Heat insulation pedestal of a semiconductor manufacturing apparatus

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a rear, top and right side perspective view of a heat insulation pedestal of a semiconductor manufacturing apparatus, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a cross sectional view taken along line 8-8 in FIG. 2.

Claims

The ornamental design for heat insulation pedestal of a semiconductor manufacturing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
6068548 May 30, 2000 Vote
6155421 December 5, 2000 Cooper
D557226 December 11, 2007 Uchino
D601979 October 13, 2009 Sato
D615936 May 18, 2010 Sato
D616391 May 25, 2010 Sato
D616396 May 25, 2010 Sato
D699200 February 11, 2014 Nagakubo
9123661 September 1, 2015 Kellogg
D818960 May 29, 2018 Yamaguchi
D827592 September 4, 2018 Ichino
D847982 May 7, 2019 Falkenberg
D870314 December 17, 2019 Isozaki
D979524 February 28, 2023 Perry
D1003243 October 31, 2023 Okajima
D1003834 November 7, 2023 Okajima
D1005245 November 21, 2023 Nakatani
D1051867 November 19, 2024 Perry
D1057675 January 14, 2025 Lind
D1066275 March 11, 2025 Rane
D1073758 May 6, 2025 Sathish
20040077167 April 22, 2004 Willis
20050277375 December 15, 2005 Young
20090050272 February 26, 2009 Rosenberg
20160002788 January 7, 2016 Nal
Foreign Patent Documents
1565116 December 2016 JP
Other references
  • Diacell® Ring Heater,https://www.almax-easylab.com/product/diacell-ring-heater/, 2025. (Year: 2025).
Patent History
Patent number: D1110288
Type: Grant
Filed: Mar 20, 2024
Date of Patent: Jan 27, 2026
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Tatsuki Jinden (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/933,535