Abstract: Assembly system for photovoltaic packages. According an embodiment, the present invention provides a system for assembling photovoltaic packages. The system includes a base plate member, which comprises a plurality of coupling elements. The plurality of coupling elements are characterized by a first length. The plurality of coupling elements is aligned according to a predetermined configuration. The plurality of coupling elements includes first and second coupling elements. The system also includes a top plate member, which includes a plurality of openings and a plurality of locator elements. The plurality of openings is characterized by a second length. The second length is greater than the first length. The openings and the locator elements are aligned according to the first predetermined configurations. The top plate member is disengageably coupled to the base plate member by the coupling elements and the openings.

Abstract: Protuberances, having vertical and lateral dimensions less than the wavelength range of lights detectable by a photodiode, are formed at an optical interface between two layers having different refractive indices. The protuberances may be formed by employing self-assembling block copolymers that form an array of sublithographic features of a first polymeric block component within a matrix of a second polymeric block component. The pattern of the polymeric block component is transferred into a first optical layer to form an array of nanoscale protuberances. Alternately, conventional lithography may be employed to form protuberances having dimensions less than the wavelength of light. A second optical layer is formed directly on the protuberances of the first optical layer. The interface between the first and second optical layers has a graded refractive index, and provides high transmission of light with little reflection.

Abstract: The present invention provides systems, devices and methods for fabricating miniature low-power light sensors. With the present invention, a light sensitive component, such as a diode, is fabricated on the front side of a silicon wafer. Connectivity from the front side of the wafer to the back side of the wafer is provided by a through silicon via. Solder bumps are then placed on the back side of the wafer to provide coupling to a printed circuit board. The techniques described in the present invention may also be applied to other types of semiconductor devices, such as light-emitting diodes, image sensors, pressure sensors, and flow sensors.

Abstract: Apparatus for accurately picking and placing one or more optoelectronic devices for vacuum lamination of materials in a way that minimizes stress to the materials.

Abstract: Methods and devices are provided for improved sensor systems. In one embodiment of the present invention, sensor system is provided that includes a sensor and sensor electronics integrated into the same ground plane.

Abstract: An integrated circuit chip includes a window cover over etchant holes in a dielectric layer and over a cavity in the substrate of said integrated circuit chip. The window cover extends at least 400 microns beyond the edge of the cavity. An integrated sensor chip with a sensor cover which extends at least 400 microns beyond the edges of a cavity. A method of forming an integrated sensor chip with a sensor cover which extends at least 400 microns beyond the edge of a cavity.

Abstract: Disclosed herein is a solid state imaging device including a support substrate; an imaging semiconductor chip having a pixel array disposed on the support substrate; and an image processing semiconductor chip disposed on the support substrate, wherein the imaging semiconductor chip and the image processing semiconductor chip are connected by through-vias, and interconnects formed on the support substrate.

Abstract: A shaped tab conductor configured to allow more incident light to strike a cell substrate, improving the photovoltaic efficiency of the cell. The shaped tab conductor is configured to reduce the amount of incident light that is blocked by the tab from reaching the surface of the cell substrate. The tab may also be configured to redirect light reflected from the cell surface back to the cell surface. The cross-section of the tab conductor may be polygonal, such as a rhombus, with at least one generally planar surface that forms an acute angle with the substrate.

Abstract: Devices having features deposited on two sides of a device substrate and methods for making the same. The devices are useful, for example, as the components in a macroelectronic system. In a preferred embodiment, the devices are photosensors having a plurality of electrodes patterned on a first side of the device and an electromagnetic interference filter patterned on a second side of the device. The method facilitates the fabrication of two-sided devices through the use of an immobilizing layer deposited on top of devices patterned on a first side of a device substrate; flipping the device substrate; processing the second side of the device substrate to produce patterned features on the second side of the device substrate; and releasing the devices having patterned elements on two sides of each device.

