Abstract: An apparatus including: a transparent substrate including a first surface and an opposing second surface; a sensor connected to the first surface of the transparent substrate; and a casing, including interconnects to the sensor, and defining a cavity and at least one aperture to the cavity, wherein the transparent substrate and the sensor are located within the cavity with the second surface of the transparent substrate adjacent the at least one aperture.

Abstract: An ultrahigh durability solar cell module that can be used semi-permanently, with an ultrahigh durability transparent substrate, solar cell element and filler, wherein the solar cell element and a liquid substance or a gel obtained by reacting the liquid substance as the filler, are sealed by a fast sealed structure comprising a high durability crosslinking reactive adhesive provided between a glass panel and back side protective substrate, and a hot-melt adhesive. The module is produced by placing the sealing compound, solar cell element and liquid substance on the glass panel and finally laying the back side protective substrate to form a provisional laminated body, and then compression bonding the provisional laminated body at room temperature in a vacuum for sealing.

Abstract: An electronic device module such as a solar cell is described. The electronic device module is made using a polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising a tapered block copolymer comprising an A block, and a B block.

Abstract: An organosiloxane block copolymer includes 65 to 90 mol % of diorganosiloxane units having the formula R12SiO2/2 (I). These diorganosiloxane units are arranged in linear blocks which have an average of from 10 to 400 diorganosiloxane units per linear block. The organosiloxane block copolymer also includes 10 to 35 mol % of siloxane units that have the average formula R2x(OR3)ySiO(4-x-y)/2 (II). The siloxane units are arranged in nonlinear blocks having at least 2 siloxane units per nonlinear block wherein 0.5?x?1.5 and 0?y?1. In addition, each R1 is independently a C1 to C10 hydrocarbyl, each R2 is independently an aryl or C4 to C10 hydrocarbyl, at least 50 mol % of R2 are aryl, and each R3 is independently R1 or H. Moreover, the organosiloxane block copolymer has a light transmittance of at least 95%.

Abstract: A base material for a solar cell module includes a base material film including at least one layer and a coating layer including at least one layer and formed on one surface or both surfaces of the base material film. The coating layer is a copolymer layer obtained by curing a liquid coating film consisting of an acrylic-based resin component consisting of metal alkoxide having a first reactive functional group, an acrylic-based monomer having a second reactive functional group that reacts with the first reactive functional group, and an acrylic-based monomer without the second reactive functional group; and an ethylene-based resin component having a carboxyl group binding to the first reactive functional group of metal alkoxide and including an ethylene monomer, a vinyl acetate monomer, and a monomer of carboxylic acid vinyl esters other than vinyl acetate.

Abstract: A method of mutually aligning first and second imaging system fixturing components forms a first alignment structure on the first imaging system fixturing component, a second alignment structure on the second imaging system fixturing component, and engages the first and second alignment structures to align, with optical accuracy, the first and second imaging system fixturing components.

Abstract: An electronic device includes a first wiring substrate including a component mounting area, a second wiring substrate stacked on the first wiring substrate, in which an opening portion is provided in a part corresponding to the component mounting area, and connected to the first wiring substrate via solder bumps which are arranged on a periphery of the component mounting area, a frame-like resin dam layer formed between the solder bumps on the periphery of the component mounting area, and surrounding the component mounting area, and an electronic component mounted on the component mounting area of the first wiring substrate, wherein a sealing resin is filled between the first wiring substrate and the second wiring substrate such that the component mounting area is formed as a resin non-forming area by the resin dam layer.

Abstract: An integrated back sheet for a back-contact solar cell module and a back-contact solar cell module made with an integrated glass back-sheet are provided. Processes for making such integrated back-sheets and back-contact solar cell modules are also provided. Elongated electrically conductive wires are mounted on a layer of the integrated back-sheet adhered to the glass back-sheet. The elongated electrically conductive wires of the integrated back-sheet electrically connect to solar cell back contacts when the back-sheet is used in a back-contact photovoltaic module.

Abstract: A photovoltaic module includes an encapsulated photovoltaic element and an infrared-transmissive decorative overlay simulating conventional roofing.

Abstract: Photovoltaic devices are provided that include: a transparent substrate; a plurality of thin film layers on the glass substrate; and, a first lead connected to one of the photovoltaic cells. An encapsulation substrate can be positioned on the plurality of thin film layers, and defines a connection aperture through which the first lead extends. The connection aperture generally has a perimeter defined by an aperture wall of the encapsulation substrate. An adhesive plug can be positioned within the connection aperture to mechanically support the transparent substrate in the area of the connection aperture. A back plate or back washer can also be bonded to the adhesive plug and/or back surface of the encapsulation substrate to help dissipate energy in and/or provide support to the encapsulation substrate. Methods are also provided for mechanically supporting a transparent substrate in an area opposite to a connection aperture defined in an encapsulation substrate.

