Abstract: A method, apparatus and system with an autonomic, self-healing polymer capable of slowing crack propagation within the polymer and slowing delamination at a material interface.

Abstract: Provided is a pixel of a multi-stacked complementary metal-oxide semiconductor (CMOS) image sensor and a method of manufacturing the image sensor including a light-receiving unit that may include first through third photodiode layers that are sequentially stacked, an integrated circuit (IC) that is formed below the light-receiving unit, electrode layers that are formed on and below each of the first through third photodiode layers, and a contact plug that connects the electrode layer formed below each of the first through third photodiode layers with a transistor of the IC.

Abstract: Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy.

Abstract: An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate.

Abstract: A method of constructing a solar cell panel is disclosed that includes providing a solar cell that has a front side and a back side, where the front side faces the sun during normal operation, heating a thermoplastic polyimide to at least its reflow temperature, flowing the thermoplastic polyimide onto the back side of the solar cell while heated to at least its reflow temperature, and cooling the thermoplastic polyimide to a temperature below its reflow temperature to bond the thermoplastic polyimide directly to the solar cell. The direct bonding of the thermoplastic polyimide to the solar cell is accomplished without an adhesive such as RTV adhesives. The method may also include bonding a substrate directly to the thermoplastic polyimide opposite the solar cell.

Abstract: A semiconductor package includes a solid-state imaging element, electrode pad, through-hole electrode, and light-transmitting substrate. The solid-state imaging element is formed on the first main surface of a semiconductor substrate. The electrode pad is formed on the first main surface of the semiconductor substrate. The through-hole electrode is formed to extend through the semiconductor substrate between the first main surface and a second main surface opposite to the electrode pad formed on the first main surface. The light-transmitting substrate is placed on a patterned adhesive to form a hollow on the solid-state imaging element. The thickness of the semiconductor substrate below the hollow when viewed from the light-transmitting substrate is larger than that of the semiconductor substrate below the adhesive.

Abstract: Disclosed are a sealing material sheet for a solar cell module and a method of manufacturing a solar cell module capable of reducing damage to a photoelectric conversion cell and leakage of a sealing material during manufacturing of a solar cell module, and easily manufacturing a high-quality solar cell module. A sealing material sheet for a solar cell module includes transparent resin (A) exhibiting an MFR (190° C., 2.16 kg load) of 10 to 20 g/10 min and transparent resin (B) exhibiting an MFR (190° C., 2.16 kg load) of 30 to 40 g/10 min. The mass ratio ? (=WA/WB) of the transparent resin (A) (mass: WA) and the transparent resin (B) (mass: WB) is 0.7 to 1.5. A solar cell module uses the sealing material sheet for a solar cell module.

Abstract: An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.

Abstract: A semiconductor package structure and a package method thereof are provided. The semiconductor package structure includes a substrate, a sensing chip, a first patterned conductive layer and a electrical connection portion. The substrate has an accommodating portion, a first surface and a second surface opposite to the first surface. The accommodating portion are extended to the second surface from the first surface.

Abstract: A solid-state image sensing device comprises: a light receiving unit for receiving light; a microlens formed above the light receiving unit; a fluorine-containing resin material layer formed on the microlens; and a transparent substrate provided over the fluorine-containing resin material layer. A resin layer adheres the fluorine-containing resin material layer and the transparent substrate.

Abstract: A membrane includes a blend of a silicone polymer and not greater than 25 wt % of an elastomeric component. The membrane has a thickness of at least 1 mm and exhibits a tensile retention index of at least 35%.

Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

Abstract: A method of sealing an electronic device is disclosed, comprising providing an assembly comprising first and second substrates in an opposed relationship, and an electronic device positioned between the first and second substrates; positioning a glass rod against or on the edge of the first and/or second substrate; and heating and softening the glass rod to form a hermetic seal between the first and second substrates and form a hermetically sealed electronic device.

