Abstract: Method and system for detecting defects on surface of object are presented. An imaging device captures images of surface of object under ambient and dark field illumination conditions. The images are processed with a plurality of image operations to detect area of potential defect at location on surface of object based on predictable pattern consisting of bright and shadow regions. Kernels are defined corresponding to configurations of dark field illumination sources to enhance detecting potential defect. Areas of potential defect are cut from processed images to sub images. Sub images are stitched together to generate hypothesis of potential defect at location on surface of object. The hypothesis is classified with a classifier to determine whether the potential defect is true defect. The classifier is trained with training data having characteristics of true defect. The method provides efficient automated detection of micro defects on surface of object.

Abstract: A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the one or more images of the selected region of the sample by comparing the one or more images of the selected region of the sample to the one or more sets of design data, retrieving one or more patterns of interest from the one or more sets of design data corresponding to the one or more defects, and classifying the one or more defects in the one or more images of the selected region of the sample based on one or more annotated electrical design properties included in the one or more patterns of interest.

Abstract: An inspection system and a method for inspecting a diced wafer. The method includes: acquiring multiple images of multiple portions of the diced wafer according to a predefined image acquisition scheme; locating multiple unique features within the multiple images; and assigning a die index to each die of the multiple dice and associating between the multiple dice and multiple reference dice in response to locations of the multiple unique features and to at least one expected die dimension.

Abstract: A method for macro inspection, the method includes: (i) concurrently illuminating a current group of spaced apart object sub areas; wherein light reflected in a specular manner from a certain object sub area of the current group of object sub areas is expected to be detected by a certain sensor element of a current group of spaced apart sensor elements that correspond to the current group of spaced apart object sub areas; wherein the object sub areas are spaced apart so as to reduce a probability of a detection of non-specular light from the object; wherein each image sub area comprises multiple pixels; (ii) obtaining image information from the current group of spaced apart sensor elements; and (iii) processing at least a portion of the image information to provide an inspection result.

Abstract: Method and system for detecting line defects on surface of object are presented. An imaging device captures images of surface of object under ambient and dark field illumination conditions. The images are processed with a plurality of image operations to detect areas of potential defects based on predictable pattern consisting of bright and shadow regions. Areas of potential defect are cut from processed images to sub images. Sub images are stitched together to generate hypotheses of potential defects at locations on surface of object. The hypotheses are classified to determine whether the potential defects are true defects at the locations. Line defect is detected by refining line segments detected on the processed image based on criteria. The criteria include distance from the true defects to the line segments and slops between the true defects and the line segments are less than threshold values.

Abstract: A computer-implemented (including method implemented using laptop, desktop, mobile, and wearable devices) method for image filtering. The method includes analyzing each image to generate a content vector for the image; applying an interest operator to the content vector, the interest operator being based on a plurality of pictures with desirable characteristics, thereby obtaining an interest index for the image; comparing the interest index for the image to an interest threshold; and taking one or more actions or abstaining from one or more actions based on a result of the step of comparing. Also, related systems and articles of manufacture.

Abstract: In a dark-field metrology method using a small target, a characteristic of an image of the target, obtained using a single diffraction order, is determined by fitting a combination fit function to the measured image. The combination fit function includes terms selected to represent aspects of the physical sensor and the target. Some coefficients of the combination fit function are determined based on parameters of the measurement process and/or target. In an embodiment the combination fit function includes jinc functions representing the point spread function of a pupil stop in the imaging system.

Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.

Abstract: An image forming apparatus includes an imager that is electrically connected to an image sensor disposed at a position where light that has passed through a sample slice is incident on the image sensor, and an illumination system that emits illumination light successively in different illumination directions relative to a sample slice to illuminate the sample slice with the illumination light and that emits a first light having a peak in a first wavelength range and a second light having a peak in a second wavelength range. The image forming apparatus obtains a plurality of first-color images with the image sensor while the sample slice is being illuminated with the first light serving as the illumination light successively in the different illumination directions. The image forming apparatus obtains at least one second-color image with the image sensor while the sample slice is being illuminated with the second light in at least one of the different illumination directions.

