electrically connected with substrate-side electrodes of said high withstand voltage capacitors, causing the plurality of semiconductor chips to be received within either a single package or a single module. Using this arrangement, a semiconductor device is capable of achieving both dielectricity and size reduction.

Abstract: An electronic card of the present invention has an insulative casing, a connector, a circuit board, a receiving portion, a first shell and a second shell. The insulative casing includes a first bar, a second bar and a transverse bar between the first bar and the second bar. The first shell and the second shell are assembled to shield the insulative casing therebetween. The first shell forms tabs respectively for locking with assembling passages of the first bar and the second bar and locking holes of the transverse bar. The receiving portion has a first cover and a second cover, and either of the first cover and the second cover is unitarily formed with the insulative casing. A transverse bar connects with the first bar and the second bar and forms a lib thereon. Such an electronic card is assembled conveniently and reliably, and shield from EMI.

Abstract: A housing for an electronic monitoring device on a vehicle part such as a lead accumulator comprises a metallic, load-bearing baseplate and an injection molded, generally parallelepipedal housing body encapsulating the baseplate. The baseplate projects out of the housing body on at least one side with a cantilevered attachment section.

Abstract: An outer enclosure case according to the present invention is substantially flat and rectangular in appearance and accommodates an inner hard-disk-drive case that contains a hard disk and a drive unit and the like for driving the hard disk. The outer enclosure case includes a box-like case body that has an open bottom portion; a cover that mounts over the open bottom portion; acoustic material of a prescribed thickness lining the inner peripheral surfaces of the enclosure case body; a heat-dissipating plate disposed on the inside of the top panel of the enclosure case body; and support members that extend from the heat-dissipating plate inside the enclosure case body so as to support the inner hard-disk-drive case between them. The enclosure case cover, the enclosure case body, the heat-dissipating plate, and the support members are constituted of aluminum or an aluminum alloy and are disposed in contact with the inner hard-disk-drive case in such a way as to dissipate heat.

Abstract: A circuit unit having a circuit unit comprising an insulating substrate (1) on which a conductive, flat coil (3) is located. The coil (3) can consist of a plurality of coil layers (9, 17) separated by insulating layers (11). To inter-connect the individual coil layer section (9, 17) into a coil, at least one opening (13) is provided in each of the insulating layers (11). The connection between the first coil ends (15, 19) of the coil (3) and an integrated circuit (7) or a module (23) containing the integrated circuit (7) can be formed solely by the coil ends (15, 19) and the connection points (27) of the integrated circuit (7) or the contacts (25) of the module (23) touching. The individual turns of the coil (3) can be disposed and dimensioned so as to permit embossing of the circuit unit without restriction within an area (37, 38) conforming with the standard.

Abstract: A memory card is disclosed, which comprises a content interface, an interface driver, a card interface controller, a security processing section which supplies an encryption key to the card interface controller upon a content reproduction request, a memory core interface including a binary counter which counts one of the amount and the number of times of content reproduced, in response to a request for reproduction of a content, and a memory core which records one of the amount and the number of times of content reproduced, if a request for reproduction of a content is input to the memory core, the memory core outputting the encrypted content to the memory core interface if the reproduction request does not cause one of the amount and the number of times of possible content reproduction to be exceeded.

Abstract: A small form factor pluggable optoelectronic transceiver module includes top and bottom housings (1, 2), a chassis (3), a receptacle (4), a PCB (5), an optoelectronic subassembly (6), and a shielding shell (9). The optoelectronic subassembly is received in the receptacle. The shielding shell is fixed on the PCB, and encases a transmitting circuit on the PCB. The chassis is attached to the PCB with screws, and accommodates and protects the PCB. The top housing is attached to the chassis and the receptacle. The top and bottom housings are attached together, encapsulating therein the receptacle, the chassis, the PCB and the shielding shell. The shielding shell provides EMI protection and ESD shielding, and reduces electrical crosstalk. The module also forms multiple grounding paths between a grounding circuit of the PCB and the top and bottom housings.

