Abstract: A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical, electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.

Abstract: Circuit board orientation in a computer system. A system includes a first set of circuit boards and a second set of circuit boards. The first set of circuit boards may be mated via a first and second set of connectors to the second set of circuit boards such that the first set of circuit boards is oriented substantially orthogonal with respect to the second set of circuit boards. Each of the boards may be accessible and hot swappable.

Abstract: A semiconductor multi-package module has stacked lower and upper packages, each of which includes a die attached to a substrate, in which the second package is inverted, and in which the upper and lower substrates are interconnected by wire bonding; and further in which at least one of the packages includes a stacked die package, or includes an additional stacked package. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a die, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, in which one or both of the upper and lower packages is a stacked die package or in which one of the packages includes an additional stacked package, and forming z-interconnects between the upper and lower substrates.

Abstract: A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-up configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

Abstract: A power module that houses components of a circuit for driving a three-phase motor. The power module includes a molded shell. A number of leads are embedded within the body of the power shell and extend from its exterior where they make electrical connection to exterior devices to a chamber within the molded shell where they are connected to respective components of the circuit. The power module includes capacitor leads, which are embedded in the molded shell, for making direct connection to respective bus capacitors, thereby allowing the capacitors to be directly assembled onto the power shell and become part of the power module. The leads embedded within the molded shell are arranged so that they pass over one another within the body of the molded shell. At least one of the leads has a portion within the chamber which acts as bridge to allow the passage of conductors.

Abstract: A flat-panel display device having a transparent first plate and a second plate which are disposed in parallel with each other and cooperate to define therebetween an air-tight space in which light is generated for emission through the first plate, the display device including a sealing material for air-tightly sealing the air-tight space along a periphery of the first and second plates, and metallic thin sheets bonded with the sealing material to end faces of the first and second plates such that the metallic thin sheets cover the end faces.

Abstract: An integrated circuit is mounted on a printed board in a state in which a first edge thereof is located to face to a first side of the printed board and a second edge adjacent to the first edge is located to face to a second side adjacent to the first side of the printed board. A power supply terminal provided on the first edge of the integrated circuit, an AGC terminal and an oscillator terminal respectively provided to a third edge are connected to external terminals via conductive patterns extended to the first side on the printed board. An electrode for measurement is provided in the vicinity of the second side on the printed board and an intermediate frequency output terminal provided on a second edge of the integrated circuit is connected to the electrode via a conductive pattern extended from the second edge to the second side on the printed board.

Abstract: The invention provides arrangements to facilitate surface mounting of subassembly boards on a motherboard with reliable, high conductivity interconnection. In accordance with the invention, the subassembly interconnection arrangement is composed of separate power and sense connector arms formed on one or more base headers. The arrangement interconnects and supports the subassembly board on the motherboard surface. Each power arm advantageously comprises a plurality of split-based mounting lugs secured to the arm in a coplanar configuration. Each sense connector arm preferably comprises a plurality of connector pins secured to the arm in a coplanar configuration. Embodiments are disclosed for vertical and horizontal surface mounting.

Abstract: The present invention provides a network device that fully utilizes the available space in a standard telco rack through the use of multiple mid-planes. Full utilization of available space allows a high switching capacity network device including both physical layer switch/router subsystems and upper layer switch/router subsystems to be fit in one telco rack. Inter-mid-plane connections may be provided by connecting switch fabric cards and/or control processor cards to each of the mid-planes. Providing a multi-layer network device in one telco rack allows for intelligent layer 1 switching (for example, dynamic network connection set up), allows for one network management system to control both layer 1 and upper layer networks and eliminates grooming fees.

Abstract: A housing for an adapter module is provided with a bail latch mechanism that serves to engage and disengage the frame into which the adapter module housing fits. The housing is stamped and formed from a piece of sheet metal and the bail latch is rotatably mounted in the housing. The bail latch is movable between two positions and the bail latch engages a cam member that is stamped and formed in one side of the housing so that movement of one end of the bail latch over the cam member cams one of the two free ends of the bail latch inwardly into the housing to thereby release the housing from the adapter frame.

