Abstract: In a GaN-based laser device having a GaN-based semiconductor stacked-layered structure including a light emitting layer, the semiconductor stacked-layered structure includes a ridge stripe structure causing a stripe-shaped waveguide, and has side surfaces opposite to each other to sandwich the stripe-shaped waveguide in its width direction therebetween. At least part of at least one of the side surfaces is processed to prevent the stripe-shaped waveguide from functioning as a Fabry-Perot resonator in the width direction.

Abstract: A transistor outline (TO) package includes a housing having a window and a substrate. Circuitry is coupled to the substrate within the housing. The circuitry comprises a laser diode and memory configured to store information related to the TO package. Electrical connectors are coupled to the substrate at the opposite side to the circuitry. At least one of the electrical connectors is electrically connected to the memory. A disclosed method includes assembling a TO package, testing the TO package, storing results of the testing in memory, and making the information stored in the memory, including the results of the testing, available to a device external to the TO package. The TO package includes a laser diode and memory configured to store information related to the TO package.

Abstract: Embodiments of the invention include a laser structure having a delta doped active region for improved carrier confinement. The laser structure includes an n-type cladding layer, an n-type waveguide layer formed adjacent the n-type cladding layer, an active region formed adjacent the n-type waveguide layer, a p-type waveguide layer formed adjacent the active region, and a p-type cladding layer formed adjacent the p-type waveguide layer. The laser structure is configured so that a p-type dopant concentration increases across the active region from the n-type side of the active region to the p-type side of the active region and/or an n-type dopant concentration decreases across the active region from the n-type side of the active region to the p-type side of the active region. The delta doped active region provides improved carrier confinement, while eliminating the need for blocking layers, thereby reducing stress on the active region caused thereby.

Abstract: There is provided a surface emitting laser allowing a direction of a far-field pattern (FFP) centroid to be inclined from a normal direction of a substrate providing the surface emitting laser, comprising: a substrate; a lower reflecting mirror, an active layer, an upper reflecting mirror stacked on the substrate; and a surface relief structure located in an upper portion of a light emitting surface of the upper reflecting mirror, the surface relief structure being made of a material allowing at least some beams emitted from the surface emitting laser to be transmitted therethrough, a plurality of regions having a predetermined optical thickness in a normal direction of the substrate being formed in contact with other region in an in-plane direction of the substrate, and a distribution of the optical thickness in the in-plane direction of the substrate is asymmetric to a central axis of the light emitting regions.

Abstract: A photonic crystal laser comprises an n-type substrate, an n-type clad layer, an active layer, a p-type clad layer, a photonic crystal layer, a p-type electrode, an n-type electrode and a package member. The n-type clad layer is formed on a first surface of the n-type substrate. The active layer is formed on the n-type clad layer. The p-type clad layer is formed on the active layer. The photonic crystal layer is formed between the n-type clad layer and the active layer or between the active layer and the p-type clad layer, and includes a photonic crystal portion. The p-type electrode is formed on the photonic crystal portion. The n-type electrode is formed on a second surface, and includes a light-transmitting portion arranged on a position opposed to the photonic crystal portion and an outer peripheral portion having lower light transmittance than the light-transmitting portion.

Abstract: A semiconductor laser element 10 according to the present invention comprises a waveguide 12 of a high mesa type. And then such the waveguide 12 comprises an oblique end face 17 as an emitting facet that is different from a cleaved end face 16. And hence it becomes possible to reduce a reflection factor at the end face by making of such the oblique end face 17, and it becomes possible to design a direction of an emitting beam 21, that is to be emitting from the oblique end face 17, to be independent of that for the cleaved end face 16 as well. Moreover, the emitting beam 21 is designed to be emitting as vertical to the cleaved end face 16. And then therefore in a case where an emitting beam from a semiconductor optical device is designed to be coupled with such as an optical fiber or another waveguide or the like, it is not necessary to device such as that the semiconductor laser element 10 is required to be arranged at a sub mount by being inclined to be oblique or the like.

Abstract: Disclosed is a side-emitting light device comprising two sub-assemblies which are optically bonded together. Each sub-assembly comprises a substrate, at least one light source disposed on the substrate, and a luminescent plate optically bonded with the at least one light source. The light source emits light of a wavelength capable of exciting luminescence light from the luminescent plate. The two sub-assemblies are arranged having the free surface of the luminescent plates facing each other. The side-emitting light device is for instance applicable for light sources comprising naked dies arranged with Thin Film Flip Chip (TFFC) technique or laser diodes.

