Abstract: A wireless module with an external antenna and a connector with the wireless module are disclosed. The wireless module includes a printed circuit board, a plurality of conductive terminals, a wireless transmission chip, an antenna connector and an external antenna. The plurality of conductive terminals, the wireless transmission chip, and the antenna connector are electrically coupled to a printed circuit board, and the external antenna is coupled to the antenna connector through a connected circuit. The wireless module further includes a casing for covering the printed circuit board, the conductive terminals, the wireless transmission chip, and the antenna connector. A pivot hinge is installed at an end of the casing, and the external antenna is pivotally coupled to the pivot hinge of the casing, so that users can change the angle of the external antenna to adjust the intensity and range of receiving/transmitting signals of the wireless module freely.

Abstract: A mobile electronic apparatus includes a main body unit having a main board, a display unit disposed so as to rotate with respect to the main body unit for operating according to a control of the main board, a solar cell module disposed on a rear surface of the display unit for generating electric power by converting solar energy into electric power, and a converting circuit disposed inside the display unit for stabilizing electric power generated by the solar cell module so as to supply stable electric power.

Abstract: A power supply module adapted to supply power to a peripheral device includes a power supply and an output-structure detachably assembled to the power supply and electrically connected between the power supply and the peripheral device. The height of the output-structure relatively to the bottom portion of the power supply is adjustable and the power supply, output-structure and the peripheral device together form a concave combination-structure. As a result, by using a separated output-structure in the invention, the power supply is able to maneuverably adjust the interconnection position of the peripheral device and the power supply through the second circuit board. Meanwhile, the power supply has a larger usable space therein.

Abstract: A device, system and process for fabricating a three-dimensional electronic substrate are disclosed. A substrate may be molded in three-dimensions to fit the form factor of an exterior device frame. Electronics and conductors may be placed onto the three-dimensional surface of the molded substrate, thereby creating a three-dimensional electronic substrate. The three dimensional substrate may then be connected to an exterior frame to allow for electronic functionalities across frame form factors.

Abstract: A solar power generating system includes at least one solar panel and at least one junction box. The solar panel includes at least one photovoltaic cell group. The photovoltaic cell group includes plural serially-connected photovoltaic cells. The junction box includes a casing, a first power output terminal, a second power output terminal, and at least one localized maximum power point tracking unit. The casing has a receiving space. The localized maximum power point tracking unit is disposed within the receiving space of the casing. An input side of the localized maximum power point tracking unit is electrically connected with the at least one photovoltaic cell group of the solar panel. An output side of the localized maximum power point tracking unit is electrically connected with the first power output terminal and the second power output terminal.

Abstract: The present invention is directed to a printed circuit board assembly having a circuit board with opposing side edges and an open frame housing with parallel mounting frames extending along the side edges of the circuit board. Each mounting frame has a body portion having a support shelf and an overhang ledge forming a channel, the channel nesting an associated side edge of the circuit board. A mounting peg is supported to extend transversely to the entry of the channel, and temporary deforming of the ledge permits entry of the associated side edge into the channel, the circuit board having a complementary peg retention hole appropriately sized to receive the mounting peg.

Abstract: A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face.

Abstract: A compact communications radio core engine (CE) module includes a modem circuit board having a first connector, and a radio frequency (RF) circuit board having a second connector configured to mate with the first connector of the modem circuit card. A module shell is constructed and arranged to contain the modem and the RF circuit boards in such an orientation so that the second connector of the RF circuit board can operatively engage the first connector of the modem circuit card.

Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.

Abstract: A printed circuit board 1 is provided, which includes: soldering lands for connecting respective leads of a dual inline lead-type electronic part 2 by jet-type soldering; and a solder-drawing land 4 for absorbing excessive solder during soldering, which is arranged at a position behind the rearmost soldering lands 3h in the traveling direction of jet-type soldering. The solder-drawing land has a square outer shape and includes a slit 4a in a bent shape therein. One corner of the square is located near the rearmost soldering lands 3h and arranged between the leads, while a bent portion of the slit is arranged near the one corner.

Abstract: A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element is configured to provide an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

Abstract: In a housing case for housing an electronic circuit board, comprising a case body, a cover, a pedestal formed on the case body to support the board, a holder formed on the cover at a location to face the pedestal to hold the board from opposite side of the pedestal, a recess formed at the case body near the pedestal, and a convex formed on the cover at a position corresponding to the recess, it is configured such that the convex is inserted in and adhered to the recess to attach the cover to the case body. With this, it becomes possible to change the amount of adhesive member in accordance with the environment, etc., with the simple structure.