Abstract: A sensor includes a substrate, a membrane, first and second spacers arranged on the substrate, a first support structure which is supported, laterally next to the membrane, by the first spacer and contacts a first electrode of a first main side of the membrane which faces the substrate, and a second support structure which is supported, laterally next to the membrane, by the second spacer and contacts a second electrode on a second main side of the membrane which is opposite the first main side, so that the membrane is suspended via the first and second spacers and is electrically connected to contact areas of the substrate.

Abstract: A photovoltaic module includes at least one photovoltaic cell, a back plate, at least two ribbons, an encapsulant layer, and a filler. The back plate is disposed over the photovoltaic cell, in which the back plate has a ribbon hole therein. The ribbons are electrically connected to the photovoltaic cell and pass through the ribbon hole. The encapsulant layer is disposed between the back plate and the photovoltaic cell, in which the encapsulant layer has at least one through hole therein, and both of the ribbons pass through the through hole. The filler fills the through hole of the encapsulant layer, in which a flowability of a material of the filler is greater than a flowability of a material of the encapsulant layer.

Abstract: Provided is a back side illuminated image sensor device. The image sensor device includes a substrate having a front side and a back side opposite the front side. The image sensor also includes a radiation-detection device that is formed in the substrate. The radiation-detection device is operable to detect a radiation wave that enters the substrate through the back side. The image sensor further includes a deep trench isolation feature that is disposed adjacent to the radiation-detection device. The image sensor device further includes a doped layer that at least partially surrounds the deep trench isolation feature in a conformal manner.

Abstract: A solar cell module includes a base body, a plurality of solar cell elements arranged at intervals over the base body, a resin layer disposed on the solar cell elements and comprising a plurality of recesses on its surface facing opposite to the solar cell elements, and a protective sheet disposed on the resin layer. The protective sheet comprises a plurality of protrusions which correspond to the recesses of the resin layer and which are in contact with the recesses. The height of first protrusion at a location corresponding to the interval between the solar cell elements among the plurality of protrusions is higher than the height of second protrusion at a location corresponding to the solar cell element among the plurality of protrusions. The interval between adjacent ones of the second protrusions in a portion corresponding to an end portion of the base body in longer than the interval between adjacent ones of the second protrusions in a portion corresponding to a central portion of the base body.

Abstract: A photovoltaic device is generally provided that includes a plurality of thin film layers on a glass substrate. The plurality of thin film layers define a plurality of photovoltaic cells connected in series to each other. An insulating layer is positioned on the plurality of thin film layers, and a sealing layer on the thin film layers, wherein the sealing layer comprises a polymeric material. A first lead is positioned on the insulating layer and connected to a first bus bar. An encapsulating substrate is positioned on the adhesive layer, wherein the encapsulating substrate defines a connection aperture through which the first lead extends. The sealing layer is positioned under the connection aperture defined by the encapsulating substrate to act as a moisture barrier therethrough. Methods are also generally provided for manufacturing a photovoltaic device.

Abstract: A photovoltaic module includes an encapsulated photovoltaic element and an infrared transmissive decorative overlay simulating conventional roofing.

Abstract: A reverse image sensor module includes first and second semiconductor chips, and first and second insulation layers. The first semiconductor chip includes a first semiconductor chip body having a first surface and a second surface facing away from the first surface, photodiodes disposed on the first surface, and a wiring layer disposed on the second surface and having wiring lines electrically connected to the photodiodes and bonding pads electrically connected to the wiring lines. The second semiconductor chip includes a second semiconductor chip body having a third surface facing the wiring layer, and through-electrodes electrically connected to the bonding pads and passing through the second semiconductor chip body. The first insulation layer is disposed on the wiring layer, and the second insulation layer is disposed on the third surface of the second semiconductor chip body facing the first insulation layer and is joined to the first insulation layer.

