Composite; I.e., Plural, Adjacent, Spatially Distinct Metal Components (e.g., Layers, Etc.) Patents (Class 428/548)
  • Patent number: 6706416
    Abstract: A method of producing a corrosion resistant ferrous product is disclosed. The product is produced by rolling a heated billet which comprises a mass of mild steel swarf in a stainless steel jacket. Two reducing agents are present in the jacket when the billet is heated. The first reducing agent is in the form of powdered aluminum, titanium turnings or other metal having a greater affinity for oxygen than chrome and which promotes the formation of CO rather than CO2 from air or oxygen which enters or evolves in the billet above about 800° C. The second reducing agent is in gaseous or vapour form substantially below that temperature. The second reducing agent may be provided by premixing with the swarf such substances as ammonium chloride or urea, which dissociate to form reducing gases when heated. Alternatively, the billet can be heated in a reducing furnace and the gas in the furnace may act as the second reducing agent.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: March 16, 2004
    Inventor: Antonino Giorgio Cacace
  • Publication number: 20040021397
    Abstract: An improved magnetoelectric composite which incorporates LaSrMn or LaCaMn oxides as a magnetostrictive composition are described. The magnetostrictive composition preferably has the formula La0.7Sr0.3MnO3 or La0.7Ca0.3MnO3. The composites preferably have a magnetostrictive layer joined to a piezoelectric layer. The composites are useful for sensors, read-heads, storage media and high frequency transducer devices.
    Type: Application
    Filed: January 30, 2003
    Publication date: February 5, 2004
    Applicant: Oakland University
    Inventor: Gopalan Srinivasan
  • Patent number: 6682817
    Abstract: A powder of a composite material comprising a non-evaporable getter material with a palladium coating continuously sorbs hydrogen. Embodiments in which the coverage of the palladium coating over the particles of the NEG material is complete can sorb hydrogen without the need for an activation treatment. Other embodiments in which the palladium coverage is less than total but greater than about 10% can also sorb gaseous species other than hydrogen. Loose powders, pressed powders, and sintered powders of the composite material are incorporated into getter devices and into the evacuated spaces of double-walled pipes, dewars, and thermal bottles. Methods for preparing powders of these composite materials utilize evaporative, sputter, and CVD deposition techniques. Another method prepares powders of the composite material by a liquid phase impregnation process.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: January 27, 2004
    Assignee: SAES Getters S.p.A.
    Inventors: Paolo della Porta, Claudio Boffito, Luca Toia
  • Publication number: 20040013897
    Abstract: A brazed sintered compact composed of first and second components, which are easily positioned relative to each other, enabling the provision of a good joining clearance. If a protrusion 3 of a first component 1 is fitted into a recess 13 of a second component 10, both components are able to be positioned relative to each other. Simultaneously, a joining clearance A can be easily obtained between a joining surface 2 of the first component 1 and a joining surface 12 of the second component 10, corresponding to a dimensional difference therebetween. Also, an inner side surface 4a of a storage groove 4 is aligned with a right or left end 11a of a leg 11, disposed opposite to the inner side surface 4a. Accordingly, it is possible to allow as much brazing material as properly needed to permeate between the joining surfaces 2 and 12. Further, as the surface tension of the surplus brazing material becomes unlikely to be developed in the storage grooves 4, 4′, the backflow of the material is prevented.
    Type: Application
    Filed: May 9, 2003
    Publication date: January 22, 2004
    Applicant: MITSUBISHI MATERIALS CORPORATION
    Inventors: Katsuhiko Yano, Toshiro Harakawa
  • Patent number: 6679157
    Abstract: A lightweight armor system may comprise a substrate having a graded metal matrix composite layer formed thereon by thermal spray deposition. The graded metal matrix composite layer comprises an increasing volume fraction of ceramic particles imbedded in a decreasing volume fraction of a metal matrix as a function of a thickness of the graded metal matrix composite layer. A ceramic impact layer is affixed to the graded metal matrix composite layer.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: January 20, 2004
    Assignee: Bechtel BWXT Idaho LLC
    Inventors: Henry S. Chu, H. Alan Bruck, Gary C. Strempek, Dominic J. Varacalle, Jr.