Abstract: An electronic apparatus includes a case, a cover member that includes a first layer, and a second layer made of a material different from that of the first layer, and an electronic component accommodated between the case and the cover member, wherein the second layer includes a first adhesion area that is adhered to the first layer, and a second adhesion area that is located closer to a center than the first adhesion area, adhered to the first layer, and recessed closer to the case than the first adhesion area, a step being formed between the first adhesion area and the second adhesion area.

Abstract: According to one embodiment, a flexible wiring module includes a flexible wiring board including a plurality of electrical wirings, a through slit configured to divide the wiring board into a plurality of fins, and a bundling region configured to bundle the plurality of wiring fins. The through slit divides a wiring region of the wiring board into a plurality of wiring fins including a first wiring fin and a second wiring fin having electrical wiring width larger than that of the first wiring fin. The bundling region bundles a laminated portion having at least a portion of the wiring fins laminated in a thickness direction and bundles the fins to cause the second wiring fin to be arranged on at least one of the upper and lower layers of the first wiring fin.

Abstract: A hardware protection system is integrated into a circuit carrier. As a result, a sensor system, which is integrated into the circuit carrier in the form of printed circuit boards, which can be produced by means of the traditional high-tech printed circuit board technology and can be equipped with and processed on traditional insertion lines of electronic module installations, is obtained.

Abstract: The invention relates to a 3D electronic module comprising a stack (100) of at least a first slice (10) and a second slice (30), the first slice (10) having on a face (101) at least one set (4) of electrically conductive protrusions (41), and the second slice (30) comprising at least one zone (61) of electrically insulating material, traversing the thickness of the slice. The second slice (30) comprises at least one electrically conductive element (3) traversing said slice in a zone (61) of electrically insulating material, able to receive a set (4) of protrusions (41) of the first slice (10).

Abstract: A wiring board is provided to protect an electronic device from static electricity and lightning surge without reducing packaging density. A wiring board is provided with a first wiring pattern (3) including mounting pads (8, 10), on which an electronic device (5) is mounted, a second wiring pattern (21) having lower impedance than the first wiring pattern (3), ICT wirings (13, 15) extending from the mounting pads (8, 10) of the first wiring pattern (3), and ICT pads (17, 19) formed at distal ends of the ICT wirings (13, 15). The ICT wirings (13, 15) extend towards the second wiring pattern (21) so that the ICT pads (13, 15) are in the vicinity of the second wiring pattern (21), and discharge gaps (G) are formed between the ICT pads (13, 15) and the second wiring pattern (21).

Abstract: An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.

Abstract: An electronic module (100) for mating with a complementary connector, comprises: a housing, a printed circuit board (3) disposed in the housing, a slider member (6) movably received in the channel, a cover member (9) confining the slider member to the housing, a gasket (5) mounted to the housing and having a pair of engaging portions (54), and an ejector (7) located above on the slider member. The slider member has a body portion (611) and a pair of arm portions (612) extending forwardly from the body portion. The ejector is located above the pair of arm portions, and has a pair of cantilever portions pivotable outward, in response to a sliding movement of the slider member, against the pair of engaging portions.

Abstract: Provided is a power module capable of welding a snubber capacitor without causing melting damage to a resin housing by welding heat. When leads of a snubber capacitor are respectively welded to upper surfaces of the specific portions of a P-pole bus bar and an N-pole bus bar, the welding heat generated at the specific portions of the P-pole bus bar and the N-pole bus bar is respectively radiated from openings, through which the lower surfaces of the specific portions of the P-pole bus bar and the N-pole bus bar are exposed. As a result, the snubber capacitor can be later appended by welding without causing melting damage to the resin housing due to the welding heat. During welding, a separate cooling head is inserted into the openings to forcibly cool the lower surfaces of the specific portions of the P-pole bus bar and the N-pole bus bar respectively, so that the melting damage to a resin housing can be more reliably avoided.

