Power device package

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Description

FIG. 1 is a top perspective view of a power device package showing my new design;

FIG. 2 is another top perspective view thereof;

FIG. 3 is a bottom perspective view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevation view thereof;

FIG. 7 is a right side elevation view thereof;

FIG. 8 is a back elevation view thereof; and,

FIG. 9 is a front elevation view thereof.

The broken lines shown in the drawings represent portions of the power device package that form no part of the claimed design.

Claims

The ornamental design for a power device package, as shown and described.

Referenced Cited
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Patent History
Patent number: D755741
Type: Grant
Filed: Feb 18, 2015
Date of Patent: May 10, 2016
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (Phoenix, AZ)
Inventors: Atapol Prajuckamol (Klaeng), Chee Hiong Chew (Seremban), Yushuang Yao (Seremban)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/517,863