Abstract: A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.

Abstract: A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations differed by 90 degrees from each other. A plurality of wirings connect the semiconductor devices included in one of the two rows to the semiconductor devices included in the other row such that the semiconductor devices arranged in the same orientations are connected to each other.

Abstract: A electronic device (100) includes a removable chip card (40) for carrying information, comprise a housing (10) and a ejecting mechanism (30). The housing (10) defines a chamber (12) and a base (14) formed adjacent to the chamber. The chamber (12) is used for accommodating a battery (20) therein. The base (14) is used for receiving the chip card (40) therewith. The ejecting mechanism (30) is mounted in the housing (10) and includes a sliding member (32) and an elastic member (36). When the battery (20) is accommodated in the chamber (12), the chip card (40) is secured between the sliding member (32) and the battery (20). When the battery (20) is removed from the chamber (12), the elastic member (36) biases the sliding member (32) to eject the chip card (40) outwardly from the base (14).

Abstract: A method and apparatus for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.

Abstract: An electronic expansion module which has at least one circuit board, that has a contact region with contacts for mechanical and electrical contact-making with mating contacts connected to the circuit board of the expansion module and a circuit board recess formed such that, with the expansion module inserted into an opening formed on a side of the housing of an electrical field device for use in industrial control, the circuit board of the expansion module does not have any conductive connection to the electrical field device except in the contact region so that reliable electrical isolation between the interior of the device and the user is ensured.

Abstract: A drive circuit for driving a semiconductor light emitting element includes a board, a first pattern formed in a first layer of the board so as to be electrically connected to an anode of the semiconductor light emitting element, and a second pattern formed in a second layer of the board so as to be electrically connected to a cathode of the semiconductor light emitting element, and the first pattern and the second pattern are formed so as to overlap with each other when viewed in a direction along a normal line of the board.

Abstract: A circuit arrangement is provided that includes at least one semiconductor component, at least one filter arrangement, which has at least two discretely made coil elements, which are disposed adjacent to one another with parallel aligned magnetic field axes, and a contacting unit, which has electrical traces for an electrically conductive connection of the semiconductor component to the filter arrangement. A thickness of the semiconductor component is at least 20% of a thickness of the coil elements.

Abstract: A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract: A control device has a base plate, a cover plate coupled to the base plate, a cavity formed between the base plate and the cover plate, a circuit carrier disposed in the cavity, and a conducting track carrier electrically coupled to the circuit carrier. The base plate has a continuous recess that is configured and arranged for feeding a casting compound into the cavity between the base plate and the cover plate. The casting compound is embodied to at least partly enclose the circuit carrier and/or the conducting track carrier in a vibration-damping manner.

Abstract: The present invention is provided a structure for mounting a printed board in which each connector that is attached to each of a plurality of sub printed boards, which are juxtaposed to one another with respect to a main printed board secured to a metal backboard, is inserted into each of a plurality of connectors that are juxtaposed to one another on the main printed board so that the sub printed boards are mounted on the main printed board by the connector connections. Parts of both ends of an area in proximity to a semiconductor-device mounted area on each of the sub printed boards ate pinched between a first metal frame and a second metal frame so that each of the sub printed boards are secured.

Abstract: An object is to provide an inverter module that can ensure satisfactory anti-vibration strength, moisture resistance, and isolation for each of the upper and lower boards of the inverter module and that can reduce the weight and cost, and to provide an integrated-inverter electric compressor. In an inverter module (21) in which a power system board (23) and a control board (31) are integrated via a resin case (22), the inverter module (21) is configured such that the power system board (23), on which a semiconductor switching device (24) is mounted, is provided at the lower part of the resin case (22) and the control board (31), on which a control-and-communication circuit is mounted, is provided thereabove.

Abstract: A flexible, modular mounting system for an industrial process terminal or similar instrumentation. The instrumentation may be panel mounted or DIN rail mounted using an enclosure having only a minimum number of unique components. An instrument housing is included for containing various electronic components of such a terminal. The housing is adapted to mate with a DIN rail, and can easily be fitted with mounting brackets that allow the housing to be used in a panel mounted arrangement. In the latter case, a user interface module is located on an opposite side of a panel wall and connected to the appropriate electronic components of the instrumentation through an opening provided therein.

Abstract: A connection apparatus of a battery cell module having a battery cell cover with connecting plates formed at opposing ends thereof, a main frame having guide channels that receive the cell cover, and a top cover to secured the cell cover to the main frame, the connection apparatus having holes at opposing sides of a bottom of the main frame, connecting units configured for insertion into the holes and for contacting the connecting plates, and a conductive bridge electrically connecting the connecting units is disclosed.