Abstract: An interconnected arrangement of photovoltaic cells is achieved using laminating current collector electrodes. The electrodes comprise a pattern of conductive material extending over a first surface of sheetlike substrate material. The first surface comprises material having adhesive affinity for a selected conductive surface. Application of the electrode to the selected conductive surface brings the first surface of the sheetlike substrate into adhesive contact with the conductive surface and simultaneously brings the conductive surface into firm contact with the conductive material extending over first surface of the sheetlike substrate. Use of the laminating current collector electrodes allows facile and continuous production of expansive area interconnected photovoltaic arrays.

Abstract: A solar cell module includes a wiring sheet formed such that n-type and p-type wirings are alternately arranged in a striped pattern on a surface of a sheet-like insulating substrate, and a back contact solar cell formed such that n-type and p-type electrodes electrically connected to impurity diffusion regions are alternately arranged in a striped pattern on one surface of a semiconductor substrate. The electrodes and the wirings are connected through conductors so as to satisfy a one-to-one relationship. The periphery of the conductor is covered with an insulating resin. An insulator having a composition different from the insulating resin is mounted between the adjacent electrodes on the back contact solar cell.

Abstract: Some embodiments include methods of forming semiconductor constructions in which a semiconductor material sidewall is along an opening, a protective organic material is over at least one semiconductor material surface, and the semiconductor material sidewall and protective organic material are both exposed to an etch utilizing at least one fluorine-containing composition. The etch is selective for the semiconductor material relative to the organic material, and reduces sharpness of at least one projection along the semiconductor material sidewall. In some embodiments, the opening is a through wafer opening, and subsequent processing forms one or more materials within such through wafer opening to form a through wafer interconnect. In some embodiments, the opening extends to a sensor array, and the protective organic material is comprised by a microlens system over the sensor array. Subsequent processing may form a macrolens structure across the opening.

Abstract: A method for producing a photovoltaic module by forming solar cells on a glass plate and contacting at least one layer of liquid encapsulant with the solar cells. The liquid encapsulant has two components. The first component is an acrylic polyol having an average number of hydroxy-functional monomer units per polymer chain from 2 to 25 and Mn from 1,000 to 10,000. The second component is a polyisocyanate with an average functionality of at least two. The molar ratio of non-terminal hydroxy groups in the polyol to isocyanate groups in the polyisocyanate is from 0.5:1 to 1:0.5.

Abstract: An exemplary printable composition of a liquid or gel suspension of diodes comprises a plurality of diodes, a first solvent and/or a viscosity modifier. In other exemplary embodiments a second solvent is also included, and the composition has a viscosity substantially between about 100 cps and about 25,000 cps at about 25° C. In an exemplary embodiment, a composition comprises: a plurality of diodes or other two-terminal integrated circuits; one or more solvents comprising about 15% to 99.9% of any of N-propanol, isopropanol, dipropylene glycol, diethylene glycol, propylene glycol, 1-methoxy-2-propanol, N-octanol, ethanol, tetrahydrofurfuryl alcohol, cyclohexanol, and mixtures thereof; a viscosity modifier comprising about 0.10% to 2.5% methoxy propyl methylcellulose resin or hydroxy propyl methylcellulose resin or mixtures thereof; and about 0.01% to 2.5% of a plurality of substantially optically transparent and chemically inert particles having a range of sizes between about 10 to about 50 microns.

Abstract: A photoelectric conversion device includes: a first substrate of which end portions are cut off so as to slope or with a groove shape; a photodiode and an amplifier circuit over the first substrate; a first electrode electrically connected to the photodiode and provided over one end portion of the first substrate; a second electrode electrically connected to the amplifier circuit and provided over an another end portion of the first substrate; and a second substrate having third and fourth electrodes thereon. The first and second electrodes are attached to the third and fourth electrodes, respectively, with a conductive material provided not only at the surfaces of the first, second, third, and fourth electrodes facing each other but also at the side surfaces of the first and second electrodes to increase the adhesiveness between a photoelectric conversion device and a member on which the photoelectric conversion device is mounted.