  • Patent number: 6670048
    Abstract: A sintered sprocket is provided in which surface pressure resistance can be improved without using a forging processing. An Fe-based sintered alloy which contains C at 0.2 to 0.5% by weight, Mo at 0.2 to 1.0% by weight, and Ni at 0.2 to 1.0% by weight, and which exhibits a metallic structure in which an internal base layer comprises ferrite and bainite and in which the ferrite adjoins voids, is subjected to a rolling and is then subjected to carburizing and hardening.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: December 30, 2003
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventor: Akira Fujiwara
  • Publication number: 20030215623
    Abstract: The present invention relates to a thermosetting resin composition with excellent electrical properties comprising (a) one or more terminally unsaturated urethane resins, (b) styrene, and (c) brominated styrene. The aforementioned composition finds great utility as a printed circuit board laminate suitable for use at microwave frequencies.
    Type: Application
    Filed: June 11, 2003
    Publication date: November 20, 2003
    Applicant: GIL Technologies, a division of The Alpha Corporation
    Inventors: Scott A. Lane, Donald C. Rollen, Timothy W. Austill
  • Publication number: 20030215641
    Abstract: Interference pigment flakes and foils are provided which have color shifting properties. The pigment flakes can have a symmetrical coating structure on opposing sides of a reflector layer, can have an asymmetrical coating structure with all of the layers on one side of the reflector layer, or can be formed with encapsulating coatings around a core reflector layer. The coating structure of the flakes and foils includes a reflector layer, a dielectric layer on the reflector layer, and a titanium-containing absorber layer on the dielectric layer. The pigment flakes and foils exhibit a discrete color shift so as to have a first color at a first angle of incident light or viewing and a second color different from the first color at a second angle of incident light or viewing. The pigment flakes can be interspersed into liquid media such as paints or inks to produce colorant compositions for subsequent application to objects or papers.
    Type: Application
    Filed: April 14, 2003
    Publication date: November 20, 2003
    Applicant: Flex Products, Inc.
    Inventors: Roger W. Phillips, Charlotte R. LeGallee, Paul T. Kohlmann, Vladimir Raksha, Alberto Argoitia
  • Publication number: 20030206818
    Abstract: A clad article of a substrate of one powdered metal that is clad with a second dissimilar powdered metal. A separation layer may be provided between the substrate and the clad layer to separate these layers during consolidation and to facilitate bonding thereof. The consolidation operation may be performed by hot isostatic pressing of the powders within a deformable container.
    Type: Application
    Filed: June 10, 2003
    Publication date: November 6, 2003
    Applicant: Crucible Materials Corp.
    Inventors: Frank J. Rizzo, Brian A. Hann, Joseph F. Perez
  • Patent number: 6635357
    Abstract: The lightweight bulletproof metal matrix macrocomposites (MMMC) contain (a) 10-99 vol. % of permeable skeleton structure of titanium, titanium aluminide, Ti-based alloys, and/or mixtures thereof infiltrated with low-melting metal selected from Al, Mg, or their alloys, and (b) 1-90 vol. % of ceramic and/or metal inserts positioned within said skeleton, whereby a normal projection area of each of said inserts is equal to or larger than the cross-section area of a bullet or a projectile body. The MMMC are manufactured as flat or solid-shaped, double-layer, or multi-layer articles containing the same inserts or different inserts in each layer, whereby insert projections of each layer cover spaces between inserts of the underlying layer. The infiltrated metal contains 1-70 wt. % of Al and Mg in the balance, optionally, alloyed with Ti, Si, Zr, Nb, V, as well as with 0-3 wt. % of TiB2, SiC, or Si3N4 sub-micron powders, to promote infiltrating and wetting by Al-containing alloys.
    Type: Grant
    Filed: February 28, 2002
    Date of Patent: October 21, 2003
    Inventors: Vladimir S. Moxson, Eugene Ivanov
  • Patent number: 6635362
    Abstract: Coating for high temperature gas turbine components that include a MCrAlX phase, and an aluminum-rich phase, significantly increase oxidation and cracking resistance of the components, thereby increasing their useful life and reducing operating costs. The aluminum-rich phase includes aluminum at a higher concentration than aluminum concentration in the MCrAlX alloy, and an aluminum diffusion-retarding composition, which may include cobalt, nickel, yttrium, zirconium, niobium, molybdenum, rhodium, cadmium, indium, cerium, iron, chromium, tantalum, silicon, boron, carbon, titanium, tungsten, rhenium, platinum, and combinations thereof, and particularly nickel and/or rhenium. The aluminum-rich phase may be derived from a particulate aluminum composite that has a core comprising aluminum and a shell comprising the aluminum diffusion-retarding composition.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: October 21, 2003
    Inventor: Xiaoci Maggie Zheng
  • Patent number: 6627326
    Abstract: An extruded magnetic structure includes a first layer of low alloy steel compressed powder and a second layer of rare earth metal compressed powder circumferentially disposed around the first layer. A third layer of compressed powder may be circumferentially disposed around the second layer.