Abstract: A housing structure of an acoustic controller, in which a lower case of the controller has an increased rigidity and improved moldability. The lower case is integrally formed by a resin and has a bottom surface thereof disposed to face a tabletop surface when the controller is in a stationarily placed thereon. The bottom surface of the lower case is formed to have a concave-forming portion that defines a concave space communicating with the outside of the controller on the left and right sides thereof and which is upward convex as viewed when the controller is stationarily placed, thus increasing the rigidity of the lower case. Bosses and vertical ribs formed to project upward from a horizontal part of the concave-forming portion of the lower case each have a reduced height, thereby improving the moldability of the lower case.

Abstract: A composite module is obtained which enables high-density mounting of components without increasing its size. A composite module includes a main substrate which is a multilayer circuit board, a sub-substrate mounted on a lower surface of the main substrate, a sealing layer arranged on the lower surface of the main substrate to cover the sub-substrate, the sealing layer defining a mount surface arranged to be mounted on a mount board, and terminal electrodes disposed on the mount surface. The terminal electrodes include at least one first terminal electrode drawn directly from the main substrate and at least one second terminal electrode drawn directly from the sub-substrate.

Abstract: A power supply cell for distributing power supplied from a first voltage supply to an integrated circuit is disclosed.

Abstract: A dynamic radon access memory (DRAM) module includes a printed circuit board, a number of DRAM units, a number of flash memory units, a number connecting pins and an interface controller. The DRAM units and the flash memory units are distributed on the printed circuit board. The connecting pins are formed at an edge of the printed circuit board. The interface controller is electrically connected to the flash memory units and a portion of the connecting pins, wherein each of the interface controller provides at least one serial interface between the flash memory units and the portion of connecting pins thereby enabling data transmission through the portion of connecting pins in at least one serial mode. The flash memory units integrally constitute a flash disk drive in the DRAM module. Therefore, frequently installation and uninstallation of the flash memory drive can be avoided. A motherboard assembly including the aforementioned DRAM module can be developed.

Abstract: According to one embodiment, an electronic device includes a device housing, a circuit board, a module, and a projection. The electronic device includes a base in which a containing portion is provided. The circuit board is housed in the device housing. The module is housed in the containing portion of the device housing and electrically connected to the circuit board. The projection is provided with a supporting part and an opening portion. The supporting part projects from the module and is supported by the base. The opening is positioned between the supporting part and the module.

Abstract: The disclosed electronic inlay and the method of making such an electronic inlay includes a circuit board, a plurality of circuit components attached to the circuit board, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The electronic inlay can be used to manufacture electronic cards while using conventional equipment to apply top and bottom overlays to the electronic inlay.

Abstract: An electrode connection structure including a first circuit component including a resin plate, a barrier film stacked on a surface of the resin plate, a circuit section formed on the barrier film and a first electrode provided on the surface of the resin plate on which the barrier film is stacked, and a second circuit component arranged to face the first circuit component and having a second electrode facing the first electrode, wherein the first and second electrodes are electrically connected via pressure applied thereto in the directions approaching each other and a portion of the barrier film surrounding the first electrode is at least partially removed from the surface of the resin plate.

Abstract: A zone controller having an electronic board with a plurality of electronic components attached thereto. The electronic components are constructed and arranged to receive a plurality of signals from a plurality of thermostats and to transmit a plurality of signals to a plurality of air control devices for controlling airflow in ducts. The electronic components include a first grouping of electronic components that are not accessed to perform either installation or operation functions, a second grouping of electronic components that are accessed to perform installation functions, and a third grouping of electronic components that are only accessed to perform operation functions. A first cover is provided that covers and prevents access to the first grouping of electronic components. A second cover is provided that selectively covers and prevents access to the second grouping of electrical components but not the third grouping of electrical components.

Abstract: A coax-balun module for converting from a balanced signal to an unbalanced signal includes a housing having a balun well adapted to receive a balun transformer. The module includes a printed circuit board electrically connected to a balun transformer and a threaded connector. The printed circuit board is further electrically connected to electrical conductors adapted to carry input signals. The housing is adapted to receive a potting material to seal the other components therein.

Abstract: The disclosure involves the efficient termination of a winding PCB of a planar inductive component to a main PCB, using relatively little space and providing a low-resistance connection. The disclosed methods are especially suitable for planar structures where several winding PCBs, and/or winding PCBs and a main PCB, are all enclosed by the magnetic path components. The methods allow for a winding PCB to simply rest on the main PCB, or other winding PCBs, without any clearance. The disclosure employs mating sets of conductive annular rings with an optional interlocking terminal pin that allows two PCBs to be fixedly coupled together, while preserving a minimum distance between the solder-mask layers of the two PCBs in order to prevent the formation of unwanted electrical connections between the two PCBs. Solder is used to ensure effective coupling in each assembly of mating annular rings and optional terminal pin.

