Abstract: A photovoltaic cell including: (a) a housing including an at least partially transparent cell wall having an interior surface; (b) an electrolyte, disposed within the cell wall, and containing an iodide based species; (c) a transparent electrically conductive coating disposed on the interior surface; (d) an anode disposed on the conductive coating, the anode including: (i) a porous film containing titania, the porous film adapted to make intimate contact with the iodide based species, and (ii) a dye, absorbed on a surface of the porous film, the dye and the porous film adapted to convert photons to electrons; (e) a cathode disposed on an interior surface of the housing, and disposed substantially opposite the anode; (f) electrically-conductive metallic wires, disposed at least partially within the cell, the wires electrically contacting the anode and the electrically conductive coating, and (g) a second electrically conductive coating including an inorganic binder and an inorganic electrically conductive fill

Abstract: The present disclosure provides a light emitting diode (LED) package, which includes a first substrate with electrodes disposed on a top thereof and a second substrate with an LED chip disposed on a top thereof. The LED chip is connected with the electrodes via wires. A first package layer is disposed on the top of the first substrate to cover the wires and electrodes. A fluorescent layer is disposed on the top of the second substrate to cover the LED chip. The present disclosure also provides a mold and a method of manufacturing the LED package.

Abstract: A thin-film encapsulation for an optoelectronic semiconductor body includes a PVD layer deposited by a PVD method, and a CVD layer deposited by a CVD method, wherein the CVD layer is applied directly on the PVD layer, and the CVD layer is etched back such that the CVD layer only fills weak points in the PVD layer.

Abstract: A backside illuminated image sensor comprises a photodiode and a first transistor located in a first chip, wherein the first transistor is electrically coupled to the photodiode. The backside illuminated image sensor further comprises a second transistor formed in a second chip and a plurality of logic circuits formed in a third chip, wherein the second chip is stacked on the first chip and the third chip is stacked on the second chip. The logic circuit, the second transistor and the first transistor are coupled to each other through a plurality of boding pads and through vias.

Abstract: The invention relates to a flexible electrical generator comprising at least one photovoltaic device and a flexible support, wherein said photovoltaic device is attached to the flexible support and wherein the flexible support comprises a fabric comprising high-strength polymeric fibers, said flexible support comprising also a plastomer wherein said plastomer is a semi-crystalline copolymer of ethylene or propylene and one or more C2 to C12 ?-olefin co-monomers and wherein said plastomer having a density as measured according to ISO1183 of between 860 and 930 kg/m3.

Abstract: A back electrode type solar cell in which a no-electrode-formed region where no electrode is placed is provided in a part of a peripheral portion of a back surface of the back electrode type solar cell such that a line connecting end portions of a plurality of electrodes to one another includes a partially inwardly recessed region and the no-electrode-formed region is located adjacent to each of an electrode for n-type and an electrode for p-type adjacent to each other, a solar cell module, a method of manufacturing a back electrode type solar cell with interconnection sheet, and a method of manufacturing a solar cell module are provided.

Abstract: An electronic device 1 includes a first glass substrate 2, a second glass substrate 3, and an electronic element part 4 provided between these glass substrates 2, 3. The electronic element part 4 provided between the first and second glass substrates 2, 3 is sealed with a sealing layer 9 made up of a molten fixed layer of a sealing glass material having an electromagnetic wave absorption ability. At least one of the first and second glass substrates 2, 3 is made up of a chemically tempered glass having a surface compressive stress value of 900 MPa or less.

Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a method includes constructing a radiation sensitive component in and/or on a microelectronic device, placing a curable component in and/or on the microelectronic device, and forming a barrier in and/or on the microelectronic device to at least partially inhibit irradiation of the radiation sensitive component. The radiation sensitive component can be doped silicon, chalcogenide, polymeric random access memory, or any other component that is altered when irradiated with one or more specific frequencies of radiation. The curable component can be an adhesive, an underfill layer, an encapsulant, a stand-off, or any other feature constructed of a material that requires curing by irradiation.

Abstract: A method for manufacturing a thin film solar cell device including a CIGS based thin film solar cell module (17). Edge deletion by selective removal of a multilayer structure (13) that includes at least a front contact (15) and a CIGS layer (7) to expose the back contact (5) in at least a peripheral area (22) in the circumferential region (21) of the module (17) adjacent to a first longitudinal thin film solar cell segment (18) allows for contacting of the module (17) by attaching at least a first contacting element (27) to the back contact (5). Preferably a blasting operation using simultaneous supply of blasting agents and gathering of debris in a blasting chamber (32) arranged on the thin film solar cell module (17) is used for the selective removal.