    Type: Grant
    Filed: July 24, 2002
    Date of Patent: September 30, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: Madhu Sudan Chatterjee, Andrzej Marian Pawlak, Vinod K. Sikka
  • Patent number: 6623690
    Abstract: A clad article of a substrate of one powdered metal that is clad with a second dissimilar powdered metal. A separation layer may be provided between the substrate and the clad layer to separate these layers during consolidation and to facilitate bonding thereof. The consolidation operation may be performed by hot isostatic pressing of the powders within a deformable container.
    Type: Grant
    Filed: July 19, 2001
    Date of Patent: September 23, 2003
    Assignee: Crucible Materials Corporation
    Inventors: Frank J. Rizzo, Brian A. Hann, Joseph F. Perez
  • Patent number: 6589667
    Abstract: The invention concerns an iron powder characterised by spherical form and a porous structure throughout. The powder particles have an average particle diameter between 10 and 300 &mgr;m, a specific surface area of at least 100 m2/kg, a flowability of at least 35 s/50 g, a reactivity of less than 5 minutes and an apparent density lower than about 4 g/cm3. The iron powder is prepared by subjecting a dry powder of essentially spherical iron-containing agglomerates to a heat treatment in a reducing atmosphere at a temperature and time sufficient for obtaining particles essentially consisting of metallic iron and having a porous structure throughout. The obtained particles may then be subjected to sintering at a time and temperature sufficient for obtaining the required strength.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: July 8, 2003
    Assignee: Höganäs AB
    Inventors: Lars Hultman, Sven Allroth
  • Patent number: 6569529
    Abstract: Interference pigment flakes and foils are provided which have color shifting properties. The pigment flakes can have a symmetrical coating structure on opposing sides of a reflector layer, can have an asymmetrical coating structure with all of the layers on one side of the reflector layer, or can be formed with encapsulating coatings around a core reflector layer. The coating structure of the flakes and foils includes a reflector layer, a dielectric layer on the reflector layer, and a titanium-containing absorber layer on the dielectric layer. The pigment flakes and foils exhibit a discrete color shift so as to have a first color at a first angle of incident light or viewing and a second color different from the first color at a second angle of incident light or viewing. The pigment flakes can be interspersed into liquid media such as paints or inks to produce colorant compositions for subsequent application to objects or papers.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: May 27, 2003
    Assignee: Flex Product, Inc.
    Inventors: Roger W. Phillips, Charlotte R. LeGallee, Paul T. Kohlmann, Vladimir Raksha, Alberto Argoitia
  • Patent number: 6569380
    Abstract: A method to form a combined enclosure and heat sink structure for a semiconductor device is achieved. A first feedstock comprising a first mixture of powdered metal materials, lubricants, and binders is prepared. A second feedstock comprising a second mixture of powdered metal materials, lubricants, and binders is prepared such that the difference between the sintering shrinkage of each of the first and second feedstocks is less than 1%. The first and second feedstocks are pressed to form a first green part having an enclosure shape and a second green part having a heat sink shape. The lubricants and the binders from said first and second green parts are removed to form a first powdered skeleton and a second powdered skeleton. The first and second powdered skeletons are sintered to complete the combined enclosure and heat sink structure. The first and second powdered skeletons are in intimate contact during the sintering.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: May 27, 2003
    Assignee: Advanced Materials Technologies Pte, Ltd.
    Inventors: Kay-Leong Lim, Lye-King Tan, Eng-Seng Tan
  • Publication number: 20030082395
    Abstract: Masters for servo printing, systems containing such masters and methods of using such masters are disclosed.