Abstract: The present invention is for a system and method of creating a continuous, seamless, waterproof, weatherproof, electrically generating surface that can be applied over a great variety of structural components. The method comprises coating the selected surface with a base elastomeric coating thus sealing holes, cracks and other surface imperfections. In one embodiment, the base elastomeric coating is allowed to dry and at least one photovoltaic module is placed on the base elastomeric coating by using another coat of elastomeric material applied to the underside surface of the photovoltaic module or on the surface of the base elastomeric coating where the photovoltaic module will be applied. Another layer of an elastomeric coating is applied covering the perimeter edges of the photovoltaic module creating a continuous, seamless, waterproof, weatherproof surface capable of generating electricity.

Abstract: A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.

Abstract: In a method and system consisting of a photovoltaic module and a connection housing or a junction box, wherein the photovoltaic module comprises at least one solar cell which is coupled at a rear side to an electrically conductive and structured layer for conducting away the electrical energy generated in a solar cell, and, furthermore, at least one transparent carrier layer and a covering layer are provided, wherein the electrically conducting layer can be contact-connected to connections of the connection housing, it is proposed that connections or connection elements of the connection housing can be coupled directly to partial regions having different polarities of the conducting layer via at least one through-opening in the covering layer, as a result of which contact-connection of a photovoltaic module to connection elements of a connection housing can be obtained in a simple and reliable manner.

Abstract: An image capture unit and its manufacturing method. The image capture unit includes a thinned-down integrated circuit chip having an image sensor on its upper surface side. A wall extends above a peripheral upper surface ring-shaped area, and a lens rests on the high portion of the wall.

Abstract: An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a first light shielding layer disposed on the second surface of the substrate; and a second light shielding layer disposed on the first light shielding layer and directly contacting with the first light shielding layer, wherein a contact interface is between the first light shielding layer and the second light shielding layer.

Abstract: A photovoltaic module configured so that a first sealing material and a rear surface support material are stacked in the stated order on a side of a photovoltaic cell. An electric output of the photovoltaic cell is output to the exterior by an electric output wire that passes through a through hole in the rear surface support material. An insulating material is disposed between the photovoltaic cell and the first sealing material in a position corresponding to the through hole.

Abstract: The photodetector device includes a semiconductor body having a front surface, and an active-area region that extends in the semiconductor body facing the front surface and is configured for receiving a light radiation and generating, in response to the light radiation received, electric charge carriers. A polydimethylsiloxane cover layer extends on the front surface in the active-area region so that the light radiation is received by the active-area region through the cover layer.

Abstract: When a resin sealed package is molded with use of a release film for the purpose of preventing generation of a flash on a surface of a seal glass, the seal glass may be broken by being compressed and bent by the release film at a portion of the seal glass below which there is a cavity. The present invention prevents this breakage of the seal glass. More specifically, the present invention prevents breakage of the seal glass by forming a recess corresponding to a compression allowance of the release film at a mold die above the portion of the seal glass below which there is the cavity, or at the seal glass itself, and thereby releasing a pressure from the release film.

Abstract: There is provided a semiconductor package including: a substrate including a semiconductor chip mounted thereon; a protective layer covering the semiconductor chip; a metal pattern mounted on the protective layer; and a first connective member connecting the semiconductor chip and the metal pattern.

Abstract: The invention describes a composite in which solar cells can be encapsulated, being a photovoltaic module, composed of the following elements: an outer layer made of a transparent thermoplastic and/or a barrier foil, and an elastic layer into which the solar cells have been embedded and a barrier foil or a barrier sheet.

Abstract: The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure comprises a device substrate having a front side and a back side; an interconnect structure disposed on the front side of the device substrate; and a bonding pad connected to the interconnect structure. The bonding pad comprises a recessed region in a dielectric material layer; a dielectric mesa of the dielectric material layer interposed between the recessed region; and a metal layer disposed in the recessed region and on the dielectric mesa.