Abstract: A content display control apparatus, a content display control method, and a computer program for executing the content display control method on a computer, whereby one or more clusters are formed from location information of a plurality of pieces of contents, an event cluster having a high probability of an event occurrence is selected, and the selected event cluster are provided to a user, thereby easily organizing and keeping the contents.

Abstract: A measurement apparatus 1 according to the present invention includes a table 10 that has an axis of rotation 14 and supports a disc-shaped object 40, a first driving unit that rotates the table 10 around the axis of rotation 14, a light source 50 that produces illumination light with which an end portion 45 of the disc-shaped object 40 is illuminated, an objective lens 60 that collects the illumination light reflected from the end portion 45, a second driving unit that moves the objective lens 60 along an optical axis 64, an imaging unit 70 that captures an image of the end portion 45 by detecting the reflected light collected by the objective lens 60, and an autofocus optical system 80 that determines a position of the objective lens 60 where the image of the end portion 45 is brought into focus in the imaging unit 70.

Abstract: A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.

Abstract: Embodiments of the present invention disclose a defect prediction method and apparatus, which relate to the data processing field, and implement accurate and quick locating of a defect in a faulty product. A specific solution is as follows: selecting a training attribute set from a pre-stored product fault record according to a target attribute, and combining the target attribute and the training attribute set into a training set, where the target attribute is a defect attribute of a historical faulty product; generating a classifier set according to the training set, where the classifier set includes at least two tree classifiers; and predicting a defect of a faulty product by using the classifier set as a prediction model. The present invention is used in a process of predicting a defect of a faulty product.

Abstract: A semiconductor device employs at least one of semiconductor chip groups. The semiconductor device includes a semiconductor chip included in the semiconductor chip groups, and a package. The semiconductor chip includes an information recording region on which is recorded a first piece of identification information indicating to which group of the semiconductor chip groups the semiconductor chip belongs based on a first category. The information recording region includes a plurality of fuses selectively blown in accordance with the first piece of identification information. Indicated on the package is a second piece of identification information indicating to which group of the semiconductor chip groups the semiconductor chip belongs based on a second category. The first and second pieces of identification information are combined together to identify the semiconductor chip from among the semiconductor chip groups.

Abstract: An inspection method includes receiving a plurality of inspection images of a substrate. The method includes generating a first noise image from a first image from the first channel and an additional noise image from the additional image from the additional channel. The method further includes generating a first signal-to-noise ratio (SNR) image from the first noise image and an additional SNR image from the additional noise image and identifying one or more first pixel candidates in the first SNR image and in the additional SNR image. The method further includes combining image data from the first SNR image and image data from the additional SNR image at common pixel candidate sites based on the one or more identified first pixel candidates and the one or more identified additional pixel candidates to form a combined image used to detect defects on the substrate.

Abstract: The present application discloses methods, systems and devices for using charged particle beam tools to pattern and inspect a substrate. The inventors have discovered that it is highly advantageous to use patterns generated using the Hadamard transform as alignment and registration marks (Hadamard targets) for multiple-column charged particle beam substrate processing and inspection tools. Hadamard targets can be written to a substrate using charged particle beams performing, for example, resist-based lithography or resist-less direct processing. High-order Hadamard targets can also be patterned and imaged to obtain superior column performance metrics for applications such as super-rapid beam calibration DOE, column matching, and column performance tracking.