Abstract: A case of server includes a chassis, a first top cover, a second top cover, at least a first tray, at least a second tray, an input/output interface circuit board, a mother board, and a third top cover. The first and the second top covers are fixed at two sides of the chassis, where an opening is formed therebetween. The first and the second trays are slidingly disposed at the chassis. The first and the second trays are correspondingly under the second top cover and the first top cover respectively. The input/output circuit boards are disposed on the first trays and the mother boards are disposed on the second trays. The third top cover is located between the first and the second top covers for covering the opening. When the third top cover is detached from the chassis, the electronic components disposed therein can be taken out from the opening.

Abstract: An attachable wireless charging device includes a carrier board, a receiving coil, a circuit board, and at least two conductive wires. The carrier board has a back surface on which an adhesive layer is coated. The receiving coil is formed in the carrier board. The circuit board is mounted to one side of the carrier board and includes a power receiving circuit, which includes a receiving control circuit, a resonance control circuit, a regulation circuit, a control circuit, a polarity selection circuit, and a circuit output section, which are electrically and sequentially connected. Electrical connection is established between the receiving control circuit and the receiving coil. The at least two conductive wires are arranged at one side of the circuit board and are electrically connectable with the circuit output section of the circuit board. As such, an attachable wireless charging device featuring automatic determination of polarity connection is provided.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin.

Abstract: There is disclosed a semiconductor device comprising at least one semiconductor element, one chip mounting base being provided at least one first interconnection on one major surface thereof and at least one second interconnection on the other major surface thereof, and the semiconductor element being electrically connected to at least the one first interconnection and mounted on the one major surface, a sealing member being provided on the one major surface of the chip mounting base and covering the semiconductor element and the first interconnection, at least one third interconnection being provided on a surface of the sealing member, and at least one fourth interconnection being provided in the sealing member and the chip mounting base, and electrically connected to the first interconnection, the second interconnection, and the third interconnection.

Abstract: An integrated audio transducer with associated signal processing electronics is disclosed. A silicon audio transducer, such as a MEMS microphone or speaker, can be integrated with audio processing electronics in a single package. The audio processing electronics can be configured using control signals. The audio processing electronics can provide a single line serial data interface and a single line control interface. The audio transducers can be integrated with associated processing electronics. A silicon microphone can be integrated with an Analog to Digital Converter (ADC). The ADC output can be a single line serial interface. The ADC can be configured using a single line serial control interface. A speaker may be integrated with a Digital to Analog Converter (DAC). Audio transducers can also be integrated with more complex processing electronics. Audio processing parameters such as gain, dynamic range, and filter characteristics may be configured using the serial interface.

Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.

Abstract: High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.

Abstract: According to one embodiment, a module connection structure designed to connect a module to other modules. The module includes a dielectric layer, a micro-strip path, a projection, and a plurality of gain adjusting lands. The dielectric layer is formed on a substrate. The micro-strip path is provided on the dielectric layer and configured to transmit a transmission signal input to one end portion, to the other end portion. The projection is formed at edges of the substrate, which are adjacent to the other modules, and protruding from the micro-strip path and the dielectric layer toward the other modules. The plurality of gain adjusting lands is formed adjacent to the micro-strip path, for use in adjusting an input/output gain of the module. The gain adjusting lands uncouple from the micro-strip path or other gain adjusting lands couple to the micro-strip path, thereby to adjust the input/output gain of the module.

Abstract: Provided herein is a composite layer including an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The composite layer includes a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the composite layer provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.

Abstract: A power conversion apparatus comprising a base 110 which includes a first fixation portion 110a and a second fixation portion 110b that are coupled to each other at a desired angle, wherein power modules IPM1, IPM2 and IPM3 are fixed on the first fixation portion 110a of the base 110, a control circuit board 10 is fixed with its first principal surface 10a held in direct or indirect touch with the second fixation portion 110b of the base 110, and components constituting a control circuit are packaged on the second principal surface 10b of the control circuit board 10. Owing to the configuration, a versatility for the installation of the power conversion apparatus on a vehicle becomes high, the vibration-proofness of the control circuit board is enhanced, and heats generated by the electronic components, etc. packaged on the control circuit board are sufficiently emitted.

Abstract: A peripheral card includes a circuit board, various circuit elements on the circuit board, a set of user terminals, a set of test terminals, and an enclosure that covers a portion of the circuit board and the circuit elements. The enclosure does not cover the user terminals and test terminals. After the peripheral card is tested, the test terminals are covered with a conformal contact coating in order to prevent access to the test terminals.

Abstract: A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

Abstract: A V1 semiconductor module has a coil terminal, which is directly connectable to a lead wire of a coil. As a result, the number of parts required to connect electronic parts is reduced. Further, since no printed circuit board is required, the coil terminal can be shaped in any size without being limited in correspondence to the thickness of a copper film of the substrate. The coil terminal and control terminals, which are connected to the printed circuit board having a control circuit for controlling current supply to the coil, are provided on different wall surfaces of a resin part. Thus, the coil and the printed circuit board can be readily connected to the coil terminal and the control terminals, respectively, resulting in simplification of the device.