Abstract: A package enclosing at least one microelectronic element (60) such as a sensor die and having electrically conductive connection pads (31) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern (30) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member (45) on the carrier at the side where the electrically conductive pattern (30) is present; removing the sacrificial carrier; and placing a microelectronic element (60) in a recess (47) which has been created in the body member (45) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element (60) to the electrically conductive pattern (30). Furthermore, a hole (41) is arranged in the package for providing access to a sensitive surface of the microelectronic element (60).

Abstract: The present invention discloses a solar cell device and a packaging method thereof. The solar cell device applies to a concentrator photovoltaic cell, and comprises a circuit substrate, a solar cell chip, and an electrode plate. The two sides of the lower surface of the electrode plate respectively have an electronic conducting element. A positive electrode plate disposed on the circuit substrate is electrically connected with a back electrode disposed on the lower surface of the solar cell chip. Through each conducting element of the electrode plate, front electrodes disposed respectively on the two sides of the upper surface of the solar cell chip are connected with a negative electrode plate disposed on the circuit substrate.

Abstract: A module made of transparent polymer material in which rectangular photovoltaic cells are embedded. The sides of the photovoltaic cells are of length l1 and l2 of respective perpendicular directions d1 and d2, according to which the module has a curvature of radius R1, respectively R2, and et denotes the total thickness of polymer material and esup the minimum thickness of polymer material covering the photovoltaic cells of the side intended to be oriented toward the sun, and for i=1 and 2, li?2?{square root over ((et?esup)(et?esup+2Ri))}{square root over ((et?esup)(et?esup+2Ri))}. Such a module may find application for a transport vehicle, for a building trade, or street furniture. A roof or part of a roof of a motor vehicle can also include such a module.

Abstract: The invention relates to a method of encapsulating a photovoltaic cell comprising curing an encapsulation composition comprising (i) a polyvinyl acetal resin/polymer, (ii) one or more ethylenically unsaturated monomers, oligomers, or a combination thereof, and (iii) at least one thermal free radical initiator and/or at least one photoinitiator. The resin/polymer is either a polyvinyl acetate derivative or a polyvinyl acetate copolymer such as EVA derivative, and comprises vinyl acetal units. The invention also relates to a photovoltaic cell encapsulated according to the method and to the encapsulation curable composition.

Abstract: A method of fabricating an optoelectronic device includes creating an optoelectronic structure on a first substrate. The optoelectronic structure includes a release layer and a plurality of inorganic semiconductor layers supported by the release layer. The plurality of inorganic semiconductor layers is configured to be active in operation of the optoelectronic device. The plurality of inorganic semiconductor layers are permanently attached to a second substrate, which is flexible. The plurality of inorganic semiconductor layers are released from the first substrate after the attaching step, and the second substrate is deformed to a non-planar configuration.

Abstract: An optoelectronic component includes at least one inorganic optoelectronically active semiconductor component having an active region that emits or receives light during operation, and a sealing material applied by atomic layer deposition on at least one surface region, the sealing material covering the surface region in a hermetically impermeable manner.

Abstract: A photovoltaic device including at least one top cell that include at least one III-V semiconductor material; a bottom cell of a germanium containing material having a thickness of 10 microns or less; and a back surface field (BSF) region provided by a eutectic alloy layer of aluminum and germanium on the back surface of the bottom cell of that is opposite the interface between the bottom cell and at least one of the top cells. The eutectic alloy of aluminum and germanium bonds the bottom cell of the germanium-containing material to a supporting substrate.

Abstract: A photoelectric converter device includes a front surface glass plate, a photoelectric conversion unit formed on the front surface glass plate and serving to generate electric power in response to incidence of light, and a back surface glass plate arranged so as to cover the photoelectric conversion unit. The front surface glass plate and the back surface glass plate are fused and joined in at least a part of a peripheral portion of the glass plates.