Abstract: An electronic device having an integral feeling between a display and an operating member is provided. A mobile phone 1 includes a reinforcing frame 31 arranged between a first case 2 and a sub-display device 29 and having a frame opening 31h formed at a position facing a display surface 29a of the sub-display device 29; a trim plate 35 arranged on a surface facing the case opening 2h of the reinforcing frame 31 to cover the frame opening 31h and positioned in the case opening 2h; a sensor board 39 arranged on the surface facing the case opening 2h of the reinforcing frame 31 and having a board opening 39h in which the trim plate 35 is inserted; a dome switch 45 arranged on a mounting surface 39a facing the case opening 2h of a sensor board 39; and a ring key 7 arranged between the case opening 2h and the trim plate 35 to be able to depress the dome switch 45.

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.

Abstract: A housing comprising at least one electrical connection through a housing wall that is particularly inexpensive to produce and allows the electronic components located on the internal face and the external face of the housing to be attached in a particularly variable manner. The electrical connection is directly surrounded by housing material while being additionally sealed by means of sealing material. The inventive housing seal is provided with a profiled seal encompassing at least two sealing lips. The sealing material is additionally used for sealing the cover and/or the bottom relative to the housing wall. The arrangement is also particularly well protected against oil and other aggressive media as a combination of housing material and sealing material is used for surrounding the electrical connection.

Abstract: A memory module includes an electronic printed circuit board with at least one contact strip, a plurality of integrated memory components, at least one first and one second buffer component, and a number of conductor tracks, which proceed from the contact strip and which are arranged on or in the printed circuit board. The conductor tracks include data lines, control lines and address lines. The conductor tracks lead from the contact strip to the buffer components or to one of the buffer components. The printed circuit board has conductor tracks that are interposed between the first buffer component and the second buffer component and that lead from the first buffer component to the second buffer component.

Abstract: A stack structure of a circuit board includes a first substrate, a second substrate and a fixing element. The first substrate has a first component area, a plurality of supporting solder elements, and a plurality of signal solder elements, wherein the plurality of signal elements is disposed in the first component area. The first substrate stacks on the second substrate. The plurality of supporting solder elements is disposed between the first and the second substrates for providing a supporting force. The fixing element secures the first substrate and the second substrate, and the supporting solder elements are disposed around the fixing element.

Abstract: An electronic module for use as a subsea electronic module (SEM) for an underwater fluid extraction well, as provided. An example of such an SEM includes a plurality of substantially planar electronics cards to operate devices in the SEM. The cards are arranged in a stack such that major faces of each card are oriented substantially parallel to, and coaxial with, major faces of the other cards in the stack. The SEM also includes a substantially planar switch card orientated relative to the stack such that its major faces are oriented substantially parallel to a main axis of the stack and orthogonal to the orientation of the major faces of the electronics cards within the stack. The switch card includes a first Ethernet switch blade configured to control traffic on a LAN area network and a second Ethernet switch blade configured to control traffic on a second LAN.

Abstract: A circuit module is provided that is configured to allow a shield member to be securely mounted to a board. The circuit module includes a board with a mounting surface on which an electronic component is mounted and a shield member that is mounted to the board. The shield member includes a shield frame having a frame portion that is solder-joined to the mounting surface and a shield cover having a top surface portion and a side portion that is attached to the frame portion of the shield frame. Furthermore, an L-shaped slit is formed at a predetermined corner among four corners of the top surface portion of the shield cover so as to extend along two sides forming the predetermined corner.

Abstract: The purpose of the present invention is providing an electronic apparatus cover easily detached in the electronic apparatus cover that protects a connector installed in a recess portion of the electronic apparatus. The present invention is an electronic apparatus cover that covers a first connector for electrically connecting to a portable apparatus of an electronic apparatus that includes a recess portion to which the portable apparatus can be attached and a first engagement portion that engages the portable apparatus, including: a third engagement portion that engages with the first engagement portion.

Abstract: Power may be supplied to an electronic module according to various techniques. In one general implementation, for example, a system for supping power to an electronic module may include a printed circuit board, the electronic module, and a conductive foil. The board may include a number of contact locations on a first side, with at least one of the contact locations electrically coupled to a via to a second side of the board. The electronic module may be electrically coupled to the contact locations on the first side of the board and receive electrical power through the at least one contact location electrically coupled to a via. The foil may be adapted to convey electrical power for the electronic module and electrically coupled on the second side of circuit board to at least the via electrically coupled to a contact location that receives electrical power for the electronic module.

Abstract: A memory card includes a substrate, at least one semiconductor chip attached to the substrate, a writing permitting/prohibiting setting element attached to the substrate, and a molding member formed on the substrate to cover the semiconductor chip.

