Sputter target for a physical vapor deposition chamber

- APPLIED MATERIALS, INC.
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Description

FIG. 1 is a top isometric view of a sputter target for a physical vapor deposition chamber, according to one embodiment of the novel design.

FIG. 2 is a top plan view thereof.

FIG. 3 is a bottom plan view thereof.

FIG. 4 is a right elevation view thereof.

FIG. 5 is a left elevation view thereof.

FIG. 6 is a front elevation view thereof.

FIG. 7 is a back elevation view thereof; and,

FIG. 8 is an enlarged cross-sectional view taken along line 8-8 in FIG. 2.

The broken lines in the drawings represent unclaimed environment and form no part of the claimed design.

Claims

We claim the ornamental design for a sputter target for a physical vapor deposition chamber, as shown and described.

Referenced Cited
U.S. Patent Documents
5320728 June 14, 1994 Tepman
D351450 October 11, 1994 Maryska
5401675 March 28, 1995 Lee et al.
D363464 October 24, 1995 Fukasawa et al.
D376744 December 24, 1996 Eisenblatter
5624536 April 29, 1997 Wada et al.
D381030 July 15, 1997 Tepman
5643428 July 1, 1997 Krivokapic et al.
5702573 December 30, 1997 Biberger et al.
5705042 January 6, 1998 Leiphart et al.
D395483 June 23, 1998 Maryska
D411516 June 29, 1999 Lmafuku et al.
5958193 September 28, 1999 Brugge
D425919 May 30, 2000 Burkhart
6086725 July 11, 2000 Abburi et al.
6114216 September 5, 2000 Yieh et al.
6362097 March 26, 2002 Demaray et al.
6390905 May 21, 2002 Korovin et al.
6659850 December 9, 2003 Korovin et al.
D487254 March 2, 2004 Suenaga
6815352 November 9, 2004 Tamura et al.
D503729 April 5, 2005 Leeuw et al.
D553104 October 16, 2007 Oohashi et al.
D557226 December 11, 2007 Uchino
D559066 January 8, 2008 Tano et al.
D559993 January 15, 2008 Nagakubo et al.
D559994 January 15, 2008 Nagakubo et al.
7402098 July 22, 2008 Severson et al.
D584591 January 13, 2009 Tano et al.
D592029 May 12, 2009 Tano et al.
D592030 May 12, 2009 Tano et al.
D598717 August 25, 2009 Jalet
D600660 September 22, 2009 Sato
D600989 September 29, 2009 Tano et al.
D614593 April 27, 2010 Lee et al.
D616389 May 25, 2010 Takahashi
D616390 May 25, 2010 Sato
D633452 March 1, 2011 Namiki et al.
D649126 November 22, 2011 Takahashi
D660645 May 29, 2012 Zandona
D669509 October 23, 2012 Krink et al.
8371904 February 12, 2013 Jindal et al.
D678745 March 26, 2013 Nguyen
D683806 June 4, 2013 Dueck
D687790 August 13, 2013 Krishnan et al.
D687791 August 13, 2013 Krishnan et al.
D691974 October 22, 2013 Osada
D703162 April 22, 2014 Tamaso
D716742 November 4, 2014 Jang et al.
D722298 February 10, 2015 Saito et al.
D724553 March 17, 2015 Choi et al.
D732094 June 16, 2015 Jussel et al.
D732145 June 16, 2015 Yamagishi et al.
D733843 July 7, 2015 Yamagishi et al.
D741823 October 27, 2015 Tateno et al.
D741921 October 27, 2015 Jarvius et al.
D746647 January 5, 2016 Roaks
D750728 March 1, 2016 Kremer
D753449 April 12, 2016 Liebowitz et al.
D754468 April 26, 2016 Nason
D759603 June 21, 2016 Saito et al.
D767234 September 20, 2016 Kirkland et al.
D769200 October 18, 2016 Fukushima et al.
9475996 October 25, 2016 Mandle
D770992 November 8, 2016 Tauchi et al.
9543126 January 10, 2017 Riker
D790039 June 20, 2017 Hawrylchak et al.
D790041 June 20, 2017 Jang
D793572 August 1, 2017 Kozuka et al.
D794753 August 15, 2017 Miller
D795208 August 22, 2017 Sasaki et al.
D796458 September 5, 2017 Jang et al.
D797067 September 12, 2017 Zhang et al.
D797691 September 19, 2017 Joubert et al.
D798248 September 26, 2017 Hanson et al.
D801942 November 7, 2017 Riker et al.
D804230 December 5, 2017 Allan
D808349 January 23, 2018 Fukushima et al.
D810705 February 20, 2018 Krishnan et al.
9892890 February 13, 2018 Bluck et al.
D813181 March 20, 2018 Okajima
9960024 May 1, 2018 Riker et al.
D819580 June 5, 2018 Krishnan
D821039 June 19, 2018 Owens
D821140 June 26, 2018 Mirchandani et al.
D825504 August 14, 2018 Zhang et al.
D825505 August 14, 2018 Hanson et al.
D830435 October 9, 2018 Wakisaka et al.
D830981 October 16, 2018 Jeong
D836572 December 25, 2018 Riker et al.