Abstract: The present disclosure discloses a fingerprint identification apparatus and a mobile terminal using the same. The fingerprint identification apparatus includes: a fingerprint identification module, including a sensing circuit, a control circuit and a base plate, wherein the sensing circuit is arranged on the base plate via a support member and electrically connected to the base plate, and the control circuit is electrically connected to the base plate and located beneath the sensing circuit. a conductor holder, the conductor holder being provided with a through hole, covering the fingerprint identification module and electrically connected to the base plate; and a dielectric cover sheet, the dielectric cover sheet being assembled in the through hole and connected to the sensing circuit.

Abstract: A method for tracking movement of a movable portion of an interventional device disposed within a natural or artificial body opening is provided. In particular, image data of fiducials is acquired and therefrom an initial position of an interventional device movable portion with respect to a given coordinate system is determined. Next, real time position data from the encoders is acquired as the movable portion is moved from the initial position, and a displaced position from the initial position is determined. From this acquired information, a position of the movable portion in the coordinate system is determined using both the initial position as determined from the image data and the real time displaced position as determined from the encoders.

Abstract: A method for reducing warpage on an organic substrate. The method includes: preparing an organic substrate, which includes (i) a core layer having an organic material, (ii) a first buildup layer on a front surface of the core layer, and (iii) a second buildup layer on a back surface of the core layer, measuring warpage of the organic substrate, calculating a thickness of a correction layer for reducing the warpage using properties of constituent materials including the coefficient of thermal expansion (CTE) and the Young's modulus of the core layer, and CTEs and the Young's modulus of the first and the second buildup layers, and forming at least one correction layer having the thickness on at least one part of surfaces of the first buildup layer and the second buildup layer. A system and an organic substrate is also provided.

Abstract: A void evaluation apparatus in a solder includes an evaluation function calculation unit for calculating a solder evaluation function by using a pixel value pi contained in the voids that is set to 1 and the pixel value pi not contained in the voids is 0 for each pixel constituting an image in the solder, and by using a weight function w(ri), which is maximum at a solder center (ri=0), and is 0 at a maximum radius (ri=r0) for a distance ri from the solder center. The apparatus further has a void evaluation unit for evaluating that the influence of voids is larger as the evaluation function is relatively larger for the each solder.

Abstract: A method includes generating synthetic data related to known defect patterns on surfaces of magnetic media using parameterized rules. A classifier model is trained with the synthetic data so that the classifier model learns how to detect and identify defect patterns on magnetic media. Performance of the classifier model is validated by using real defect pattern data. The classifier model is deployed for use in identifying defective data patterns on magnetic media test specimens. The classifier may be used before or after clustering defect data points on surfaces of magnetic media.

Abstract: A calibration method for calibrating the position error in the point of interest induced from the stage of the defect inspection tool is achieved by controlling the deflectors directly. The position error in the point of interest is obtained from the design layout database.

Abstract: A pattern from a patterning device is applied to a substrate by a lithographic apparatus. The applied pattern includes product features and metrology targets. The metrology targets include large targets which are for measuring overlay using X-ray scattering and small targets which are for measuring overlay by diffraction of visible radiation. Some of the smaller targets are distributed at locations between the larger targets, while other small targets are placed at the same locations as a large target. By comparing values measured using a small target and large target at the same location, parameter values measured using all the small targets can be corrected for better accuracy. The large targets can be located primarily within scribe lanes while the small targets are distributed within product areas.

Abstract: Defect classification includes acquiring one or more images of a specimen, receiving a manual classification of one or more training defects based on one or more attributes of the one or more training defects, generating an ensemble learning classifier based on the received manual classification and the attributes of the one or more training defects, generating a confidence threshold for each defect type of the one or more training defects based on a received classification purity requirement, acquiring one or more images including one or more test defects, classifying the one or more test defects with the generated ensemble learning classifier, calculating a confidence level for each of the one or more test defects with the generated ensemble learning classifier and reporting one or more test defects having a confidence level below the generated confidence threshold via the user interface device for manual classification.