Abstract: Disclosed is a solar cell module wherein deterioration of the strength of adhering between a terminal box and an adhesive can be suppressed, while facilitating an adhering step. The solar cell module (1) is provided with the terminal box (3) which is adhered to a solar cell panel (2) with the adhesive (4) therebetween. The terminal box includes an adhesive opening (313), and the adhesive opening has a neck portion (313c) having a width narrower than that of the lower open end (313a) and/or that of the upper open end (313b), and the adhesive opening is filled with the adhesive.

Abstract: A solar cell module is provided that comprises: a solar cell; a connection electrode provided on each of a light-receiving surface and back surface of the solar cell; a conductive resin adhesive arranged on an upper surface of the connection electrode; and a wiring material electrically connected to the solar cell and connected with the connection electrode and the conductive resin adhesive, wherein the conductive resin adhesive changes color upon curing, and the conductive resin adhesive on the upper surface of the connection electrode provided on the light-receiving surface of the solar cell is arranged within a region corresponding to at least one of the connection electrode and the wiring material, on a projection plane parallel with the light-receiving surface and exposed on a light-receiving surface side.

Abstract: The invention relates to the use in a photovoltaic module of a film of a composition as a backsheet or as an encapsulant, this composition comprising, with respect to the total weight of the composition: from 1 to 99% of a polyethylene having an ethylene whose level by weight is greater than or equal to 80% chosen from the homopolymers of ethylene and the copolymers of ethylene and another alpha-olefin; from 99 to 1% of a polyolefin B, other than A, carrying a reactive functional group X chosen from the anhydride carboxylic acids and epoxides. The invention also relates to, the composition additionally comprises a polyolefin C, other than B, which carries a functional group Y capable of reacting with the functional group X. The invention further relates to a photovoltaic module comprising the film which is used of the composition and also a process for the manufacture of this module.

Abstract: A multilayer article having a cell substrate; a thin-film photovoltaic cell disposed on the cell substrate; an encapsulant layer disposed on the photovoltaic cell; and at least one plastic substrate coated on at least one side with one or more transparent, amorphous barrier layers disposed on the encapsulant layer. The invention extends to the process of making the article.

Abstract: Disclosed is a solar cell module wherein deterioration of the strength of adhering between a solar cell panel and a terminal box can be suppressed, while reducing the quantity of an adhesive to be used. The solar cell module (1) is provided with the terminal box (3) which is adhered to the solar cell panel (2) with the adhesive (4) therebetween. The adhesive surface (31a) of the terminal box, said adhesive surface having the solar cell panel (2) adhered thereon, includes a top portion (31f) where the distance to the surface of the solar cell panel (2) is shortest, and an inclined portion (31g) which is configured such that the distance to the surface of the solar cell panel increases toward the side far from the top portion.

Abstract: Methods and devices are provided for absorber layers formed on foil substrate. In one embodiment, a method of manufacturing photovoltaic devices may be comprised of providing a substrate comprising of at least one electrically conductive aluminum foil substrate, at least one electrically conductive diffusion barrier layer, and at least one electrically conductive electrode layer above the diffusion barrier layer. The diffusion barrier layer may prevent chemical interaction between the aluminum foil substrate and the electrode layer. An absorber layer may be formed on the substrate. In one embodiment, the absorber layer may be a non-silicon absorber layer. In another embodiment, the absorber layer may be an amorphous silicon (doped or undoped) absorber layer. Optionally, the absorber layer may be based on organic and/or inorganic materials.

Abstract: A photovoltaic module assembly includes a photovoltaic module and a base layer. The photovoltaic module has a bottom side, a top side, a main body, and a peripheral edge strip. The peripheral edge strip includes a plurality of apertures formed therethrough. The base layer is disposed adjacent the bottom side of the photovoltaic module. The base layer has an underlying portion and a flap portion. The flap portion is folded over the peripheral edge strip of the photovoltaic module, and is disposed adjacent the top side of the photovoltaic module. The flap portion is attached to the underlying portion of the base layer through the plurality of apertures in the peripheral edge strip. The photovoltaic module is thereby secured to the base layer.