Abstract: In one embodiment, a method includes depositing a photoactive layer onto a first substrate, depositing a contact layer onto the photoactive layer, attaching a second substrate onto the contact layer, and removing the first substrate from the photoactive layer, contact layer, and second substrate.

Abstract: A method of fabricating organic solar panels with transparent contacts. The method uses a layer-by-layer spray technique to create the anode layer. The method includes placing the substrate on a flat magnet, aligning a magnetic shadow mask over the substrate, applying photoresist to the substrate using spray photolithography, etching the substrate, cleaning the substrate, spin coating a tuning layer on substrate, spin coating an active layer of P3HT/PCBM on the substrate, spray coating the substrate with a modified PEDOT solution, and annealing the substrate.

Abstract: The present invention discloses a light-emitting diode (LED) package structure, which includes a housing, a first electrode plate, a second electrode plate, a light-emitting diode, and a voltage regulation diode. The housing has a top surface forming a cavity, and the cavity contains therein a wall that divides the cavity into a light emission section and a voltage regulation section. By separately arranging the light-emitting diode and the voltage regulation diode in two different sections of the light emission section and the voltage regulation section, the present invention prevents the voltage regulation diode from affecting light flux of the light-emitting diode by absorbing light, thereby enhancing overall lighting performance of the LED package structure.

Abstract: A method for manufacturing polycarbonate solar cells. The method is designed to adapt many techniques used in the compact disc manufacturing industry to the manufacture of polycarbonate solar cells. The method comprises: creating a polycarbonate substrate for a solar cell; depositing a low resistivity cathodic contact layer on the polycarbonate substrate; depositing a photonic energy absorbing layer with a sputter chamber comprising a quaternary CIGS sputter target; using a modulated high intensity pulsed xenon flashlamp; depositing a buffer layer; depositing a highly resistive transmissive intrinsic layer; depositing a transmissive contact oxide window layer; adding anodic contacts to one of the layers; depositing an anti-reflective coating layer; and encapsulating the solar cell to provide environmental protection.

Abstract: An inverted organic solar photovoltaic cell is described that may be fabricated onto rigid or flexible substrates using spray-on technology to apply the various layers of the cell. Indium tin oxide with a thin layer of cesium carbonate functions as the cathode for the novel inverted cells. An active layer of poly-3(hexylthiophene) and [6,6]-phenyl C61-butyric acid methylester having a thickness around 200 nm to 600 nm facilitates a high level of light transmittal through the cell. A modified PEDOT:PSS, made by doping a conductive polymer with dimethylsulfoxide (DMSO), functions as the anode. A method of forming the inverted organic solar photovoltaic cell is also described using gas-propelled spraying to achieve thin layers. After the layers are formed, the cell is sealed using a vacuum and temperature-based annealing and encapsulation with UV-cure epoxy.

Abstract: Provided is a process of producing a solar battery module 1 including plural solar battery cells 4 sealed by a resin 5 between a transparent panel 2 of the light reception surface side and a back face panel 3, which is characterized by arranging plural solar battery cells 4 at a prescribed interval and mutually connecting them to each other by a conductor 8; arranging a first sealing resin sheet 12 substantially covering the entire surface of the transparent panel 2 of the light reception surface side between the transparent panel 2 of the light reception surface side and the solar battery cells 4; arranging a second sealing resin sheet 10 substantially covering the entire surface of the back face panel 3 between the back face panel 3 and the solar battery cells 4; arranging sealing resin sheet pieces 18, 19 which are thicker than the solar battery cells 4 at a space 9 between the solar battery cells 4 so as to be sandwiched by the first sealing resin sheet 12 and the second sealing resin sheet 10; dischargin

Abstract: There is provided a solid-state imaging device including a sensor substrate having a sensor-side semiconductor layer including a pixel region in which a photoelectric conversion section is provided and a sensor-side wiring layer provided on an opposite surface side from a light receiving surface of the sensor-side semiconductor layer, a circuit substrate having a circuit-side semiconductor layer and a circuit-side wiring layer and provided on a side of the sensor-side wiring layer of the sensor substrate, a connection unit region in which a connection section is provided, the connection section having a first through electrode, a second through electrode, and a connection electrode connecting the first through electrode and the second through electrode, and an insulating layer having a step portion which has the connection electrode embedded therein and has a film thickness that gradually decreases from the connection unit region to the pixel region.