    Type: Application
    Filed: November 1, 2001
    Publication date: May 1, 2003
    Inventor: Michael Mallary
  • Patent number: 6541124
    Abstract: A drill resistant plate, which presents a rough surface of hardened particles to drilling attack, and which tends to snap or destroy drill bits before they can began drilling. The plate is made by brazing hard particles into a matrix of brazing material attached to a steel plate. Nickel-Silver brazing material is used to form the matrix on the steel plate, and tungsten carbide particles of 8-10 mesh are secured within the matrix, with the hard particles of tungsten carbide partially exposed, presenting a roughened surface with angular pieces of tungsten carbide to the drilling attack.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: April 1, 2003
    Assignee: Rhino Metals, Inc.
    Inventor: Donald K. Suggs
  • Patent number: 6534194
    Abstract: In accordance with the invention a reactive multilayer foil is fabricated by providing an assembly (stack or multilayer) of reactive layers, inserting the assembly into a jacket, deforming the jacketed assembly to reduce its cross sectional area, flattening the jacketed assembly into a sheet, and then removing the jacket. Advantageously, the assembly is wound into a cylinder before insertion into the jacket, and the jacketed assembly is cooled to a temperature below 100° C. during deforming. The resulting multilayer foil is advantageous as a freestanding reactive foil for use in bonding, ignition or propulsion.
    Type: Grant
    Filed: May 1, 2001
    Date of Patent: March 18, 2003
    Assignee: Johns Hopkins University
    Inventors: Timothy P. Weihs, Michael Reiss
  • Publication number: 20030044631
    Abstract: The present invention relates to thermally conductive, elastomeric pads and methods for manufacturing such pads. The methods involve injection-molding a thermally conductive composition comprising about 30 to 60% by volume of an elastomer polymer matrix and about 25 to 60% by volume of a thermally conductive filler material. The resultant pads have heat transfer properties and can be used as a thermal interface to protect heat-generating electronic devices.
    Type: Application
    Filed: August 22, 2002
    Publication date: March 6, 2003
    Inventors: E. Mikhail Sagal, Kevin A. McCullough, James D. Miller
  • Publication number: 20030044609
    Abstract: A rare earth borate in the form of substantially spherical, uniform diameter particles having an average particle diameter of 0.5-2 &mgr;m is prepared by mixing substantially spherical rare earth oxide co-precipitates having an average particle diameter of 0.5-2 &mgr;m with boric acid or boron oxide, and heating the mixture at 600-1100° C. for reaction. It is a useful raw material for phosphor manufacture.
    Type: Application
    Filed: January 29, 2002
    Publication date: March 6, 2003
    Inventors: Kazuhiro Wataya, Miyuki Ohyama
  • Patent number: 6522237
    Abstract: An electrode for a PTC thermistor of the present invention includes a base layer having electrical conductivity and a sintered layer formed on the base layer. The sintered layer is formed by sintering a conductive powder and has electrical conductivity, and has roughness on a surface thereof. Thus, the present invention can provide an electrode for a PTC thermistor that has a large adhesion to the conductive polymer and can be produced easily.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: February 18, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiko Ito, Masakazu Tanahashi, Toshiro Kume, Kouichi Morimoto, Junji Kojima, Emiko Igaki
  • Patent number: 6514627
    Abstract: A plurality of catalyst disks pressed from porous catalyst material are stacked one on the other and together sintered with the application of pressure to make a stacked reactor for hydrogen production from hydrocarbons. To form especially tight seams the catalyst disks have projections formed in the area of contact with an adjacent catalyst disk. Hollow spaces formed in the catalyst disk or formed by two adjacent catalyst disks have a system for supporting the hollow spaces, as for example a cooper grid placed in the hollow space, which can be covered at least partially by a metal sheet or supporting bars pressed onto the catalyst disk.
    Type: Grant
    Filed: July 21, 1999
    Date of Patent: February 4, 2003
    Assignee: Ballard Power Systems AG
    Inventors: Dietmar Heil, Oskar Lamla, Martin Schübler
  • Patent number: 6506226
    Abstract: The invention relates to a hard metal or cermet body with a hard material phase consisting of WC and/or at least one carbide, nitride, carbonitride and/or oxicarbonitride of at least one of the elements from group IVa, Va, or VIa of the periodic table and a binding metal phase consisting of Fe, Co and/or Ni, said binding metal phase making up 3 to 25 mass %. In particular, WC crystallites should protrude beyond the hard metal or cermet surface of the by 2 to 20 &mgr;m in order to improve the adhesion of surface layers that are applied.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: January 14, 2003
    Assignee: Widia GmbH
    Inventors: Limin Chen, Walter Lengauer, Hans Werner Daub, Klaus Dreyer, Dieter Kassel, José Garcia, Georg Korb
  • Patent number: 6500355
    Abstract: A conductive structure in a silicon wafer for preventing plasma damage. The wafer includes a plurality of dies and a plurality of scribe lines between the dies. The semiconductor substrate of this wafer further includes a plurality of patterned conductive layers. The conductive structure comprises of a plurality of ground wires and a plurality of contacts. The ground wires are distributed inside the scribe lines and are positioned at least in the uppermost conductive layer. The contacts are used for connecting the ground wires and the semiconductor substrate electrically. When other conductive layers other than the uppermost conductive layer also contain ground wire connections, the ground wires in different conductive layers are electrically connected by plugs.