Abstract: A solar cell packaging process is disclosed. At first, a solar cell is provided, and at least one liquid packaging material is spray-coated onto a surface of the solar cell by a spray-coating process. A liquid packaging material is directly spread on the surface of the solar cell in at least one covering process. Then, the liquid packaging material is hardened in curing process. Therefore, a packaging layer is formed on the surface of the solar cell to finish the solar cell packaging. By implementing the above packaging process, it ensures there is no over stress applied on the solar cell in the packaging process to avoid generating broken pieces for significantly improving the yield.

Abstract: A solar cell module and a method of manufacturing the solar cell module are disclosed. The method in accordance with an embodiment of the present invention includes forming a conductive bump on a conductive pad formed on one surface of a solar cell, forming a circuit pattern on one surface of a transparent substrate, in which the circuit pattern corresponds to a position of the conductive bump, adhering the solar cell to the transparent substrate in such a way that the conductive bump is in direct contact with the circuit pattern, and forming a protective resin layer on one surface of the transparent substrate in such a way that the solar cell is covered. By using the above steps, a thinner solar cell module can be implemented while improving the manufacturing efficiency.

Abstract: The present invention relates to a process for producing solar modules.

Abstract: Embodiments of the invention explore solution-based deposition of a cathode for an OLED structure. A typical embodiment of the invention may include a method performed according to the following steps: Glass substrates including deposited Indium Tin-Oxide (ITO) are prepared. The substrates are subjected to ultrasonic cleaning with deionized water and organic solvents. Features are etched into the ITO using high concentration HCl solution. A hole injecting layer is deposited by spin coater. The layer is annealed on a hot plate, then a polyphenylene vinylene (PPV) polymer is deposited by spin coater and annealed on a hot plate. Low work function cathode metal is then deposited in an electroless solution and annealed on a hot plate. The device is encapsulated.

Abstract: Provided is a solar cell module that comprises a solar cell assembly. The solar cell assembly is encapsulated by a poly(vinyl butyral) encapsulant and contains a silver component that is at least partially in contact with the poly(vinyl butyral) encapsulant. The poly(vinyl butyral) encapsulant comprises poly(vinyl butyral), about 15 to about 45 wt % of one or more plasticizers, and about 0.1 to about 2 wt % of one or more unsaturated heterocyclic compounds, based on the total weight of the poly(vinyl butyral) encapsulant. Further provided are an assembly for preparing the solar cell module; a process for preventing or reducing the discoloration of a poly(vinyl butyral) encapsulant in contact with a silver component in the solar cell module; and the use of the solar cell module to convert solar energy to electricity.

Abstract: A solar cell module having a metal layer as a substrate, and being usable pratically. The solar cell module 10 has such a configuration that a weather resistant layer 11, an encapsulation layer 12, a power generation element 13 including a power generation layer sandwiched between a couple of electrodes, a power generation element substrate, a fluorinated hydrocarbon resin layer 16, and a metal layer 17 stacked in this order.

Abstract: The present invention relates to a photovoltaic device comprising silicon microparticles and to a method of producing the same.

Abstract: The present invention pertains to a proximity sensor packaging structure, which comprises a substrate, two first electrically conductive layers and a plurality of second electrically conductive layers that are disposed on the substrate. The substrate has first and second grooves that are respectively defined by a bottom surface and an interior sidewall. Each electrically conductive layer extends from a bottom surface of the first groove, along the interior sidewall of the first groove and in an opposite direction relative to the other first electrically conductive layer, to an exterior sidewall of the substrate. The second electrically conductive layers include first and second electrically conductive portions. The first electrically conductive portion is disposed on a central region of the bottom surface of the second groove. The second electrically conductive portion extends from the bottom surface of the second groove, along the interior sidewall thereof, to the exterior sidewall of the substrate.

