Power device package
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Description
The broken lines shown in the drawings represent portions of the power device package that form no part of the claimed design.
Claims
The ornamental design for a power device package, as shown and described.
Referenced Cited
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Patent History
Patent number: D755741
Type: Grant
Filed: Feb 18, 2015
Date of Patent: May 10, 2016
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (Phoenix, AZ)
Inventors: Atapol Prajuckamol (Klaeng), Chee Hiong Chew (Seremban), Yushuang Yao (Seremban)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/517,863
Type: Grant
Filed: Feb 18, 2015
Date of Patent: May 10, 2016
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (Phoenix, AZ)
Inventors: Atapol Prajuckamol (Klaeng), Chee Hiong Chew (Seremban), Yushuang Yao (Seremban)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/517,863
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)