Abstract: The present invention is directed to electronic components shielded from electromagnetic interference through the use of conforming shield enclosures. Conforming shield enclosures are flexible metalized thermoformed thin-wall polycarbonate polymer film substrates used to shield a radiation source. The present invention relates to conforming shielded forms for electronic component assemblies and specifically to electronic component assemblies which are shielded to protect against electromagnetic and radiofrequency interference. Specifically, the shielded electronic component assembly comprises (a) a semiconductor device to be shielded from electromagnetic frequencies; (b) a reference potential source; (c) a housing enclosing the semiconductor device within the assembly; and (d) a conforming shield enclosure electrically connected to the reference potential source.

Abstract: Driving system with converter control for low voltage three-phase motors, which is provided with a power unit containing transistors and capacitors, a triggering unit for the transistors and a control unit as well as connections for direct and alternating current, the units being disposed in a common casing made of a heat-conductive material, characterised by the following features: the power unit is provided with a first printed circuit board (24) made of fairly heat-conductive material, which is disposed on the fairly heat-conductive bottom of the casing (12) in a plane fitting arrangement, a second printed circuit board (26) contains the triggering unit, the second printed circuit board (26) being electrically and mechanically connected to the first printed circuit board (24) in a spacing to it with the aid of contact pins (30) of metallic material attached on the first printed circuit board (24) by soldering, and terminal pins (22) are connected with contact points (38) of the first printed circuit board

Abstract: An electronic digital controller, such as a load cell indicator, is disclosed in which a number of components, such as a circuit board, display, and keypad are placed within an enclosure, and the enclosure is bonded closed, such as using an adhesive, to render the enclosure watertight. The keypad is a touch sensitive, capacitive keypad with no moving parts, and it is housed behind a rigid panel. An optoelectronic transceiver allows for data exchange with an electronic memory device housed in the adhesively sealed enclosure and allows for data exchange and for updating or modification of software code housed therein. Other components, such as another circuit board, a power supply, and block connectors, are placed in an adjacent enclosure, and the circuit boards in the two enclosures are electrically connected. The power supply is preferably a potted AC power supply but may also include a battery.

Abstract: A memory module is capable of constituting short loop-through form memory bus systems in which the length of the entire channel can be reduced. As a result, the systems are suitable for a high-speed operation, and costs for fabricating systems such as a board and a module connector can be reduced. The memory module includes a plurality of tabs located in one side of the front and in one side on the rear of the memory module, for being interconnected by a connector on a system board, a plurality of vias for connecting two different signal layers of the memory module, and a plurality of data buses extended from the tabs on the front of the memory module to the tabs on the rear of the memory module through each of the vias. At least one memory device is connected to each of the data buses. Preferably, each of the data buses is formed to be perpendicular to one side of the memory module on which the tabs are formed.

Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Abstract: There is provided an electronic apparatus that is free of the problems with the prior art and is capable of achieving higher efficiency of cooling the interior of the casing without sacrificing cost reduction and designing compact in size. A casing houses a plurality of circuit boards having electronic parts mounted thereon and at least one high load part that generates heat. The casing has exhaust ports formed therein for heat radiation and exhaust ports for heat radiation. The plurality of circuit boards are comprised of a first circuit board and a second circuit board. The first circuit board is disposed to extend substantially horizontally, and the second circuit board is disposed to extend substantially vertically with a horizontal gap provided between the first circuit board and the second circuit board. The at least one high load part is arranged below the horizontal gap, and the exhaust ports are arranged above the horizontal gap.

Abstract: A fiber channel backplane configuration is capable of modular expansion, e.g., from 64 ports to 128 ports or 256 ports by a simple operation. The backplane includes connectors that provide permanent and jumper/vertical connections to support 64 user port switch in a single chassis. For a 128 port switch, two 64 port chassis are used. In the 128 port configuration, the connectors are configured to provide permanent and jumper/vertical connections to make intra-chassis and inter-chassis connections between the fabric switch and fabric input/output boards. Using jumper plugs, the jumper connectors provide vertical connections between the fiber input/output boards and fiber switch boards of two chassis. For a 256 port switch configuration, four 64 port chassis assemblies are used. The connectors are configured to provide each switch with permanent, vertical, horizontal, and diagonal connections to the fiber input/output boards of each of the four chassis.

Abstract: A method and system are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.

Abstract: A module connection assembly connects modules in a torus configuration that can be changed remotely. In particular, a single module can be added to or deleted from the configuration by remotely switching from conducting paths that provide end-around electrical paths to conducting paths that provide pass-through electrical paths. The assembly includes two backplanes, a first set of module connectors for electrically connecting modules to one of the backplanes, and a second set of module connectors for electrically connecting modules to the other backplane. The assembly further includes configuration controllers. Each configuration controller selects between end-around electrical paths that electrically connect multiple module connectors of the first set to each other, and pass-through electrical paths that electrically connect module connectors of the first set to module connectors of the second set.