Abstract: The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 ?m or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A display apparatus including a display module and a protection structure is provided. The display module has an image display region and a trace disposing region surrounding the image display region. The protection structure is disposed on the display module and includes a cover, a first electrode layer, a substrate, a second electrode layer and a display medium layer. The first electrode layer is disposed on the cover and the location of the first electrode layer at least shields the trace disposing region. The substrate is disposed between the cover and the display module. The second electrode layer is disposed on the substrate corresponding to the first electrode layer. The location of the second electrode layer at least shields the trace disposing region. The display medium layer is disposed between the first electrode layer and the second electrode layer, wherein the display medium layer substantially surrounds the image display region.

Abstract: The frame assembly mainly contains a number of linear edge members and a number of L-shaped corner members end-to-end joining the edge members by a number of connection pieces into a rectangular frame surrounding a touch panel. Both the edge and corner members have a C-shaped cross section with a space inside for holding circuit boards of the touch panel. The circuit boards of the corner and edge members are aligned so that their connectivity by matching connectors is easily established when putting the frame assembly together.

Abstract: The present invention relates to a terminal structure. The terminal structure includes: a terminal having: a conductor layer containing at least one metal selected from gold, silver, and copper; a first layer containing nickel and phosphorus, laid on the conductor layer; a second layer having a smaller atomic ratio of nickel to phosphorus than the first layer and containing Ni3P, laid on the first layer; a third layer containing a first intermetallic compound of an Ni—P—Sn type, laid on the second layer; and a fourth layer containing a second intermetallic compound of an Ni—Cu—Sn type, laid on the third layer; and a solder layer on the fourth layer of the terminal. Ra2 is larger than Ra1, where Ra1 is a surface roughness of the third layer on the second layer side and Ra2 is a surface roughness of the third layer on the fourth layer side.

Abstract: Two panel-sized fully populated printed wiring board assemblies formed together, with an anisotropic epoxy that provides electrical connection for RF signals and DC supplies without the need for wirebonds, mechanical interconnects or solder balls.

Abstract: An apparatus for coupling an integrated circuit (IC) package to a printed circuit board. The apparatus includes an interposer an interposer having a plurality of connections suitable for surface mounting on corresponding pads of a printed circuit board (PCB). The plurality of connections is arranged in a grid array. The interposer further includes a plurality of plated through holes. The apparatus further includes a substrate having a plurality of pins. The substrate is coupled to the interposer by inserting each of the plurality of pins into a corresponding one of the plurality of plated through holes of the interposer. An IC package including an IC is mounted on the substrate.

Abstract: A computer includes an expansion card, a mother board and a connector. The mother board includes an expansion slot thereon. The expansion slot corresponds to the expansion card. The connector connects the expansion card and the expansion slot.

Abstract: A potted electrical circuit is enclosed within a housing and has a first and second fiberglass layer that is laid upon a top surface of the potted electrical circuit. A lid of the housing seals the electrical circuit there within and an opening formed in a side wall allows circuitry wiring to extend there from out. The first fiberglass layer is a woven layer while the second fiberglass layer is a padding-like layer. Circuitry wiring pushes through the woven first fiberglass layer before extending out through the opening in the housing. The first fiberglass layer is tucked in and around the electrical circuit and adheres to the inside of the housing by attaching to the potting material while it hardens. In a preferred embodiment, the electrical circuit in combination with the insulation material is used within a transient voltage surge suppression device.

Abstract: A potted electrical circuit is enclosed within a housing and has a first and second fiberglass layer that is laid upon a top surface of the potted electrical circuit. A lid of the housing seals the electrical circuit there within and an opening formed in a side wall allows circuitry wiring to extend there from out. The first fiberglass layer is a woven layer while the second fiberglass layer is a padding-like layer. Circuitry wiring pushes through the woven first fiberglass layer before extending out through the opening in the housing. The first fiberglass layer is tucked in and around the electrical circuit and adheres to the inside of the housing by attaching to the potting material while it hardens. In a preferred embodiment, the electrical circuit in combination with the insulation material is used within a transient voltage surge suppression device.