    Type: Grant
    Filed: November 16, 2000
    Date of Patent: December 31, 2002
    Assignee: United Microelectronics Corp.
    Inventor: Chung-Chih Chen
  • Publication number: 20020192485
    Abstract: A printed circuit board of the present invention is formed of an electrical insulating base material with through holes that are formed in a thickness direction of the electrical insulating base material and are filled with an electrical conductor; the electrical insulating base material including a core layer formed by impregnating a holder with a resin and resin layers formed on both sides of the core layer; and wiring layers that are formed on both surfaces of the electrical insulating base material into a predetermined pattern and are electrically connected to each other by the electrical conductor. The wiring layer is embedded in at least one of the resin layers. The resin layers on the both sides have different thicknesses from each other, and a thinner layer out of the resin layers has a thickness equal to or smaller than a mean particle diameter of an electrically conductive filler contained in the electrical conductor.
    Type: Application
    Filed: August 19, 2002
    Publication date: December 19, 2002
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shozo Ochi, Fumio Echigo, Yoji Ueda
  • Publication number: 20020187362
    Abstract: A method is provided for manufacturing a multi-layered magnetic rod in which a steel powder is reduced and extruded through a die. To improve the magnetic properties, a layer of rare earth magnetic power formed around the low alloy steel in the extruder chamber. A second layer of coating formed around the rare earth powder and the three layers are co-extruded through the die to produce a layered rod having improved magnetic properties. The resulting magnetic rod may be machined using conventional machining methods.
    Type: Application
    Filed: July 24, 2002
    Publication date: December 12, 2002
    Inventors: Madhu Sudan Chatterjee, Andrzej Marian Pawlak, Vinod K. Sikka
  • Patent number: 6485843
    Abstract: A surface-mount device attach method for attaching solder ball-grid array or solder column-grid array surface-mount devices to a printed circuit board where the conventional solder mask structure is replaced with a layer of plated nickel to prevent printed circuit board warping caused by the mismatch in the coefficients of thermal expansion between the conventional solder mask and the printed circuit board. A native nickel-oxide layer that forms on the surface of the exposed portions of the plated nickel layer functions as a solder dam.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: November 26, 2002
    Assignee: Altera Corporation
    Inventor: Mohammad Eslamy
  • Patent number: 6486413
    Abstract: A substrate is coated with a conductive layer, which comprises a conductive layer of bonded ultrafine metal particles formed on the top surface thereof. The ultra fine metal particles have a diameter of 1-20 nm, and the substrate is of a flexible high polymer material. Since the conductive layer is formed by bonded layer of the ultrafine metal particles, an extremely thin layer having high conductivity can be formed. This structure enables the formation of a flexible printed circuit board with high-density interconnects or a transparent conductive film provided with both transparency and conductivity. Conventional vacuum equipments and complicated processes are not necessary for forming the conductive layer on the substrate.
    Type: Grant
    Filed: November 15, 2000
    Date of Patent: November 26, 2002
    Assignee: Ebara Corporation
    Inventor: Naoaki Ogure
  • Patent number: 6469090
    Abstract: An electrically conductive liquid silicone rubber composition having (A) 100 parts by weight of an organopolysiloxane having a viscosity of 10-100,000 centipoise at 25° C., (B) 1-100 parts by weight of a finely divided silica powder, (C) 30-700 parts by weight of a metal powder or an electrically conductive metal-plated powder, and (D) a curing agent in an amount sufficient to cure the organopolysiloxane. The composition has a low volumetric resistivity, a stable electrical resistance and can be injection-molded and cured to give an outstanding silicone rubber that is useful in electrical components and electrical contacts employed in high-conductivity applications.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: October 22, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Syuuichi Azechi, Tsutomu Nakamura, Motoo Fukushima
  • Patent number: 6461563
    Abstract: The invention shows how powder injection molding may be used to form a continuous body having multiple parts, each of which has different physical properties such as magnetic characteristics or hardness. This is accomplished through careful control of the relative shrinkage rates of these various parts. Additionally, care is taken to ensure that only certain selected physical properties are allowed to differ between the parts while others may be altered through relatively small changes in the composition of the feedstocks used. An additional application of the present invention is a process for forming, in a single integrated operation, an object that is contained within an enclosure while not being attached to said enclosure. This is accomplished by causing the shrinkage rate of the object to be substantially greater than that of the enclosure. As a result, after sintering, the object is found to have detached itself from the enclosure and is free to move around therein.