Abstract: A semiconductor laser according to the present invention comprises a ?/2 dielectric film (?: in-medium wavelength of a dielectric film, for example, SiO2, Si3N4, Al2O3, and AlN) in contact with a facet of a resonator; and a first dielectric double layered film disposed on the dielectric film, which includes a first layer of a-Si and a second layer of a material having a refractive index lower than that of a-Si. The first layer has a thickness ¼ of an in-medium wavelength of a-Si, and the second layer has a thickness ¼ of an in-medium wavelength of the second layer. Therefore, it is possible to firmly stack the first dielectric double layered film and form a high reflectance film with high yield.

Abstract: A process for fabricating lasers capable of emitting blue light wherein a GaN wafer is etched to form laser waveguides and mirrors using a temperature of over 500° C. and an ion beam in excess of 500 V in CAIBE.

Abstract: This method of manufacturing a semiconductor laser apparatus includes steps of forming a first solder layer on a first electrode, forming a second solder layer with a second melting point on a second electrode through a barrier layer, forming a reaction solder layer with a third melting point higher than the second melting point by reacting the first solder layer having a first melting point with the first electrode and bonding a first semiconductor laser device to a base through the reaction solder layer, and bonding a second semiconductor laser device by melting the second solder layer with the second melting point after the step of bonding the first semiconductor laser device.

Abstract: An apparatus comprising a header comprising a platform for attaching opto-electronic components, an optical element, a laser diode (LD) configured to emit an optical signal that passes through the optical element, and a cap affixed to the header such that the cap is coaxially aligned with the header, wherein the cap and header encase the optical element and the LD.

Abstract: Described is a method for controlling the wavelength of a laser in a wavelength division multiplexed (WDM) system. The method includes generating broadband light having a dithered optical power and a wavelength spectrum that includes a plurality of WDM wavelengths. The broadband light is spectrally filtered to generate a spectrally-sliced optical signal having a wavelength spectrum that includes one of the WDM wavelengths. The spectrally-sliced optical signal is injected into a laser and a dithered optical power of the laser is determined. A parameter of the laser is controlled in response to the determination of the dithered optical power to thereby align a wavelength of the laser to the wavelength spectrum of the spectrally-sliced optical signal.

Abstract: This invention relates to a side-emitting light device comprising two sub-assemblies which are optically bonded together. Each sub-assembly comprises a substrate, at least one light source disposed on the substrate, and a luminescent plate optically bonded with the at least one light source. The light source emits light of a wavelength capable of exciting luminescence light from the luminescent plate. The two sub-assemblies are arranged having the free surface of the luminescent plates facing each other. The side-emitting light device is for instance applicable for light sources comprising naked dies arranged with Thin Film Flip Chip (TFFC) technique or laser diodes.

Abstract: A multibeam laser diode capable of improving heat release characteristics in the case of junction-down assembly is provided. Contact electrodes are provided respectively for protruding streaks of a laser diode device, and pad electrodes are provided to avoid the protruding streaks and the contact electrodes. The contact electrodes and the pad electrodes are connected by wiring electrodes, and the contact electrodes are covered with a first insulating film. Thereby, electric connection is enabled without straightly jointing the contact electrodes to a solder layer. A heat conduction layer configured of a metal is provided on the first insulating film, the heat conduction layer is jointed to the solder layer, and thereby the heat release characteristics are able to be improved even in the case of junction-down assembly.

Abstract: A p-type pad electrode in a red semiconductor laser device and a first terminal are connected through a wire. A p-type pad electrode in an infrared semiconductor laser device and a second terminal are connected through a wire. A p-electrode in a blue-violet semiconductor laser device and a third terminal are connected through a wire. An n-electrode in the blue-violet semiconductor laser device is electrically conducting to a mount. An n-electrode in the red semiconductor laser device and the mount are connected through a wire, while an n-electrode in the infrared semiconductor laser device and the mount is connected through a wire. The mount has a fourth terminal inside.

Abstract: A semiconductor laser device includes a semiconductor laser element configured to emit a fundamental wave; a transducer configured to receive the fundamental wave incident thereon and convert a wavelength of the fundamental wave to emit wavelength converted light; a filter configured to selectively transmit wavelength range light having a desired wavelength range of the wavelength converted light; a sealing member including a light-transmitting member and configured to enclose the semiconductor laser element, the light-transmitting member being configured to receive the wavelength range light transmitted through the filter and incident on the light-transmitting member, specularly reflect part of the wavelength range light, and substantially transmit the remaining part of the wavelength range light; and a photoreceptor configured to receive the specularly reflected light from the light-transmitting member.