Abstract: A solid-state imaging apparatus includes: a resin structure member configured by an insulating resin and having a through-opening portion a wiring portion is formed on the surface of the resin structure member; a solid-state image pickup element connected to the wiring portion and attached to the through-opening portion; and a light-transmitting member disposed to cover the through-opening portion with being separated from the solid-state image pickup element by a predetermined distance. A fixing member which is smaller in coefficient of thermal expansion than the insulating resin is placed in close proximity to a solid-state image pickup element attaching face.

Abstract: A heat sink for a transceiver optoelectronic module including dual direct heat paths and a structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Abstract: An expansion card mounting apparatus includes a rear panel (20) defining an opening (21), a retaining bracket (10) slidably attached to the panel and including a main body (12) and a pressing body (16), and a fastening member (30) fixed to the retaining bracket. A support plate (22) extends rearwardly from the panel adjacent the opening. A through opening (120) is defined in the main body. Cutouts (162) are defined in the pressing body. The fastening member includes a plurality of pressing clips (35) extending through the cutouts to abut end portions (52) of slot covers (50), and an operation lever (33) extending through the through opening of the retaining bracket to resiliently engage with the panel at the opening. Thus the end portions of the slot covers are securely sandwiched between the pressing body and the support plate.

Abstract: In order to obtain a minimal leakage inductance in a semiconductor component, it is necessary to provide at least two adjacent switching elements whose load current connection elements which are adjacent on one housing side to have different polarities. A multiplicity of even-numbered switching elements are advantageously disposed next to one another on an alignment line. The leads between the load current connection elements and the load current connections of the switching elements that are disposed next to one another advantageously run approximately orthogonally with respect to the alignment line. The assigned load current connection elements then alternately have the first and the second supply potential and this minimizes the leakage inductance.

Abstract: A memory module for a computer system comprises a printed circuit board adapted for the computer system. The memory module further comprises four banks of memory chips mounted upon the printed circuit board. Each of the four banks of memory has a separate chip select signal and clock enable signal routed to it. The combination of four chip select and four clock enable signals allows for activation of any of the four banks of memory chips.

Abstract: The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene terephthalate glycol placed between a first layer and a third layer, the first layer and third layer being of a chemical nature different from that of said second layer, and an electronic module being incorporated in a cavity of the card body, the module including an integrated circuit, where the thickness of the second layer is of the same order of magnitude as that of the first and third layers, and wherein the cavity extends into the second layer from the first layer.

Abstract: A method of manufacturing a printed wiring board, enabling insertion components to be mounted on both sides thereof, including: a) providing first and second copper-clad laminates, including plated through-holes thereon; b) hot-pressing the laminates with each other and a first prepreg bonding sheet therebetween, so that the through-holes are closed by the prepreg to form non-through holes; c) laminating a second prepreg on each of the surfaces of the composite laminate; d) covering the opening of respective non-through holes with a heat resistant resin film; e) laminating one-side copper-clad laminate on each of the surfaces of the product of (d), with the copper side out, followed by hot-pressing; f) etching the copper sides to form outer layer circuit patterns; g) removing the base material layers covering the openings of the non-through holes; and h) removing the heat resistant resin films of the openings of the non-through holes.

Abstract: A method and apparatus for connecting circuit boards together in a sensor assembly includes a connector that allows the circuit boards to be positioned generally perpendicular to each other. The connector includes a first end that is received within an opening formed at one edge of a main circuit board. A second end of the connector includes a resilient hook or clip that grippingly engages opposing sides of an auxiliary circuit board. The connector comprises an electrical contact between the main and auxiliary circuit boards. The perpendicular orientation of the auxiliary circuit board to the main circuit board allows for more compact packaging.