Abstract: A camera module includes a circuit board; a lens electrically connected to the circuit board; a adjusting base disposed on the circuit board and having at least two through-hole disposed adjacent to opposite sides of the lens; at least two fixed posts; at least two adjusting screw respectively passing through the through-holes of the adjusting base so as to be secured in the fixed posts; and at least two springs respectively encircling the adjusting screws, wherein two ends of each spring are positioned against the adjusting base and one of the fixed post respectively.

Abstract: A method of forming a sensor array. The method includes depositing a source/drain contact layer; depositing a semiconductor layer on the source/drain contact layer; and patterning the source/drain contact layer and the semiconductor layer substantially simultaneously, wherein the patterned semiconductor layer forms part of a sensor of the sensor array.

Abstract: The yield of a semiconductor device is improved. Inside the resin sealing body which forms a semiconductor device, the semiconductor chip is sealed in the state where it has arranged aslant to the upper and lower sides of a resin sealing body. In the suspension lead which supports the die pad carrying this semiconductor chip, the small recess is formed in the fifth surface of the opposite side with the surface on which the semiconductor chip was mounted. This recess is a portion used as the starting point when making die pad 2a slanting. The side surface of the side near a die pad between two side surfaces of this recess is formed in the state where it inclined rather than the side surface of the side near the periphery of a resin sealing body.

Abstract: The reliability of a photosensor-type semiconductor device is enhanced. The sealing step in a manufacturing process for the semiconductor device is carried out as described below. A molding die having an upper die and a lower die is prepared and a film is arranged between the upper die and the lower die. A lead frame in which first adhesive, a semiconductor chip, second adhesive 11, and a base material are mounted over the upper surface of each tab is arranged between the film and the lower die. The base material has an opening formed therein and the opening is covered with a protective sheet. The semiconductor chip has a light receiving area formed in its main surface. The upper die and the lower die are clamped to cause part of the base material to bite into the film. Thereafter, sealing resin is supplied to between the film and the lower die to form a blanket sealing body. Thus the photosensor-type semiconductor device without resin flash over the light receiving area is obtained.

Abstract: The present invention can simplify a process. In the present invention, a transparent conductive layer (5) is provided on an electrode side substrate (12); a porous semiconductor layer (7) is provided on the transparent conductive layer (5); and a counter electrode layer (9) in a state in which it is separated from the porous semiconductor layer (7) is provided. A cell partition wall (6) which is provided on the electrode side substrate (12) and surrounds the periphery of the porous semiconductor layer (7) is provided. In the sensitized solar cell module (11), electrolytic solution (10) is impregnated in the porous semiconductor layer (7) and the counter electrode layer (9), and a sealing material in the form of liquid is disposed in such a manner as to cover an upper portion of the cell partition wall (6) to seal the electrolytic solution (10). Then, the sealing material in the form of liquid is solidified.

Abstract: The invention provides a solar cell module stacked member in which a pressure sensitive-type adhesive for bonding together a support member and a solar cell module is not photodegraded, and there is no concern of separation of the support member and the solar cell module. In a solar cell module stacked member in which a support member and a solar cell module having an internal solar cell element are stacked, the support member and the solar cell module are bonded together; the support member and the solar cell module are bonded together by a reaction hardening-type adhesive in an outer rim portion of the solar cell module irradiated with sunlight; and the support member and the solar cell module are bonded together by a pressure sensitive-type adhesive in a portion which is on the inside of the outer rim portion of the solar cell module and in which sunlight is blocked.

Abstract: A carrier assembly for temporary accommodation of one or more solar cell laminates while the solar laminates are conveyed through a lamination plant. The solar cell laminate comprises a solar cell layer of silicon material, an upper and a lower encapsulating layer of EVA material covering the top and bottom of the solar cell layer, an upper and lower protective layer covering the upper and lower encapsulating layer, respectively. The encapsulating layer has a specific melting temperature and a specific curing temperature; the melting temperature is lower than the curing temperature.