Abstract: Disclosed herein is a solid-state image pickup device including: a trench formed in an insulating film above a light-receiving portion; a first waveguide core portion provided on an inner wall side of the trench; a second waveguide core portion filled in the trench via the first waveguide core portion; and a rectangular lens formed of the same material as that of the second waveguide core portion and provided integrally with the second waveguide core portion.

Abstract: A photovoltaic solar panel includes a front glass, a back glass, and a photovoltaic (PV) power generating layer encapsulated between the front glass and the back glass. The PV power generating layer is configured to convert ambient electromagnetic energy, received through the front glass, to a direct current (DC) power output. The PV solar panel also includes at least one component, disposed behind the PV power generating layer, selected from the group consisting of: a direct current to alternating current (DC-AC) inverter configured to convert the DC power output from the PV power generator to an alternating current (AC) power output, a battery, and an antenna.

Abstract: A packaged optoelectronic device and a method for manufacturing is provided. The packaged optoelectronic device includes at least one optoelectronic device with two electrodes sandwiched between a first barrier layer and a second barrier layer. At least one of the barrier layers comprises at least one aperture. Further, the packaged device includes a plurality of thin electrically conductive connectors. Each of the thin connectors extends out through the at least one aperture and is coupled to the anode or the cathode. Further, the thin connectors are connected to an external power source to provide power to the anode and the cathode.

Abstract: A light-emitting surface element includes a connection device, a light-generating element having at least two electrical connections electrically conductively connected to assigned connection lines on the connection device, and at least one planar light-guiding element formed by injection-molding in a manner at least partly embedding an arrangement composed of connection device and light-generating element in the planar light-guiding element.

Abstract: An assembly for extracting heat from a photovoltaic cell assembly for a receiver of a solar radiation-based electrical power generating system is disclosed. The assembly comprises a coolant chamber and a coolant member in the form of a plurality of heat transfer fingers of high thermal conductivity material that are located in the coolant chamber. The fingers have ends that are in thermal contact with the photovoltaic cell assembly and thereby facilitate heat transfer away from the assembly. The fingers are sufficiently flexible to accommodate differences in thermal expansion coefficient between the object and the fingers. The fingers have a relatively high surface area for heat transfer from the fingers to coolant that, in use, circulates through the coolant chamber.

Abstract: Provided are: an alkoysilyl group-containing hydrogenated block copolymer produced by introducing an alkoxysilyl group into a hydrogenated block copolymer that is obtained by hydrogenating 90% or more of unsaturated bonds of a block copolymer that includes at least two polymer blocks [A] and at least one polymer block [B], the polymer block [A] including a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block [B] including a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block [A] in the block copolymer to a weight fraction wB of the polymer block [B] in the block copolymer being 20:80 to 60:40; a method for producing the same; a solar cell element encapsulating material; a sheet, a laminated sheet; a multilayer sheet; and a method for encapsulating a solar cell element.

Abstract: An image sensor package includes an image sensor die having an active side and a backside, wherein an image sensor device region and a bond pad are provided on the active side. A through-silicon-via (TSV) structure extending through the thickness of the image sensor die is provided to electrically connect the bond pad. A multi-layer re-distributed interconnection structure is provided on the backside of the image sensor die. A solder mask or passivation layer covers the multi-layer re-distributed interconnection structure.

Abstract: There is disclosed methods of making photosensitive devices, such as flexible photovoltaic (PV) devices, through the use of epitaxial liftoff. Also described herein are methods of preparing flexible PV devices comprising a structure having a growth substrate, wherein the selective etching of protective layers yields a smooth growth substrate that us suitable for reuse.

Abstract: A solar cell module includes a framing member (20) formed of long-side frames (21) and short-side frames (25) that hold a peripheral edge portion of a solar cell panel (10), and a supporting member (30) disposed to straddle between the long-side frames (21). At both end portions in a longitudinal direction of a lower horizontal plate (32) of the supporting member (30), an engaging portion (32b) enlarged in a width direction by forming notches from both sides in the width direction. A lower plate (21d) of the long-side frame (21) has an inner-side edge portion (21d1) where a cut out portion (23) to which the engaging portion (32b) fits is formed. In a main plate (21a), a through hole is formed. A vertical main plate (33) of the supporting member (30) has, in a longitudinal direction, an end surface where a screw hole is disposed.

Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Abstract: A semiconductor device having a substrate including a photodiode; a resin layer formed on an upper surface of the substrate, the resin layer not covering a light receiving region of the photodiode, the resin layer including at least one groove surrounding the light receiving region; and a molding resin portion formed by mold-sealing the photodiode with the resin layer thereon so as not to cover the light receiving region.