Abstract: Disclosed are methods and apparatus for imaging a rounded edge of a sample, such as a wafer with a beveled edge. In one embodiment, the system includes a curved diffuser having an internal surface for positioning towards the rounded edge of the sample and an external surface opposite the internal surface and light sources for generating a plurality of illumination beams adjacent to a plurality of positions on the external surface of the diffuser so that the diffuser outputs uniform light onto the rounded edge of the sample at a wide range of incident angles. The system further includes a sensor for receiving light scattered from the rounded edge of the sample in response to the incident light and generating a detected signal for generating an image. These elements are partially or entirely integrated into a compact assembly.

Abstract: A method for inspecting an installed component includes receiving an identity and selected location of the component as an input signal via a handheld inspection device having a controller, digital camera, and display screen, and collecting a dynamic pixel image of the selected location in real-time using the digital camera. The method includes displaying the image in real time via the display screen, projecting virtual guidance lines onto the image corresponding to edges of the installed component, and identifying the component via the controller when the image is aligned with the projected acquisition lines. A predetermined area of the installed component is identified after identifying the installed component, a predetermined feature dimension is measured within the identified predetermined area, and an output signal is generated with a status indicative of whether the measured feature dimension falls within a calibrated range.

Abstract: Provided is a charged particle beam device which can specify a position of an initial core with high accuracy even when fine line and space patterns are formed by an SADP in plural times. The charged particle beam device includes a detector (810) which detects secondary charged particles discharged from a sample (807) when a charged particle beam is emitted to the sample having a plurality of patterns of line shape, a display unit (817) which displays image data of a surface of the sample on the basis of a signal of the secondary charged particles, a calculation unit (812) which calculates an LER value with respect to the plurality of the patterns of line shape from the image data, and a determination unit (816) which compares the values to determine a position of the initial core.

Abstract: The disclosure relates to devices, systems and methods for image registration and annotation. The devices include computer software products for aligning whole slide digital images on a common grid and transferring annotations from one aligned image to another aligned image on the basis of matching tissue structure. The systems include computer-implemented systems such as work stations and networked computers for accomplishing the tissue-structure based image registration and cross-image annotation. The methods include processes for aligning digital images corresponding to adjacent tissue sections on a common grid based on tissue structure, and transferring annotations from one of the adjacent tissue images to another of the adjacent tissue images.

Abstract: A method of position control of an optical component relative to a surface is disclosed. The method may include: obtaining a first signal by a first position measurement process; controlling relative movement between the optical component and the surface for a first range of motion using the first signal; obtaining a second signal by a second position measurement process different than the first position measurement process; and controlling relative movement between the optical component and the surface for a second range of motion using the second signal, the second range of motion being nearer the surface than the first range of motion.

Abstract: A method of determining a measurement subset of metrology point locations which includes a subset of potential metrology point locations on a substrate. The method including identifying a plurality of candidate metrology point locations from the potential metrology point locations. A change in the level of informativity imparted by the measurement subset of metrology point locations which is attributable to the inclusion of that candidate metrology point location into the measurement subset of metrology point locations is evaluated for each of the candidate metrology point locations. The candidate metrology point locations which have the greatest increase in the level of informativity attributed thereto are selected for inclusion into the measurement subset of metrology point locations.

Abstract: Apparatus and methods for inspecting a specimen are disclosed. An inspection tool is used at one or more operating modes to obtain images of a plurality of training regions of a specimen, and the training regions are identified as defect-free. Three or more basis training images are derived from the images of the training regions. A classifier is formed based on the three or more basis training images. The inspection system is used at the one or more operating modes to obtain images of a plurality of test regions of a specimen. Three or more basis test images are derived from to the test regions. The classifier is applied to the three or more basis test images to find defects in the test regions.

