Circuit board with heat sink

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Description

FIG. 1 is a front, right side perspective view of a circuit board with heat sink, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a left side view thereof; and,

FIG. 8 is a rear, left side perspective view thereof.

The even dashed broken lines shown in the drawings represent portions of the circuit board with heat sink that form no part of the claimed design.

Claims

The ornamental design for a circuit board with heat sink, as shown and described.

Referenced Cited
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Other references
  • PCB Heat Sink for Effective Thermal Management,https://www.fs-pcba.com/pcb-heat-sink-for-optimal-pcb-thermal-management/, 2025. (Year: 2025).
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Patent History
Patent number: D1102397
Type: Grant
Filed: Dec 6, 2024
Date of Patent: Nov 18, 2025
Assignee: Canaan Creative Co., LTD. (Beijing)
Inventors: Shaohua Zhang (Beijing), Huan Yang (Beijing), Nangeng Zhang (Beijing)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/977,292