Abstract: A sliding module for an electronic device, the module comprising first and second parts slideably connected together, the first and second parts comprising respective circuit connectors for connection with corresponding respective circuit boards, and wherein the module comprises one or more conductors arranged to provide electrical connection between the respective circuit connectors to thereby provide electrical connection paths between respective circuit boards connected at the circuit connectors.

Abstract: According to at least one embodiment, a cell board interconnection architecture comprises an interconnection structure for interconnecting a plurality of cell boards, the interconnection structure configured to allow air to pass therethrough in a direction in which the cell boards couple therewith.

Abstract: A flexible display screen includes a plurality of flexible display modules joined side by side, each flexible display module having a flexible circuit board, which is fixedly arranged with a plurality of display chips on its front face, and a plurality of magnets on its back face, so that the flexible display screen can be attracted on a metal medium by the magnets, wherein the magnets are distributed at least on the perimeter of the back face of the flexible circuit board so that the joining sides of two adjoining flexible circuit boards are arranged respectively and symmetrically with a same number of magnets, and each pair of magnets disposed on the respective joining sides having opposite polarity orientations.

Abstract: A server enclosure includes a chassis having a sidewall, a securing bracket secured to the chassis, a receiving member attached to the securing bracket, and a switch module for powering the server on/off. The securing bracket includes a first sidewall and a second sidewall perpendicularly extending therefrom. The receiving member is secured to the second sidewall of the securing bracket and includes a first sidewall abutting the first sidewall of the securing bracket. The switch module includes a printed circuit board. The switch module is received in the receiving member with the printed circuit board parallel to the first sidewall thereof. The second sidewall of the securing bracket abuts on the receiving member to enclose the switch module therein.

Abstract: A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the semiconductor element, wherein at least a part of a top face of a recess side wall is covered by a resin, thereby providing a light emitting device.

Abstract: A card insulator is formed with slits that conform to height changes required by the components mounted to a card. The insulative sheet has simple linear slits that extend completely through the sheet and allow the insulator to deform with simple linear bends when contacted by the tall components mounted to the card. The linear bends allow the surface of the deformed insulator to be flexible without buckling the insulator and without bowing the card.

Abstract: A display panel structure includes a circuit board, and a display unit substrate connected to the circuit board and having a display unit. The display panel structure further includes a supporting member comprised of a first supporting section that is fitted to the circuit board, a second supporting section that is fitted to the display unit substrate, and a spacer section to secure a specified space between the circuit board and the display unit substrate. With the supporting member, the display unit substrate is supported in a state inclined relative to the circuit board.

Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.

Abstract: Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate.

Abstract: This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (1). At least one recess (2) is made in the sheet (1) and extends through the insulating-material layer (1) as far as the conductive layer on the opposite surface (1a). A component (6) is set in the recess, with its contact surface towards the conductive layer and the component (6) is attached to the conductive layer. After this, a conductive pattern (14) is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component (6) set in the recess.

Abstract: The electronic module (BG) incorporates a specified separation edge (SAK, SAK1, SAK2, SAK3) for the mechanical, irreversible separation of a separable part (AT, AT1, AT2, AT3) of the module (BG) from the remainder of the module (BGR), both the separable part (AT, AT1, AT2, AT3) and the module remainder (BGR) incorporating essentially interacting circuit components (ST1, ST2) for an intended electrotechnical operation of the module (BG). By separating the separable part (AT, AT1, AT2, AT3) the electrotechnical operation of the module (BG) can be permanently deactivated.

Abstract: According to one embodiment, a fastening device comprises an object having a through hole, and a fastener which fixes the object to a support by being screwed into a screw hole. The fastener includes a gripper and a stopper. The gripper is capable of protruding outside of the object from the through hole and getting into the through hole, and has an end surface on a side opposite to a male screw portion. The stopper is positioned between the male screw portion and the gripper. In a state in which the male screw portion is screwed into the screw hole, the end surface is positioned inside the through hole. In a state in which the male screw portion is removed from the screw hole, the gripper protrudes outside of the object from the through hole, and the stopper is caught in the object and holds the fastener to the object.

Abstract: Provided are a power system module allowing a user's requirements to be easily met, and having economic practicality and high integration, and a manufacturing method thereof. The power system module includes a plastic case, a molding type power module package, a control circuit board, and at least one external terminal. The plastic case defines a bottom and a side wall. The molding type power module package is fixed to the bottom of the plastic case and includes at least a power device therein. The control circuit board is fixed to the side wall of the plastic case, includes at least a control device mounted thereon which is electrically connected to the power module package. The external terminal protrudes to outside the plastic case and is electrically connected to the control circuit board.