Abstract: A tandem solar cell and fabricating method thereof are disclosed. The steps of the fabricating method comprises: a top inverted solar cell having a plurality of inverted solar sub-cells is provided; a bottom normal solar cell having a plurality of normal solar sub-cells accompanying with the inverted solar sub-cells is provided; and processing fit process of the top inverted solar cell and the bottom normal solar cell is executed, wherein an interlayer is disposed between the bottom normal solar cell and the top inverted solar cell, and the interlayer includes a plurality of conductive dots. The plurality of inverted solar sub-cells and normal solar sub-cells are placed with an offset distance from each other, and a plurality of solar sub-cells are formed after the pressing fit process, and the plurality of solar sub-cells are series/parallel connection each other by electrically connecting the plurality of conductive dots.

Abstract: A luminescent solar concentrator comprises a primary waveguide and at least one photovoltaic cell. The primary waveguide has a curved surface which concentrates light on a perimeter. The photovoltaic cell is oriented at the perimeter so that it can both receive the concentrated light and receive direct light as well. A back sheet may be provided that provides structural support and protection. The perimeter may have the shape of a polygon where a photovoltaic cell is oriented along each edge. Modules and arrays of such units are also disclosed.

Abstract: A solar cell includes a cathode component, an anode component, sealant for assembling the cathode component and the anode component to form a closed space, and electrolyte accommodated in the closed space, in which the cathode component contains a lower transparent conductive substrate, a nano-oxide semiconductor thin film formed on the lower transparent conductive substrate, and dye attached to a nano-particle surface of the nano-oxide semiconductor thin film; and the anode component contains an upper transparent conductive substrate, and an anode electrode layer formed on the upper transparent conductive substrate, the nano-oxide semiconductor thin film and the anode electrode layer being arranged opposite to each other and contacting with the electrolyte, in which the anode component further contains a CdTe layer which is patterned to have an opening, and the anode electrode layer is located in the opening of the CdTe layer.

Abstract: A composition including a mixture of a cross-linking agent and a first polyolefin including a functional monomer selected from among unsaturated carboxylic diacid or carboxylic acid anhydrides, the unsaturated carboxylic acids and the unsaturated epoxides being suitable for cross-linking with a second polyolefin in order to form an assembly adhered to a substrate, said assembly and the substrate forming an integral structure having two separate layers, characterized in that the amount of cross-linking agent is no lower than 5% of the total weight of the composition. Said masterbatch enables, even in the absence of silanes, cross-linking of polymers, in particular polyolefins, in order to increase the adhesive capacity thereof to substrates such as polymers, metals, metal oxides or silicon. Said masterbatch can be used in particular for encapsulating photovoltaic cells.

Abstract: It is to provide an electrolyte solution for a dye sensitized solar cell that does not generate a gas, can be used in a wide temperature range, and is excellent in durability. The electrolyte solution contains a chain sulfone compound represented by formula (1) as a solvent. (In the formula, R1 and R2 each independently represent an alkyl group having from 1 to 12 carbon atoms, which may be partially substituted by a halogen, an alkoxy group or an aromatic ring, an alkoxy group, or a phenyl group.

Abstract: The present invention relates to a solar cell assembly, comprising a solar cell attached to a bonding pad and a cooling substrate and wherein the bonding pad and the cooling substrate are joined to each other in a planar and flush manner such that the bonding pad and the cooling substrate are connected to each other in form of a solid state connection. The invention further relates to a solar cell assembly that includes a solar cell attached to a bonding pad and a cooling substrate and wherein the bonding pad is attached on a surface of the cooling substrate such that the bonding pad and the cooling substrate are connected to each other in form of a solid state connection. Also, a method for manufacture of such solar cell assemblies.

Abstract: A photoelectric conversion module includes a first photoelectric cell, a second photoelectric cell, the second photoelectric cell being adjacent to the first photoelectric cell, a first electrode, the first electrode corresponding to the first photoelectric cell, a second electrode, and a connecting member disposed between the first photoelectric cell and the second photoelectric cell, the connecting member electrically connecting the first electrode and the second electrode to each other, the connecting member including a first conductive bump, a second conductive bump, and a conductive connector part contacting the first and second conductive bumps.