Abstract: A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

Abstract: A photovoltaic cell including at least: a closed chamber including two end walls arranged opposite one another, with at least one being intended to receive incident light radiation, and including at least one side wall formed by at least one stack of a first electrode and a second electrode electrically insulated from one another, the first electrode and second electrode each having an annular shape each being disposed at a periphery of a respective one of the two end walls; at least two non-miscible electrolytes placed in the closed chamber, forming two superimposed layers of which one is in contact with the first electrode and the other is in contact with the second electrode; and a photoactive layer, placed in the closed chamber, that achieves a photovoltaic conversion of energy of the incident light radiation.

Abstract: The present application is directed to a method of making an article. The method comprises coating a composition to a surface of a substrate. The coating composition comprises an aqueous continuous liquid phase, a silica nano-particle dispersed in the aqueous continuous liquid phase, and a polymer latex dispersion. The coated substrate is then heated to at least 300° C.

Abstract: A method for manufacturing a backside-illuminated image sensor may include forming an insulating layer having a predetermined depth in an inactive region of a front side of a semiconductor substrate and forming a photodetector in an active region of a front side of the semiconductor substrate having the insulating layer. Further, the method may include stacking a support substrate on and/or over the front side of the semiconductor substrate having the photodetector. Furthermore, the method may include performing back grinding on the rear side of the semiconductor substrate by using the insulating layer as the stop point.

Abstract: A system and method for improved photovoltaic module structure and encapsulation is described. One embodiment includes a photovoltaic module comprising a front substrate, a photovoltaic structure attached to the front substrate, wherein the photovoltaic structure comprises at least one photovoltaic cell, and a membrane, wherein the membrane and the front substrate substantially encapsulate the photovoltaic structure.

Abstract: A compact sensor module and methods for forming the same are disclosed herein. In some embodiments, a sensor die is mounted on a sensor substrate. A processor die can be mounted on a flexible processor substrate. In some arrangements, a thermally insulating stiffener can be disposed between the sensor substrate and the flexible processor substrate.

Abstract: A photoelectric conversion device includes a first semiconductor substrate including a photoelectric conversion unit for generating a signal charge in accordance with an incident light, and a second semiconductor substrate including a signal processing unit for processing an electrical signal on the basis of the signal charge generated in the photoelectric conversion unit. The signal processing unit is situated in an orthogonal projection area from the photoelectric conversion unit to the second semiconductor substrate. A multilayer film including a plurality of insulator layers is provided between the first semiconductor substrate and the second semiconductor substrate. The thickness of the second semiconductor substrate is smaller than 500 micrometers. The thickness of the second semiconductor substrate is greater than the distance from the second semiconductor substrate and a light-receiving surface of the first semiconductor substrate.

Abstract: A magnetic field sensor includes a compensation loop coupled in series with normal circuit couplings in order to reduce a transient signal that would otherwise be generated when the magnetic field sensor experiences a high rate of change of magnetic field. In some embodiments, the magnetic field sensor is a current sensor responsive to a magnetic field generated by a current-carrying conductor.

Abstract: The invention relates to an organic electronic device, particularly an OLED device (100), and to a method for its manufacturing. The device (100) comprises at least one functional unit (LU1, LU2, LU3) with an organic layer (120). On top of this functional unit (LU1, LU2, LU3), at least one inorganic encapsulation layer (140, 141) and at least one organic encapsulation layer (150, 151) are disposed in which at least one conductive line (161, 162) is embedded. In this way an OLED with a thin film encapsulation can be provided that can electrically be contacted at contact points (CL) on its back side.

Abstract: On the same semiconductor substrate 1, a memory cell array in which a plurality of memory elements R having a chalcogenide-material storage layer 22 storing a high-resistance state with a high electric resistance value and a low-resistance state with a low electric resistance value by a change of an atom arrangement are disposed in a matrix is formed in a memory cell region mmry, and a semiconductor integrated circuit is formed in a logic circuit region lgc. This chalcogenide-material storage layer 22 is made of a chalcogenide material containing at least either one of Ga or In of 10.5 atom % or larger to 40 atom % or smaller, Ge of 5 atom % or larger to 35 atom % or smaller, Sb of 5 atom % or larger to 25 atom % or smaller, and Te of 40 atom % or larger to 65 atom % or smaller.

Abstract: The invention relates to method for manufacturing an electronic device comprising an organic layer (120). According to this method, a stack with a metal layer (130) and an organic layer (120) as first and second outer layers is structured by etching both these outer layers. In one particular embodiment, an additional metal layer (140) may be generated on the outermost metal layer (130) by galvanic growth through a structured isolation 10 layer (150). After removal of said isolation layer (150), the metal (130) may be etched in the openings of the additional metal layer (140). In a further etching step, the organic material (120) may be removed in said openings, too.