Abstract: A thin film solar cell and process for forming the same. The solar cell includes a bottom electrode layer, semiconductor light absorbing layer, top electrode layer, and a protective moisture barrier layer. In some embodiments, the barrier layer is formed of a water-insoluble material. The barrier layer helps protect the top electrode layer from exposure and damage caused by water and oxygen.

Abstract: The present invention provides a solar cell flip chip package structure, comprising: a substrate having a first surface, a second surface and an opening extending from the first surface to the second surface; a conducting layer disposed on the first surface of the substrate; a solar cell flip chip bonded on the conducting layer; a transparent layer attached on the second surface of the substrate; and a storage space formed between the opening extending from the first surface to the second surface, the solar cell flip chip and the transparent layer.

Abstract: In a manufacturing method for an image sensor integrated circuit, a plurality of pixel regions each having a photodiode are arranged on a silicon substrate. A light-transmissive conductive film is formed over the silicon substrate. A protective film is formed on the light-transmissive conductive film while holding a potential of the light-transmissive conductive film at the same potential as that of the silicon substrate.

Abstract: A method of assembling a magnetoresistive random access memory (MRAM) device includes providing a substrate having an opening. A tape is applied to a surface of the substrate and a first magnetic shield is placed onto the tape and within the substrate opening. An adhesive is applied between the first magnetic shield and the substrate to attach the first magnetic shield to the substrate. An MRAM die is attached to the first magnetic shield and bond pads of the MRAM die are connected to pads on the substrate with wires. A second magnetic shield is attached to a top surface of the MRAM die. An encapsulating material is dispensed onto the substrate, the MRAM die, the second magnetic shield and part of the first magnetic shield, cured, and then the tape is removed. Solder balls then may be attached to the substrate.

Abstract: An imaging device package includes: an imaging device chip; a substrate on which the imaging device chip is mounted; a wire that electrically connects the imaging device chip and the substrate at a peripheral edge of the substrate around the imaging device chip; a supporting body that supports an optical member with respect to the substrate; and a bonding section that bonds the supporting body to the substrate while sealing the wire and a bonding terminal of the wire at the peripheral edge of the substrate.

Abstract: A framed solar cell module comprises: (a) a platelike solar cell module that comprises a solar cell element formed of one or a plurality of electrically interconnected solar cells; (b) a frame body that has a groove portion into which the outer periphery of the solar cell module is fitted; and (c) a sealant material that is so provided as to fill up a space between the outer periphery of the solar cell module and the groove portion of the frame body, and wherein the sealant material is formed of a cross-linkable blend composition of an ionomer and an ethylene copolymer.

Abstract: This invention relates to an encapsulation structure comprising a luminescent wavelength conversion material for at least one solar cell or photovoltaic device which acts to enhance the solar harvesting efficiency of the solar cell device. The luminescent wavelength conversion material comprises at least one chromophore and an optically transparent polymer matrix. Application of the encapsulation structure, as disclosed herein, to solar harvesting devices, including solar cells, solar panels, and photovoltaic devices, improves the solar harvesting efficiency of the device by widening the spectrum of incoming sunlight that can be effectively converted into electricity by the device.

Abstract: A method of fabricating epitaxial structures including applying an etch stop to one side of a substrate and then growing at least one epitaxial layer on a first side of said substrate, flipping the substrate, growing a second etch stop and at least one epitaxial layer on a second side of the substrate, applying a carrier medium to the ultimate epitaxial layer on each side, dividing the substrate into two parts generally along an epitaxial plane to create separate epitaxial structures, removing any residual substrate and removing the etch stop.

Abstract: Disclosed is a dye-sensitized solar cell module and a method of manufacturing the same. More specifically a counter electrode has connection parts formed within the side surfaces of the transparent conductive substrates. Edges of the working electrode and the counter electrode are bonded with each other by a sealant along the outer peripheral except for at one or more portions of the edges to form an electrolyte injection port. An electrolyte is then injected through the electrolyte injection hole into a space between the working electrode and the counter electrode. The electrolyte injection hole is then sealed by a sealant.