Abstract: An expansion card fastening mechanism includes a baseboard, a card edge connector and a support bracket. The card edge connector is disposed on the baseboard to be inserted by an edge of an expansion card substantially in parallel with the baseboard. The support bracket includes a bottom wall, two lateral walls and two fastening members. The bottom wall is in contact with the baseboard. Two lateral walls extends upright from the bottom wall. Two fastening members are respectively disposed on a top edge of each lateral wall, wherein the bottom wall is selectively located at one of multiple positions on the baseboard such that an opposite edge of the expansion card is secured by the two fastening members.

Abstract: Data processing modules including a housing and connectors carried by the housing, and systems including the same.

Abstract: Disclosed herein is a module, including: a circuit board; electronic components mounted on the circuit board; a mold resin that insulates and seals the electronic components; a shield conducting film that covers the outside of the mold resin; and shield conducting walls which are so formed in the mold resin as to divide the mold resin into a plurality of regions.

Abstract: Disclosed are an electronic component module and a method of manufacturing the same. The electronic component module includes a first insulating layer having a first surface in which first circuit patterns are embedded, electronic components of different kinds, the electronic components being mounted on the first circuit patterns and having electrode parts placed in different locations, and a molding layer encompassing the electronic components. Accordingly, a thin-film type electronic component module having a thin insulating layer with a circuit pattern can be provided.

Abstract: Conductive or solder bumps are stacked between a mounted component such as a BGA device and a printed wiring substrate in a multileveled printed circuit board unit. An interposer or relay substrate is interposed between the adjacent stacked conductive bumps. The interposer substrate is made of a porous material. When any difference in the expansion is caused between the printed wiring substrate and the mounted component, one side of the interposer substrate receives a relatively smaller displacement force while the other side of the interposer substrate receives a relatively larger displacement force. A shearing stress is induced in the interposer substrate. Deformation of the porous material serves to absorb the shearing stress in the interposer substrate. The conductive bumps bonded on one side of the interposer substrate as well as the conductive bumps bonded on the other side of the interposer substrate may be relieved from a shearing stress.

Abstract: A method and apparatus are provided for the interconnection of multiple circuit boards within a device. A module is provided which comprises multiple circuit boards interconnected with a plurality of connectors. Modules may be interconnected to other modules using the same connectors. Circuit components are disposed on inner surfaces of the circuit boards of the module. Multiple circuit boards and modules are interconnected by contacts that do not require soldering, that permit the circuit boards and modules to be removably coupled to each other by the contacts, and that permit circuit boards to be positioned by a spaced amount that results in a small spacing between circuit boards. Enclosures are also provided, which allow modules to be configured and secured in both a horizontal and vertical direction. Thus, modules may be interconnected to other modules on each side, as well as interconnected to other modules stacked above or below the module.

Abstract: In a circuit module, a conductive partition is defined by a plurality of conductive chips provided on a component mounting surface. The component mounting surface is divided into a first block and a second block by the conductive partition. The shape of the conductive partition can be freely changed in accordance with the size of a circuit board and the arrangement of electronic components in the first block and the second block by changing the positions of the conductive chips and the number of conductive chips. Electromagnetic interference between the first block and the second block is prevented by the conductive partition.

Abstract: A stacked semiconductor package includes a first semiconductor package having a first semiconductor chip having a first pad and a through-hole passing through a the portion corresponding to the pad; a second semiconductor package disposed over the first semiconductor package, and including a second semiconductor chip having a second pad disposed at a portion corresponding to the first pad and blocking the through-hole; and a through-electrode disposed within the through-hole, and having a pillar shaped core supported by the second pad, a through-electrode unit disposed over a surface of the core and electrically connected with the second pad, a first metal layer interposed between the core and the through electrode unit, and a second metal layer interposed between an inner surface of the first semiconductor chip formed by the through-hole and the through-electrode unit.

Abstract: An electronic module (100) includes a housing having an outer surface and a metallic gasket (5) attached to the housing and substantially covering the outer surface. The gasket (5) includes an outer configuration with a plurality of elastic detents (52) and a unitary inner configuration with a seamless sheet (51).

Abstract: A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also are of sufficient size so that they extend beyond the bottom or top surface of the IC device, including the wiring interconnect and encapsulate material, as the conductive elements make contact with the FBGA positioned below or above to form a stack. The IC device, such as a memory chip, is mounted upon a first surface of a printed circuit board substrate forming part of the FBGA. Lead wires are used to attach the IC device to the printed board substrate and encapsulant is used to contain the IC device and wires within and below the matrix and profile of the conductive elements.