Apparatus for evaluating semiconductor substrate

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Description

FIG. 1 is a front, top, and right side perspective view of an apparatus for evaluating semiconductor substrate according to the design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2; and,

FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 2.

The broken lines illustrate portions of the apparatus for evaluating semiconductor substrate that form no part of the claimed design. The hatching shown in FIG. 8 and FIG. 9 represents unclaimed subject matter and forms no part of the claimed design.

Claims

The ornamental design for an apparatus for evaluating semiconductor substrate, as shown and described.

Referenced Cited
U.S. Patent Documents
5281320 January 25, 1994 Turner
D350490 September 13, 1994 Takao
D352911 November 29, 1994 Yamamoto
D365584 December 26, 1995 Nakagome
D415184 October 12, 1999 Anai
D415776 October 26, 1999 Anai
D426785 June 20, 2000 Asai
D427088 June 27, 2000 Asai
D447967 September 18, 2001 Terada
6454472 September 24, 2002 Kim
6942738 September 13, 2005 Nelson
D546354 July 10, 2007 Kihara
D637098 May 3, 2011 Oonuma
D657068 April 3, 2012 Shibata
D730894 June 2, 2015 Hokari
D733134 June 30, 2015 Utsuki
D733135 June 30, 2015 Utsuki
D858590 September 3, 2019 Kazaoka
D905139 December 15, 2020 Ferraro
20020150449 October 17, 2002 Nelson
20030136513 July 24, 2003 Lee
20060057799 March 16, 2006 Horiguchi
20100189880 July 29, 2010 Gibson
20220254665 August 11, 2022 Wu
Other references
  • U.S. Appl. No. 29/789,675, filed Oct. 13, 2021.
  • U.S. Appl. No. 29/789,677, filed Oct. 13, 2021.
  • United States Notice of Allowance issued in U.S. Appl. No. 29/789,675 dated Mar. 8, 2023 (nine (9) pages).
  • United States Notice of Allowance issued in U.S. Appl. No. 29/789,677 dated Mar. 8, 2023 (nine (9) pages).
Patent History
Patent number: D989144
Type: Grant
Filed: Oct 13, 2021
Date of Patent: Jun 13, 2023
Assignee: Hitachi High-Tech Corporation (Tokyo)
Inventors: Masayuki Arakawa (Tokyo), Junpei Hokari (Tokyo), Akira Kojima (Tokyo), Masaki Mizuochi (Tokyo), Tomokazu Kobayashi (Tokyo), Takaaki Kikuchi (Tokyo)
Primary Examiner: Patricia A Palasik
Application Number: 29/789,674