Abstract: Capacitor material for use in forming capacitors, is disclosed. More specifically, the invention is directed to capacitors formed from this material that have one or more discrete electrodes (314), each electrode (314) being exposed to at least two thicknesses of dielectric material (300). These electrodes (314) are surrounded by wider insulative material (312) such that the material can be cut, or patterned into capacitors having specific values. A single electrode can form a small value capacitor while still providing a larger conductive area for attaching the capacitor to associated circuitry. The thin dielectric (310) can be a tunable material so that the capacitance can be varied with voltage. The tunability can be increased by adding thin electrodes that interact with direct current.

Abstract: There is provided an electronic apparatus which allows an operating panel surface thereof to be precisely finished and coated in a bright color and hence be attractive in appearance. A main case covers a plurality of operators so as to allow the operators to be operated. A first board, which processes signals generated by operations of the operators, is mounted in the main case and has electronic circuitry formed thereon. A second board, which processes signals at least from the first board, is mounted in the main case and has electronic circuitry formed thereon. The second board is disposed under the first board. At least one stay connects between the opposite sides of the main case. The first board is disposed on the stay, and the second board is disposed under the stay.

Abstract: Structures that provide decoupling capacitance to packaged IC devices with reduced capacitor and via parasitic inductance. A capacitive interposer structure is physically interposed between the packaged IC and the PCB, thus eliminating the leads and vias that traverse the PCB in known structures. A capacitive interposer is mounted to a PCB and the packaged IC is mounted on the interposer. The interposer has an array of lands on an upper surface, to which the packaged IC is coupled, and an array of terminals on a lower surface, which are coupled to the PCB. Electrically conductive vias interconnect each land with an associated terminal on the opposite surface of the interposer. Within the interposer, layers of a conductive material alternate with layers of a dielectric material, thus forming parallel plate capacitors between adjacent dielectric layers. Each conductive layer is either electrically coupled to, or is electrically isolated from, each via.

Abstract: A compact enclosure for interchangeable SONET multiplexer cards and a method for using the same. The present invention further provides a compact enclosure for receiving one or more reduced size SONET multiplexer cards having front panel access to electrical and optical connectors, along with other cards such as DS1-DS3 multiplexer cards and wave division multiplexing cards, which is adapted for use in a reduced size enclosure, and a method for using the same.

Abstract: A wiring board includes a substrate, and an interconnect pattern which is formed on the substrate and includes a land. A penetration hole, which exposes the substrate, is formed in the land. The penetration hole is formed in a region along a periphery of the land.

Abstract: A computer system includes a processor and a multi-layer circuit board having a memory unit, a memory control unit, and a data bus coupling the memory control unit to the memory unit. A first signal line is formed on a selected layer of the circuit board and connected between a first pin on the memory unit and the memory control unit. A second signal line is also formed on the selected layer of the circuit board and is connected to the first pin on the memory unit.

Abstract: A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1C, and a light-transmitting member is attached so as to cover the through-opening portion 1C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.

Abstract: Replaceable parts having a relatively short service life such as electrolytic capacitors are mounted on a reusable printed circuit board and one or more than one replaceable printed circuit boards so that the operation of replacing the electrolytic capacitors can be performed very easily and reliably. The replaceable printed circuit board may preferably be fitted to a replaceable frame and the replaceable frame is replaced. The primary side replaceable parts and the secondary side replaceable parts may be mounted on the same replaceable printed circuit board.

Abstract: An electronic energy meter and its package is described in which the meter package has a reduced number of parts, and the main circuit board assembly has the metering electronics on board, thereby eliminating the need for flying leads and point-to-point wiring within the package. The energy meter includes a first enclosure portion, a circuit board assembly for performing metering functions, a partial terminal block, and a second enclosure portion. The first and second enclosure portions are mateable with each other to form a meter package, in which the circuit board assembly and partial terminal block are at least partially contained within the meter package.

Abstract: An electronic apparatus includes a first assembly and a second assembly. Each assembly has a circuit board defining a front side and a back side, a set of connectors mounted to the front side of that circuit board, and a heat sink disposed over the front side of that circuit board. The heat sink is configured to provide cooling to that assembly. The electronic apparatus further includes a coupling mechanism that couples the first and second assemblies together in a substantially parallel manner. The sets of connectors of the assemblies form a connection interface to concurrently connect the first and second assemblies to a backplane.