Abstract: A method includes obtaining first data representing a first circuit symbol and second data representing a second circuit symbol. The first circuit symbol has a plurality of first pins having a first position vector associated therewith. The second circuit symbol has a plurality of second pins having a second position vector associated therewith, and each of the plurality of second pins corresponds to a respective one of the plurality of first pins. An adjustment transformation mapping position vectors to transform the position vectors is determined. The adjustment transformation minimizes an error measure that is based on one or more deviations. Each deviation is a deviation between a transformed position vector and the first position vector associated with one of the first pins. The transformed position vector is obtained by applying the adjustment transformation to the second position vector associated with the second pin corresponding to the first pin.

Abstract: Systems and methods are proposed for accurate and efficient automatic measurement of jaw and leaf positioning in multi-leaf collimator imaging systems. Specifically, the method enables the automated and objective processing of images to determine characteristics of collimator jaws and MLC leaves. These novel techniques enable verification of collimator component positioning to ensure accurate beam modulation for radiation application procedures.

Abstract: A circuit board includes a board base with a first surface and a second surface that is located opposite the first surface. A plurality of first coupling pads are located on the first surface of the board base. A plurality of second coupling pads are located on the second surface of the board base. The first coupling pads and the second coupling pads define a coupling pad footprint. A breakout via system is included in the board base. The breakout via system includes a plurality of primary signal vias that are located in the board base and outside of the coupling pad footprint, a plurality of first primary signal via connections that extend between the primary signal vias and the plurality of first coupling pads, and a plurality of second primary signal via connections that extend between the primary signal vias and the plurality of second coupling pads.

Abstract: Systems, methods, and non-transitory computer-readable media can identify a set of regions corresponding to a geographical area. A collection of training images can be acquired. Each training image in the collection can be associated with one or more respective recognized objects and with a respective region in the set of regions. Histogram metrics for a plurality of object categories within each region in the set of regions can be determined based at least in part on the collection of training images. A neural network can be developed based at least in part on the histogram metrics for the plurality of object categories within each region in the set of regions and on the collection of training images.

Abstract: An acquirer acquires, for the on-the path categories situated on the path from the topmost category of a hierarchical structure comprising categories into which products or serves are classified to each of a category of interest and the categories immediately below the category of interest, the frequencies of the names of the on-the-path categories and a keyword co-occurring in a search query given to a search device. An identifier identifies the category of interest as a category candidate immediately above a category of which the name is given by the keyword when the frequencies acquired for the on-the-path categories satisfy a candidate condition associated by the search device.

Abstract: When the lengths of FEM wafers are automatically measured, not only the sizes of targets, the lengths of which are to be measured, are often varied from those in registration, but also the patterns of the targets are often deformed. Therefore, it is difficult to automatically determine whether the length measurement is possible or not. Therefore, the following are executed with a semiconductor inspection system: (1) a process of identifying the position of the contour line of an inspected image using a distance image calculated from a reference image, (2) a process of calculating a defect size image based on the position of the contour line with respect to the identified distance image, and detecting a defect candidate from the defect size image, and (3-1) a process of, upon detection of the defect candidate, calculating the size of the detected defect candidate, or (3-2) a process of detecting a portion different between the first and second contour lines as the defect candidate.

Abstract: A direct-write lithography apparatus includes a polarization selector stage configured to vary a polarization orientation angle of light from a light source, a focusing element configured to focus the light from the light source into a spot at a focal plane thereof, and a scanning stage configured to scan the spot in at least two dimensions along a surface of a polarization-sensitive recording medium that is arranged proximate to the focal plane such that neighboring scans substantially overlap. The polarization selector stage and the scanning stage are configured to be operated independently of one another. Related fabrication methods of and optical elements fabricated thereby are also discussed.

Abstract: Provided herein is a method, including a) transferring an initial pattern of an initial template to a substrate; b) performing block copolymer self-assembly over the substrate with a density multiplication factor k; c) creating a subsequent pattern in a subsequent template with the density multiplication factor k; and d) repeating steps a)-c) with the subsequent template as the initial template until a design specification for the subsequent pattern with respect to pattern density and pattern resolution is met.