D837755 January 8, 2019 Riker et al.
D839224 January 29, 2019 Yamaki et al.
D851613 June 18, 2019 Johanson et al.
D858468 September 3, 2019 Riker et al.
D859333 September 10, 2019 Riker et al.
10442056 October 15, 2019 Namiki et al.
D868124 November 26, 2019 Riker
D869409 December 10, 2019 Riker
D877101 March 3, 2020 Johanson et al.
10662520 May 26, 2020 West
D888903 June 30, 2020 Gunther et al.
D891382 July 28, 2020 Koppa et al.
D893441 August 18, 2020 Rao et al.
D894137 August 25, 2020 Johanson et al.
10811232 October 20, 2020 Srikantaiah et al.
D902165 November 17, 2020 Johanson et al.
D908645 January 26, 2021 Savandaiah et al.
D913979 March 23, 2021 Babu
D913980 March 23, 2021 Lee
20030015421 January 23, 2003 Cha et al.
20030029715 February 13, 2003 Yu et al.
20040149567 August 5, 2004 Kosyachkov
20040211665 October 28, 2004 Yoon et al.
20050152089 July 14, 2005 Matsuda et al.
20050193952 September 8, 2005 Goodman et al.
20060249369 November 9, 2006 Marangon et al.
20070076345 April 5, 2007 Bang
20070228302 October 4, 2007 Norman
20080121620 May 29, 2008 Guo et al.
20080308416 December 18, 2008 Allen et al.
20090260982 October 22, 2009 Riker et al.
20090308732 December 17, 2009 Cao et al.
20090308739 December 17, 2009 Riker et al.
20100096261 April 22, 2010 Hoffman et al.
20100108500 May 6, 2010 Hawrylchak et al.
20100170786 July 8, 2010 Wang et al.
20120033340 February 9, 2012 Roy et al.
20120263569 October 18, 2012 Priddy
20130316628 November 28, 2013 Jang et al.
20140261180 September 18, 2014 Yoshidome et al.
20150114823 April 30, 2015 Lee et al.
20150170888 June 18, 2015 Riker et al.
20150357169 December 10, 2015 Yuan
20160002776 January 7, 2016 Nal et al.
20160002788 January 7, 2016 Nal et al.
20160035547 February 4, 2016 Johanson et al.
20170009367 January 12, 2017 Harris
20170117121 April 27, 2017 Riker et al.
Foreign Patent Documents
206573738 October 2017 CN
D1420846 August 2011 JP
D1421157 August 2011 JP
D1422692 September 2014 JP
223429 May 1994 TW
223430 May 1994 TW
M267462 June 2005 TW
D122892 May 2006 TW
D117576 June 2007 TW
M346018 December 2008 TW
D129207 June 2009 TW
2009388890 September 2009 TW
D137192 October 2010 TW
D146490 April 2012 TW
D153743 May 2013 TW
D159673 April 2014 TW
D159674 April 2014 TW
D159675 April 2014 TW
D159676 April 2014 TW
D166552 March 2015 TW
D169790 August 2015 TW
D174341 March 2016 TW
D174342 March 2016 TW
D175852 May 2016 TW
D175853 May 2016 TW
D175855 May 2016 TW
D176440 June 2016 TW
D178698 October 2016 TW
D180288 December 2016 TW
D197827 June 2019 TW
Other references
  • Search Report for Taiwan Design Application No. 106301373 dated Jun. 20, 2017.
  • Search Report for Taiwan Design Application No. 107305358 dated Feb. 21, 2019.
  • Search Report for Taiwan Design Application No. 1077303086 dated Jul. 6, 2018.
  • Sputtering Targets, posted at Angstrom Sciences, posting date May 5, 2016. Site visited Apr. 1, 2019. URL: <https://web.archive.org/web/20160505015447/https://www.angstromsciences.com/sputtering-targets> (Year: 2016).
  • Sputtering Targets for LSis, posted at JX Nippon Mining & Metals, posting date Mar. 22, 2016. Site visited Apr. 1, 2019. URL: <https://web .archive .org/web/20160322055046/http :1/www.nmm.jx-group.co.jp/english/products/04_supa/target_adv.html> (Year: 2016).
  • Search Report for Taiwan Design Application No. 107305411, dated Feb. 21, 2019, 2 pages.
  • Search Report for Taiwan Design Application No. 109305355, dated Mar. 29, 2021.
  • Sputtering Targets and Evaporation Materials. Thin Film Materials Technology, 2 pages, HC14040155, Japan.
  • Sputtering Targets, GMR TMR MRAM, 2 pages, HC16042450. Japan.
Patent History
Patent number: D937329
Type: Grant
Filed: Mar 23, 2020
Date of Patent: Nov 30, 2021
Assignee: APPLIED MATERIALS, INC. (Santa Clara, CA)
Inventors: Martin Riker (Milpitas, CA), William Fruchterman (Sunnyvale, CA), Ilya Lavitsky (Santa Clara, CA), Srinivasa Rao Yedla (Bangalore), Kirankumar Neelasandra Savandaiah (Bangalore)
Primary Examiner: Calvin E Vansant
Assistant Examiner: Mark T. Philipps
Application Number: 29/728,957