    Type: Grant
    Filed: December 11, 2000
    Date of Patent: October 8, 2002
    Assignee: Advanced Materials Technologies Pte. Ltd.
    Inventors: Kay-Leong Lim, Lye-King Tan, Eng-Seng Tan, Robin Baumgartner
  • Publication number: 20020136917
    Abstract: A metallic tube for transporting corrosive, abrasive, and erosive industrial flow streams. The tube has an outer tube material consisting of consolidated metallic powder bonded to an inner tube material consisting of a corrosion- or wear-resistant, weld- or spray-deposited material. The tube has a bend in it of at least about 45°, such as a U-bend, which would normally inhibit the weld- or spray-deposition of the corrosion- or wear-resistant inner tube material.
    Type: Application
    Filed: March 26, 2001
    Publication date: September 26, 2002
    Inventors: Damadoran Raghu, James B. C. Wu, John C. Hebeisen, Stephen J. Mashl
  • Patent number: 6440578
    Abstract: An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: August 27, 2002
    Assignee: NGK Insulators, Ltd.
    Inventors: Masayuki Shinkai, Masahiro Kida
  • Publication number: 20020102426
    Abstract: A method of ion implantation using oxygen backfill and a modified surface layer formed therefrom are provided. The method of ion implantation includes the steps of placing a substrate metal in an ion implantation vacuum chamber, introducing oxygen into the ion implantation vacuum chamber and directing a beam of ions at the substrate metal. The modified surface includes a substrate metal and implanted atoms at a surface of the substrate metal. The implanted atoms are integrated with the substrate metal. The substrate metal has an implanted atom concentration of at least 5 atomic % to a depth of over 250 Å.
    Type: Application
    Filed: November 1, 2001
    Publication date: August 1, 2002
    Inventors: Bruce D. Sartwell, Paul M. Natishan
  • Publication number: 20020100683
    Abstract: A method includes combining a solid first material and a solid second material and melting at least a portion of the first material sufficient to coat the second material and any remaining first material. An approximately homogenous distribution of the second material can be formed throughout the liquid phase of the first material. The first material liquid phase can then be solidified to define a composite target blank exhibiting an approximately homogenous distribution of the solid second material in a matrix of the solidified first material. The first material can comprise Se and the second material can comprise Ge. The composite target blank can include at least about 50 vol % matrix. The first and second materials can be powdered metals. Accordingly, a physical vapor deposition target can include a matrix of a first material and an approximately homogenous distribution of particles of a second material throughout the first material matrix.
    Type: Application
    Filed: January 30, 2001
    Publication date: August 1, 2002
    Inventors: Vasanth N. Mohan, Jianxing Li, Timothy A. Scott
  • Patent number: 6426146
    Abstract: This invention relates to a treated copper foil, comprising: a copper foil with a layer of zinc oxide adhered to the base surface of at least on side of said copper foil, said layer of zinc oxide having a thickness of about 3 Å to about 80 Å; and a layer of a trivalent chromium oxide adhered to said layer of zinc oxide. In one embodiment, the foil has a layer of a silane coupling agent adhered to the layer of trivalent chromium oxide. The invention also relates to a process for applying the layer of zinc oxide and the layer of trivalent chromium oxide to the copper foil. The invention also relates to laminates comprising a dielectric substrate and the foregoing copper foil adhered to the substrate. In one embodiment, the dielectric substrate is comprised of an epoxy resin made with a curing agent that is other than an amine curing agent.
    Type: Grant
    Filed: February 10, 2000
    Date of Patent: July 30, 2002
    Assignee: GA-TEK Inc.