Abstract: In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.

Abstract: A method for analyzing quality of a glazing including: generating at least one digital image of a test chart produced in reflection by an external surface of the glazing on an outside of the glazing; computation by at least one processing unit of quantities representative of the quality of the glazing based on the at least one image generated; and comparing values computed for the representative quantities with respect to reference values. The test chart exhibits a pattern including elements of closed contours arranged periodically. The representative quantities are representative of a deformation of the image of the test chart produced in reflection by the external surface of the glazing on the outside of the glazing, and the computation of a representative quantity includes the computation of a density of the elements.

Abstract: A system for testing MEMS-structures includes a microforce sensor, two or more multi-axis micropositioning units, at least one electrical probe and a sample holder on which a MEMS-structure is mounted. At least one of the multi-axis micropositioning units is motorized and at least one additional micropositioning unit is equipped with at least one electrical probe to apply electrical signals or to measure electrical signals at one or multiple locations on the MEMS structure. The system with the aforementioned components allows a combined electrical and probe-based mechanical testing of MEMS-structures.

Abstract: A de-noising method for remote images of ground buildings using spectrum constraints. The method includes: 1) obtaining a reference image of ground buildings from a remote image database of the ground buildings, performing a Fourier transformation on the reference image to obtain an amplitude spectrum, and performing a threshold segmentation, an erosion operation and a dilation operation successively on the amplitude spectrum to obtain a binary template of spectrum of the ground buildings; and 2) obtaining a real-time image of the ground buildings by a high-speed aircraft, performing a Fourier transformation on the real-time image to obtain a spectrum, filtering the spectrum of the real-time image in frequency domain by the binary template of spectrum of the ground buildings, and performing an inverse Fourier transformation thereon to generate a filtered real-time image of the ground buildings.

Abstract: A method of designing patterns of semiconductor devices includes forming a plurality of tiles having patterns on a wafer, measuring the patterns of the plurality of tiles, analyzing the measurements of the patterns and determining a tile having such a size that the measurements linearly vary according to a design size and pattern density, and modifying the pattern density of the determined tile.

Abstract: An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.

Abstract: Method for detecting a surface flaw of an object using an electronic device includes requesting a detection device to control a camera unit to capture a current image of a test object placed on the detection device. The current image includes a sidewall image and a reflected image. The method obtains the current image, and detects whether the sidewall image has a surface flaw. When the sidewall image has a surface flaw, a rotation angle of the test object is determined based on the reflected image. The method obtains a standard sidewall image of a standard object stored in a storage device of the electronic device, based on the rotation angle, compares the sidewall image with the standard sidewall image, and determines and displays a position of the surface flaw on a sidewall of the test object based on the comparison.

Abstract: A lithography apparatus includes: a shield including a shield member having an aperture formed therein and having a first edge and a second edge defining the aperture; a driving mechanism including a rotation mechanism configured to rotate the shield member and a translation mechanism configured to translate the shield member; and a controller configured to control the driving mechanism so as to sequentially perform patterning.

Abstract: A method for determining overlay between layers of a multilayer structure may include obtaining a given image representing the multilayer structure, obtaining expected images for layers of the multilayer structure, providing a combined expected image of the multilayer structure as a combination of the expected images of said layers, performing registration of the given image against the combined expected image, and providing segmentation of the given image, thereby producing a segmented image, and maps of the layers of said multilayered structure. The method may further include determining overlay between any two selected layers of the multilayer structure by processing the maps of the two selected layers together with the expected images of said two selected layers.

Abstract: Portable apparatus for identifying and mitigating defects in electronic devices disposed on substrates or windows wherein such defects can be visually perceived by the end user and wherein the substrates or windows may include flat panel displays, photovoltaic windows, electrochromic devices, and the like, particularly electrochromic windows.

Abstract: Disclosed is an apparatus for handling electronic components. The apparatus comprises: i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components.