Abstract: A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves.

Abstract: An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board.

Abstract: An optical package is provided comprising a laser diode and a wavelength conversion device. The laser diode and the wavelength conversion device define an external laser cavity and the wavelength conversion device is tilted relative to the output face of the laser diode to define a tilt angle ? that is less than approximately 85°. The input face of the wavelength conversion device comprises a pair of tapered facets and a microlens. The pair of tapered facets and the microlens are defined on the input face such that they share respective portions of the facial waveguide region on the input face, with the tapered facets occupying peripheral portions of the facial waveguide region on the input face and the microlens occupying an interior portion of the facial waveguide region on the input face. Each of the pair of tapered facets define a facet angle ? within the facial waveguide region that is less than the facet angle ? and is greater than approximately 45°. Additional embodiments are disclosed and claimed.

Abstract: In this semiconductor laser apparatus, a first wire-bonding portion is arranged at a position in a fourth direction from a first semiconductor laser device and in a first direction from a photodetector, and a second wire-bonding portion is arranged at a position in the fourth direction from the first semiconductor laser device and in a third direction from the first wire-bonding portion. A third wire-bonding portion is arranged at a position in a second direction from a third semiconductor laser device and in the first direction from the photodetector, and a fourth wire-bonding portion is arranged at a position in the second direction from the third semiconductor laser device and in the third direction from the third wire-bonding portion.

Abstract: Provided is an external cavity laser light source. The light source includes a substrate, an optical waveguide, and a current blocking layer. The optical waveguide includes a passive waveguide layer, a lower clad layer, an active layer, and an upper clad layer that are sequentially stacked on the substrate and is divided into regions including a linear active waveguide region, a bent active waveguide region, a tapered waveguide region, and a window region. The current blocking layer was formed an outside of the active layer to reduce leakage current. The linear and bent active waveguide regions have a buried heterostructure (BH), and the tapered waveguide region and the window region have a buried ridge stripe (BRS) structure. The passive waveguide layer a width substantially equal to a maximal width of the tapered waveguide region at least in the bent active waveguide region, the tapered waveguide region, and the window region.

Abstract: A semiconductor light emitting device includes a first-conductivity-type first multilayer film reflecting mirror, and a second-conductivity-type second multilayer film reflecting mirror; a cavity layer; and a first conductive section, a second conductive section, and a third conductive section. The cavity layer has a stacked configuration including a first-conductivity-type or undoped first cladding layer, an undoped first active layer, a second-conductivity-type or undoped second cladding layer, a second-conductivity-type first contact layer, a first-conductivity-type second contact layer, a first-conductivity-type or undoped third cladding layer, an undoped second active layer, and a second-conductivity-type or undoped fourth cladding layer.

Abstract: A monolithic red/infrared semiconductor laser device is joined to a blue-violet semiconductor laser device. The distance between a blue-violet emission point in the blue-violet semiconductor laser device and an infrared emission point in an infrared semiconductor laser device is significantly shorter than the distance between a red emission point in a red semiconductor laser device and the infrared emission point. A blue-violet laser beam, a red laser beam, and an infrared laser beam respectively emitted from the blue-violet emission point, the red emission point, and the infrared emission point are introduced into a photodetector after being incident on an optical disk by an optical system comprising a polarizing beam splitter, a collimator lens, a beam expander, a ?/4 plate, an objective lens, a cylindrical lens, and an optical axis correction element.

Abstract: Circuit arrangements for the operation of a pulse laser diode and methods for operating a pulse laser diode include a current source to supply a direct current to the pulse laser diode. The circuit arrangement can provide operation of the pulse laser diode that can be stable and without unintentional shifts in wavelength.

Abstract: A light-emitting element mount (4) is fixed onto a base (8), and a semiconductor laser element (1) is fixed onto the light-emitting element mount (4). An anchor member (5), which is in the shape of a roughly rectangular plate, is fixed onto the base (8). An optical fiber (2) is fixed onto the anchor member (5) by means of an anchoring material (6). The optical fiber (2) is aligned and optically coupled with the semiconductor laser element (1). A cut-out (9) is formed in the part of the base (8) corresponding to the anchoring material (6) (below the anchoring material (6)). Thus the anchor member (5) is fixed onto the base (8) so as to straddle the cut-out (9). Since the cut-out (9) is formed below the anchor member (5), a spot heater (10) or like can be used to heat the anchor member (5) from the bottom surface thereof. Thus, the anchoring material (6) on top of the anchor member (5) can be efficiently heated.