Abstract: A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and the second substrate. The device also includes a circuit chip connected to the transmission line.

Abstract: There is disclosed a system and method for providing an improved common control bus for use in the on-line insertion of line replaceable units (such as circuit board cards) into a backplane of a processor shelf, a modem shelf, or a similar type of equipment. The present invention increases the number of device locations that a common control bus can access. The present invention comprises a complex programmable logic device on a circuit board card that is coupled to a common control bus. The complex programmable logic device is capable of selectively coupling to the common control bus each one of a plurality of device locations on the circuit board card. The complex programmable logic device controls data access to and from each device that is coupled to the common control bus.

Abstract: A computer system employing redundant power distribution. A computer system includes power distribution boards arranged to distribute power such that the computer system may continue to operate if there is any single point of power failure. The computer system includes a first plurality of circuit boards, a plurality of switch circuit boards and a first and second power distribution board. The plurality of switch circuit boards may be coupled to the first plurality of circuit boards and may convey address and data information between the first plurality of circuit boards. The first power distribution board and the second power distribution board may be coupled to independently distribute power to each of the first plurality of circuit boards. At least two of the first plurality of circuit boards may be coupled to independently distribute power to each of the plurality of switch circuit boards.

Abstract: The device has a package with a base plate, and at least two terminal pins perpendicularly protruding from the base plate of the package. At least one of the terminal pins is a high-frequency terminal pin that transmits a high-frequency signal. The device has a flexible conductor arrangement with a plurality of interconnects. The conductor arrangement provides an electrical connection between the terminal pins of the package and electrical contacts of a printed circuit board. The conductor arrangement has contact regions for electrically connecting the interconnects to a terminal pin and to a contact of a printed circuit board. At least the region of the conductor arrangement that provides a connection to high-frequency terminal pin lies in a plane aligned substantially perpendicular to the plane of the base plate.

Abstract: A dummy module is inserted into an open slot in a modular rack to provide a cover for that slot. The dummy module is formed of the same housing as an operational module and contains a similar PCB as an operational module, without all the electrical and electronic components mounted thereon that an operational module would have. The PCB may have no components and no electrical tracks thereon, or it may be provided with some limited functionality. The PCB may have a memory device, such as an Electrically Erasable Programmable Read only Memory (EEPROM) mounted thereon, with at least an electrical track leading thereto from the connector block to enable a rack controller to interrogate the EEPROM. Thus, the rack controller would receive a positive identification from the EEPROM that the particular slot is empty, rather than simply trying to interrogate the slot and receiving no answer whatsoever.

Abstract: A security system for electronic circuits (e.g. electronic circuits contained within a secure POS terminal) is provided that is both more tamper resistant, and tamper responsive and less expensive than the prior art epoxy potting. This is achieved by inserting an electrical connector between a first and a second circuit board contained within a case of the POS terminal. The first and the second circuit boards are any type of circuit board known in the art, including both not limited to, rigid circuit boards, flexible circuit boards, printed circuit boards, etc. If the case is opened the connector no longer provides an electrical connection between the first and the second circuit boards, triggering a tamper detection circuit. In some embodiments of the invention, a flexible conductive film is wrapped around the circuit boards and the connector.

Abstract: The present invention is directed to a converter device. In a first aspect of the present invention, a converter device includes a board having a first side and a second side. The first side includes a first set of contacts suitable for electrically contacting an integrated circuit having a first configuration. The second side includes a second set of contacts suitable for electrically contacting a circuit board having a second configuration. The second set of contacts is communicatively coupled to the first set of contacts.

Abstract: A keyless entry system comprising a transmitter for transmitting binary pulse signals including a specific identification code by the operation of the user, a receiver for receiving said signals from the transmitter via an antenna, and a controlling section for supplying output signals for making the action intended by said user implemented when said identification code received by said receiver and the register code stored in the storage section are determined to be identified is provided. The ground of the receiving section and the ground of the controlling section are electrically connected.

Abstract: A computer housing includes a frame, a fixed plate mounted in a space confined by the frame and formed with a plurality of slots, and a board-mounting plate mounted slidably and detachably on the fixed plate and formed with a plurality of stamped tabs. The board-mounting plate is slidable to a locking position where each tab engages a periphery of a respective one of the slots.

