Circuit board with heat sink
Description
The even dashed broken lines shown in the drawings represent portions of the circuit board with heat sink that form no part of the claimed design.
Claims
The ornamental design for a circuit board with heat sink, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
| 3072734 | January 1963 | Fox |
| D255351 | June 10, 1980 | Pettijohn |
| 4235496 | November 25, 1980 | Aug |
| D292698 | November 10, 1987 | DeVita |
| D363920 | November 7, 1995 | Roberts |
| D396449 | July 28, 1998 | Taylor |
| D430856 | September 12, 2000 | Wilkerson |
| D459706 | July 2, 2002 | Ebihara |
| D471524 | March 11, 2003 | Ebihara |
| 6765278 | July 20, 2004 | Parsons |
| D508681 | August 23, 2005 | Enderlein |
| D525213 | July 18, 2006 | Enderlein |
| D637193 | May 3, 2011 | Andre |
| D639756 | June 14, 2011 | Greene, Jr. |
| D642546 | August 2, 2011 | Greene, Jr. |
| D647072 | October 18, 2011 | Bentley |
| D787456 | May 23, 2017 | Matsumoto |
| D787457 | May 23, 2017 | Matsumoto |
| D798868 | October 3, 2017 | Daniel |
| D799438 | October 10, 2017 | Takahashi |
| D880484 | April 7, 2020 | Li |
| D883240 | May 5, 2020 | Fathauer |
| D909319 | February 2, 2021 | Nordeen |
| D930601 | September 14, 2021 | McBride |
| D938374 | December 14, 2021 | McBride |
| D944219 | February 22, 2022 | McBride |
| D949117 | April 19, 2022 | McBride |
| D956707 | July 5, 2022 | Yamauchi |
| D958762 | July 26, 2022 | McBride |
| D989014 | June 13, 2023 | McBride |
| D995456 | August 15, 2023 | Fleece |
| D995457 | August 15, 2023 | Fleece |
| D1001753 | October 17, 2023 | McBride |
| D1009815 | January 2, 2024 | McBride |
| D1010591 | January 9, 2024 | McBride |
| D1012872 | January 30, 2024 | McBride |
| D1022931 | April 16, 2024 | Kannan |
| D1051082 | November 12, 2024 | Nakazato |
| D1051866 | November 19, 2024 | Fleece |
| D1052544 | November 26, 2024 | Fleece |
| D1055879 | December 31, 2024 | Nakazato |
| D1059314 | January 28, 2025 | Zhang |
| 20090268390 | October 29, 2009 | King |
- PCB Heat Sink for Effective Thermal Management,https://www.fs-pcba.com/pcb-heat-sink-for-optimal-pcb-thermal-management/, 2025. (Year: 2025).
- Heat Sink PCB,https://sfxpcb.com/product/heat-sink-pcb/, 2025. (Year: 2025).
- Custom Heatsink Solutions by Radian,https://radianheatsinks.com/custom-heatsink/, 2024. (Year: 2024).
- 7.87 4″ (200mm) Wide Heatsink (64AS),https://heatsinkonline.com/products/787 4-wide-heatsink-64as?variant=42105917014178¤cy=USD&utm_medium=product_sync&utm_source=google&utm_content=sag_organic&utm_campaign=sag_organic&utm_campaign=gs-2022-07-05&utm_source=google&utm,Copyright © 2024. (Year: 2024).
Patent History
Patent number: D1102397
Type: Grant
Filed: Dec 6, 2024
Date of Patent: Nov 18, 2025
Assignee: Canaan Creative Co., LTD. (Beijing)
Inventors: Shaohua Zhang (Beijing), Huan Yang (Beijing), Nangeng Zhang (Beijing)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/977,292
Type: Grant
Filed: Dec 6, 2024
Date of Patent: Nov 18, 2025
Assignee: Canaan Creative Co., LTD. (Beijing)
Inventors: Shaohua Zhang (Beijing), Huan Yang (Beijing), Nangeng Zhang (Beijing)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/977,292
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)