Electrode plate for a plasma processing apparatus
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/635,289, filed herewith and entitled “Gas Ring for a Plasma Processing Apparatus”;
Application Ser. No. 29/635,292, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”; and
Application Ser. No. 29/635,296, filed herewith and entitled “Electrode Plate Peripheral Ring for a Plasma Processing Apparatus”.
The broken lines show the boundaries of the enlarged portions illustrated in
Claims
The ornamental design for an electrode plate for a plasma processing apparatus, as shown and described.
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- Okuda et al., Design U.S. Appl. No. 29/635,289, filed Jan. 30, 2018.
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- Isozaki et al., Design U.S. Appl. No. 29/635,296, filed Jan. 30, 2018.
Type: Grant
Filed: Jan 30, 2018
Date of Patent: Dec 3, 2019
Assignee: Hitachi High-Technologies Corporation (Tokyo)
Inventors: Masakazu Isozaki (Tokyo), Masahito Mori (Tokyo), Kenetsu Yokogawa (Tokyo), Takao Arase (Tokyo), Takahisa Hashimoto (Tokyo)
Primary Examiner: Susan Bennett Hattan
Assistant Examiner: Omeed Agilee
Application Number: 29/635,287