Abstract: The light emitting diode assembly for an illuminated sign discloses an enhanced waterproofs function and an enhanced durability. The light emitting diode assembly includes a case being open upwards, in which a connecting recess is formed on upper portions of both sides of the case. A printed circuit board is installed in the case and being mounted on upper sides of a plurality of light emitting diodes. The hollow cap is coupled in the connecting recess of the case, in which a plurality of wires passes through the cap. A synthetic resin material for covering the printed circuit board, the cap and the light emitting diode, the synthetic resin material being filled in the case. In this structure, the light emitting diode assembly can prevent the printed circuit board, transformer and the light emitting diode from being damaged by using an epoxy resin.

Abstract: A high-frequency module has a signal electrode provided on a cut side thereof, and is arranged to produce no burrs. The module includes a substantially four-sided substrate, a recess at a cut side of the substrate, and a signal electrode at the recess. The signal electrode is spaced from the cut side by a distance.

Abstract: A front panel assembly includes a front panel (10), a lining panel (30) and a cover (50). An opening (12) is defined in the front panel. A pair of parallel first arcuate guideways (122) is formed on an internal surface of the front panel at upper and lower extremities of the opening. The lining panel is attached to the front panel, includes a central vertical beam (36), and defines a recess (34). A pair of parallel second arcuate guideways (342) is formed at upper and lower extremities of the recess. A plurality of ports or other components is installed in the lining panel at the recess. The cover is received in the recess, and is slidable along the first and second guideways. The cover is slid toward the beam and snappingly engaging therewith, thus protecting the ports or other components in the recess from contamination or accidental damage.

Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

Abstract: Charge prevention patterns disposed on one surface of a circuit board and electrolytic plating patterns disposed on the other surface of the circuit board are disposed in a zigzag pattern in end surfaces of the substrate. The thickness of a coating layer is smaller than the thickness of a card case.

Abstract: A parallel printed circuit board assembly includes a main circuit board (1) and an auxiliary circuit board (2). The main circuit board has a surface (14) with a plug connector (32) and a receptacle connector (44) mounted thereon. The auxiliary circuit board has a surface (22) with a plug connector (42) and a receptacle connector (34) mounted thereon. The plug and receptacle connectors of the main circuit board respectively mate with the receptacle and plug connectors of the auxiliary circuit board. Because of the arrangement of the plug and receptacle connectors on the main and auxiliary circuit boards, the circuit boards can only connect with one another in one correct way.

Abstract: A multi-chip package (MCP) in which heat generated in first and second chips of the MCP is spread effectively and a method for manufacturing the same. The MCP includes first and second chips. The MCP further comprises a tape including a conductive material layer therein situated between the first chip and the second chip. Thus, the heat generated in the second chip can effectively spread to the outside through the tape.

Abstract: A printed circuit board (PCB) has a plurality of electromagnetic interference (EMI) reducing circuits, which reduce electromagnetic waves emitted from the PCB, and a plurality of switching devices, such as MOS transistors, relays and DIP switches, to enable and disable the EMI reducing circuits. The EMI reducing circuits connected between border portions of a voltage and a ground layers in the PCB include at least a capacitor. A combination of the EMI reducing circuits which gives a minimum amount of electromagnetic waves emitted from an apparatus including the PCB is selected as a suitable combination of EMI reducing circuits. An information processing apparatus having the printed circuit boards has means for selecting a combination of the EMI reducing circuits which allow the minimum EMI emitted for the apparatus.

Abstract: A stackable package to create a 3-dimensional memory array using ball grid array technology. Specifically, memory chips are coupled to a pre-formed packages which have alignment features to allow for the stacking of the ball grid arrays. The alignment features are used to align and orient each package with respect to an adjacent package, substrate or printed circuit board. The alignment features also support the weight of the adjacent package during solder ball reflow to maintain stack height and parallelism between packages. Each memory device is serially connected to the adjacent memory device through the vias and solder balls on each package.