Abstract: A method and apparatus used for forming a lens and spacer combination, and imager module employing the spacer and lens combination. The apparatus includes a mold having a base, spacer section, and mold feature. The method includes using the mold with a blank to create a spacer that includes an integral lens. The spacer and lens combination and imager modules can be formed on a wafer level.

Abstract: A solar energy module includes one or more solar cells, each having a front side for receiving light and an opposite back side. An encapsulant material covers at least the front side of each of the solar cells. The solar energy module also includes a backskin layer formed from a cross-linked mixture of high density polyethylene (HDPE) and acid copolymer bonded to the back side of each of the solar cells.

Abstract: A manufacturing method of pixel structure includes: sequentially forming a gate, a gate insulation layer, a semiconductor layer and a conductive layer on a substrate; forming a first patterned photoresist layer including multiple first photoresist blocks and multiple second photoresist blocks on the conductive layer; reducing the thickness of the first patterned photoresist layer until the second photoresist blocks are completely removed; forming a pixel electrode layer and a second photoresist layer on a partial pixel electrode layer; removing a part of the pixel electrode layer exposed by the second photoresist layer, a partial conductive layer and a partial semiconductor layer both under the removed pixel electrode layer to define a first electrode block, a second electrode block and a channel region; removing the remained first patterned photoresist layer and second photoresist layer and forming a protective layer and a common electrode layer on a part of the protective layer.

Abstract: An image sensor package and method of manufacture that includes a crystalline handler with conductive elements extending therethrough, an image sensor chip disposed in a cavity of the handler, and a transparent substrate disposed over the cavity and bonded to both the handler and image sensor chip. The transparent substrate includes conductive traces that electrically connect the sensor chip's contact pads to the handler's conductive elements, so that off-chip signaling is provided by the substrate's conductive traces and the handler's conductive elements.

Abstract: Disclosed embodiments include a photovoltaic module including a conductor interface for electrically connecting tabs of internal module wiring with external conductors, where the conductor interface includes retention surfaces for retaining the tabs and external conductors in an electrically connected position. Methods of manufacturing a photovoltaic module are also disclosed.

Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ?-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about ?35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/?-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

Abstract: A method of manufacturing a solar cell module includes a step of connecting electrodes of solar cells with an interconnection tab so as to form a first solar cell unit, by welding the interconnection tab to the electrodes while remaining an unmelted part of solder of the interconnection tab, and a step of connecting an interconnection tab of a second solar cell unit to the interconnection tab of the first solar cell unit at the unmelted part of the interconnection tab of the first solar cell unit.

Abstract: A module is disclosed, which includes a carrier, at least one solar cell disposed on the carrier, and a covering layer that is applied to a side of the at least one solar cell facing away from the carrier. The covering layer includes side lugs, corner lugs, and notches, and wherein one notch each forms a side edge of a side lug or of a corner lug. The side lugs and corner lugs are divided by a corresponding fold line and are disposed on the side of the carrier facing away from the at least one solar cell. The side edges of the corresponding side lugs and corner lugs formed by a notch are in contact with one another.

Abstract: A photovoltaic module comprising a first substrate, a backing sheet, a solar cell or a plurality of solar cells, each solar cell positioned between the substrate and the backing sheet, at least one thin electrically conducting board positioned between the substrate and the backing sheet and preferably where the module has at least one electronic device, preferably positioned on the electrically conducting board, that provides the module with a desired function or capability.

Abstract: Hybrid integration of vertical cavity surface emitting lasers (VCSELs) and/or other optical device components with silicon-based integrated circuits. A multitude of individual VCSELs or optical devices are processed on the surface of a compound semiconductor wafer and then transferred to a silicon-based integrated circuit. A sacrificial separation layer is employed between the optical components and the mother semiconductor substrate. The transfer of the optical components to a carrier substrate is followed by the elimination of the sacrificial or separation layer and simultaneous removal of the mother substrate. This is followed by the attachment and interconnection of the optical components to the surface of, or embedded within the upper layers of, an integrated circuit, followed by the release of the components from the carrier substrate.

Abstract: An imager device is disclosed including a first substrate having an array of photosensitive elements formed thereon, a first conductive layer formed above the first substrate, a first conductive member extending through the first substrate, the first conductive member being conductively coupled to the first conductive layer, a standoff structure formed above the first substrate, a second conductive layer formed above the standoff structure, the second conductive layer being conductively coupled to the first conductive layer, and an electrically powered device positioned above the standoff structure, the electrically powered device being electrically coupled to the second conductive layer.