Abstract: The invention provides an optoelectronic device combining a vertical cavity surface emitting laser (VCSEL) and a photodetector for monitoring the output power of the vertical cavity surface emitting laser. To improve the signal-to-noise ratio of the photodetector, a light deflector is interposed between the photodetector and the VCSEL.

Abstract: A semiconductor optical integrated element includes: a substrate; and a laser diode and a modulator which are integrated on the substrate. The laser diode includes an embedded waveguide having a core layer, both sides of which are embedded in a semiconductor material. The modulator includes a high-mesa ridge waveguide having a core layer, neither side of which is embedded in the semiconductor material. The core layers in the laser diode and the modulator are stripe-shaped.

Abstract: A Vertical Cavity Surface Emitting Laser (VCSEL) capable of providing high output of fundamental transverse mode while preventing oscillation of high-order transverse mode is provided. The VCSEL includes a semiconductor layer including an active layer and a current confinement layer, and a transverse mode adjustment section formed on the semiconductor layer. The current confinement layer has a current injection region and a current confinement region. The transverse mode adjustment section has a high reflectance area and a low reflectance area. The high reflectance area is formed in a region including a first opposed region opposing to a center point of the current injection region. A center point of the high reflectance area is arranged in a region different from the first opposed region. The low reflectance area is formed in a region where the high reflectance area is not formed, in an opposed region opposing to the current injection region.

Abstract: To provide a semiconductor optical device which can restrain laser characteristics from being deteriorated by excitation in a substrate mode and can reduce the number of manufacturing steps. A semiconductor optical device comprises a first DBR layer, provided on a semiconductor substrate, having first and second semiconductor layers stacked alternately, a first cladding layer, an active layer, and a second cladding layer. The semiconductor substrate has a bandgap higher than that of the active layer. The first DBR layer is transparent to light having an emission wavelength, while the first and second semiconductor layers have respective refractive indices different from each other. Since the first DBR layer is thus provided between the semiconductor substrate and first cladding layer, the guided light reaching the lower end of the first cladding layer, if any, is reflected by the first DBR layer, whereby light can be restrained from leaking to the semiconductor substrate.

Abstract: Provided is a surface emitting laser manufacturing method, etc., which reduces process damage occurring to a surface relief structure, enabling stable provision of a single transverse mode characteristic. Provided is a method including a surface relief structure for controlling a reflectance in a light emitting portion of an upper mirror, the surface relief structure including a stepped structure, includes: forming a resist pattern including a pattern for forming a mesa structure and a pattern for forming a stepped structure, on or above the upper mirror, and performing first-phase etching for etching the surface layer of the upper mirror to determine the horizontal position of the stepped structure; forming a current confining structure after the performing first-phase etching; and performing second-phase etching for further etching the area that the first-phase etching has been performed, to determine the depth position of the stepped structure, after the forming a current confining structure.

Abstract: A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves.

Abstract: A Vertical Cavity Surface Emitting Laser (VCSEL) and its fabrication are taught which incorporate a high contrast grating (HCG) to replace the top mirror of the device and which can operate at long-wavelengths, such as beyond 0.85 ?m. The HCG beneficially provides a high degree of polarization differentiation and provides optical containment in response to lensing by the HCG. The device incorporates a quantum well active layer, a tunnel junction, and control of aperture width using ion implantation. A tunable VCSEL is taught which controls output wavelength in response to controlling a micro-mechanical actuator coupled to a HCG top mirror which can be moved to, or from, the body of the VCSEL. A fabrication process for the VCSEL includes patterning the HCG using a wet etching process, and highly anisotropic wet etching while precisely controlling temperature and PH.

Abstract: This semiconductor laser apparatus includes a semiconductor laser chip and a package sealing the semiconductor laser chip. The package has a concave base portion with an opening provided in an upper surface and one side surface and a sealing member covering the opening, and the sealing member is mounted on a bonded region of the base portion through a sealant.