Abstract: A mini-type connector has a substrate, a plurality of metal joints and a metal frame. The substrate includes a connector and a circuit board, wherein the connector is extended from the circuit board. The plurality of metal joints is assembled to the connector of the substrate for being electrically connected to an external electronic device. The metal frame covers the connector of the substrate for enhancing the stress-resistance strength of the connector. The connector is integrally formed with the circuit board.

Abstract: A multichip mounted structure has a substrate 11 provided with substrate-side terminals 16a and 16b and a plurality of IC chips 12a and 12b provided with bumps 14a and 14b, respectively, so that the substrate-side terminals 16a and 16b are conductively connected with the bumps 14a and 14b, respectively. The bumps 14a and 14b provided on the plurality of IC chips 12a and 12b, respectively, form pairs of terminal lines opposing each other. Since the plurality of IC chips 12a and 12b are mounted on the substrate 11 so that central lines L1 and L2 between the pairs of terminal lines which are individually formed approximately coincide with each other, it is not necessary to transport a position of a compressive head, and one piece of ACF 19 can be commonly used.

Abstract: A circuit board is provided with extending portions having terminal patterns formed thereon. A housing contains the circuit board while permitting the extending portions to protrude. A mother board has, formed therein, through holes in which the extending portions are to be inserted, having, formed thereon, wiring pattern that is to be electrically connected to the terminal patterns, and permitting the extending portions to be inserted in the through holes so that the housing is placed thereon. The circuit board is provided with a protruded portion which extends separately from the extending portions and pushes the terminal patterns onto the wiring pattern of the mother board. The mother board is provided with an insertion hole in which the protruded portion is to be inserted being slightly deviated from the positions of the through holes in which the extending portions are to be inserted.

Abstract: A multi-state indicator includes a section connecting a first trace to a second trace adapted to facilitate application of force to said section to disconnect said section from said first and/or second trace(s) and to disconnect said first trace from said second trace. In addition, the multi-state indicator includes circuitry to indicate a state based on whether said first trace connects to said second trace.

Abstract: A memory module is capable of constituting short loop-through form memory bus systems in which the length of the entire channel can be reduced. As a result, the systems are suitable for a high-speed operation, and costs for fabricating systems such as a board and a module connector can be reduced. The memory module includes a plurality of tabs located in one side of the front and in one side on the rear of the memory module, for being interconnected by a connector on a system board, a plurality of vias for connecting two different signal layers of the memory module, and a plurality of data buses extended from the tabs on the front of the memory module to the tabs on the rear of the memory module through each of the vias. At least one memory device is connected to each of the data buses. Preferably, each of the data buses is formed to be perpendicular to one side of the memory module on which the tabs are formed.

Abstract: A latching apparatus has a guide member, a circuit board attachment member which is configured to attach to a circuit board, and a control assembly. The control assembly is configured to (i) retain the circuit board attachment member within a retaining range of the guide member when the guide member is unlocked from a receptacle member, and (ii) un-restrict the circuit board attachment member such that the circuit board attachment member is movable outside of the retaining range of the guide member when the guide member is locked with the receptacle member.

Abstract: Two substrate leaves are coupled by a folded flexible circuit medium. Integrated circuit components can be mounted to opposite faces of both leaves. A signal terminal projects from one of the leaves. Both leaves include paths for communicating signals between their respective components and the terminal. Preferably the leaves are formed by two outer, rigid substrates each laminarly affixed to a respcective inner substrate, the inner substrates being separate sections of the folded circuit medium and the outer substrates being separated sections of a rigid circuit medium. Components are mounted to the exposed faces of the substrates. The fold includes paths for communicating signals between the leaf distal from the terminal and the terminal, the signal paths between one leaf and the terminal being closely matched in length and impedance to corresponding paths between the other leaf and the terminal.