    Inventors: Thomas J. Ameen, Edward Czapor
  • Patent number: 6426154
    Abstract: The present invention provides a ceramic circuit board comprising: a ceramic substrate and a metal circuit plate bonded to the ceramic substrate through a brazing material layer; wherein the brazing material layer is composed of Al—Si group brazing material and an amount of Si contained in the brazing material is 7 wt % or less. In addition, it is preferable to form a thinned portion, holes, or grooves to outer peripheral portion of the metal circuit plate. According to the above structure of the present invention, there can be provided a ceramic circuit board having both high bonding strength and high heat-cycle resistance, and capable of increasing an operating reliability as electronic device.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: July 30, 2002
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Naba, Hiroshi Komorita, Noritaka Nakayama, Kiyoshi Iyogi
  • Patent number: 6414078
    Abstract: In a silicone rubber composition comprising an organopolysiloxane having at least two aliphatic unsaturated groups and a curing agent, metallized particles of inorganic material or organic resin are effectively dispersed to give a conductive composition which cures into a conductive silicone rubber part having a low and stable volume resistivity.
    Type: Grant
    Filed: October 6, 2000
    Date of Patent: July 2, 2002
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Motoo Fukushima, Tsutomu Nakamura, Mikio Iino
  • Patent number: 6395406
    Abstract: A method for preparing an aluminum alloy-containing coating composition is described. A slurry containing a selected amount of aluminum is combined with at least one additional slurry containing a selected amount of a second metal which forms an alloy with aluminum. The resulting slurry mixture is applied to a metal substrate, and then heated to form a substantially devolatilized coating. The coating then receives a secondary heat treatment. Related compositions and articles are also described, as are processes for repairing a damaged or worn coating, utilizing the slurry.
    Type: Grant
    Filed: April 24, 2000
    Date of Patent: May 28, 2002
    Assignee: General Electric Company
    Inventor: D Sangeeta
  • Patent number: 6391082
    Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited.
    Type: Grant
    Filed: July 2, 1999
    Date of Patent: May 21, 2002
    Assignee: Holl Technologies Company
    Inventor: Richard A. Holl
  • Patent number: 6372362
    Abstract: A method for forming a composite vapor-deposited film one side of which suitable for vapor-deposition on a phosphor surface of a CRT, such as a color television picture tube, has high light reflectivity, and the other side of which has a property to absorb radiant heat, and a composite vapor-deposition material suitable for vacuum deposition are disclosed. The composite vapor-deposition material has a high vapor-pressure metal envelope and a low vapor-pressure metal in the core region of the envelope. Low vapor-pressure metal powder should preferably be dispersed and held by high vapor-pressure metal powder in the core region. Vacuum deposition using this composite vapor-deposition material yields a composite deposited film having a composition comprising almost 100% of the high vapor-pressure metal formed in the initial stage of evaporation, and a composition comprising 100% of the low vapor-pressure metal formed in the final stage of evaporation.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: April 16, 2002
    Assignee: Hitachi Metals, Ltd.
    Inventors: Shinji Furuichi, Shigetoshi Takashima
  • Patent number: 6361878
    Abstract: A method of providing a roughened bond coat, for example in a thermal barrier coating system, comprises providing an oxidation-resistant plasma-sprayed layer onto a substrate and disposing a slurry overlayer on the oxidation-resistant plasma-sprayed layer. These steps form a roughened bond coat possessing an uneven, undulated, and irregular surface. A roughened bond coat in a thermal barrier coating system reduces de-bonding of the bond coat and a thermal barrier coating layer, which is desirable to maintain the insulation features of the thermal barrier coating system.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: March 26, 2002
    Assignee: General Electric Company
    Inventors: Ann Melinda Ritter, Melvin Robert Jackson, Curtis Alan Johnson
  • Patent number: 6358630
    Abstract: This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.
    Type: Grant
    Filed: November 26, 1999
    Date of Patent: March 19, 2002
    Assignee: Ibiden Co., Ltd.