Abstract: An interface controller mounted in a SCSI hole includes a circuit board and a panel. The circuit board is associated with a chip, an IDE interface male plug and control circuit. The panel is disposed at a lateral side of the circuit board and has a size adapted to the SCSI hole and being joined to an inner side of the SCSI hole. The panel is associated with an inserted recess so as to be fixed to a used casing of an independent CD-ROM drive or hard disk drive with SCSI socket for saving production cost.

Abstract: A housing has a housing portion with a main portion and a retainer extending from the main portion. The retainer may cooperate with a first printed circuit board element to hold the first printed circuit board element in spaced relation to the main portion and hold a second printed circuit board element in spaced relation to the first printed circuit board element. The housing may have first and second housing portions that cooperate to form an enclosure for supporting a printer circuit board. A support element extends from the first housing portion. The retainer cooperates with the first printed circuit board element to pull the first printed circuit board element toward the support element, which supports the first printed circuit board element in spaced relation to the first housing portion. The retainer also holds a second printed circuit board element in spaced relation to the first printed circuit board element. The housing may be used in a control module.

Abstract: A memory module preferably includes a printed circuit board (PCB) panel having multiple memory chip pad groups arranged on both sides thereof. Each memory chip pad group preferably includes multiple pads that correspond to lead lines of multiple memory chips arranged on the PCB panel. Connectors are preferably formed along an edge of the PCB panel to electrically connect the memory chip pad groups to an external device. Multiple damping chip pad groups preferably include built-in damping chips. One or more of the damping chip pad groups are preferably arranged adjacent to a lateral edge of one or more of the memory chips. The damping chip pad groups can electrically connect the connectors to the memory chip pad groups and dampen the signal noises.

Abstract: An electronic component assembly mounted on a circuit board (1) comprises an intermediate connector (2) mounted on the circuit board and having a first space (7) for accommodating first electronic components (8A, 8B, and 8C) provided on the circuit board and a unit body (11) provided on the intermediate connector and connected to the circuit board through the intermediate connector. The unit body comprises a connector member (12) having a second space (16) and a mounting member (13) having second electronic component (19A, 19B, and 19C) accommodated in the second space.

Abstract: A system carrier for freely programmable blocks that are connected to one another by buses, of a carrier body, at least three identically configured connectors disposed on the carrier body and being configured to receive in each case one module with a freely programmable block, the module being couplable to the connector and its position changable, and three groups of buses arranged to fixedly connect the connectors to one another.

Abstract: A computer module for use in a scalable computer system is provided. The computer module includes a chassis at least partially defining an interior and a processor board configured for insertion into a processor region of the interior of the chassis along an insertion axis. The processor board includes at least one connector for communicating signals to and from the processor board. The connector of the processor board is oriented along a connection axis that is substantially perpendicular to the insertion axis. The computer module also includes a memory board configured for insertion into a memory region of the interior of the chassis along the insertion axis. The memory board includes at least one connector for communicating signals to and from the memory board. The connector of the memory board is oriented along the connection axis.

Abstract: A method and apparatus are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.

Abstract: A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.

Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.

Abstract: A board to board array type connector comprising an array type connector, an upper supporting cover, a lower supporting cover, a screw with a bolt and a screw nut; during application, the upper supporting cover is on the top of the upper PCB, the upper pressing area/point presses down on the top of the upper PCB, the lower supporting cover is on the bottom of the lower PCB, the lower pressing area/point presses up on the bottom of the lower PCB; the screw with bolt passes through all the through holes and is fastened with the screw nut on the end to assemble the whole set, the stress is distributed equilibrium to the upper and lower pressing area/point, the pressure is evenly over all the connection pins of the array type connector for better electrical conductivity.

Abstract: An assembly for supporting a short printed circuit card includes a card slot separator disposed in a card bay of a computer system and at least one card support block. The at least one card support block couples to the card slot separator and can be selectively positioned along the card slot separator for reception of an unsupported edge of the short printed circuit card.

Abstract: A video-apparatus-tuner mounting board includes a television tuner mounted on the board; a predetermined circuit to be connected to pins connected to an internal circuit of the television tuner; through holes arranged in a line, into which pins are inserted; and conductor lands, formed around the through holes, to be connected to the pins. Of the conductor lands, first conductor lands connected to the pins of a specific television tuner to be mounted on the board are connected to the predetermined circuit and to second conductor lands, which are not connected to the pins of the specific television tuner.