Abstract: A CF card (1) comprises: a casing constituted by two panel plates (2, 2) and a frame (3); and a printed wiring board (4) accommodated in the casing. A plurality of claw-like engaging parts (5) are provided to the peripheries of the panel plates (2). When the CF card (1) is assembled, the engaging parts (5) of the first panel plate (2) are inserted into through holes of a long groove (8) provided in the frame (3) and then the printed wiring board (4) is mounted on the panel plate (2) located at the inside of the frame (3). Thereafter, the engaging parts (5) of the second panel plate (2) are inserted into the through holes of the long groove (8) from the surface located in the opposite side of the frame (3). There are two types of engaging parts (5): one having lances and the other having holes. Inside the through holes, the lances of the engaging parts (5) of one panel plate (2) are inserted into the holes of the engaging parts (5) of the other panel plate (2).

Abstract: A chassis for circuit cards has a housing, a front end, a connector end, and a top cover. The housing has an airflow slot on its underside, and the top cover is open in nature, the combination of which allows the flow of forced convection air from top to bottom (or vice versa) to cool the circuit cards. The connector end has alignment pins which assist in blind mating of the chassis in difficult to access areas. Stabilizer rods, spacers and spacer brackets, made from stainless steel, hold the circuit cards in place and protect them from shock, vibration, and other trauma. The front end has a jacking type screw which enables one to exert sufficient pressure so that the greater than 200 I/O pins at the connector end are easily forced into receiving sockets.

Abstract: A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.

Abstract: A device having electrical and mechanical components. The device comprises multiple layers in which: a first layer or set of layers arranged is to function as one or more electrodes or conductors; and a second layer is arranged to function as one or more press contracts or wire contacts or wire bond pads. The second layer has different physical properties than the first layer, wherein the first layer or set of layers is relatively hard or tough and the second layer is relatively soft or malleable. A corresponding method is provided.

Abstract: An electronic component includes via holes having an elongated cross section, which are provided in a ceramic green molded product provided with a plurality of terminal conductors to define external terminal electrodes. Thereby, a portion of each terminal conductor is exposed on the inner wall of a piecing hole. The ceramic molded product is fired to obtain a ceramic sintered product. Then, the sintered product is split along cutting grooves passing through the via-holes, wherein ceramic electronic components are produced.

Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.

Abstract: A junction box and ballast circuitry assembly including a ballast housing for attachment to the junction box. The junction box is provided with two opposed open ends, one of the ends being in alignment with a side of the ballast housing and the opposed open end being adaptable for electrical communication with a lighting fixture. The junction box is provided with brackets on opposed sides for alignment with outwardly extending tabs on opposite sides of the ballast assembly to receive a fastening bolt through the tab and an opening in the aligned bracket.

Abstract: A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also are of sufficient size so that they extend beyond the bottom or top surface of the IC device, including the wiring interconnect and encapsulate material, as the conductive elements make contact with the FBGA positioned below or above to form a stack. The IC device, such as a memory chip, is mounted upon a first surface of a printed circuit board substrate forming part of the FBGA. Lead wires are used to attach the IC device to the printed board substrate and encapsulant is used to contain the IC device and wires within and below the matrix and profile of the conductive elements.

Abstract: A surface-mounted module in which, after a module is assembled, each circuit element of the module can be evaluated. In addition, the whole module mounted on a substrate can be evaluated. The module including includes a module substrate; and circuit elements on the module substrate and insulated from one another, each circuit element having an independent function. Each circuit element, and the each circuit element has a terminal insulated from terminals of other circuit elements on a surface of the module substrate. A surface-mounted module further includes a base substrate that has a connection wiring to electrically connect two terminals on the module surface and supplies electric power to the module, and achieves functions by operating each circuit element connected via the wiring in response to the electric power supplied from the base substrate.

Abstract: A Category 5 (as well as newer revisions, such as Category 6 and Category E)/single-pair surge protector module for protecting telecommunications related equipment and the like from transient voltage and current surges includes a two-piece interfitting housing which receives a miniature printed circuit board therein. The miniature printed circuit board is used to mount a Category 5 (as well as newer revisions, such as Category 6 and Category E)/circuit surge protector device. The surge protector device includes a pair of voltage suppressors and four banks of diodes.