Abstract: An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to suitably produce flexible solar cell modules in which a solar cell element and a solar cell encapsulant sheet are well adhered to each other by encapsulating a solar cell by roll-to-roll processing in a continuous manner without the need to perform a crosslinking process and without causing wrinkles and curls.

Abstract: A method is provided of fabricating a photo voltaic generator panel (15) including a polymer back sheet (24) with at least one attachment feature (21) so as to provide means of attaching the panel to a structural support (25) upon subsequent installation. At least one polymer attachment feature (21) is applied to the outer side of the polymer back sheet of the panel during the manufacturing process for the panel whereby the attachment feature projects with respect to the back sheet. The application may be in conjunction with a lamination process, or subsequent to the lamination process, or as an integral part of the back sheet manufacturing process. The attachment feature is adapted to engage with a corresponding feature (26) or features to be found on a support structure (25) located at a site for the installation of the panel. The said at least one polymer attachment feature and said outer side of the polymer back sheet have a similar thermal expansion coefficient.

Abstract: A component with an optoelectronic semiconductor chip fixed to a connection carrier by a bonding layer and embedded in an encapsulation, wherein a decoupling layer is arranged at least in places between the bonding layer and the encapsulation.

Abstract: A photovoltaic module comprising a front sheet, a front encapsulant layer, at least one photoactive cell having a frontface and a backface, and a backing sheet, wherein the backface of the photoactive cell is in direct contact with the backing sheet.

Abstract: An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to suitably produce flexible solar cell modules in which a solar cell element and a solar cell encapsulant sheet are well adhered to each other by encapsulating a solar cell by roll-to-roll processing in a continuous manner without the need to perform a crosslinking process and without causing wrinkles and curls.

Abstract: An object of the present invention is to provide a method for producing a flexible solar cell module which makes it possible to encapsulate a solar cell in a continuous manner without the need to perform a crosslinking process and highly efficiently produce flexible solar cell modules in which a solar cell and a solar cell encapsulant sheet are well adhered to each other without causing wrinkles and curls.

Abstract: A display device and a fabricating method of the same are disclosed.

Abstract: An apparatus is disclosed for converting incident light to electrical energy and heat. the apparatus includes an evacuated enclosure having at least a portion for admitting incident light; and an absorber member disposed at least partially in said enclosure to receive incident light. The absorber includes a selective surface which converts a portion of the incident light to heat. The selective surface comprises a photovoltaic layer which converts a portion of the incident light to electrical energy. In some embodiments, the absorber includes an elongated inner tube having an outer surface including the selective surface.

Abstract: An organic optoelectronic device includes a substrate, an anode, a cathode, an active region comprising an organic material, an encapsulation that isolates the active region from an ambient environment, wherein the encapsulation comprises a housing, and a first hermetically sealed electrical path through the housing.

Abstract: An optoelectronic component has a semiconductor chip and a carrier, which is bonded to the semiconductor chip by means of a bonding layer of a metal or a metal alloy. The semiconductor chip includes electrical connection regions facing the carrier and the carrier includes electrical back contacts on its back remote from the semiconductor chip. The back contacts are connected electrically conductively to the first electrical or second connection region respectively, in each case by at least one via extending through the carrier. The first and/or second electrical back contact is connected to the first or second electrical connection region respectively by at least one further via extending through the carrier.

Abstract: On a lamination frame is disposed a stacked member of photovoltaic cells and a concave-convex member. The photovoltaic cells are formed using a flexible substrate. When forming the stacked member, each of the plurality of photovoltaic cells is disposed on a lamination frame in the state of an intermediate member sandwiched between protective films for lamination and sealing. Among the protective films, the protective film positioned on the side of the light-receiving face of the photovoltaic cells is opposed entirely by the concave-convex member. The concave-convex member has concavities and convexities on the surface opposing the protective film. By simultaneously subjecting the intermediate member and the concave-convex member to lamination treatment, a plurality of photovoltaic cells can be simultaneously and individually sealed by the protective film.

Abstract: An image pickup device and a method of the same are described herein. By way of first example, the image pickup device includes a seal member having a first surface, the first surface of the seal member including a concave portion, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member. By way of a second example, the image pickup device includes a seal member having a first surface, the first surface being a polished surface, and an optical device coupled to a second surface of the seal member, the second surface of the seal member being opposite from the first surface of the seal member.