Abstract: The present invention provides a solar module formed using a powder coating and thermal treatment process. The solar module includes a substrate having a surface region and a photovoltaic material overlying the surface region. The solar module further includes a barrier material overlying the photovoltaic material. Moreover, the solar module includes a coating overlying the barrier material and enclosing the photovoltaic material to mechanically protect the photovoltaic material. In certain embodiments, photovoltaic material is a thin film photovoltaic cell and the coating is provided by a powder coating substantially free of bubbles formed by electrostatic spraying and cured with a thermal treatment process.

Abstract: This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material.

Abstract: A thin film photovoltaic module that is connectable to a terminal includes a first glass sheet defining a sun facing surface and a second glass sheet defining a back facing surface opposite the front side surface. The second glass sheet includes a feed-though opening extending through the second glass sheet. A photovoltaic material is between the first glass sheet and the second glass sheet. An encapsulant material is between the first glass sheet and the second glass sheet that bonds the first glass sheet and the second glass sheet together and seals the photovoltaic material from moisture. A conductor is electrically connected to the photovoltaic material at one end. The conductor passes through the feed-though opening. A reinforcing member is disposed on the sun facing surface of the first glass sheet. The reinforcing member has a footprint hanging over at least a portion of the feed-through opening.

Abstract: Disclosed are a dye sensitized solar cell and a sealing method thereof. The dye sensitized solar cell includes: an upper electrode glass substrate and a lower electrode glass substrate having a hole formed in at least one thereof; a first sealing material forming a cell internal space by maintaining an interval between the upper electrode glass substrate and the lower electrode glass substrate; an electrolytic solution filled in the cell internal space between the upper electrode glass substrate and the lower electrode glass substrate; and a plug inserted and pressed into the hole to seal the hole.

Abstract: The invention relates to a solar cell module and to a manufacturing method for the same, the solar cell module comprising a glass carrier (1) and a solar cell structure (2) arranged on a device side surface (11) of the glass carrier (1), characterized by a protection layer (3) arranged on a back side surface (12) of the glass carrier (1) opposite to the device side surface (11).

Abstract: A method for manufacturing a photovoltaic module including a laminating step.

Abstract: The present invention provides a production method of a solar cell module, comprising: a first process of mounting a module layered body, which comprises at least a glass member, an encapsulant, a solar cell element and a translucent member in this order, and in which an outer periphery of the encapsulant is positioned at an inner side of outer peripheries of the glass member and the translucent member, on a mounting platen of a double vacuum chamber system laminator comprising a first chamber and a second chamber that are partitioned by a flexible member, and the mounting platen, which is provided in the second chamber facing the flexible member and comprises a heating means, the module layered body being mounted on the mounting platen so that the glass member is at the flexible member side; a second process of depressurizing the inside of the first chamber and the inside of the second chamber; and a third process of heat-pressure bonding and integrating the module layered body by raising a pressure in the f

Abstract: A method for manufacturing a solar battery module according to the present invention includes the steps of forming a solar battery cell (25) on a front-side insulation substrate (22), disposing a sealing member (24) on the front-side insulation substrate (22) on which the solar battery cell (25) is formed, the sealing member (24) having a shape smaller than outer shapes of the front-side insulation substrate (22) and a back-side insulation substrate (23) and having an uneven shape on a side that faces the solar battery cell (25), disposing the back-side insulation substrate (23) on the sealing member (24), sealing the solar battery cell (25) between the front-side insulation substrate (22) and the back-side insulation substrate (23) by applying heat under pressure from above the back-side insulation substrate (23) in vacuum conditions so as to squeeze the uneven portion of the sealing member (24) and bring the sealing member into intimate contact with the solar battery cell (25), and cooling and thereby harde

Abstract: A solar cell module includes a structure in which a back surface material, a back-surface-side sealing resin, a solar cell, a light-receiving-surface-side sealing resin, and a front surface material are laminated in sequential order, in which a melting point of a portion, which is in contact with the solar cell, of at least one of the light-receiving-surface-side sealing resin and the back-surface-side sealing resin is lower than a melting point of a portion, which is in contact with the back surface material, of the back-surface-side sealing resin.

Abstract: Methods of fabricating optoelectronic devices, such as photovoltaic cells and light-emitting devices. In one embodiment, such a method includes providing a substrate, applying a monolayer of semiconductor particles to the substrate, and encasing the monolayer with one or more coatings so as to form an encased-particle layer. At some point during the method, the substrate is removed so as to expose the reverse side of the encased-particle layer and further processing is performed on the reverse side. When a device made using such a method has been completed and installed into an electrical circuit the semiconductor particles actively participate in the photoelectric effect or generation of light, depending on the type of device.