Abstract: An access device of a memory card comprises a substrate for providing a receiving space. The substrate is positioned in an expanding slot of a system mainframe. The receiving space of the substrate has a control panel. The control panel has a control IC for accessing and converting signal formats of a memory card. At an end for outputting data signal on the control panel has a data wire for outputting signals from the control panel. The data wire is directly connected to a specific interface in a mother board of a system. Another data wire connected in parallel with the data wire is connected to an external interface of a back plate of the mainframe so that the external interface is still utilized by other devices. Thereby, the data inputted to the memory card can be accessed directly from the system mainframe without any external device.

Abstract: A server system includes a plurality of printed circuit assemblies. The server system includes a chassis for housing the plurality of printed circuit assemblies. A server management card coupled to the plurality of printed circuit assemblies monitors and manages operation of the server system. The server management card receives and stores status information from the plurality of printed circuit assemblies. A first LCD panel is mounted on a first side of the chassis and is coupled to the server management card. A second LCD panel is mounted on a second side of the chassis and is coupled to the server management card.

Abstract: A cartridge design allows any standard size IDE hard drive to be used like a removable media. The cartridge with the hard drive can then be connected to any computing devices via various interface ports such as USB, Firewire, PCMCIA, Parallel or any new IO ports. The cartridge consists of a disk connecting board, a cartridge housing and an eject mechanism to remove the hard drive from the cartridge.

Abstract: A digital data processing device, e.g., a web server, having a power supply and at least one component such as a motherboard or a disk drive powered by the power supply and interconnected therewith by a power transfer element which is separate from the power supply and the component. The power transfer element is adapted to physically mate with the power supply and the powered component and to provide electrical coupling between them along a non-obstructing path of defined geometry. It includes a substantially rigid card, e.g. a circuit card, with at least one conductive pathway, and further aspects of the invention provide mechanisms for coupling the power transfer element to the supply and to the other component while orienting the card within the chassis. The power transfer card may carry an edge connector into which the edge of a power supply card fits, or vice-versa, so power enters conductors on the card at a proximal edge or end of the card.

Abstract: A memory module having balanced data input/output contacts. A memory module includes a printed circuit board having an edge connector and a plurality of memory integrated circuits. The edge connector may be adapted for insertion into a socket of a motherboard of a computer system, for example. The edge connector includes a plurality of contact pads on both sides of the printed circuit board. The contact pads are configured to convey data signals, power and ground to and from the printed circuit board. The power and ground contact pads alternate along the edge connector. There are no more than four data signal contact pads without intervening power or ground contact pads.

Abstract: A parallel printed circuit board assembly includes a main circuit board (1) and an auxiliary circuit board (2). The main circuit board has a surface (14) with a plug connector (32) and a receptacle connector (44) mounted thereon. The auxiliary circuit board has a surface (22) with a plug connector (42) and a receptacle connector (34) mounted thereon. The plug and receptacle connectors of the main circuit board respectively mate with the receptacle and plug connectors of the auxiliary circuit board. Because of the arrangement of the plug and receptacle connectors on the main and auxiliary circuit boards, the circuit boards can only connect with one another in one correct way.

Abstract: The present invention provides a tray-style flash memory drive that can be embedded in or externally connected to a computer system or a digital electronic product to enable the computer system or digital product to access various memory cards (flash memory cards), said flash memory drive comprises a case, a base in the case, and a tray that may slide or close on the base, wherein there is a circuit board in the case, and the circuit board has a signal transmission unit and a plurality of contacts. There is a plurality of lugs on the bottom of the tray. When the tray slides and opens, and a memory card is placed in it, the lugs will contact the I/O pins of the memory card on their top surfaces. When the tray slides backward and closes, the lugs will contact the contacts on the circuit board on their bottom surfaces electrically. Thus data stored in the memory card can be input and output via the transmission unit through the I/O pins of the memory card, the lugs on the tray, and the contacts.