Abstract: A vertical cavity surface emitting laser (VCSEL) is described using a sub-wavelength grating (SWG) structure that has a very broad reflection spectrum and very high reflectivity. The grating comprises segments of high and low refractive index materials with an index differential between the high and low index materials. By way of example, a SWG reflective structure is disposed over a low index cavity region and above another reflective layer (either SWG or DBR). In one embodiment, the SWG structure is movable, such as according to MEMS techniques, in relation to the opposing reflector to provide wavelength selective tuning. The SWG-VCSEL design is scalable to form the optical cavities for a range of SWG-VCSELs at different wavelengths, and wavelength ranges.

Abstract: A means for optically coupling a semiconductor laser to an optical fiber is disclosed. In one embodiment, a volume phase holographic element is disposed on a light-emitting surface of a semiconductor laser. The volume phase holographic element acts as an aberration-corrector for a lens that is disposed between the semiconductor laser and the optical fiber. In this way, an inexpensive lens that is not aberration free can be used. In some embodiments, the volume phase holographic element converts a Gaussian light beam emitted by the semiconductor laser into an annular beam that is more suitable for long distance transmission in multimode fibers.

Abstract: In accordance with one embodiment of the present disclosure, a process of manufacturing a semiconductor laser diode comprising a gain section, a QWI output window, and QWI waveguide areas is provided. The QWI waveguide areas are fabricated using quantum well intermixing and define a QWI waveguide portion in the QWI output window of the laser diode. The QWI output window is transparent to the lasing wavelength ?L. The QWI waveguide portion in the QWI output window is characterized by an energy bandgap that is larger than an energy bandgap of the gain section such that the band gap wavelength ?QWI in the QWI waveguide portion and the QWI output window is shorter than the lasing wavelength ?L. The QWI output window is characterized by a photoluminescent wavelength ?PL. The manufacturing process comprises a ?PL screening protocol that determines laser diode reliability based on a comparison of the lasing wavelength ?L and the photoluminescent wavelength ?PL of the QWI output window.

Abstract: A semiconductor laser is provided capable of generating very narrow laser beams and having stable characteristics, a method for generating the laser beams and a method for reducing a spectral line-width of the laser beams. The semiconductor laser includes a semiconductor active layer, a photonic crystal optical waveguide forming a periodic structure of two-dimensional refractive index within a plane perpendicular to a semiconductor laminate direction directly or indirectly connected to the semiconductor active layer; and an optical cavity that contains the semiconductor active layer and the photonic crystal optical waveguide and oscillates light that is generated from the semiconductor active layer and is guided through the photonic crystal optical waveguide as laser.

Abstract: A diffraction grating device includes a substrate with a primary surface having a plurality of grating areas that are periodically arranged with a constant period in a predetermined axis direction, the grating area including a first area and a second area, a diffraction grating structure providing a chirped grating whose pitch monotonically changes along the predetermined axis direction, a core layer that is optically coupled with the diffraction grating structure with a coupling coefficient, a plurality of grating portions including the diffraction grating structure and the core layer, the grating portion including a first portion and second portion that are arranged on the first area and the second area, respectively, of the primary surface and a perturbing layer disposed at the first portion or the second portion. The perturbing layer changes the coupling coefficient between the diffraction grating structure and core layer.

Abstract: There is provided a semiconductor light-emitting device including a temperature detecting section which is allowed to accurately estimate an element temperature. The semiconductor light-emitting device includes: one or a plurality of surface-emitting semiconductor light-emitting sections and one or a plurality of semiconductor temperature detecting sections on a semiconductor substrate, the surface-emitting semiconductor light-emitting sections emitting light in a direction normal to the semiconductor substrate, the semiconductor temperature detecting sections not emitting light to outside. The semiconductor light-emitting sections and the semiconductor temperature detecting sections have a PN junction or a PIN junction in a direction normal to the semiconductor substrate.

Abstract: Geometrical design of laser microchips is disclosed that allows variation of the optical path length in the different media by simple displacement of the microchip, the movement having a non-zero projection orthogonal to the pump beam. The concept can be implemented to vary optical loss in the lasing cavity, the absorbed pump power, or the optical length of the cavity. Passively Q-switched microchip laser output performance can thus be controlled by simple transverse displacement of the microchip relative to the pump beam. The above microlaser can be combined with voltage-controlled variable-focus output optics in order to control the peak power density of the laser pulses.

Abstract: A Vertical Cavity Surface Emitting Laser (VCSEL) is optimized for longer life of the VCSEL by controlling the distance of doped and undoped layers near an active region. In addition, the VCSEL optimized for reduced parasitic lateral current under an oxide of the VCSEL by forming a high Al confinement region and placing the oxide at a null in a standing optical wave. Further, the VCSEL is optimized to reduce resistance.