Abstract: A multilayer film suitable as a backing for a photovoltaic module is provided. The film comprises, in the order listed: a) a layer of a moulding composition which comprises at least 35% by weight, based on the overall layer moulding composition, of polyamide; b) a layer of a moulding composition which comprises at least 50% by weight, based on the overall layer moulding composition, of a polymer fraction consisting of: I) 30 to 95 parts by weight of polyamide and II) 5 to 70 parts by weight of polyolefin, where a sum of I) and II) in parts by weight is 100; and c) a layer of a moulding composition which comprises at least 35% by weight, based on the overall moulding composition, of polyamide; wherein at least one of layers a), b) and c) further comprises a polyamide elastomer which is a polyetheresteramide, a polyetheramide or a combination thereof.

Abstract: A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor substrate having a first surface and a second surface at an opposite side thereof. The first surface has an active layer with a light-receiving part. The semiconductor device also includes an adhesive layer provided to surround the light-receiving part on the first surface of the semiconductor substrate; a light-transmissive protective member disposed above the light-receiving part of the semiconductor substrate with a predetermined gap and adhered via the adhesive layer; and plural external connection terminals arranged in a predetermined array on the second surface of the semiconductor substrate are included. Each center point of the external connection terminals forming two facing edges is positioned inside of an area of the adhesive layer projected on the second surface among the outermost external connection terminals.

Abstract: An object of the present invention is to provide an actuator allowing a control of displacement and configured to offer a high degree of freedom in designing, and a drive device and an imaging device including the actuator. To achieve the object, an actuator is adopted including a movable part deformable in accordance with heat generation and a control section controlling the amount of deformation of the movable part. In the actuator, the movable part is structured with a plurality of portions including a base portion, a force generating portion, and a heat generating portion being stacked, the force generating portion generating force in accordance with heating, the heat generating portion generating heat in accordance with a current supply. The control section controls the amount of deformation of the movable part by controlling the current supply to the heat generating portion based on an electrical resistance in the heat generating portion.

Abstract: The invention relates to the use of a) at least one (poly)alkyl(meth)acrylate and b) at least one compound according to formula (I), wherein the radicals R1 and R2 independently represent an alkyl or cycloalkyl radical having 1 to 20 carbon atoms, for producing solar cell modules, in particular for producing light concentrators for solar cell modules.

Abstract: A method of concentrated photovoltaic (CPV) packaging of a semiconductor solar cell for converting solar energy into electricity. The method includes affixing a photovoltaic device to a laminated substrate structure that is obtained by an additive or subtractive lamination process, attaching a photovoltaic device to a mounting paddle of the laminated substrate structure, connecting wire bonding of the photovoltaic device to leads of the laminated substrate structure, and applying overmold material to affix the photovoltaic device to the mounting paddle. During the application of the overmold material, a portion of the photovoltaic device is exposed to allow for the collection of the solar energy.

Abstract: An opto-electrical device is provided that comprises a cover (10), a barrier structure (20), an opto-electrical structure (30) and a plurality of transverse electrical conductors (40).

Abstract: A manufacturing method of a package carrier is provided. A substrate having an upper and lower surface is provided. A first opening communicating the upper and lower surface of the substrate is formed. A heat conducting element is disposed inside the first opening, wherein the heat conducting element is fixed in the first opening via an insulating material. At least a through hole passing through the substrate is formed. A metal layer is formed on the upper and lower surface of the substrate and inside the through hole. The metal layer covers the upper and lower surface of the substrate, the heat conducting element and the insulating material. A portion of the metal layer is removed. A solder mask is formed on the metal layer. A surface passivation layer is formed and covers the metal layer exposed by the solder mask and the metal layer located inside the through hole.

Abstract: A moisture trapping filler composition may include a filler material combined with a desiccant material.

Abstract: An LED packaging method includes: providing a mold with two isolated receiving spaces and a substrate with a die supporting portion and an electrode portion respectively received in the two receiving spaces; disposing an LED die on the die supporting portion and electrically connecting the LED die to the electrode portion of the substrate by metal wires; injecting a light wavelength converting material into the first receiving space and covering the LED die with the light wavelength converting material; communicating the first receiving space to the second receiving space, injecting a first light transmissive material into the communicated first and second spaces, and covering the light wavelength converting material and the metal wires with the first light transmissive material; and removing the mold to obtain a packaged LED.