Abstract: This invention relates to the use of a thermoplastic elastomer comprising at least one silicone ionomer in the formation of electronic devices.

Abstract: A sealing member, a photoelectric conversion device having the same, and a method of preparing the same are disclosed. In one aspect, the sealing member for the photoelectric conversion device joins a first substrate and a second substrate, which face each other, and seals an electrolyte solution in a space therebetween. An edge of the sealing member may include a rounded portion and a radius of a circle including the rounded portion is about 50% or more of the width of the sealing member. The sealing member may serve to reduce leakage of the electrolyte solution due to lowered adhesion of the sealing member or a wrinkled sealing member, and thus, improve reliability of the photoelectric conversion device.

Abstract: A solar cell module, a solar cell panel, a process for producing a solar cell module and a process for producing a solar cell panel that are capable of inhibiting EVA protrusions and recesses, and capable of inhibiting penetration of moisture into the interior of the solar cell module. The solar cell module comprises a transparent substrate and a back substrate disposed across a photovoltaic layer, an inner seal portion disposed between, and surrounding the periphery of, the transparent substrate and the back substrate, a gap formed in a portion of the inner seal portion and linking a region in which an encapsulant is disposed with the outside, an encapsulant disposed inside the region surrounded by the transparent substrate, the back substrate and the inner seal portion, and an outer seal portion that covers the gap.

Abstract: A method for assembling an optically pumped solid-state laser having an extended cavity. The method includes the steps of providing a casing, mounting a TEC and a base plate in the casing, and mounting a plurality of laser components on the base plate using a UV and heat curing adhesive. Once the laser components are correctly positioned and aligned on the base plate, the adhesive is pre-cured using UV radiation. Final curing of the adhesive is obtained by subjecting the entire laser package to an ambient temperature of at least 100° C. The base plate is preferably selected to have a CTE similar to that of the laser components in order to facilitate the high temperature curing. A preferred material for the base plate is AlSiC.

Abstract: The MEMS package has a mounting substrate on which one or more transducer chips are mounted wherein the mounting substrate has an opening. A top cover is attached to and separated from the mounting substrate by a spacer forming a housing enclosed by the top cover, the spacer, and the mounting substrate and accessed by the opening. Electrical connections are made between the one or more transducer chips and the mounting substrate and/or between the one or more transducer chips and the top cover. A bottom cover can be mounted on a bottom surface of the mounting substrate wherein a hollow chamber is formed between the mounting substrate and the bottom cover, wherein a second opening in the bottom cover is not aligned with the first opening. Pads on outside surfaces of the top and bottom covers can be used for further attachment to printed circuit boards. The top and bottom covers can be a flexible printed circuit board folded under the mounting substrate.

Abstract: An object of the present invention is to provide a photovoltaic module that achieves a reduction in adverse influence of damage accumulated in a collector electrode provided on the light receiving surface side, and a method for manufacturing the photovoltaic module. To this end, in a photovoltaic module of the present invention, the degree of cross-linkage of the second region of the sealing material that is in contact with the back surface of the solar cell is smaller than that of the first region of the sealing material that is in contact with the light receiving surface of the solar cell.

Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

Abstract: A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.

Abstract: The present invention relates to a photovoltaic component comprising a superimposed arrangement of at least one inorganic solar cell and at least one organic solar cell. The inorganic solar cell comprises a translucent backside opposite to the organic solar cell. The present invention further relates to a method of producing a photovoltaic component.

Abstract: An optical device includes at least one optical die (4) that is embedded, at least peripherally, in a plate made of an encapsulation material so that the optical die may transmit light, from one side of the plate to the other. An electronic package is formed by a semiconductor device which includes at least one optical, integrated-circuit chip with the optical device placed so that the optical die lies above optical integrated circuits formed in or on the integrated circuit chip. The optical device is attached onto the semiconductor device.