Abstract: The present invention relates to a nitride semiconductor laser device having a structure in which two or more of nitride semiconductor laser elements, having at least a first electrode on a first main surface of a first conductive type conductive substrate, having at least a first conductive type nitride semiconductor layer, an active layer, a second conductive type nitride semiconductor layer, and a second electrode on a second main surface of the conductive substrate, and having a stripe-waveguide structure parallel to the first main surface, are arranged in a direction parallel to the first main surface and a direction perpendicular to the direction of light that is emitted from the stripe waveguide structure in the nitride semiconductor laser device, and the first sub-mount and the first electrode of the nitride semiconductor laser element are electrically and heat-conductively connected, and the second sub-mount and the second electrode of the nitride semiconductor laser element are electrically and heat

Abstract: Diode lasers type of devices with good coupling between field distribution and gain are disclosed. A single element has a flat field distribution that couples with the uniform current injection in a contact region. A multi element array having almost flat field distribution in each element and almost equal amplitude for the field intensity in all elements is provided. Injection by multiple contacts couples well with the overall field distribution. Also, the lasers are stable against filament formation and mode switching.

Abstract: An active photonic device assembly (1) comprising a substrate (10) and a waveguide entity (18) provided on the substrate (10). The active photonic device assembly (1) further comprises a contact layer (22) of a first III/V material epitaxially grown laterally on top of the waveguide entity (18) from opening fillings (20) in turn provided on a substrate surface. An active photonic device (25) is provided on the contact layer (22).

Abstract: An integrated semiconductor laser device capable of improving the properties of a laser beam and reducing the cost for optical axis adjustment is provided. This integrated semiconductor laser device comprises a first semiconductor laser element including a first emission region and having either a projecting portion or a recess portion and a second semiconductor laser element including a second emission region and having either a recess portion or a projecting portion. Either the projecting portion or the recess portion of the first semiconductor laser element is fitted to either the recess portion or the projecting portion of the second semiconductor laser element.

Abstract: A semiconductor ring laser (SRL) section is monolithically integrated with a DFB or DBR master laser section on a semiconductor substrate of a light-emitting device to provide an injection locking mode of operation that can result in low-cost ultrafast (over 100 GHz) functional chip that will be easy to use in practice.

Abstract: A wavelength tunable laser includes a first facet including a high reflection coating film; a gain region disposed adjacent to the first facet, the gain region including two or more light emitting devices that are arranged parallel to one another; an optical wavelength multiplexer optically connected to the light emitting devices; and an optical reflector disposed adjacent to a second facet opposite the first facet, the optical reflector having a reflection spectrum with periodic reflection peaks. The optical wavelength multiplexer is disposed between the gain region and the optical reflector, and the optical reflector and the first facet including the high reflection coating film form a laser cavity.

Abstract: A semiconductor laser apparatus has a Zener diode containing a first semiconductor region of a first conduction type and a second semiconductor region of a second conduction type joined with the first semiconductor region, and a vertical-cavity surface-emitting semiconductor laser diode stacked above the Zener diode and containing at least a first mirror layer of a first conduction type, a second mirror layer of a second conduction type and an active region sandwiched between the first and second mirror layers. The first semiconductor region and the second mirror layer are electrically connected and the second semiconductor region and the first mirror layer are electrically connected.

Abstract: Provided is a surface emitting laser array using a photonic crystal, which allows an active layer to be shared without disconnecting the active layer between the individual surface emitting lasers adjacent to each other, and enables high-density arraying easily. The surface emitting laser array includes: at least two surface emitting lasers formed on a substrate, each having a laminated structure of multiple semiconductor layers including a semiconductor multilayer mirror, an active layer, and a photonic crystal having a refractive index profile in an in-plane direction, the photonic crystal and the semiconductor multilayer mirror in the laminated structure forming a waveguide for guiding light in a resonance mode; and a region without the photonic crystal provided between adjacent surface emitting lasers in the surface emitting laser array, in which the surface emitting lasers have the same semiconductor multilayer mirror and the same active layer.

Abstract: A surface-emitting laser includes a surface relief structure provided on an upper multilayer reflector, the surface relief structure including a region of a first laminate, a region of a second laminate that has a larger optical thickness than the first laminate, and a region of a third laminate that has a larger optical thickness than the first laminate and the second laminate.