    Inventors: Kiyotaka Tsukada, Hiroyuki Kobayashi, Yoshikazu Ukai, Kenji Chihara, Yoshihide Tohyama, Yasuyoshi Okuda, Yoshihiro Kodera
  • Patent number: 6350294
    Abstract: The present invention relates to powder-metallurgically produced composite material comprising a matrix of a metal with a melting point of at most 1,200° C. and a granular additive which consists of at least two refractory components embedded in said matrix, characterized in that the refractory components are present as mixed crystals or intermetallic phases. In one embodiment of the invention one or a first group of refractory component(s) has a melting point in the range of 1,500 to 2,400° C. and the second or the second group of refractory component(s) has a melting point above 2,400° C. The composite material is produced by heating a pulverized mixture of the refractory components, thus converting it into a mixed crystal or an intermetallic phase, and then combining the powder obtained by cooling and pulverizing with a metal matrix having a melting point of at most 1,200° C. by means of powder-metallurgy.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: February 26, 2002
    Assignee: Louis Renner GmbH
    Inventors: Gerd Renner, Udo Siefken
  • Publication number: 20020004141
    Abstract: The magnet has hard magnetic grains (K), with the hard magnetic grains (K) separated from one another in a surface layer of the magnet by a first phase (P1), while the hard magnetic grains (K) in the remaining part of the magnet are separated from one another through a nonmagnetic second phase (P2). The first phase (P1) is more corrosion resistant than the second phase (P2), so that the surface layer serves as corrosion protection. The first phase (P1) has, in addition to elements of which the second phase (P2) consists, at least one further element.
    Type: Application
    Filed: May 18, 2001
    Publication date: January 10, 2002
    Inventors: Peter Schrey, Wilhelm Fernengel, Lothar Zapf
  • Publication number: 20010052375
    Abstract: Abradable coatings for turbine engine shrouds are formed from biscuits formed of silicon-diffused powdered alloy compositions which are processed with an HF precursor to strip oxides from the coating during processing, the alloy blends comprising MCrAl(Y)n alloys in which n is 0, 1 or more.
    Type: Application
    Filed: November 18, 1998
    Publication date: December 20, 2001
    Inventors: GEORGE K. SIEVERS, EUGENE V. CLARK
  • Patent number: 6331361
    Abstract: A method for manufacturing and repair wherein a component composed of equiaxed cast or wrought alloys has at least one section joined thereto composed of directionally solidified or single crystal material
    Type: Grant
    Filed: July 6, 2000
    Date of Patent: December 18, 2001
    Assignee: Hickham Industries, Inc.
    Inventors: Hans van Esch, Wayne Greaves
  • Patent number: 6322901
    Abstract: A coated nanocrystal capable of light emission includes a substantially monodisperse nanoparticle selected from the group consisting of CdX, where x=S, Se, Te and an overcoating of ZnY, where Y=S, Se, uniformly deposited thereon, said coated nanoparticle characterized in that when irradiated the particles exhibit photoluminescence in a narrow spectral range of no greater than about 60 nm, and most preferably 40 nm, at full width half max (FWHM). The particle size of the nanocrystallite core is in the range of about 20 Åto about 125 Å, with a deviation of less than 10% in the core. The coated nanocrystal exhibits photoluminescence having quantum yields of greater than 30%.
    Type: Grant
    Filed: November 13, 1997
    Date of Patent: November 27, 2001
    Assignee: Massachusetts Institute of Technology
    Inventors: Moungi Bawendi, Klavs F. Jensen, Bashir O. Dabbousi, Xavier Rodriguez-Viejo, Frederic Victor Mikulec
  • Patent number: 6299658
    Abstract: In a cemented carbide, at least one compound 3 including a carbide, a nitride or carbo-nitride of at least one component selected from IVa, Va and VIa group elements or a solid solution thereof exists in at least some WC crystal grains 1. Preferably the compound 3 is in the form of compound grains 3 comprising a carbide, a nitride or a carbo-nitride of Ti, Zr, Hf or W or a solid solution thereof, having an average grain diameter smaller than 0.3 &mgr;m. The compound grains make up at most 10% of the cross-sectional area of the WC crystal grains that contain the compound grains, while at least 10% of the total cross-sectional area of the cemented carbide is made up of such WC crystal grains that contain the compound grains.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: October 9, 2001
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hideki Moriguchi, Akihiko Ikegaya
  • Publication number: 20010026836
    Abstract: A line-type film-forming method for sequentially forming aluminum metallized films and silicone plasma polymerized protective films on a plurality of synthetic-resin base materials. The films are formed by moving a case, which houses the synthetic-resin base materials, successively in line through an aluminum metallizing chamber and a plasma polymerized film forming chamber so as to form a reflector that can be mounted in a discharge headlamp.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 4, 2001
    Inventor: Teruaki Inaba