Abstract: A thin-film solar cell includes a body and a polymer layer. The body includes a first electrode layer, a photoelectric conversion layer, and a second electrode layer, and the polymer layer includes a hardening material and an interface material. The photoelectric conversion layer is disposed between the first electrode layer and the second electrode layer, and the polymer layer surrounds the photoelectric conversion layer, in which the interface material is used for bonding to the hardening material and the photoelectric conversion layer respectively. Therefore, the thin-film solar cell may reduce the Staebler-Wronski Effect generated by the photoelectric conversion layer in the photoelectric conversion procedure. Accordingly, the photoelectric conversion efficiency is improved.

Abstract: A process for producing a solar cell module, including (a) forming a seal part made of e.g. a double sided adhesive tape on the edge of a surface of a transparent surface material (first surface material), (b) supplying a liquid state photocurable resin composition to the region enclosed by the seal part, (c) laminating, in a reduced pressure atmosphere of not more than 100 Pa, on the photocurable resin composition, a glass substrate (second surface material) having a thin-film type solar cell device formed, to obtain a laminated material having the photocurable resin composition hermetically sealed, and (d) curing the photocurable resin composition in such a state that the laminated material is placed in a pressure atmosphere of not less than 50 kPa to form a resin layer.

Abstract: An image sensor including a deep guard ring and a noise blocking area and a method of manufacturing the same. The image sensor includes the deep guard ring and a deep P well surrounding the noise blocking area, thereby preventing crosstalk between adjacent pixels. In addition, an ion implantation layer is divided by the noise blocking area, so that substrate crosstalk is effectively eliminated.

Abstract: A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate (22) is provided. The semiconductor substrate (22) has first and second opposing sides (24, 26) and first and second portions (28, 30). A tuning depression (32) is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor (34) is formed on the first opposing side (24) of the first semiconductor substrate. The radio frequency conductor (34) has a first end (46) on the first portion (28) of the first semiconductor substrate (22) and a second end (48) on the second portion (30) of the first semiconductor substrate (22). A microelectronic die (78) having an integrated circuit formed therein is attached to the first opposing side (24) and the first portion (28) of the semiconductor substrate (22) such that the integrated circuit is electrically connected to the first end (46) of the radio frequency conductor (34).

Abstract: A solar cell module includes a glass substrate, a first sealing resin layer, a solar cell connected to a tab wire, a second sealing resin layer, and a protective sheet, which are laminated. The second sealing resin layer is formed from a blend polymer of a thermoplastic polyurethane resin having an ester-type polyol unit and a thermoplastic polyurethane resin having an ether-type polyol unit. The blend ratio of the thermoplastic polyurethane resin having the ester-type polyol unit to the thermoplastic polyurethane resin having the ether-type polyol unit in the blend polymer is 20:80 to 50:50 by mass.

Abstract: A backside-illuminated imaging device, which performs imaging by illuminating light from a back side of a semiconductor substrate to generate electric charges in the semiconductor substrate based on the light and reading out the electric charges from a front side of the semiconductor substrate, is provided and includes: a back-side layer including an back-side element on the back side of the semiconductor substrate; a front-side layer including an front-side element on the front side of the semiconductor substrate; a support substrate above the front-side layer; a spacer, one end of which comes in contact with the front-side layer and the other end of which comes in contact with the support substrate, to form a space having a uniform distance between the semiconductor substrate and the support substrate; and an adhesive filled in at least a part of the space between the surface-side element formation layer and the support substrate.

Abstract: An integrated optical imaging system includes a first substrate having first and second opposing surfaces, a second substrate having third and fourth opposing surfaces, a spacer between a substantially planar portion of the third surface of the second substrate and a substantially planar portion of the second surface of the first substrate, at least two of the spacer, the first substrate and the second substrate sealing an interior space between the third surface of the second substrate and the second surface of the first substrate, and an optical imaging system having n surfaces, where n is greater than or equal to two, at least two of the n surfaces of the optical imaging system are on respective ones of the first, second, third and fourth surfaces.